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1. 发明专利

JP2010189753A Plating bath and plating method using the same 有权
标题翻译：使用它的镀锌浴和镀层方法
公开(公告)号：JP2010189753A
公开(公告)日：2010-09-02
申请号：JP2009038368
申请日：2009-02-20
申请人： Daiwa Fine Chemicals Co Ltd (Laboratory) , Kyoto Ichi , Metek Kitamura Co Ltd , Yasushi Mizutani , Toshihiro Nakamura , メテック北村株式会社 , 俊博中村 , 京都市 , 株式会社大和化成研究所 , 泰水谷
发明人： YOSHIMOTO MASAKAZU , KITAMURA SHINGO , KAWAGUCHI KEIKO , INOUE NAOYA , NAKAMURA TOSHIHIRO , MIZUTANI YASUSHI , NAKAI YOJI , NAWAFUNE HIDEMI
IPC分类号： C25D3/58
摘要： PROBLEM TO BE SOLVED: To provide a plating bath achieving good performance of a plating film and to provide a plating method using the bath. SOLUTION: The plating bath does not substantially contain a cyanide compound but contains: (A) a thiourea compound expressed by chemical formula (1), X 1 X 2 NC(=S)NX 3 X 4 ; and (B) at least one of water-soluble salt or water-soluble complex of a metal, as a plating metal, selected from elements in groups 8 to 11, group 12 except for mercury, group 13, group 14 and group 15 in the fourth to sixth periods of the periodical table. In formula (1), X 1 , X 2 , X 3 and X 4 each represents hydrogen, an alkyl or allyl group, or a group expressed by chemical formula (2), -(CHZ 1 -CH 2 -S) n -Y. In formula (2), Z 1 represents hydrogen or a methyl group; n represents an integer of 0 to 10; Y represents a group expressed by chemical formula (3), -CHZ 2 -CH 2 -D. In formula (3), Z 2 represents hydrogen or a methyl group; D represents SH, OH, NX 5 X 6 or COOH; X 5 and X 6 may be identical or different from each other; and at least one in X 1 , X 2 , X 3 and X 4 is a group expressed by formula (2). COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种获得镀膜性能良好的电镀浴，并提供使用该浴的电镀方法。电镀液基本上不含有氰化物，但含有：（A）由化学式（1）表示的硫脲化合物，X 1 X 2 NC（= S）NX 3 X 4 ; 和（B）除了汞，第13族，第14族和第15族之外，选自第8组至第11组，第12组的元素的金属的金属溶液盐或水溶性复合物中的至少一种作为电镀金属期刊第四至第六期。在式（1）中，X 1 ，X 2 ，X 3 和X 4 分别表示氢，烷基或烯丙基，或由化学式（2）表示的基团， - （CHZ 1 -S 。在式（2）中，Z 1表示氢或甲基; n表示0〜10的整数， Y表示由化学式（3）表示的基团，-CHZ 2 -CH 2 。在式（3）中，Z 2表示氢或甲基; D表示SH，OH，NX X 6或COOH; X 5 和X 6 可以相同或不同; X 1 ，X 2 ，X 3 和X 4 中的至少一个是由式（2）。版权所有（C）2010，JPO＆INPIT

2. 发明专利

JP2012237034A Aqueous solution for blackening metal surface, and method of carrying out blackening treatment 有权
标题翻译：用于盲孔金属表面的水溶液和进行黑化处理的方法
公开(公告)号：JP2012237034A
公开(公告)日：2012-12-06
申请号：JP2011106433
申请日：2011-05-11
申请人： Daiwa Fine Chemicals Co Ltd (Laboratory) , 株式会社大和化成研究所
发明人： KITAMURA SHINGO , SHIGEKUNI YUJI , YOSHIMOTO MASAKAZU
IPC分类号： C23C22/34 , C23C22/82
摘要： PROBLEM TO BE SOLVED: To provide a liquid and a method for blackening a metal, capable of forming a practically useful blackened metal by a simple method of allowing the metal to contact with the liquid for blackening metal under such a mild condition as to be at a temperature near room temperature, without using an electrolysis process.SOLUTION: The aqueous solution for blackening the surface of the metal comprises the following components (A) and (B), and the method of blackening the surface of the metal includes causing the surface of the metal to contact with the aqueous solution. The component (A) is one or more selected from the group consisting of a fluoride ion, a borofluoride ion and a silicofluoride ion. The component (B) is one or more of polar aprotic solvents.
摘要翻译：要解决的问题：提供一种能够使金属变黑的液体和方法，其能够通过简单的方法形成实用的黑色金属，该方法允许金属与液体接触，以在如下温和条件下使金属变黑：处于接近室温的温度，而不使用电解过程。解决方案：用于使金属表面变黑的水溶液包括以下组分（A）和（B），并且使金属表面变黑的方法包括使金属表面与水溶液接触。组分（A）是选自氟离子，氟氟化物离子和氟硅化物离子中的一种或多种。组分（B）是极性非质子溶剂中的一种或多种。版权所有（C）2013，JPO＆INPIT

