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    • 3. 发明授权
    • Method for programming, erasing and reading a flash memory cell
    • 编程,擦除和读取闪存单元的方法
    • US06801456B1
    • 2004-10-05
    • US10707474
    • 2003-12-17
    • Ching-Hsiang HsuChih-Hsun ChuJih-Wen ChouCheng-Tung Huang
    • Ching-Hsiang HsuChih-Hsun ChuJih-Wen ChouCheng-Tung Huang
    • G11C1604
    • G11C16/10G11C16/0466
    • A method for programming PMOS single transistor flash memory cells through channel hot carrier induced hot electron injection mechanism is disclosed. The PMOS single transistor flash memory cell includes an ONO stack layer situated on an N-well of a semiconductor substrate, a P+ poly gate formed on the ONO stack layer, a P+ doped source region disposed in the N-well at one side of the gate, and a P+ doped drain region disposed in the N-well at the other side of the gate. The method includes the steps of: applying a word line voltage VWL on the P+ poly gate, applying a source line voltage VSL on the source, wherein the source line voltage VSL is greater than the word line voltage VWL, thereby providing adequate bias to turn on the P channel thereof. A bit line voltage that is smaller than the source line voltage VSL is applied on the P+ doped drain region, thereby driving channel hot holes to flow toward the P+ doped drain region and then inducing hot electron injection near the drain side. A well voltage VNW is applied to the N-well, wherein VNW=VSL.
    • 公开了一种通过通道热载流子诱发的热电子注入机制来编程PMOS单晶体管闪存单元的方法。 PMOS单晶体管闪存单元包括位于半导体衬底的N阱上的ONO堆叠层,形成在ONO堆叠层上的P +多晶硅栅极,设置在N + 并且在栅极的另一侧设置在N阱中的P +掺杂漏极区。 该方法包括以下步骤:在P ++多栅极上施加字线电压VWL,在源极上施加源极线电压VSL,其中源极线电压VSL大于字线电压VWL,从而提供足够的 偏置以打开其P通道。 小于源极线电压VSL的位线电压施加在P +掺杂漏极区域上,从而驱动通道热孔流向P +掺杂漏极区域,然后在漏极附近引入热电子注入 侧。 将井电压VNW施加到N阱,其中VNW = VSL。
    • 9. 发明授权
    • Structure of a low-voltage channel write/erase flash memory cell and fabricating method thereof
    • 低电压通道写入/擦除闪存单元的结构及其制造方法
    • US06677198B2
    • 2004-01-13
    • US10064109
    • 2002-06-12
    • Ching-Hsiang HsuChing-Sung Yang
    • Ching-Hsiang HsuChing-Sung Yang
    • H01L21336
    • H01L29/66825H01L21/28273H01L29/7883
    • The present invention relates to a structure of a low-voltage channel write/erase flash memory cell and a fabricating method thereof, which structure comprises an N-substrate, a deep P-well formed on the substrate, and an N-well formed on the deep P-well. A deep p-type region and a shallow p-type region are ion-implanted in the N-well. The deep p-type region is connected to the shallow p-type region. An n-type region is ion-implanted in the deep p-type region to be electrically shorted with the deep p-type region and be used as a drain. Another n-type region is also ion-implanted at one side of the shallow p-type region to be used as a source. The present invention can apply the same voltage to the deep P-well and the N-well on the N-substrate by adding in a triple well architecture so that the leakage current capably generated can be reduced to minimum, thereby effectively reducing end voltages when performing the operation of erasing, simplifying the design complexity of a charge pump circuit required by the whole structure, and enhancing the operating efficiency.
    • 本发明涉及一种低电压通道写入/擦除闪速存储单元的结构及其制造方法,该结构包括N衬底,在衬底上形成的深P阱以及形成在N阱上的N阱 深P井。 将深P型区域和浅P型区域离子注入到N阱中。 深P型区域连接到浅P型区域。 在深p型区域中离子注入n型区域,与深p型区域电短路并用作漏极。 另一个n型区域也被离子注入在用作源的浅P型区域的一侧。 本发明可以通过添加三阱结构将相同的电压施加在N衬底上的深P阱和N阱上,使得可以产生的泄漏电流可以减小到最小,从而有效地减少最终电压,当 执行擦除操作,简化了整个结构所需的电荷泵电路的设计复杂度,提高了运行效率。