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    • 6. 发明授权
    • Semiconductor memory device having improved data retention
    • 具有改进的数据保持的半导体存储器件
    • US06914825B2
    • 2005-07-05
    • US10249366
    • 2003-04-03
    • Ching-Hsiang HsuShih-Jye ShenMing-Chou Ho
    • Ching-Hsiang HsuShih-Jye ShenMing-Chou Ho
    • G11C16/04H01L21/8247H01L27/115
    • H01L27/11521G11C16/0408G11C2216/10H01L27/115H01L27/11558
    • A NVM device encompasses a MOS select transistor including a select gate electrically connected to a word line, a first source doping region electrically connected to a source line, and a first drain doping region. A MOS floating gate transistor is serially electrically connected to the MOS select transistor. The MOS floating gate transistor comprises a floating gate, a second source doping region electrically connected to the first drain doping region of the MOS select transistor, and a second drain doping region electrically connected to a bit line. The second source doping region and the second drain doping region define a floating gate channel. When the MOS floating gate transistor is programmed via a hot electron injection (HEI) mode, the floating gate is a P+ doped floating gate; when the MOS floating gate transistor is programmed via a hot hole injection (HHI) mode, the floating gate is an N+ doped floating gate.
    • NVM器件包括MOS选择晶体管,其包括电连接到字线的选择栅极,电连接到源极线的第一源极掺杂区域和第一漏极掺杂区域。 MOS浮栅晶体管与MOS选择晶体管串联电连接。 MOS浮栅晶体管包括浮置栅极,电连接到MOS选择晶体管的第一漏极掺杂区域的第二源极掺杂区域和电连接到位线的第二漏极掺杂区域。 第二源极掺杂区域和第二漏极掺杂区域限定浮动栅极沟道。 当通过热电子注入(HEI)模式对MOS浮栅晶体管进行编程时,浮栅是P + 当通过热空穴注入(HHI)模式来编程MOS浮栅晶体管时,浮置栅极是掺杂N +的浮栅。
    • 7. 发明授权
    • Method for operating N-channel electrically erasable programmable logic device
    • 用于操作N沟道电可擦除可编程逻辑器件的方法
    • US06842374B2
    • 2005-01-11
    • US10248283
    • 2003-01-06
    • Kung-Hong LeeChing-Hsiang HsuYa-Chin KingShih-Jye ShenMing-Chou Ho
    • Kung-Hong LeeChing-Hsiang HsuYa-Chin KingShih-Jye ShenMing-Chou Ho
    • G11C16/04H01L21/8247H01L27/115H01L29/788
    • H01L27/11521G11C16/0433G11C2216/10H01L27/115H01L27/11558H01L29/7885
    • An electrically erasable programmable logic device (EEPLD) contains a P-type substrate. A first N-type doped region is disposed in the P-type substrate. A first gate, which is used to store data, overlies the P-type substrate and is adjacent to the first N-type doped region. A second N-type doped region is laterally disposed in the P-type substrate. The second N-type doped region is also adjacent to the first gate. A second gate, which acts as a select gate or select gate of the EEPLD, overlies the P-type substrate and is adjacent to the second N-type doped region. A third N-type doped region is disposed in the P-type substrate. The third N-type doped region is adjacent to the second gate. By Applying a sufficient voltage on the first N-type doped region (VBL), and changing a select gate voltage (VSG) or the third N-type doped region voltage (VSL) applied on the second gate of the EEPLD, the operation of the EEPLD can be selectively implemented either under a channel hot hole (CHH) program mode or a channel hot electron (CHE) erase mode.
    • 电可擦除可编程逻辑器件(EEPLD)包含P型衬底。 第一N型掺杂区域设置在P型衬底中。 用于存储数据的第一栅极覆盖P型衬底并与第一N型掺杂区域相邻。 第二N型掺杂区域横向设置在P型衬底中。 第二N型掺杂区域也与第一栅极相邻。 作为EEPLD的选择栅极或选择栅极的第二栅极覆盖P型衬底并与第二N型掺杂区域相邻。 在P型衬底中设置第三N型掺杂区域。 第三N型掺杂区域与第二栅极相邻。 通过在第一N型掺杂区域(VBL)上施加足够的电压,并且改变施加在EEPLD的第二栅极上的选择栅极电压(VSG)或第三N型掺杂区域电压(VSL),操作 可以在通道热孔(CHH)编程模式或通道热电子(CHE)擦除模式)下选择性地实施EEPLD。