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1. 发明专利

JP2012237034A Aqueous solution for blackening metal surface, and method of carrying out blackening treatment 有权
标题翻译：用于盲孔金属表面的水溶液和进行黑化处理的方法
公开(公告)号：JP2012237034A
公开(公告)日：2012-12-06
申请号：JP2011106433
申请日：2011-05-11
申请人： Daiwa Fine Chemicals Co Ltd (Laboratory) , 株式会社大和化成研究所
发明人： KITAMURA SHINGO , SHIGEKUNI YUJI , YOSHIMOTO MASAKAZU
IPC分类号： C23C22/34 , C23C22/82
摘要： PROBLEM TO BE SOLVED: To provide a liquid and a method for blackening a metal, capable of forming a practically useful blackened metal by a simple method of allowing the metal to contact with the liquid for blackening metal under such a mild condition as to be at a temperature near room temperature, without using an electrolysis process.SOLUTION: The aqueous solution for blackening the surface of the metal comprises the following components (A) and (B), and the method of blackening the surface of the metal includes causing the surface of the metal to contact with the aqueous solution. The component (A) is one or more selected from the group consisting of a fluoride ion, a borofluoride ion and a silicofluoride ion. The component (B) is one or more of polar aprotic solvents.
摘要翻译：要解决的问题：提供一种能够使金属变黑的液体和方法，其能够通过简单的方法形成实用的黑色金属，该方法允许金属与液体接触，以在如下温和条件下使金属变黑：处于接近室温的温度，而不使用电解过程。解决方案：用于使金属表面变黑的水溶液包括以下组分（A）和（B），并且使金属表面变黑的方法包括使金属表面与水溶液接触。组分（A）是选自氟离子，氟氟化物离子和氟硅化物离子中的一种或多种。组分（B）是极性非质子溶剂中的一种或多种。版权所有（C）2013，JPO＆INPIT

2. 发明专利

JP2011012293A Plating method for magnesium or magnesium alloy 审中-公开
标题翻译：镁或镁合金的镀层方法
公开(公告)号：JP2011012293A
公开(公告)日：2011-01-20
申请号：JP2009155607
申请日：2009-06-30
申请人： Daiwa Fine Chemicals Co Ltd (Laboratory) , Million Kagaku Kk , ミリオン化学株式会社 , 株式会社大和化成研究所
发明人： OKUHAMA YOSHIAKI , YOSHIMOTO MASAKAZU , NAKAO SEIICHIRO , SHIBATA YOKO , KAWAI AKIHIKO , MATSUMURA KENJU , UNNO SHINICHI
IPC分类号： C25D5/30 , C25D5/42
摘要： PROBLEM TO BE SOLVED: To provide a plating method for magnesium or magnesium alloy, which imparts adequate corrosion resistance to a plated product, produce the product with adequate efficiency, adequately suppresses the occurrence of EMI, and imparts a decorative appearance having a metallic luster on the surface of the product.SOLUTION: The plating method for magnesium or magnesium alloy includes a step of forming an electroconductive resin layer containing an electroconductive filler other than a metal on a magnesium or magnesium alloy substrate, prior to a plating step.
摘要翻译：要解决的问题：为了提供对镀覆产品赋予足够的耐腐蚀性的镁或镁合金的镀覆方法，以足够的效率生产产品，充分抑制EMI的发生，并赋予具有金属光泽的装饰外观产品的表面。解决方案：镁或镁合金的电镀方法包括在电镀步骤之前，在镁或镁合金基底上形成含有金属以外的导电填料的导电树脂层的步骤。