3. 发明专利

JP2012177150A Surface-treated metal 有权
标题翻译：表面处理金属
公开(公告)号：JP2012177150A
公开(公告)日：2012-09-13
申请号：JP2011040197
申请日：2011-02-25
申请人： Daiwa Fine Chemicals Co Ltd (Laboratory) , 株式会社大和化成研究所
发明人： KITAMURA SHINGO , NANBU JUNICHI , YOSHIMOTO MASAKAZU
IPC分类号： C23C22/48 , C23C22/40
摘要： PROBLEM TO BE SOLVED: To provide a surface-treated metal with superior corrosion resistance suitable for practical use without using a coating agent such as a resin, and to provide a chemical conversion treatment method.SOLUTION: The surface-treated metal includes a coating layer containing a tannin compound and a thiol compound on a surface of metallic base material.
摘要翻译：要解决的问题：提供一种表面处理金属具有优异的耐腐蚀性，适用于实际使用，而不使用树脂等涂层剂，并提供化学转化处理方法。解决方案：表面处理的金属包括在金属基材的表面上含有单宁化合物和硫醇化合物的涂层。版权所有（C）2012，JPO＆INPIT

4. 发明专利

JP2009041092A Chemical treatment liquid for galvanizing or galvannealing film, and method for forming corrosion protection coating using the same 有权
标题翻译：化学处理液体用于镀锌或镀锌膜，以及使用其形成耐腐蚀涂层的方法
公开(公告)号：JP2009041092A
公开(公告)日：2009-02-26
申请号：JP2007210016
申请日：2007-08-10
申请人： Daiwa Fine Chemicals Co Ltd (Laboratory) , 株式会社大和化成研究所
发明人： KITAMURA SHINGO , OMORI SATOSHI , YOSHIMOTO MASAKAZU
IPC分类号： C23C22/30
CPC分类号： C23C2222/10
摘要： PROBLEM TO BE SOLVED: To provide a chemical treatment liquid capable of forming a corrosion protection coating in which satisfactory corrosion protection performance can be obtained with high reproducibility and high uniformity, and variation is hard to occur in the corrosion protection performance.
SOLUTION: Disclosed is a chemical treatment liquid for a galvanizing or galvannealing coating which does not substantially comprise hexavalent chromium ions, and at least comprises the following (A) to (F): (A) trivalent chromium ions; (B) nitric acid ions; (C) one or more of ≤8C aliphatic polycarboxylic acids other than carbon which compose a carboxyl group; (D) one or more metal ions selected from iron, cobalt and nickel; (E) zinc ions; and (F) one or more 1 to 6C aliphatic alcohols.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供能够形成耐腐蚀保护涂层的化学处理液，其中可以以高再现性和高均匀性获得令人满意的防腐蚀性能，并且在防腐蚀性能方面难以发生变化。解决方案：公开了一种基本上不含六价铬离子的镀锌或合金化镀层的化学处理液，并且至少包括以下（A）至（F）：（A）三价铬离子; （B）硝酸离子; （C）除了构成羧基的碳以外的≤8C脂肪族多元羧酸中的一种以上; （D）一种或多种选自铁，钴和镍的金属离子; （E）锌离子; 和（F）一种或多种1至6C脂族醇。版权所有（C）2009，JPO＆INPIT

5. 发明专利

JP2007327127A Silver plating method 审中-公开
标题翻译：镀银方法
公开(公告)号：JP2007327127A
公开(公告)日：2007-12-20
申请号：JP2006161049
申请日：2006-06-09
申请人： Daiwa Fine Chemicals Co Ltd (Laboratory) , 株式会社大和化成研究所
发明人： YOSHIMOTO MASAKAZU , KITAMURA SHINGO , OMORI SATOSHI , KADOKAWA SOJI
IPC分类号： C25D5/10 , C25D3/38 , C25D3/46 , C25D5/02 , C25D17/00
CPC分类号： C25D3/46 , C25D3/38 , C25D5/022 , C25D5/10 , C25D5/34 , C25D17/002 , H05K3/244
摘要： PROBLEM TO BE SOLVED: To provide a method of applying silver plating using a non-cyan acidic plating bath, free from the dissolution of a resist in pattern plating and having good adhesion.
SOLUTION: The silver plating method of applying the silver plating using the non cyan acidic silver plating bath (A) includes a step of strike-plating using a non cyan acidic strike bath (B) before the silver plating.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种使用非青色酸性电镀浴施加镀银的方法，其不会在图案电镀中溶解抗蚀剂并且具有良好的粘附性。解决方案：使用非青色酸性镀银浴（A）施加银镀的镀银方法包括在镀银之前使用非青色酸性镀浴（B）进行镀覆的步骤。版权所有（C）2008，JPO＆INPIT

