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    • 6. 发明授权
    • Monolithic optoelectronic integrated circuit
    • 单片光电集成电路
    • US5237633A
    • 1993-08-17
    • US791708
    • 1991-11-14
    • Craig A. GawPaige M. HolmKwong-Han H. LeungGeorge W. RhyneDaniel L. Rode
    • Craig A. GawPaige M. HolmKwong-Han H. LeungGeorge W. RhyneDaniel L. Rode
    • H04B10/12H05B33/08
    • H05B33/0818H05B33/0803
    • A monolithic optoelectronic integrated circuit having an optical emission portion (18) and a drive portion (11, or 22 and 21). The drive portion is capable of accepting TTL and standard CMOS logic voltage levels. In a first embodiment, the monolithic optoelectronic integrated circuit (10) has a light emitting diode (18) driven by a dual gate FET (11). In a second embodiment, the monolithic optoelectronic integrated circuit (20) has a light emitting diode (18) driven by two FETs (22 and 21). In each embodiment (10 or 20), a gate (13 or 23) of the respective drive circuit accepts the TTL or standard CMOS logic voltage. Further, in each embodiment current limiting is accomplished by coupling a gate with the source of the FET (11 or 22). Thus, the output of the light emitting diode (18, 18) is controlled by an input signal to the drive circuit.
    • 具有光发射部分(18)和驱动部分(11或22和21)的单片光电集成电路。 驱动部分能够接受TTL和标准CMOS逻辑电压电平。 在第一实施例中,单片光电集成电路(10)具有由双栅极FET(11)驱动的发光二极管(18)。 在第二实施例中,单片光电集成电路(20)具有由两个FET(22和21)驱动的发光二极管(18)。 在每个实施例(10或20)中,相应驱动电路的栅极(13或23)接受TTL或标准CMOS逻辑电压。 此外,在每个实施例中,通过将栅极与FET(11或22)的源耦合来实现电流限制。 因此,发光二极管(18,18)的输出由驱动电路的输入信号控制。
    • 7. 发明授权
    • Self aligned, substrate emitting LED
    • 自对准,衬底发射LED
    • US4989050A
    • 1991-01-29
    • US399049
    • 1989-08-28
    • Craig A. GawCurtis D. Moyer
    • Craig A. GawCurtis D. Moyer
    • H01L33/00H01L33/38
    • H01L33/38H01L33/0025H01L33/0062
    • A light emitting diode is provided comprising a substrate which is transparent to the emitted light upon which a plurality of semiconductor layers, including a quantum well active layer, are formed. The materials are chosen not only for their optical characteristics but also so that many of the layers act as etch stops for layers which are formed on top of them. In addition to operational semiconductor layes which form the light emitting diode, two sacrificial semiconductor layers are formed on the substrate which serve as masks during processing and are removed prior to device metallization. An initial pattern is formed in the uppermost semiconductor layer and is transferred down through lower layers using the etch stop layers and selective etches so that further photolithography steps are unnecessary. Electrodes are formed on one side of the device by conventional metal deposition techniques and are self aligned to the LED junction.
    • 提供了一种发光二极管,其包括对发射的光透明的衬底,在衬底上形成包括量子阱活性层的多个半导体层。 这些材料不仅用于其光学特性,而且还使得许多层用作形成在它们之上的层的蚀刻停止。 除了形成发光二极管的操作半导体层之外,在衬底上形成两个牺牲半导体层,其在处理期间用作掩模,并且在器件金属化之前被去除。 在最上半导体层中形成初始图案,并且通过使用蚀刻停止层和选择性蚀刻的下层向下传送,使得不需要进一步的光刻步骤。 电极通过常规的金属沉积技术形成在器件的一侧,并且与LED结自对准。