3. 发明专利

JP2009249648A Plated member 有权
标题翻译：备注会员
公开(公告)号：JP2009249648A
公开(公告)日：2009-10-29
申请号：JP2008095187
申请日：2008-04-01
申请人： Daiwa Fine Chemicals Co Ltd (Laboratory) , 株式会社大和化成研究所
发明人： YOSHIMOTO MASAKAZU , OMORI SATOSHI , TAKAMATSU YOSHINORI
IPC分类号： C25D7/00 , C22C5/06 , C22C28/00 , C25D5/50 , F16C33/12
摘要： PROBLEM TO BE SOLVED: To provide a plated member having a soft alloy plating film formed thereon having high durability against sulfurization and obtained by a simple method. SOLUTION: The plated member is obtained by subjecting a base material to silver plating and indium plating, and diffusing indium into silver by thermal diffusion. The rate of content of the indium in the film is preferably 0.1% or more and less than 60% by weight. In order to control hardness, one or more kinds of metal selected from among copper, zinc, gallium, germanium, tin, antimony, gold and bismuth can be added in a content of not more than 1% (wt.%) in the film. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有在其上形成的具有高耐硫化耐久性并通过简单方法获得的软合金镀膜的镀层构件。解决方案：通过使基材进行镀银和铟电镀，并通过热扩散将铟扩散到银中而获得电镀部件。膜中的铟的含有率优选为0.1重量％以上且小于60重量％。为了控制硬度，可以在膜中添加选自铜，锌，镓，锗，锡，锑，金和铋中的一种或多种金属，其含量不超过1％（重量％）。版权所有（C）2010，JPO＆INPIT

4. 发明专利

JP2006235587A Method of manufacturing plastic lens for spectacles manufacturable with high productivity 有权
标题翻译：制造具有高生产率的制造用塑料镜片的方法
公开(公告)号：JP2006235587A
公开(公告)日：2006-09-07
申请号：JP2005353446
申请日：2005-12-07
申请人： Daiwa Fine Chemicals Co Ltd (Laboratory) , Tokai Kogaku Kk , 東海光学株式会社 , 株式会社大和化成研究所
发明人： NAGAO JUNJI , OKUHAMA YOSHIAKI , FUNATSU AKIRA , SHIGETA YOSHIKATSU , INOUE NAOYA
IPC分类号： G02C7/02 , C08G18/38 , G02B1/04
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a plastic lens for spectacles having productivity made higher than ever before by using a newly developed compound.
SOLUTION: The method of manufacturing the plastic lens for spectacles comprises adding the compound expressed by a formula (1) (where R represents 1-6C alkyl group) to a (thio)urethane monomer or episulfide monomer, and mixing and dissolving the mixture, then subjecting the mixture to polymerization curing.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种通过使用新开发的化合物来制造具有比以前更高生产率的眼镜的塑料透镜的方法。＆lt; P＆gt;解决方案：制造眼镜用塑料透镜的方法包括将由式（1）表示的化合物（其中R表示1-6C烷基）加入到（硫代）氨基甲酸酯单体或环硫化物单体中，并将其溶解混合物，然后使混合物进行聚合固化。版权所有（C）2006，JPO＆NCIPI

