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1. 发明授权

US06978189B1 Matching data related to multiple metrology tools 有权
标题翻译：匹配与多个计量工具相关的数据
公开(公告)号：US06978189B1
公开(公告)日：2005-12-20
申请号：US10156450
申请日：2002-05-28
申请人： Christopher A. Bode , Matthew A. Purdy , Alexander J. Pasadyn
发明人： Christopher A. Bode , Matthew A. Purdy , Alexander J. Pasadyn
IPC分类号： G06F19/00 , H01L21/00
CPC分类号： H01L21/67288 , H01L21/67253
摘要： A method and an apparatus for matching data related to an integrated metrology tool and a standalone metrology tool. At least one semiconductor wafer is processed. An integrated metrology tool and/or a standalone metrology tool is matched based upon a difference between metrology data relating to a processed semiconductor wafer acquired by the integrated metrology tool and metrology data acquired by the standalone metrology tool, using a controller.
摘要翻译：一种用于匹配与综合计量工具相关的数据的方法和装置以及独立计量工具。至少一个半导体晶片被处理。基于与由综合计量工具获得的经处理的半导体晶片相关的度量数据与使用控制器由独立计量工具获取的度量数据之间的差异进行匹配的综合计量工具和/或独立计量工具。

2. 发明授权

US06788988B1 Method and apparatus using integrated metrology data for pre-process and post-process control 有权
标题翻译：使用集成度量数据进行预处理和后处理控制的方法和装置
公开(公告)号：US06788988B1
公开(公告)日：2004-09-07
申请号：US10023098
申请日：2001-12-17
申请人： Alexander J. Pasadyn , Christopher A. Bode
发明人： Alexander J. Pasadyn , Christopher A. Bode
IPC分类号： G06F1900
CPC分类号： G05B15/02 , H01L22/20 , H01L2223/54453
摘要： A method and an apparatus for acquiring pre-process and post-process integrated metrology data. A lot of semiconductor wafers is provided. A pre-process integrated metrology data acquisition from a first semiconductor wafer within the lot of semiconductor wafers is performed. A process operation on the first semiconductor wafer is performed at least partially during the process of acquiring pre-process metrology data from a second semiconductor wafer within the lot of semiconductor wafers. Post-process integrated metrology data is acquired from the first semiconductor wafer in response to processing of the first semiconductor wafer. The pre-process and the post-process metrology data is analyzed for evaluation of the process operation performed on the first semiconductor wafer.
摘要翻译：一种用于获取预处理和后处理综合度量数据的方法和装置。提供了许多半导体晶片。执行在许多半导体晶片内的第一半导体晶片的预处理集成度量数据采集。在从多个半导体晶片的第二半导体晶片获取预处理测量数据的过程中，至少部分地执行在第一半导体晶片上的处理操作。响应于第一半导体晶片的处理，从第一半导体晶片获取后处理集成度量数据。分析预处理和后处理计量数据以评估在第一半导体晶片上执行的处理操作。

3. 发明授权

US06778873B1 Identifying a cause of a fault based on a process controller output 失效
标题翻译：根据过程控制器输出识别出故障的原因
公开(公告)号：US06778873B1
公开(公告)日：2004-08-17
申请号：US10210640
申请日：2002-07-31
申请人： Jin Wang , Elfido Coss, Jr. , Brian K. Cusson , Alexander J. Pasadyn , Michael L. Miller , Naomi M. Jenkins , Christopher A. Bode
发明人： Jin Wang , Elfido Coss, Jr. , Brian K. Cusson , Alexander J. Pasadyn , Michael L. Miller , Naomi M. Jenkins , Christopher A. Bode
IPC分类号： G06F1900
CPC分类号： G05B19/4184 , G05B23/0281 , G05B2219/31357 , G05B2219/31363 , G05B2219/32201 , Y02P90/14 , Y02P90/22
摘要： A method and apparatus is provided for identifying a cause of a fault based on controller output. The method comprises processing at least one workpiece under a direction of the controller and detecting a fault associated with the processing of the at least one workpiece. The method further includes determining a plurality of possible causes of the detected fault, identifying a more likely possible cause out of the plurality of possible causes, providing fault information associated with the identified more likely possible cause to the controller. The method further includes providing fault information associated with the identified more likely possible cause to the controller. The method further comprises adjusting the processing of one or more workpieces to be processed next based on the fault information provided to the controller. The method further includes generating prediction data associated with processing of the next workpieces, and comparing the prediction data to processing data associated with the processing of the next workpieces to identify a possible cause of the fault.
摘要翻译：提供了一种基于控制器输出来识别故障原因的方法和装置。该方法包括在控制器的方向上处理至少一个工件，并检测与至少一个工件的处理相关的故障。该方法还包括确定检测到的故障的多个可能的原因，从多个可能的原因中识别更可能的可能原因，将与所识别的更可能的可能原因相关联的故障信息提供给控制器。该方法还包括向控制器提供与所识别的更可能的可能原因相关联的故障信息。该方法还包括基于提供给控制器的故障信息来调整接下来要处理的一个或多个待处理工件的处理。该方法还包括生成与下一个工件的处理相关联的预测数据，以及将预测数据与与下一个工件的处理相关联的处理数据进行比较，以识别故障的可能原因。

