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    • 1. 发明授权
    • Antiblooming structure for solid-state image sensor
    • 固态图像传感器的抗隆起结构
    • US5349215A
    • 1994-09-20
    • US95504
    • 1993-07-23
    • Constantine N. AnagnostopoulosWin-Chyi ChangEric G. StevensGeorgia R. Torok
    • Constantine N. AnagnostopoulosWin-Chyi ChangEric G. StevensGeorgia R. Torok
    • H01L27/148H01L27/14
    • H01L27/14887
    • Solid-state image sensors, in general, comprise a photodetector for detecting radiation from the image and converting the radiation to charge carriers, and transfer means for carrying the charge carriers to an output circuit. One type of solid-state image sensor uses a CCD as both the photodetector and the transfer means. The solid-state image sensor generally includes a plurality of the CCD's arranged in spaced parallel relation to form an array. The image sensor of this disclosure utilizes only one antiblooming lateral overflow barrier. The excess signal charge of phase 1 flows into the preceding phase 2 and is saved. This eliminates the overflow barrier of phase 1 so that blooming protection is via the overflow barrier of the preceding phase 2. This results in an image sensor with blooming protection and increased charge capacity.
    • 固态图像传感器通常包括用于检测来自图像的辐射并将辐射转换为电荷载流子的光电检测器,以及用于将电荷载体携带到输出电路的转移装置。 一种类型的固态图像传感器使用CCD作为光电检测器和转印装置。 固态图像传感器通常包括以间隔开的平行关系布置的多个CCD,以形成阵列。 本公开的图像传感器仅使用一个防侧向横向溢流屏障。 相1的过量信号电荷流入前一相2并被保存。 这消除了相1的溢出屏障,使得起霜保护通过前一相2的溢流屏障。这导致具有防霜保护和增加充电容量的图像传感器。
    • 2. 发明授权
    • Transfer region design for charge-coupled device image sensor
    • 电荷耦合器件图像传感器的传输区域设计
    • US5235196A
    • 1993-08-10
    • US918093
    • 1992-07-24
    • Constantine N. AnagnostopoulosHerbert J. ErhardtEric G. StevensRobert H. Philbrick
    • Constantine N. AnagnostopoulosHerbert J. ErhardtEric G. StevensRobert H. Philbrick
    • H01L27/148
    • H01L27/14831
    • The present invention is directed to an image sensor which comprises a body of a semiconductor material having therein a plurality of photodetectors arranged in a line and a CCD shift register extending along the line of photodetectors adjacent to but spaced from an edge of the photodetectors. The CCD shift register includes a channel region and a plurality of first and second gate electrodes extending over and insulated from the channel region. One of each of the first and second gate electrodes extends across a portion of the edge of each photodetector. Each of the first electrodes has an arm extending along the entire edge of its respective photodetector between the photodetector and the second gate electrode. A separate transfer region is in the body between the edge of each photodetector and its respective first electrode and extends along the entire edge of the photodetector. A transfer gate is over and insulated from the transfer regions.
    • 本发明涉及一种图像传感器,其包括半导体材料本体,其中具有排列成一行的多个光电检测器,以及沿着与光电检测器的边缘相邻但间隔开的光电检测器线延伸的CCD移位寄存器。 CCD移位寄存器包括沟道区和多个第一和第二栅电极,其延伸并且与沟道区绝缘。 第一和第二栅电极中的每一个延伸穿过每个光电检测器的边缘的一部分。 每个第一电极具有在光电检测器和第二栅电极之间沿其各自的光电检测器的整个边缘延伸的臂。 单独的转移区域位于每个光电检测器的边缘和其相应的第一电极之间的本体中,并且沿着光电检测器的整个边缘延伸。 转移栅极结束并与转移区域绝缘。
    • 3. 发明申请
    • PHOTODETECTOR ISOLATION IN IMAGE SENSORS
    • 图像传感器中的光电隔离
    • US20120080731A1
    • 2012-04-05
    • US12894262
    • 2010-09-30
    • Hung Q. DoanEric G. StevensRobert M. Guidash
    • Hung Q. DoanEric G. StevensRobert M. Guidash
    • H01L27/146
    • H01L27/1463H01L27/14607H01L27/1461H01L27/14645H01L27/14689
    • A first shallow trench isolation region is disposed in the silicon semiconductor layer laterally adjacent to a photodetector while a second shallow trench isolation region is disposed in the silicon semiconductor layer laterally adjacent to other electrical components in a pixel. The first and second shallow trench isolation regions each include a trench disposed in the silicon semiconductor layer that is filled with a dielectric material. An isolation layer having the second conductivity is disposed only along a portion of a bottom and only along a sidewall of the trench immediately adjacent to the photodetector. The isolation layer is not disposed along the other portion of the bottom and along the other sidewall of the trench adjacent the photodetector. The isolation layer is not disposed along the bottom and sidewalls of the trench adjacent to the other electrical components.
    • 第一浅沟槽隔离区域设置在与半导体器件的光电探测器侧向相邻的硅半导体层中,而第二浅沟槽隔离区域设置在与半导体层中的像素中的其它电气元件横向相邻的硅半导体层中。 第一和第二浅沟槽隔离区域各自包括设置在硅半导体层中的填充有电介质材料的沟槽。 具有第二导电性的隔离层仅沿着底部的一部分并且仅沿着与光电检测器紧邻的沟槽的侧壁设置。 隔离层不沿着底部的另一部分并且沿着邻近光电检测器的沟槽的另一个侧壁设置。 绝缘层不沿着与其它电气部件相邻的沟槽的底部和侧壁设置。
    • 4. 发明申请
    • TRENCH ISOLATION REGIONS IN IMAGE SENSORS
    • 图像传感器中的分离区域
    • US20100148230A1
    • 2010-06-17
    • US12332407
    • 2008-12-11
    • Eric G. StevensHung Q. Doan
    • Eric G. StevensHung Q. Doan
    • H01L21/762H01L31/112
    • H01L27/14689H01L21/76224H01L27/1463
    • Trenches are formed in a substrate or layer and a solid source doped with one or more dopants is deposited over the image sensor such that the solid source fills the one or more trenches and is disposed on the surface of the substrate. The surface of the image sensor is then planarized so that the solid source remains only in the trenches. A thermal drive operation is performed to cause at least a portion of the one or more dopants in the solid source to diffuse into the portions of the substrate or layer that are immediately adjacent to and surround the sidewall and bottom surfaces of the trenches. The diffused dopant or dopants form passivation regions that passivate the interface between the substrate or layer and the sidewall and bottom surfaces of the trenches.
    • 沟槽形成在衬底或层中,并且掺杂有一种或多种掺杂剂的固体源沉积在图像传感器上,使得固体源填充一个或多个沟槽并且设置在衬底的表面上。 然后将图像传感器的表面平坦化,使得固体源仅保留在沟槽中。 执行热驱动操作以使固体源中的一种或多种掺杂剂的至少一部分扩散到紧邻和围绕沟槽的侧壁和底表面的衬底或层的部分。 扩散掺杂剂或掺杂剂形成钝化区域,其钝化衬底或层与沟槽的侧壁和底表面之间的界面。