5. 发明专利

JP2006144073A Lead-free tin-silver based alloy or tin-copper based alloy electroplating bath 有权
标题翻译：无铅锡银合金或锡铜合金电镀浴
公开(公告)号：JP2006144073A
公开(公告)日：2006-06-08
申请号：JP2004335506
申请日：2004-11-19
申请人： Daiwa Fine Chemicals Co Ltd (Laboratory) , Ishihara Chem Co Ltd , 株式会社大和化成研究所 , 石原薬品株式会社
发明人： HAGA MASAKI , NISHIKAWA TETSUJI , TANAKA KAORU , INAI SHOYA , OBATA KEIGO , YOSHIMOTO MASAKAZU
IPC分类号： C25D3/60
摘要： PROBLEM TO BE SOLVED: To effectively prevent the substitute precipitation of silver or copper onto the surface of a tin or tin alloy anode at the time of plating treatment in a lead-free tin-silver based alloy or tin-copper based alloy electroplating bath. SOLUTION: The lead-free tin-silver based alloy or tin-copper based alloy electroplating bath is obtained by adding a nonionic surfactant(s) selected from distyrenated phenol polyalkoxylate whose HLB(Hydrophile-Lypophile Balance) is 7.3 to 15.2, tristyrenated phenol polyalkoxylate whose HLB is 7.0 to 10.4, distyrenated cresol polyalkoxylate whose HLB is 8.2 to 15.0, and a tristyrenated cresol polyalkoxylate whose HLB is 7.7 to 13.9 to a tin-silver based alloy or tin-copper based alloy electroplating bath comprising a stannous salt, a silver or copper salt and various acids. Since the nonionic surfactant(s) with the specified chemical structural species having the prescribed HLB is selectively added, the substitute precipitation of silver or copper onto an anode surface is prevented, and the consumption of silver or copper in the bath is suppressed, thus the composition of the plating bath can be stabilized. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了有效地防止在无铅锡 - 银基合金或锡 - 铜基合金中电镀处理时锡或铜在锡或锡合金阳极的表面上的替代沉淀电镀浴
解决方案：通过添加选自其中HLB（亲水亲油平衡平衡）为7.3〜15.2的二苯乙烯化苯酚聚烷氧基化物的非离子表面活性剂，得到无铅锡 - 银基合金或锡 - 铜基合金电镀浴， HLB为7.0〜10.4的三苯乙烯化苯酚聚烷氧基化物，HLB为8.2〜15.0的二苯乙烯化甲醇溶液，HLB为7.7〜13.9的三苯乙烯化甲醇溶液，其含锡亚锡盐或锡 - 铜系合金电镀浴，银或铜盐和各种酸。由于选择性地添加具有规定的HLB的特定化学结构种类的非离子表面活性剂，所以可以防止银或铜在阳极表面上的替代沉淀，并且抑制浴中的银或铜的消耗，因此镀液的组成可以稳定。版权所有（C）2006，JPO＆NCIPI

6. 发明专利

JP2005042135A Reducing agent solution, method of producing metal powder by using the same, and method of forming metal film 有权
标题翻译：还原剂溶液，使用该金属粉末的方法生产金属粉末及形成金属膜的方法
公开(公告)号：JP2005042135A
公开(公告)日：2005-02-17
申请号：JP2003200655
申请日：2003-07-23
申请人： Daiwa Fine Chemicals Co Ltd (Laboratory) , Sumitomo Electric Ind Ltd , 住友電気工業株式会社 , 株式会社大和化成研究所
发明人： MASHIMA MASATOSHI , SHIMODA KOHEI , KOYAMA KEIJI , OKADA KAZUMASA , OBATA KEIGO , YOSHIMOTO MASAKAZU , NAKAO SEIICHIRO , NAMIKAWA KAZUTOSHI
IPC分类号： C02F1/461 , B22F9/24 , C23C18/16 , C23C18/31
摘要： PROBLEM TO BE SOLVED: To provide a reducing agent solution with which metal powder or a metal film capable of exhibiting the satisfactory characteristics of the metal itself to the full can be produced since it does not comprise any halogen, and in which the re-regulation of pH is not needed in the case it is regenerated by electrolytic treatment and is repeatedly used, and to provide methods of forming metal powder and a metallic film using the same.
SOLUTION: The reducing agent solution comprises the ions of transition metal for reducing the ions of metal in a reaction system so as to be precipitated and methansulfonate ions, and is substantially free from halogen. As for the method of producing metal powder, the ions of metal are reduced by the reducing action of the ions of transition metal in a reaction system of a liquid phase including the reducing agent solution so as to be precipitated. As for the method of forming a metal film, in a state where the object to be plated is dipped into a reaction system including the reducing agent solution, the ions of metal are reduced by the reducing action of the ions of transition metal so as to be precipitated over the surface of the object to be plated.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：待解决的问题：提供一种还原剂溶液，由于它不包含任何卤素，因此可以制备能够充分显示出金属本身的令人满意的特性的金属粉末或金属膜的还原剂溶液，其中在通过电解处理再生并重复使用时，不需要重新调节pH，并且提供使用其形成金属粉末和金属膜的方法。解决方案：还原剂溶液包含过渡金属的离子，用于还原反应体系中的金属离子以沉淀和甲磺酸根离子，并且基本上不含卤素。对于金属粉末的制造方法，通过在包含还原剂溶液的液相的反应体系中的过渡金属的离子的还原作用使金属的离子析出而析出。对于形成金属膜的方法，在将待镀物体浸入包括还原剂溶液的反应体系的状态下，通过过渡金属的离子的还原作用使金属的离子减少，从而沉淀在待镀物体的表面上。版权所有（C）2005，JPO＆NCIPI