4. 发明授权

US06756243B2 Method and apparatus for cascade control using integrated metrology 有权
标题翻译：使用综合计量的级联控制的方法和装置
公开(公告)号：US06756243B2
公开(公告)日：2004-06-29
申请号：US10020551
申请日：2001-10-30
申请人： Alexander J. Pasadyn , Christopher A. Bode
发明人： Alexander J. Pasadyn , Christopher A. Bode
IPC分类号： H01L2166
CPC分类号： H01L22/20 , H01L2223/54453 , Y10T29/41
摘要： A method and an apparatus for performing cascade control of processing of semiconductor wafers. A first semiconductor wafer for processing is received. A second semiconductor wafer for processing is received. A cascade processing operation upon the first and the second semiconductor wafers is performed, wherein the cascade processing operation comprises acquiring pre-process metrology data related to the second semiconductor wafer during at least a portion of a time period wherein the first semiconductor wafer is being processed.
摘要翻译：一种用于对半导体晶片的处理进行级联控制的方法和装置。接收用于处理的第一半导体晶片。接收用于处理的第二半导体晶片。执行在第一和第二半导体晶片上的级联处理操作，其中级联处理操作包括在其中正在处理第一半导体晶片的时间段的至少一部分期间获取与第二半导体晶片相关的预处理测量数据。

5. 发明授权

US06751518B1 Dynamic process state adjustment of a processing tool to reduce non-uniformity 有权
标题翻译：动态过程状态调整的加工工具减少不均匀性
公开(公告)号：US06751518B1
公开(公告)日：2004-06-15
申请号：US10134244
申请日：2002-04-29
申请人： Thomas J. Sonderman , Alexander J. Pasadyn , Christopher A. Bode
发明人： Thomas J. Sonderman , Alexander J. Pasadyn , Christopher A. Bode
IPC分类号： G06F1900
CPC分类号： H01L21/67276
摘要： A method and an apparatus for reducing process non-uniformity across a processed semiconductor wafers. A first semiconductor wafer is processed. A process non-uniformity associated with the first processed semiconductor wafer is identified. A feedback correction in response to the process non-uniformity during processing of a second semiconductor wafer is performed and/or a feed-forward compensation is performed in response to the process non-uniformity during a subsequent process performed across the first semiconductor wafer is performed.
摘要翻译：一种用于减少经处理的半导体晶片的工艺不均匀性的方法和装置。处理第一半导体晶片。识别与第一处理的半导体晶片相关联的工艺不均匀。执行响应于处理第二半导体晶片期间的处理不均匀性的反馈校正和/或响应于在第一半导体晶片执行的后续处理期间的处理不均匀性执行前馈补偿。

