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    • 3. 发明授权
    • Reduce line end pull back by exposing and etching space after mask one trim and etch
    • 通过在掩模一次修整和蚀刻后曝光和蚀刻空间来减少线端拉回
    • US07015148B1
    • 2006-03-21
    • US10852883
    • 2004-05-25
    • Todd P. LukancLuigi CapodieciChristopher A. SpenceJoerg ReissSarah N. McGowan
    • Todd P. LukancLuigi CapodieciChristopher A. SpenceJoerg ReissSarah N. McGowan
    • H01L21/302H01L21/461
    • H01L21/0276H01L21/28123H01L21/28282H01L21/32139
    • The invention is a method of manufacturing a semiconductor device and such semiconductor device. The semiconductor device includes an integrated circuit pattern including a horizontal line, a vertical line and a space therebetween, the space including a precise width dimension. The method includes the steps of: forming a photosensitive layer to be patterned, patterning the photosensitive layer to form a pattern including a master horizontal line and a master vertical line without a space therebetween, transferring the pattern to at least one underlying layer using the patterned photosensitive layer, forming a second photosensitive layer over the patterned at least one underlying layer, patterning the second photosensitive layer to form a second pattern including a master space aligned to dissect a horizontal line and a vertical line formed in the at least one underlying layer, and transferring the second pattern to the at least one underlying layer to form a third pattern including a horizontal line and a vertical line with a space therebetween, the space including a precise width dimension.
    • 本发明是制造半导体器件和这种半导体器件的方法。 半导体器件包括集成电路图案,其包括水平线,垂直线和它们之间的空间,该空间包括精确的宽度尺寸。 该方法包括以下步骤:形成待图案化的感光层,图案化感光层以形成包括主水平线和主垂直线的图案,其间没有间隙,使用图案化将图案转移到至少一个下层 在所述图案化的至少一个下层上形成第二感光层,对所述第二感光层进行图案化,以形成第二图案,所述第二图案包括对准以剖开在所述至少一个下层中形成的水​​平线和垂直线的主空间, 以及将所述第二图案转移到所述至少一个下层,以形成包括水平线和在其间具有空间的垂直线的第三图案,所述空间包括精确的宽度尺寸。