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    • 1. 发明授权
    • Multiple branch alternative element power regulation
    • 多分支替代元件功率调节
    • US08278888B2
    • 2012-10-02
    • US13230466
    • 2011-09-12
    • Patrick K. EganJordan R. KeusemanMichael L. Miller
    • Patrick K. EganJordan R. KeusemanMichael L. Miller
    • G05F1/00
    • G05F1/563
    • A power regulation scheme includes a first voltage regulation portion connected in parallel with a second voltage regulation portion that regulates a voltage if an open condition occurs within the first voltage regulation portion. Each voltage regulation portion may include a first voltage regulator connected in series with a second voltage regulator that regulates the voltage if a short condition occurs within the first voltage regulator. Each voltage regulation portion may utilize a switching element to route an output voltage of the first voltage regulator past the second voltage regulator if the output voltage has been regulated and/or to force the output voltage to be regulated by the second voltage regulator if the output voltage has not been regulated.
    • 功率调节方案包括与第二电压调节部分并联连接的第一电压调节部分,其在第一电压调节部分内发生开路状态时调节电压。 每个电压调节部分可以包括与第二电压调节器串联连接的第一电压调节器,其在第一电压调节器内发生短路条件时调节电压。 如果输出电压已被调节,则每个电压调节部分可以使用开关元件来路由第一电压调节器的输出电压通过第二电压调节器,和/或如果输出电压被强制输出电压被第二电压调节器调节 电压没有被调节。
    • 2. 发明申请
    • Multiple Branch Alternative Element Power Regulation
    • 多分支替代元件功率调节
    • US20110031946A1
    • 2011-02-10
    • US12535191
    • 2009-08-04
    • Patrick K. EganJordan R. KeusemanMichael L. Miller
    • Patrick K. EganJordan R. KeusemanMichael L. Miller
    • G05F1/10
    • G05F1/563
    • A power regulation circuit includes at least a first regulator connected to a second regulator in series forming a first regulator pair and a third regulator connected to a fourth regulator in series forming a second regulator pair. The first regulator pair is connected in parallel with the second regulator pair. Each individual regulator is configured to separately regulate an input voltage to a predetermined regulated output voltage. The second regulator pair regulates the input voltage if a short condition occurs within the first regulator pair and the second and fourth regulators each regulate the input voltage if an open condition occurs within the first or third regulator respectively.
    • 功率调节电路至少包括连接到第二调节器的第一调节器,其串联地形成第一调节器对,以及连接到串联形成第二调节器对的第四调节器的第三调节器。 第一调节器对与第二调节器对并联。 每个单独的调节器被配置为分别地将输入电压调节到预定的调节输出电压。 如果在第一稳压器对内发生短路状态,则第二稳压器对调节输入电压,而第二和第四调节器分别在第一或第三稳压器内分别发生开路状态时调节输入电压。
    • 4. 发明授权
    • Portable friction forge welder
    • 便携式摩擦锻造焊机
    • US07770777B2
    • 2010-08-10
    • US11619707
    • 2007-01-04
    • Michael L. Miller
    • Michael L. Miller
    • B23K20/12
    • B23K20/1285
    • A portable friction forge welder that applies a direct rotational load to workpieces via a rotational actuator and a direct axial load to workpieces via an axial actuator, where the rotational actuator and the axial actuator have separate and independent power sources. The portable friction forge welder relies on a stored energy linear axial actuator or a center-hole hydraulic axial actuator to achieve high axial forces and a high torque, low rotational velocity to achieve rotational forces, enabling the welder to achieve higher quality welds using larger diameter workpieces than conventional portable friction welders. By applying a high axial force between workpieces prior to high torque rotation of the workpieces results in improved quality welds. A unique clamping device maintains a fixed positional relationship between the workpieces and includes a unique shroud that enables friction welds under a positive pressure inert atmosphere.