6. 发明授权

US06576385B2 Method of varying stepper exposure dose to compensate for across-wafer variations in photoresist thickness 失效
标题翻译：改变步进曝光剂量以补偿光致抗蚀剂厚度的跨晶片变化的方法
公开(公告)号：US06576385B2
公开(公告)日：2003-06-10
申请号：US09776206
申请日：2001-02-02
申请人： Christopher A. Bode , Joyce S. Oey Hewett , Alexander J. Pasadyn
发明人： Christopher A. Bode , Joyce S. Oey Hewett , Alexander J. Pasadyn
IPC分类号： G03F900
CPC分类号： G03F7/70558
摘要： A method of compensating for across-wafer variations in photoresist thickness is provided. The method comprises providing a wafer having a process layer formed there-above, forming a layer of photoresist above the process layer, measuring a thickness of the layer of photoresist at a plurality of locations to result in a plurality of thickness measurements, providing the thickness measurements to a controller that determines, based upon the thickness measurements, an exposure dose of an exposure process to be performed on the layer of photoresist, and performing the exposure process on the layer of photoresist using the determined exposure dose. This exposure dose may be varied on a flash-by-flash basis as the stepper tool “steps” across the surface of wafers. That is, the exposure dose for a group of flashes, or for each flash, may be varied in response to the thickness measurements.
摘要翻译：提供了补偿光致抗蚀剂厚度的跨晶片变化的方法。该方法包括提供具有在其上形成的处理层的晶片，在处理层上方形成光致抗蚀剂层，测量多个位置处的光致抗蚀剂层的厚度，以产生多个厚度测量值，从而提供厚度控制器的测量，其基于厚度测量确定将在光致抗蚀剂层上进行的曝光处理的曝光剂量，以及使用确定的曝光剂量对光致抗蚀剂层进行曝光处理。当步进工具跨越晶片表面“步进”时，该曝光剂量可以在逐闪的基础上变化。也就是说，一组闪光或每个闪光灯的曝光剂量可以响应于厚度测量而变化。

7. 发明授权

US08615314B1 Process control using analysis of an upstream process 有权
标题翻译：使用上游流程分析的流程控制
公开(公告)号：US08615314B1
公开(公告)日：2013-12-24
申请号：US10932989
申请日：2004-09-02
申请人： Thomas J. Sonderman , Christopher A. Bode , Alexander J. Pasadyn
发明人： Thomas J. Sonderman , Christopher A. Bode , Alexander J. Pasadyn
IPC分类号： G05B13/02
CPC分类号： G05B19/41875 , G05B2219/32182 , G05B2219/45031 , Y02P90/22
摘要： A method, apparatus and a system, for performing a process control using analysis of an upstream process is provided. The method comprises performing a first process on a workpiece and performing a qualitative analysis upon the workpiece relating to the first process, the qualitative analysis comprises analyzing at least one metrology measurement relating to the first process and a workpiece feature to evaluate a characteristic of the workpiece. The method further comprises selecting a process control parameter for performing a second process upon the workpiece based upon the qualitative analysis.
摘要翻译：提供了一种使用上游处理的分析进行处理控制的方法，装置和系统。该方法包括对工件执行第一过程并对与第一过程相关的工件执行定性分析，定性分析包括分析与第一过程有关的至少一个度量测量和工件特征以评估工件的特性。该方法还包括基于定性分析来选择用于对工件执行第二处理的过程控制参数。

8. 发明授权

US07424392B1 Applying a self-adaptive filter to a drifting process 失效
标题翻译：将自适应滤波器应用于漂移过程
公开(公告)号：US07424392B1
公开(公告)日：2008-09-09
申请号：US10323502
申请日：2002-12-18
申请人： Jin Wang , Robert J. Chong , Christopher A. Bode , Si-Zhao J. Qin , Alexander J. Pasadyn
发明人： Jin Wang , Robert J. Chong , Christopher A. Bode , Si-Zhao J. Qin , Alexander J. Pasadyn
IPC分类号： G06F17/18 , G21C17/00
CPC分类号： G05B19/41875 , G05B2219/32135 , G05B2219/32182 , G05B2219/32184 , G05B2219/37224 , G05B2219/41146 , G05B2219/41147 , G05B2219/50065 , Y02P90/22
摘要： A method and an apparatus are provided for applying a self-adaptive filter to a drifting process. The method includes processing a workpiece, measuring an output characteristic of the processed workpiece and modifying a previous estimated process state based at least on the measured output characteristic. The method further includes estimating a next process state based at least on the modified previous estimated process state.
摘要翻译：提供了一种用于将自适应滤波器应用于漂移过程的方法和装置。该方法包括处理工件，测量被处理工件的输出特性，以及至少基于所测量的输出特性修改先前的估计过程状态。该方法还包括至少基于修改的先前估计的处理状态来估计下一处理状态。

