会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 2. 发明授权
    • Method for programming, erasing and reading a flash memory cell
    • 编程,擦除和读取闪存单元的方法
    • US06801456B1
    • 2004-10-05
    • US10707474
    • 2003-12-17
    • Ching-Hsiang HsuChih-Hsun ChuJih-Wen ChouCheng-Tung Huang
    • Ching-Hsiang HsuChih-Hsun ChuJih-Wen ChouCheng-Tung Huang
    • G11C1604
    • G11C16/10G11C16/0466
    • A method for programming PMOS single transistor flash memory cells through channel hot carrier induced hot electron injection mechanism is disclosed. The PMOS single transistor flash memory cell includes an ONO stack layer situated on an N-well of a semiconductor substrate, a P+ poly gate formed on the ONO stack layer, a P+ doped source region disposed in the N-well at one side of the gate, and a P+ doped drain region disposed in the N-well at the other side of the gate. The method includes the steps of: applying a word line voltage VWL on the P+ poly gate, applying a source line voltage VSL on the source, wherein the source line voltage VSL is greater than the word line voltage VWL, thereby providing adequate bias to turn on the P channel thereof. A bit line voltage that is smaller than the source line voltage VSL is applied on the P+ doped drain region, thereby driving channel hot holes to flow toward the P+ doped drain region and then inducing hot electron injection near the drain side. A well voltage VNW is applied to the N-well, wherein VNW=VSL.
    • 公开了一种通过通道热载流子诱发的热电子注入机制来编程PMOS单晶体管闪存单元的方法。 PMOS单晶体管闪存单元包括位于半导体衬底的N阱上的ONO堆叠层,形成在ONO堆叠层上的P +多晶硅栅极,设置在N + 并且在栅极的另一侧设置在N阱中的P +掺杂漏极区。 该方法包括以下步骤:在P ++多栅极上施加字线电压VWL,在源极上施加源极线电压VSL,其中源极线电压VSL大于字线电压VWL,从而提供足够的 偏置以打开其P通道。 小于源极线电压VSL的位线电压施加在P +掺杂漏极区域上,从而驱动通道热孔流向P +掺杂漏极区域,然后在漏极附近引入热电子注入 侧。 将井电压VNW施加到N阱,其中VNW = VSL。
    • 9. 发明申请
    • NON-VOLATILE MEMORY WITH A STABLE THRESHOLD VOLTAGE ON SOI SUBSTRATE
    • 在SOI衬底上具有稳定阈值电压的非易失性存储器
    • US20110057243A1
    • 2011-03-10
    • US12943945
    • 2010-11-11
    • Hsin-Ming ChenHai-Ming LeeShih-Jye ShenChing-Hsiang Hsu
    • Hsin-Ming ChenHai-Ming LeeShih-Jye ShenChing-Hsiang Hsu
    • H01L27/12
    • H01L27/115
    • A non-volatile memory disposed in a SOI substrate is provided. The non-volatile memory includes a memory cell and a first conductive type doped region. The memory cell includes a gate, a charge storage structure, a bottom dielectric layer, a second conductive type drain region, and a second conductive type source region. The gate is disposed on the SOI substrate. The charge storage structure is disposed between the gate and the SOI substrate. The bottom dielectric layer is disposed between the charge storage layer and the SOI substrate. The second conductive type drain region and the second conductive type source region are disposed in a first conductive type silicon body layer next to the two sides of the gate. The first conductive type doped region is disposed in the first conductive type silicon body layer and electrically connected to the first conductive type silicon body layer beneath the gate.
    • 设置在SOI衬底中的非易失性存储器。 非易失性存储器包括存储单元和第一导电类型掺杂区域。 存储单元包括栅极,电荷存储结构,底部电介质层,第二导电类型漏极区域和第二导电型源极区域。 栅极设置在SOI衬底上。 电荷存储结构设置在栅极和SOI衬底之间。 底部电介质层设置在电荷存储层和SOI衬底之间。 第二导电型漏极区域和第二导电型源极区域设置在栅极的两侧旁边的第一导电型硅体层中。 第一导电型掺杂区域设置在第一导电型硅体层中,并且与栅极下方的第一导电型硅体层电连接。