7. 发明专利

JP2004327687A Material for preventing electromagnetic interference 审中-公开
公开(公告)号：JP2004327687A
公开(公告)日：2004-11-18
申请号：JP2003119869
申请日：2003-04-24
申请人： Daiwa Fine Chemicals Co Ltd (Laboratory) , 株式会社大和化成研究所
发明人： OKUHAMA YOSHIAKI , OBATA KEIGO , YOSHIMOTO MASAKAZU , KIN TOUKEN
IPC分类号： H01F1/00 , H05K9/00
摘要： PROBLEM TO BE SOLVED: To provide a low-cost sheeted material for preventing electromagnetic interference which meets the demands of public in the effects of sufficiently shielding electromagnetic waves, in particular, magnetic field waves in a frequency domain of lower than 10MHz, and ensures shielding effects in a comparatively low frequency band attained not only by reflecting but also by absorbing electromagnetic waves. SOLUTION: The sheeted material for preventing electromagnetic interference is provided, in which at least one layer (layer A) of a soft magnetic metal film comprising microcrystal whose particle size is less than 100nm as observed by a transmission microscope, is formed by wet plating. A metal film layer (layer B) of better conductivity than that of the soft magnetic film is formed above or (and) below the layer A by wet plating to obtain a layer structure of two or more layers. COPYRIGHT: (C)2005,JPO&NCIPI

8. 发明专利

JP2004244719A Aliphatic sulfonic acid plating bath for tin or tin alloy 有权
公开(公告)号：JP2004244719A
公开(公告)日：2004-09-02
申请号：JP2003432338
申请日：2003-12-26
申请人： Daiwa Fine Chemicals Co Ltd (Laboratory) , Ishihara Chem Co Ltd , Mitsubishi Materials Corp , 三菱マテリアル株式会社 , 株式会社大和化成研究所 , 石原薬品株式会社
发明人： MASUDA AKIHIRO , OBINATA MASAYOSHI , OBATA KEIGO , YOSHIMOTO MASAKAZU , TSUJI SEIKI , UCHIDA MAMORU , ORI KEIJI , SAKAEGAWA MASAHIRO
IPC分类号： C25D3/32 , C25D3/56 , C25D3/60
CPC分类号： C25D3/32 , C25D3/60
摘要： PROBLEM TO BE SOLVED: To improve the reflow property and film appearance of a tin or tin alloy film. SOLUTION: The aliphatic sulfonic acid plating bath for tin and tin alloy contains (a) a soluble salt composed of a stannous salt and any of the salts of the metals selected from copper, bismuth, silver, indium, zinc, nickel, etc., and (b) aliphatic sulfonic acid composed of alkane sulfonic acid and alkanol sulfonic acid, in which the aliphatic sulfonic acid (b) precludes sulfur compounds as impurities exclusive of the sulfonic acid (a compound having a sulfur atom on the way of oxidation within the molecule and a compound having a sulfur atom and chlorine atom in combination within the molecule) or reduces such compounds down to a slight concentration. Examples of impurities that affect plating characteristics include dimethyl disulfide, methane thiosulfonic acid S-methyl and α-chlorodimethyl sulfone. COPYRIGHT: (C)2004,JPO&NCIPI

