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1. 发明授权

US6162626A Thermostable glutamate dehydrogenase and process for producing the same 有权
标题翻译：热稳定性谷氨酸脱氢酶及其制备方法
公开(公告)号：US6162626A
公开(公告)日：2000-12-19
申请号：US239303
申请日：1999-01-29
申请人： Chikako Terashima , Kohji Uchida , Hirokazu Matsukawa , Osamu Oka , Tuyosi Fujita , Tadayuki Imanaka
发明人： Chikako Terashima , Kohji Uchida , Hirokazu Matsukawa , Osamu Oka , Tuyosi Fujita , Tadayuki Imanaka
IPC分类号： C12N15/09 , C12N1/21 , C12N9/04 , C12N9/06 , C12N15/00 , C12Q1/32 , C12R1/01 , C12R1/19 , C12N9/02 , C07H21/04 , C12N1/20
CPC分类号： C12Y104/01002 , C12N9/0016
摘要： The present invention provides a process for mass producing recombinant, thermostable GLDH at a low cost. The invention also provides a process for mass producing recombinant, thermostable GLDH at a low cost, by culturing a transformant without using a drug such as IPTG. The invention further provides thermostable GLDH which can use more stable NADH as a coenzyme in an ammonia assay reagent.
摘要翻译：本发明提供了以低成本批量生产重组，耐热性GLDH的方法。本发明还提供了通过在不使用诸如IPTG的药物下培养转化体来大规模生产重组，耐热性GLDH的方法。本发明还提供了可在氨测定试剂中使用更稳定的NADH作为辅酶的热稳定性GLDH。

2. 发明授权

US06352847B1 Ammonia elimination liquid reagent 有权
标题翻译：氨清除液试剂
公开(公告)号：US06352847B1
公开(公告)日：2002-03-05
申请号：US09327487
申请日：1999-06-08
申请人： Hirokazu Matsukawa , Osamu Oka , Tuyosi Fujita , Kentaro Miyazaki
发明人： Hirokazu Matsukawa , Osamu Oka , Tuyosi Fujita , Kentaro Miyazaki
IPC分类号： C12N904
CPC分类号： C12N9/0006 , C12Q1/32
摘要： The invention provides an ammonia elimination reagent in solution, comprising a thermo-resistant isocitrate dehydrogenase with prominent stability under conditions at high alkaline pHs. For example, the isocitrate dehydrogenase is preferably derived from the genus Thermus. For an assay system of biological substances generating a reaction product ammonia, an ammonia elimination reagent can be prepared by selecting and using the enzyme; the resulting ammonia elimination reagent can be stored in solution; additionally, the assay system can be designed in combination with both the coenzymes NAD+ and NADP+. The ammonia elimination reagent is novel and can eliminate ammonia in an extremely short time.
摘要翻译：本发明提供一种溶液中的氨清除试剂，其包含在高碱性pH下条件下具有突出稳定性的耐热异柠檬酸脱氢酶。例如，异柠檬酸脱氢酶优选来自嗜热栖热菌属。对于产生反应产物氨的生物物质的测定系统，可以通过选择和使用酶来制备氨消除剂; 所得氨消除剂可以储存在溶液中; 此外，测定系统可以与辅酶NAD +和NADP +两者结合设计。氨消除剂是新颖的，可以在极短时间内消除氨。