9. 发明授权

US06970757B1 Method and apparatus for updating control state variables of a process control model based on rework data 有权
标题翻译：基于返工数据更新过程控制模型的控制状态变量的方法和装置
公开(公告)号：US06970757B1
公开(公告)日：2005-11-29
申请号：US09838467
申请日：2001-04-19
申请人： Joyce S. Oey Hewett , Anthony J. Toprac , Christopher A. Bode , Alexander J. Pasadyn , Anastasia Oshelski Peterson , Thomas J. Sonderman , Michael L. Miller
发明人： Joyce S. Oey Hewett , Anthony J. Toprac , Christopher A. Bode , Alexander J. Pasadyn , Anastasia Oshelski Peterson , Thomas J. Sonderman , Michael L. Miller
IPC分类号： G05B19/418 , G06F19/00
CPC分类号： G05B19/41875 , G05B2219/32179 , G05B2219/32228 , G05B2219/45031 , Y02P90/22 , Y02P90/86
摘要： A method for controlling a manufacturing process includes processing a plurality of workpieces in a tool; monitoring a rework rate associated with the workpieces processed in the tool; and initiating an automatic corrective action in response to the rework rate being greater than a predetermined threshold. A manufacturing system includes a tool adapted to process a plurality of workpieces and a rework controller adapted to monitor a rework rate associated with the workpieces processed in the tool and initiate an automatic corrective action in response to the rework rate being greater than a predetermined threshold.
摘要翻译：一种用于控制制造过程的方法包括在工具中处理多个工件; 监测与工具中处理的工件相关联的返工率; 以及响应于所述返工率大于预定阈值而启动自动校正动作。制造系统包括适于处理多个工件的工具和适于监测与工具中处理的工件相关联的返工率的返工控制器，并响应于返工率大于预定阈值而启动自动校正动作。

10. 发明授权

US06937914B1 Method and apparatus for controlling process target values based on manufacturing metrics 失效
标题翻译：基于制造指标控制过程目标值的方法和装置
公开(公告)号：US06937914B1
公开(公告)日：2005-08-30
申请号：US09789872
申请日：2001-02-21
申请人： Christopher A. Bode , Thomas J. Sonderman , Alexander J. Pasadyn , Anthony J. Toprac , Joyce S. Oey Hewett , Anastasia Oshelski Peterson , Michael L. Miller
发明人： Christopher A. Bode , Thomas J. Sonderman , Alexander J. Pasadyn , Anthony J. Toprac , Joyce S. Oey Hewett , Anastasia Oshelski Peterson , Michael L. Miller
IPC分类号： G05B19/418 , G06F19/00
CPC分类号： G05B19/41865 , G05B2219/32063 , G05B2219/45031 , Y02P90/20 , Y02P90/86
摘要： A method for controlling a tool adapted to process workpieces in accordance with an operating recipe based on a process target value is provided. The method includes collecting manufacturing characteristic data associated with the workpieces; correlating the manufacturing characteristic data with a first manufacturing metric to generate a first manufacturing metric distribution for the workpieces; and adjusting the process target value based on the first manufacturing metric distribution. A manufacturing system includes a processing tool and a target monitor. The processing tool is adapted to process workpieces in accordance with an operating recipe based on a process target value. The target monitor is adapted to collect manufacturing characteristic data associated with the workpieces, correlate the manufacturing characteristic data with a first manufacturing metric to generate a first manufacturing metric distribution for the workpieces, and adjust the process target value based on the first manufacturing metric distribution.
摘要翻译：提供了一种用于控制适于根据基于过程目标值的操作配方来处理工件的工具的方法。该方法包括收集与工件相关联的制造特性数据; 将所述制造特征数据与第一制造度量相关联，以产生所述工件的第一制造度量分布; 以及基于所述第一制造度量分布来调整所述过程目标值。制造系统包括处理工具和目标监视器。处理工具适于根据基于过程目标值的操作配方来处理工件。目标监视器适于收集与工件相关联的制造特性数据，将制造特性数据与第一制造度量相关联，以产生工件的第一制造度量分布，并且基于第一制造度量分布来调整过程目标值。

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