9. 发明专利

JP2013044001A Tin and tin alloy plating bath, and electronic part with electrodeposited film formed with the bath 有权
标题翻译： TIN和TIN合金涂层浴和电子部件与电泳膜形成与浴
公开(公告)号：JP2013044001A
公开(公告)日：2013-03-04
申请号：JP2011180987
申请日：2011-08-22
申请人： Ishihara Chem Co Ltd , 石原薬品株式会社 , Daiwa Fine Chemicals Co Ltd (Laboratory) , 株式会社大和化成研究所
发明人： NISHIKAWA TETSUJI , YOSHIMOTO MASAKAZU
IPC分类号： C25D3/32
摘要： PROBLEM TO BE SOLVED: To improve the appearance of an electrodeposited film and the uniformity of electrodeposition in a wide range of current density region and stabilize the composition ratio of a tin alloy film in a tin or tin alloy plating bath.SOLUTION: The tin or tin alloy plating bath contains (A) a soluble salt composed of any of a tin salt and a mixture of a tin salt and a salt of a predetermined metal such as silver, copper, bismuth, and lead, (B) an acid or a salt thereof, and (C) a specific phenanthroline-dione compound. The film has excellent electrodeposition uniformity and good film appearance in a wide range of current density region because the phenanthroline-dione compound is contained. In the tin alloy plating, a uniform alloy composition can be obtained in a wide range of current density region.
摘要翻译：要解决的问题：为了改善电沉积膜的外观和在电流密度范围宽的电沉积的均匀性，并稳定锡或锡合金电镀浴中锡合金膜的组成比。锡或锡合金电镀液含有（A）由锡盐和锡盐与预定金属的盐（如银，铜，铋和铅）的盐的混合物组成的可溶性盐，（B）酸或其盐，和（C）特殊的菲咯啉二酮化合物。由于含有菲咯啉二酮化合物，该膜在电流密度范围宽的范围内具有优异的电沉积均匀性和良好的膜外观。在锡合金镀层中，可以在宽的电流密度范围内获得均匀的合金组成。版权所有（C）2013，JPO＆INPIT

10. 发明专利

JP2013023693A Imidazole ring-bonded type oxyalkylene compound and plating bath containing the compound 有权
标题翻译：咪唑环键合型氧化亚烷基化合物和包含化合物的包衣浴
公开(公告)号：JP2013023693A
公开(公告)日：2013-02-04
申请号：JP2011155990
申请日：2011-07-14
申请人： Ishihara Chem Co Ltd , 石原薬品株式会社 , Daiwa Fine Chemicals Co Ltd (Laboratory) , 株式会社大和化成研究所
发明人： NISHIKAWA TETSUJI , SAKAEGAWA MASAHIRO , YOSHIMOTO MASAKAZU
IPC分类号： C25D3/30 , C08G65/333 , C23C18/31 , C23C18/48 , C25D3/12 , C25D3/22 , C25D3/34 , C25D3/38 , C25D3/46 , C25D3/48 , C25D3/50 , C25D3/56
摘要： PROBLEM TO BE SOLVED: To satisfy both of solubility in water and defoaming property and to make the management of plating solutions easy, in various kinds of plating baths.SOLUTION: A new imidazole ring-bonded type oxyalkylene compound includes an oxyalkylene chain selected from 2 to 4C alkylene, wherein an imidazole ring is bonded to the oxyalkylene chain through nitrogen atom at the third position and located at the terminal. When the oxyalkylene compound is used for various kinds of plating baths, foaming property is dominantly reduced while satisfactorily maintaining water solubility by introducing an imidazole ring group to the terminal in comparison with a conventional nonionic surfactant. When the oxyalkylene compound, in which an imidazole ring group exists in the molecule of a nonionic surfactant, is used for a copper plating bath for example, both of the action of the surfactant and leveling action are provided, and the plating solutions are easily managed.
摘要翻译：要解决的问题：为了满足在水中的溶解性和消泡性，并且能够在各种电镀浴中容易地进行电镀溶液的管理。解决方案：新的咪唑环键合氧化烯化合物包括选自2至4个亚烷基的氧化烯链，其中咪唑环通过位于末端的第三位的氮原子与氧化烯链结合。当将氧化烯化合物用于各种电镀浴时，与常规的非离子表面活性剂相比，通过将咪唑环引入末端，令人满意地保持水溶性，从而显着降低发泡性。当在非离子表面活性剂分子中存在咪唑环基的氧化烯化合物用于例如铜电镀浴时，提供表面活性剂的作用和流平作用，并且电镀溶液容易管理。版权所有（C）2013，JPO＆INPIT

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