3. 发明授权

US06265042B1 Adhesive tape for electronic parts 失效
标题翻译：电子部件用胶带
公开(公告)号：US06265042B1
公开(公告)日：2001-07-24
申请号：US09150036
申请日：1998-09-09
申请人： Osamu Oka , Takeshi Nishigaya
发明人： Osamu Oka , Takeshi Nishigaya
IPC分类号： B32B712
CPC分类号： C09J179/08 , C09J7/22 , C09J7/38 , C09J2479/08 , C09J2479/086 , H01L23/4951 , H01L23/49558 , H01L2224/45144 , H01L2224/4826 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01039 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , Y10T428/14 , Y10T428/1405 , Y10T428/1476 , Y10T428/25 , Y10T428/31721 , H01L2924/00014
摘要： An adhesive tape for electronic parts of the present invention is characterized by comprising a heat resisting film and an adhesive layer provided on at least a side of said heat resisting film, said adhesive layer contains at least a polyimide comprising 100-30% by mol of at least one of the repeating units represented by the following formulas (1a) and (1b) and 0-70% by mol of at least one of the repeating unit represented by the following formulas (2a) and (2b) and 0.1-15 parts by weight of a silane coupling agent based on 100 parts by weight of said polyimide: wherein Ar represents a specified divalent aromatic group wherein R is an alkylene group having 1 to 10 carbon atoms or —CH2OC6H4—, the methylene group of which attaches to Si, and n means an integer of 1 to 20.
摘要翻译：本发明的电子部件用胶带的特征在于，在耐热薄膜的至少一侧设置有耐热薄膜和粘合剂层，所述粘合剂层至少包含含有100〜30摩尔％由下式（1a）和（1b）表示的重复单元中的至少一种和由下式（2a）和（2b）表示的重复单元中的至少一种和0.1-15 基于100重量份所述聚酰亚胺的硅烷偶联剂重量份：其中Ar表示指定的二价芳族基团，其中R是具有1-10个碳原子的亚烷基或-CH 2 OC 6 H 4 - ，其亚甲基连接到Si ，n表示1〜20的整数。

4. 发明授权

US06184337B2 Adhesive tape for electronic parts and liquid adhesive 失效
标题翻译：电子部件和液体胶粘剂胶带
公开(公告)号：US06184337B2
公开(公告)日：2001-02-06
申请号：US09178770
申请日：1998-10-26
申请人： Osamu Oka , Takeshi Nishigaya , Fumiyoshi Yamanashi
发明人： Osamu Oka , Takeshi Nishigaya , Fumiyoshi Yamanashi
IPC分类号： C09J13324
CPC分类号： H01L24/83 , C08G73/10 , C08G73/1064 , C08L79/08 , C09J7/22 , C09J7/35 , C09J179/08 , C09J2201/122 , C09J2201/61 , C09J2479/08 , H01L23/49513 , H01L24/29 , H01L24/31 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/29 , H01L2224/29101 , H01L2224/29139 , H01L2224/2919 , H01L2224/29298 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/4911 , H01L2224/73215 , H01L2224/8319 , H01L2224/8385 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01012 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01039 , H01L2924/0104 , H01L2924/01045 , H01L2924/01047 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/181 , H01L2924/19107 , Y10T428/1476 , Y10T428/2896 , H01L2924/00014 , H01L2924/07025 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： The present invention provide a novel polyimide which is soluble in organic solvents and excels in heat resistance, and to a process for producing the polyimide. The polyimide of the present invention comprises a repeating unit represented by the formula (1) and having a number average molecular weight of from 4,000 to 200,000. wherein X is —SO2— or —C(═O)—OCH2CH2O—C(═O)—, and R1, R2, R3 and R4 are independently an alkyl group having 1 to 4 carbon atoms or an alkoxy group having 1 to 4 carbon atoms.
摘要翻译：本发明提供一种可溶于有机溶剂且耐热性优异的新型聚酰亚胺，以及聚酰亚胺的制造方法。本发明的聚酰亚胺包含由式（1）表示的重复单元，其数均分子量为4,000至200,000.其中X为-SO 2 - 或-C（= O）-OCH 2 CH 2 O-C（= O ） - ，R 1，R 2，R 3和R 4独立地为具有1至4个碳原子的烷基或具有1至4个碳原子的烷氧基。

