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1. 发明授权

US06828028B1 Medical materials and process for producing the same 有权
标题翻译：医疗材料和生产过程相同
公开(公告)号：US06828028B1
公开(公告)日：2004-12-07
申请号：US10048367
申请日：2002-01-25
申请人： Hiroki Fukui , Ken Suzuki , Kenshiro Shuto , Nobuyuki Yamamoto , Kazuhiko Ishihara , Nobuo Nakabayashi
发明人： Hiroki Fukui , Ken Suzuki , Kenshiro Shuto , Nobuyuki Yamamoto , Kazuhiko Ishihara , Nobuo Nakabayashi
IPC分类号： B32B2738
CPC分类号： A61L29/085 , A61L27/34 , A61L31/10 , A61L33/06 , Y10T428/31511 , Y10T428/31515
摘要： A medical material having a surface which is safe and excellent in stability with the lapse of time and has a high durability as needed in establishing a long-lasting surface lubricity in a wet state and an excellent compatibility with blood, and a method for producing the same. These materials are obtained by forming a coating layer with a coating material containing a polymeric substance (A) having a heterocyclic group represented by the formula (1) on at least a part of a surface of a medical material base, and then ring-opening the heterocyclic group remaining in the coating layer by a nucleophilic compound (N): wherein X represents O, NH or S; and R1 represents H or CH3.
摘要翻译：一种医用材料，其具有安全性和稳定性优异的时间，并且在建立湿状态下的持久的表面润滑性和与血液的优异的相容性方面需要时具有高的耐久性，以及用于制备相同。这些材料通过在包含医药材料基材的表面的至少一部分上的含有式（1）表示的具有杂环基的聚合物质（A）的涂布材料形成涂层而得到，然后开环通过亲核化合物（N）保留在涂层中的杂环基：其中X表示O，NH或S; 且R 1表示H或CH 3。

2. 发明授权

US06800371B2 Adhesives and adhesive compositions containing thioether groups 有权
标题翻译：含有硫醚基团的粘合剂和粘合剂组合物
公开(公告)号：US06800371B2
公开(公告)日：2004-10-05
申请号：US09801234
申请日：2001-03-07
申请人： Kathleen B. Gross , Susan C. Noe , Alphonsus V. Pocius , William J. Schultz , Wendy L. Thompson
发明人： Kathleen B. Gross , Susan C. Noe , Alphonsus V. Pocius , William J. Schultz , Wendy L. Thompson
IPC分类号： B32B2738
CPC分类号： C08G59/38 , C08G59/302 , C08L63/00 , C09J5/06 , C09J163/00 , C09J2400/163 , C09J2400/226 , C09J2463/00 , C09J2479/086 , C09J2483/006 , Y10T428/31511
摘要： In one aspect, the invention provides a curable composition comprising a mixture of epoxy resin, catalyst and an epoxy reactive thioether-containing compound and the resulting adhesives. The resulting adhesives are water and/or solvent resistant and bond to plastics such as ABS, polycarbonate, and PMMA; polyimide; noble metals such as gold and palladium; and silicon-containing materials such as silicon wafer die and silicon dioxide.
摘要翻译：一方面，本发明提供一种可固化组合物，其包含环氧树脂，催化剂和含环氧反应性硫醚的化合物的混合物和所得粘合剂。所得到的粘合剂是耐水和/或耐溶剂的并且结合到塑料如ABS，聚碳酸酯和PMMA; 聚酰亚胺贵金属如金和钯; 以及硅晶片和二氧化硅等含硅材料。