    • 一种便携式摩擦锻造焊机,其通过旋转致动器将直接旋转负载施加到工件,并且通过轴向致动器将直接轴向载荷施加到工件,其中旋转致动器和轴向致动器具有分离和独立的动力源。 便携式摩擦锻造焊机依靠储能线性轴向致动器或中心孔液压轴向致动器来实现高轴向力和高扭矩,低旋转速度以实现旋转力,使焊机能够使用更大直径的焊接实现更高质量的焊缝 工件比传统的便携式摩擦焊机。 通过在工件的高扭矩旋转之前在工件之间施加高的轴向力导致改进的质量焊接。 独特的夹紧装置保持工件之间的固定的位置关系,并且包括能够在正压惰性气氛下进行摩擦焊接的独特的护罩。
    • 7. 发明授权
    • Fault detection system with real-time database
    • 具有实时数据库的故障检测系统
    • US06868512B1
    • 2005-03-15
    • US10229226
    • 2002-08-27
    • Michael L. MillerElfido Coss, Jr.
    • Michael L. MillerElfido Coss, Jr.
    • H01L21/66H02H3/05G01R31/28
    • H01L22/20Y10S707/99953
    • A method includes receiving incoming fault detection and correction (FDC) data. The incoming FDC data is stored in a real-time database, A first subscriber list designating a first subscriber for at least a portion of the incoming FDC data is provided. The portion of the incoming FDC data designated in the first subscriber list is sent to the first subscriber. A system includes at least one data collection source, a real-time database, and a database management unit. The data collection source is configured to generate incoming fault detection and correction (FDC) data. The database management unit is configured to store the incoming FDC data in the real-time database, provide a first subscriber list designating a first subscriber for at least a portion of the incoming FDC data, and send the portion of the incoming FDC data designated in the first subscriber list to the first subscriber.
    • 一种方法包括接收进入的故障检测和校正(FDC)数据。 输入的FDC数据被存储在实时数据库中。提供了为输入FDC数据的至少一部分指定第一订户的第一用户列表。 在第一用户列表中指定的输入FDC数据的部分被发送到第一用户。 系统包括至少一个数据收集源,实时数据库和数据库管理单元。 数据采集​​源被配置为产生进入的故障检测和校正(FDC)数据。 数据库管理单元被配置为将输入的FDC数据存储在实时数据库中,为进入的FDC数据的至少一部分提供指定第一订户的第一订户列表,并且将指定的输入FDC数据的部分发送到 第一订阅者列表。
    • 8. 发明授权
    • Method and apparatus for controlling wafer uniformity using spatially resolved sensors
    • 使用空间分辨的传感器控制晶片均匀性的方法和装置
    • US06706541B1
    • 2004-03-16
    • US09421803
    • 1999-10-20
    • Anthony J. TopracMichael L. Miller
    • Anthony J. TopracMichael L. Miller
    • H01L2100
    • H01J37/32935H01J37/3299
    • A processing system includes a sensor, a processing tool, and an automatic process controller. The sensor has a plurality of sensing regions. The processing tool is adapted to process at least one process layer on a wafer. The process tool includes a process control device controllable by a process control variable. The sensor is adapted to measure a process layer characteristic of the process layer in a selected one of the sensing regions. The automatic process controller is adapted to receive the process layer characteristics measured by the sensor and adjust the process control variable in response to the process layer characteristic measured in one sensing region differing from the process layer characteristic measured in another sensing region. A method for controlling wafer uniformity includes processing a process layer on a wafer; measuring a characteristic of the layer in a plurality of sensing locations; and changing a process control variable of a process control device in response to the process layer characteristic measured in one sensing location differing from the process layer characteristic measured in another sensing location to affect the rate of processing the process layer in at least one of the sensing locations.
    • 处理系统包括传感器,处理工具和自动过程控制器。 传感器具有多个感测区域。 处理工具适于处理晶片上的至少一个处理层。 处理工具包括可由过程控制变量控制的过程控制装置。 传感器适于测量所选感测区域中的处理层的处理层特性。 自动过程控制器适于接收由传感器测量的过程层特性,并且响应于在与另一感测区域中测量的处理层特性不同的一个感测区域中测量的过程层特性来调整过程控制变量。 一种用于控制晶片均匀性的方法包括处理晶片上的处理层; 测量多个感测位置中的层的特性; 以及响应于在一个感测位置中测量的处理层特性改变过程控制设备的过程控制变量,所述过程控制变量与在另一感测位置中测量的过程层特性不同,以影响在至少一个感测中处理过程层的速率 位置。