6. 发明专利

JP2006286345A Surface finishing method of hydrogen storage alloy, surface-finished hydrogen storage alloy, and nickel-hydrogen secondary battery using the same 审中-公开
标题翻译：氢储存合金表面处理方法，表面处理氢储存合金及使用其的镍氢二次电池
公开(公告)号：JP2006286345A
公开(公告)日：2006-10-19
申请号：JP2005103386
申请日：2005-03-31
申请人： Arakawa Chem Ind Co Ltd , Daiwa Fine Chemicals Co Ltd (Laboratory) , 株式会社大和化成研究所 , 荒川化学工業株式会社
发明人： KITAMURA SHINGO , OBATA KEIGO , KOBAYASHI MICHINORI , MIZUIE JIRO
IPC分类号： H01M4/38 , C23C18/16 , C23C18/34 , H01M10/30
CPC分类号： Y02E60/124
摘要： PROBLEM TO BE SOLVED: To provide a surface finishing method of a hydrogen storage alloy, a surface-finished hydrogen storage alloy, and a nickel-hydrogen secondary battery using this alloy. SOLUTION: The surface finishing method of the hydrogen storage alloy particle is characterized by improvement of the electrochemical performance, especially the initial cycle activity and high rate of discharging characteristics, as well as enhancement of the cycle life performance through formation of the durable nickel-coating film on a surface of the hydrogen storage alloy particle and control of its coating amount within the specified range. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供使用该合金的储氢合金的表面精加工方法，表面处理的储氢合金和镍氢二次电池。解决方案：储氢合金颗粒的表面处理方法的特征在于改善电化学性能，特别是初始循环活性和高放电特性，以及通过形成耐用性来提高循环寿命性能在该储氢合金粒子的表面上形成镍涂膜，将其涂敷量控制在规定范围内。版权所有（C）2007，JPO＆INPIT

7. 发明专利

JP2009149965A Silver-plating method 有权
标题翻译：镀银方法
公开(公告)号：JP2009149965A
公开(公告)日：2009-07-09
申请号：JP2007341848
申请日：2007-12-19
申请人： Daiwa Fine Chemicals Co Ltd (Laboratory) , 株式会社大和化成研究所
发明人： YOSHIMOTO MASAKAZU , KITAMURA SHINGO , OMORI SATOSHI , KADOKAWA SOJI
IPC分类号： C25D3/46 , C25D5/24
CPC分类号： C25D3/46 , C25D5/34
摘要： PROBLEM TO BE SOLVED: To provide a silver-plating method, which does not need to form an unnecessary layer of a nickel layer inbetween a substrate which is difficult to be plated and a silver-plated film, and can form the silver-plated film having sufficient adhesiveness directly on the substrate which is difficult to be plated with the use of a halide-free plating bath under a satisfactory working environment.
SOLUTION: The silver-plating method is used for forming the silver-plated film on the substrate on which an oxide film is easily formed and the oxide film hinders the adhesiveness of a plated film, and comprises at least the steps of: (A) degreasing the substrate; (B) removing the oxide film with a strongly acidic solution; and subsequently to the step (B), (C) plating the substrate with silver by using a phosphine-containing acidic silver-plating bath which essentially does not contain a halide ion and a cyanide ion while skipping a step of nickel strike plating or nickel-alloy strike plating.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种镀银方法，其不需要在难以镀覆的基板和镀银膜之间形成不需要的镍层的层，并且可以形成银在基板上直接具有足够的粘合性的薄膜，其难以在令人满意的工作环境下使用不含卤化物的电镀液进行电镀。解决方案：使用镀银方法在容易形成氧化膜的基板上形成镀银膜，并且氧化膜阻碍电镀膜的粘附性，并且至少包括以下步骤：（A）脱脂基材; （B）用强酸溶液除去氧化膜; 然后在步骤（B）中，（C）通过使用基本上不含有卤离子和氰离子的含磷酸性镀银浴，同时跳过镍触镀或镍的步骤合金打击电镀。版权所有（C）2009，JPO＆INPIT