5. 发明授权

US5959068A Adhesive tape for electronic parts and liquid adhesive 失效
标题翻译：电子部件和液体胶粘剂胶带
公开(公告)号：US5959068A
公开(公告)日：1999-09-28
申请号：US190174
申请日：1998-11-12
申请人： Osamu Oka , Takeshi Nishigaya , Fumiyoshi Yamanashi
发明人： Osamu Oka , Takeshi Nishigaya , Fumiyoshi Yamanashi
IPC分类号： C09J7/02 , C08G73/10 , C09D179/08 , C09J179/08 , H01L21/60 , H01L23/29 , H01L23/31 , C08G69/08 , C08G75/00 , C08G79/02
CPC分类号： C09D179/08 , C08G73/10 , C08G73/1035 , C08G73/106 , C08G73/1064 , C09J179/08 , H01L24/32 , H01L24/83 , H01L2224/2919 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/4911 , H01L2224/73215 , H01L2224/8319 , H01L2224/838 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/0104 , H01L2924/01045 , H01L2924/01047 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/181 , Y10T428/2826 , Y10T428/2839 , Y10T428/2852 , Y10T428/2887
摘要： This invention provide an adhesive tape and a liquid adhesive for electronic parts having sufficient thermal resistance and reliability. The adhesive tape comprises an adhesive layer composed of at least a polyimide comprising the repeating units represented by the formulas (1) and (2), provided on surface of a heat resistance film or a release film: ##STR1## wherein X is --SO.sub.2 -- and/or --C(.dbd.O)--OCH.sub.2 CH.sub.2 O--C(.dbd.O)--, Ar is a divalent group containing aromatic rings, and R is an alkylene group having 1 to 10 carbon atoms or --CH.sub.2 OC.sub.6 H.sub.4 --, and n means an integer of 1 to 20.
摘要翻译：本发明提供一种具有足够热阻和可靠性的电子部件的胶带和液体粘合剂。粘合带包括至少由包含由式（1）和（2）表示的重复单元的聚酰亚胺构成的粘合剂层，其设置在耐热膜或脱模膜的表面上：其中X是-SO 2 - 和/ 或-C（= O）-OCH 2 CH 2 O-C（= O） - ，Ar为含有芳环的二价基团，R为碳原子数1〜10的亚烷基或-CH 2 OC 6 H 4 - ，n表示1 到20。

6. 发明授权

US5723571A Polyimide and process for producing the same 失效
标题翻译：聚酰亚胺及其制造方法
公开(公告)号：US5723571A
公开(公告)日：1998-03-03
申请号：US703151
申请日：1996-08-29
申请人： Osamu Oka , Takeshi Nishigaya
发明人： Osamu Oka , Takeshi Nishigaya
IPC分类号： C08G77/455 , C08G73/10 , C08G77/42 , C08G69/26
CPC分类号： C08G73/1042 , C08G73/106
摘要： A novel polyimide is soluble in organic solvents and excels in heat resistance. The polyimide comprises 95-40 mol % of the repeating unit represented by the formulas (1) and 60-5 mol % of the repeating unit represented by the formula (2) and has a number average molecular weight of 4,000-200,000: ##STR1## wherein X is --SO.sub.2 -- and/or --C(.dbd.O)--OCH.sub.2 CH.sub.2 O--C(.dbd.O)--, Ar is a divalent group containing aromatic rings, and R is an alkylene group having 1-10 carbon atoms or a group: --CH.sub.2 OC.sub.6 H.sub.4 --, and n is an integer of 1-20.
摘要翻译：新型聚酰亚胺可溶于有机溶剂，耐热性优异。聚酰亚胺含有95-40摩尔％的由式（1）表示的重复单元和60-5摩尔％的式（2）表示的重复单元，其数均分子量为4,000-200,000:nd / 或-C（= O）-OCH 2 CH 2 O-C（= O） - ，Ar是含有芳环的二价基团，R是具有1-10个碳原子的亚烷基或基团-CH 2 OC 6 H 4 - ，n是 1-20的整数。

