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JP2005042135A Reducing agent solution, method of producing metal powder by using the same, and method of forming metal film 有权
标题翻译：还原剂溶液，使用该金属粉末的方法生产金属粉末及形成金属膜的方法
公开(公告)号：JP2005042135A
公开(公告)日：2005-02-17
申请号：JP2003200655
申请日：2003-07-23
申请人： Daiwa Fine Chemicals Co Ltd (Laboratory) , Sumitomo Electric Ind Ltd , 住友電気工業株式会社 , 株式会社大和化成研究所
发明人： MASHIMA MASATOSHI , SHIMODA KOHEI , KOYAMA KEIJI , OKADA KAZUMASA , OBATA KEIGO , YOSHIMOTO MASAKAZU , NAKAO SEIICHIRO , NAMIKAWA KAZUTOSHI
IPC分类号： C02F1/461 , B22F9/24 , C23C18/16 , C23C18/31
摘要： PROBLEM TO BE SOLVED: To provide a reducing agent solution with which metal powder or a metal film capable of exhibiting the satisfactory characteristics of the metal itself to the full can be produced since it does not comprise any halogen, and in which the re-regulation of pH is not needed in the case it is regenerated by electrolytic treatment and is repeatedly used, and to provide methods of forming metal powder and a metallic film using the same.
SOLUTION: The reducing agent solution comprises the ions of transition metal for reducing the ions of metal in a reaction system so as to be precipitated and methansulfonate ions, and is substantially free from halogen. As for the method of producing metal powder, the ions of metal are reduced by the reducing action of the ions of transition metal in a reaction system of a liquid phase including the reducing agent solution so as to be precipitated. As for the method of forming a metal film, in a state where the object to be plated is dipped into a reaction system including the reducing agent solution, the ions of metal are reduced by the reducing action of the ions of transition metal so as to be precipitated over the surface of the object to be plated.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：待解决的问题：提供一种还原剂溶液，由于它不包含任何卤素，因此可以制备能够充分显示出金属本身的令人满意的特性的金属粉末或金属膜的还原剂溶液，其中在通过电解处理再生并重复使用时，不需要重新调节pH，并且提供使用其形成金属粉末和金属膜的方法。解决方案：还原剂溶液包含过渡金属的离子，用于还原反应体系中的金属离子以沉淀和甲磺酸根离子，并且基本上不含卤素。对于金属粉末的制造方法，通过在包含还原剂溶液的液相的反应体系中的过渡金属的离子的还原作用使金属的离子析出而析出。对于形成金属膜的方法，在将待镀物体浸入包括还原剂溶液的反应体系的状态下，通过过渡金属的离子的还原作用使金属的离子减少，从而沉淀在待镀物体的表面上。版权所有（C）2005，JPO＆NCIPI

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