8. 发明专利

JP2005129254A Negative electrode for lithium secondary battery 有权
标题翻译：用于锂二次电池的负极
公开(公告)号：JP2005129254A
公开(公告)日：2005-05-19
申请号：JP2003360655
申请日：2003-10-21
申请人： Daiwa Fine Chemicals Co Ltd (Laboratory) , National Institute Of Advanced Industrial & Technology , 株式会社大和化成研究所 , 独立行政法人産業技術総合研究所
发明人： KITAMURA SHINGO , KIN TOUKEN , OBATA KEIGO , SAKAI TETSUO
IPC分类号： C23C28/02 , C22C9/02 , C22C13/00 , C22C19/03 , C22C38/00 , H01M4/13 , H01M4/134 , H01M4/139 , H01M4/1395 , H01M4/38 , H01M4/66 , H01M4/80 , H01M10/05 , H01M4/02 , H01M4/04 , H01M10/40
CPC分类号： Y02P70/54
摘要： PROBLEM TO BE SOLVED: To provide a new electrode for a secondary battery which has a high charge and discharge capacity and a long cycle lifetime, and which is highly useful as a negative electrode of a lithium-ion secondary battery. SOLUTION: This is the electrode for the lithium secondary battery containing a substrate composed of a sheet-shaped non-conductive material having a fine structure, and an active material layer composed of tin or tin alloy formed on a surface part of the substrate and a surface of the inside of the fine structure. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种具有高充放电能力和长循环寿命的二次电池用新型电极，作为锂离子二次电池的负极是非常有用的。解决方案：这是含有由具有微细结构的片状非导电材料构成的基板的锂二次电池用电极和由锡或锡合金构成的活性物质层，底物和精细结构内部的表面。版权所有（C）2005，JPO＆NCIPI

9. 发明专利

JP2004190042A Pretreatment solution for providing catalyst for electroless plating, pretreatment method using the solution, and electroless plated film and/or plated object produced by use of the method 有权
公开(公告)号：JP2004190042A
公开(公告)日：2004-07-08
申请号：JP2002326687
申请日：2002-11-11
申请人： Daiwa Fine Chemicals Co Ltd (Laboratory) , 株式会社大和化成研究所
发明人： OKUHAMA YOSHIAKI , OBATA KEIGO , YOSHIMOTO MASAKAZU , KIN TOUKEN , KITAMURA SHINGO , NAKAO SEIICHIRO , TSUJI HIDENORI , NAWAFUNE HIDEMI
IPC分类号： C23C18/18 , C23C18/31
摘要： PROBLEM TO BE SOLVED: To provide pretreatment solution for providing catalyst for electroless plating, and a pretreatment method using the solution. SOLUTION: The pretreatment solution comprises a silver colloidal solution containing, as essential components, at least the following components (I), (II) and (III): (I) silver colloidal particles, (II) one or two or more kinds of ions selected from ions of a metal having an electric potential capable of reducing silver ions to metal silver in the solution and/or ions oxidized at the time of reduction of the silver ions, and (III) one or two or more kinds of ions selected from hydroxycarboxylate ions, condensed phosphate ions and/or aminocarboxylate ions, the silver colloidal particles in (I) produced by the ions of the metal having an electric potential capable of reducing silver ions in (II) to metal silver. When an object to be plated is pretreated, effective catalyst for electroless plating is provided thereby. COPYRIGHT: (C)2004,JPO&NCIPI

10. 发明专利

JP2004043947A Method for forming circuit pattern 有权
公开(公告)号：JP2004043947A
公开(公告)日：2004-02-12
申请号：JP2002326652
申请日：2002-11-11
申请人： Daiwa Fine Chemicals Co Ltd (Laboratory) , 株式会社大和化成研究所
发明人： OKUHAMA YOSHIAKI , OBATA KEIGO , YOSHIMOTO MASAKAZU , KITAMURA SHINGO , NAKAO SEIICHIRO , MASUYAMA OSAMU , TSUJI HIDENORI
IPC分类号： C23C18/28 , B05D3/10 , B05D5/12 , C23C18/16 , C23C18/30 , C23C18/38 , H01B13/00 , H05K3/06 , H05K3/18 , H05K3/46
CPC分类号： C23C18/161 , C23C18/1651 , C23C18/30 , H05K3/181 , Y10T29/49121 , Y10T29/49156
摘要： PROBLEM TO BE SOLVED: To provide a circuit pattern forming method applying especially an electroless plating technology. SOLUTION: The circuit pattern forming method contains at least (a) a process in which a copper film is formed by applying the electroless copper plating on a nonconductor and (b) a process in which the circuit pattern is formed by etching the copper film. In the process (a) and in the catalyst impartation for the electroless copper plating, at least silver colloidal particles, one or more kinds selected from an ion of a metal having an electric potential capable of reducing a silver ion to a metallic silver in a solution or (and) an ion which is oxidized when the ion reduces the silver ion and one or more kinds selected from among a hydroxy carboxylic acid ion, a condensed phosphoric acid ion and/or an amine carboxylic acid ion are contained as essential components. Further, a silver colloidal solution obtained by the ion of the metal having the electric potential capable of reducing the silver ion to the metallic silver is used as the silver colloidal particles. COPYRIGHT: (C)2004,JPO

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