7. 发明授权

US06617021B2 Adhesive composition and adhesive sheet for semiconductor devices 失效
公开(公告)号：US06617021B2
公开(公告)日：2003-09-09
申请号：US10068945
申请日：2002-02-11
申请人： Masaharu Kobayashi , Osamu Oka , Yasuhiro Yoshii
发明人： Masaharu Kobayashi , Osamu Oka , Yasuhiro Yoshii
IPC分类号： B32B2738
CPC分类号： C09J163/08 , C08G59/504 , C08L53/025 , C08L61/04 , C08L2666/02 , C08L2666/14 , C09J7/22 , C09J7/38 , C09J153/025 , C09J163/00 , C09J2203/326 , C09J2453/00 , C09J2461/00 , C09J2463/00 , H01L24/32 , H01L24/73 , H01L24/83 , H01L2224/06135 , H01L2224/06136 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/73215 , H01L2224/73265 , H01L2224/83194 , H01L2224/8385 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/0104 , H01L2924/01042 , H01L2924/01045 , H01L2924/01074 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/3011 , Y10S428/901 , Y10T428/1476 , Y10T428/287 , Y10T428/31511 , Y10T428/31663 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An adhesive composition for semiconductor devices contains as essential components (A) epoxy resin, (B) phonolic resin, (C) epoxidized styrene-butadiene-styrene block copolymer and (D) diaminosiloxane compound. The adhesive composition is excellent in heat resistance, thermal cycle test and humidity resistance. An adhesive sheet employing the above adhesive composition is also provided.

8. 发明授权

US6132865A Adhesive tape for electronic parts 失效
标题翻译：电子部件用胶带
公开(公告)号：US6132865A
公开(公告)日：2000-10-17
申请号：US118022
申请日：1998-07-17
申请人： Osamu Oka , Jun Tochihira , Fumiki Komagata
发明人： Osamu Oka , Jun Tochihira , Fumiki Komagata
IPC分类号： B32B7/12 , B32B15/08 , C08G73/10 , C09J7/02 , C09J179/08 , H01L21/52 , H01L21/60 , H01L23/495
CPC分类号： H01L24/29 , B32B15/08 , B32B7/12 , C09J179/08 , C09J7/0242 , C09J7/0292 , H01L23/49513 , C09J2201/36 , C09J2479/08 , H01L2224/2919 , H01L2224/2929 , H01L2224/29386 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L24/45 , H01L24/48 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/0104 , H01L2924/01045 , H01L2924/01047 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0665 , H01L2924/15153 , H01L2924/1517 , H01L2924/181 , Y10T428/2804 , Y10T428/2887 , Y10T428/2896 , Y10T428/31663 , Y10T428/31721
摘要： An adhesive tape for electronic parts which comprises a metal substrate and an adhesive layer A and an adhesive layer B laminated in order on at least one side of said metal substrate, wherein said adhesive A comprises a polyimide consisting of 100 -20% by mol of the repeating unit represented by the following formula (1a) and 0-80% by mol of the repeating unit represented by the following formula (1b), said adhesive B comprises a polyimide consisting of 100-40% by mol of the repeating unit represented by the following formula (1a) and 0-60% by mol of the repeating unit represented by the following formula (2), and the adhesive layer A and the adhesive layer B have each a different glass transition temperature: ##STR1## wherein Ar represents a divalent group selected from the specified structures containing aromatic rings, R is an alkylene group having 1 to 10 carbon atoms or --CH.sub.2 OC.sub.6 H.sub.4 --, the methylene group of which attaches to Si, and n means an integer of 1 to 20.
摘要翻译：一种用于电子部件的胶带，包括金属基材和粘合剂层A和在所述金属基材的至少一侧依次层压的粘合剂层B，其中所述粘合剂A包含由100〜20摩尔％由下式（1a）表示的重复单元和由下式（1b）表示的重复单元为0〜80摩尔％，所述粘合剂B包含由100〜40摩尔％的重复单元表示的聚酰亚胺通过下式（1a）和0-60摩尔％由下式（2）表示的重复单元，并且粘合剂层A和粘合剂层B各自具有不同的玻璃化转变温度：其中Ar表示二价选自含有芳环的指定结构的基团，R为碳原子数1〜10的亚烷基或-CH 2 OC 6 H 4 - ，其亚甲基与Si连接，n表示1〜20的整数。

9. 发明授权

US5421959A Composite comprising paper and electro-conducting polymers and its production process 失效
标题翻译：复合材料包括纸和导电聚合物及其生产工艺
公开(公告)号：US5421959A
公开(公告)日：1995-06-06
申请号：US196385
申请日：1994-02-15
申请人： Osamu Oka , Katsumi Yoshino
发明人： Osamu Oka , Katsumi Yoshino
IPC分类号： H01B1/12 , D21H27/00
CPC分类号： H01B1/127 , H01B1/128
摘要： A composite comprising a paper and a conjugated electroconducting polymer, the conjugated electroconducting polymer existing between fibers or in close contact with fibers of the paper, is disclosed. A process for producing a composite comprising a paper and a conjugated electroconducting polymer, the conjugated electroconducting polymer existing between fibers or in close contact with fibers of the paper, which comprises subjecting a conjugated compound to electropolymerization or oxidation polymerization in the presence of a paper, is also disclosed. A process for producing a functional composite, which comprises impregnating a paper with a solution of a precursor polymer of a conjugated electroconducting polymer and heat treating the paper to form a conjugated electroconducting polymer between or on surface of fibers of the paper, is further disclosed.
摘要翻译：公开了包含纸和共轭导电聚合物的复合材料，存在于纤维之间或与纸的纤维紧密接触的共轭导电聚合物。一种生产包含纸和共轭导电聚合物的复合材料的方法，所述共轭导电聚合物存在于纤维之间或与纸的纤维紧密接触，其包括在纸的存在下使共轭化合物进行电聚合或氧化聚合，也被披露。一种功能性复合体的制造方法，其特征在于，包括用共轭导电性聚合物的前体聚合物的溶液浸渍纸，并在纸张的纤维表面或表面之间热处理纸张以形成共轭导电聚合物。

10. 发明授权

US5250639A Polyaniline derivatives and their production process 失效
标题翻译：聚苯胺衍生物及其制备方法
公开(公告)号：US5250639A
公开(公告)日：1993-10-05
申请号：US909530
申请日：1992-07-08
申请人： Osamu Oka
发明人： Osamu Oka
IPC分类号： C08G73/02 , C08F283/00
CPC分类号： C08G73/0266
摘要： This invention provides a novel graft polyaniline derivative soluble or gelatinizable in general organic solvents, which forms elastic self-standing films or fibers, and also their production process. The graft polyaniline derivative is represented by the following formula (I) which consists of a quinodiimine unit structure, an imino-1,4-phenylene unit structure and a N-polyether chain substituted imino-1,4-phenylene unit structure bonding at random, ##STR1## wherein k is an integer of at least 1, m and n each is zero or an integer of at least 1, k+m+n=10 to 5,000, m/(n+m)=0 to 1, Alk represents a polyether chain having a number average molecular weight of 100 to 100,000 and having oxygen atoms at the both terminals, A represents a specific linking group.
摘要翻译：本发明提供了一种新型的可溶于或可凝胶化的一般有机溶剂的接枝聚苯胺衍生物，其形成弹性自立膜或纤维，以及它们的制备方法。接枝聚苯胺衍生物由以下式（I）表示，其由醌二亚胺单元结构，亚氨基-1,4-亚苯基单元结构和N-聚醚链取代的亚氨基-1,4-亚苯基单元结构随机键合（I）其中k是至少为1的整数，m和n各自为零或至少为1的整数，k + m + n = 10至5,000，m /（n + m）= 0 至1，Alk表示数均分子量为100〜100,000，在两端具有氧原子的聚醚链，A表示特定的连接基。

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