3. 发明授权

US06749939B2 Composition having sealing and sound dampening properties and methods related thereto 有权
标题翻译：具有密封和声音衰减特性的组合物及其相关方法
公开(公告)号：US06749939B2
公开(公告)日：2004-06-15
申请号：US10078598
申请日：2002-02-19
申请人： Umesh C. Desai , Marvis E. Hartman , Anthony C. Palermo
发明人： Umesh C. Desai , Marvis E. Hartman , Anthony C. Palermo
IPC分类号： B32B2738
CPC分类号： C08L63/00 , Y10T428/31511 , Y10T428/31529 , C08L2666/18
摘要： A composition having sealing and sound dampening properties is disclosed which comprises one or more polyepoxides comprising at least two epoxide groups per molecule; a thermoplastic polyester polymer; a curing agent adapted to react with the polyepoxides; inorganic particles having an oil absorption value of less than 70; and inorganic microparticles different from the previously mentioned inorganic particles, the inorganic microparticles having an average particle size prior to incorporation into the composition ranging from 0.5 to 200 microns. Multilayer composites, coated substrates, and methods for forming sound dampening coatings on a metallic substrate are also provided.
摘要翻译：公开了一种具有密封和防声性能的组合物，其包含每分子包含至少两个环氧基团的一种或多种聚环氧化物; 热塑性聚酯聚合物; 适于与多环氧化物反应的固化剂; 吸油值小于70的无机颗粒; 和与上述无机颗粒不同的无机微粒，无机微粒在掺入组合物中的平均粒径为0.5-200微米。还提供了多层复合材料，涂覆基材以及在金属基材上形成阻尼涂层的方法。

4. 发明授权

US06730402B2 Flame-retardant epoxy resin composition and laminate made with the same 失效
标题翻译：阻燃环氧树脂组合物和由其制成的层压材料
公开(公告)号：US06730402B2
公开(公告)日：2004-05-04
申请号：US10070827
申请日：2002-03-11
申请人： Yukihiro Kiuchi , Masatoshi Iji
发明人： Yukihiro Kiuchi , Masatoshi Iji
IPC分类号： B32B2738
CPC分类号： C08L63/00 , C08G59/063 , C08G59/621 , C08K3/22 , Y10T428/31511 , Y10T428/31515 , Y10T428/31663 , C08L61/04 , C08L2666/16
摘要： A flame-retardant epoxy resin composition includes an epoxy resin, a curing agent, and a metal hydroxide, wherein the curing agent as a phenolic resin (C) containing, in the molecular chain, structural units derived from a phenol (A) and structural units derived from an aromatic compound (B) other than the phenol (A), or the epoxy resin is a novolac epoxy resin CD) obtained by subjecting the phenolic hydroxyl groups of the phenolic resin (C) to etherification with glycidyl. The composition has a high degree of flame retardancy.
摘要翻译：阻燃性环氧树脂组合物包括环氧树脂，固化剂和金属氢氧化物，其中作为酚醛树脂（C）的固化剂在分子链中含有衍生自苯酚（A）的结构单元和结构式衍生自苯酚（A）以外的芳香族化合物（B）的单元，或环氧树脂是酚醛树脂（C）的酚性羟基与缩水甘油醚化而得到的酚醛清漆型环氧树脂CD。该组合物具有高度的阻燃性。

5. 发明授权

US06716529B2 Adhesive sheet for semiconductor connecting substrate, adhesive-backed tape for TAB, adhesive-backed tape for wire bonding connection, semiconductor connecting substrate and semiconductor device 有权
标题翻译：用于半导体连接基板的粘合片，用于TAB的粘合剂背带，用于引线接合连接的粘合剂背衬带，半导体连接基板和半导体器件
公开(公告)号：US06716529B2
公开(公告)日：2004-04-06
申请号：US09940513
申请日：2001-08-29
申请人： Yasushi Sawamura , Shoji Kigoshi , Taku Hatano , Yukitsuna Konishi , Yoshio Ando
发明人： Yasushi Sawamura , Shoji Kigoshi , Taku Hatano , Yukitsuna Konishi , Yoshio Ando
IPC分类号： B32B2738
CPC分类号： H01L24/50 , C08G59/245 , C08L55/00 , C08L77/00 , C08L2666/02 , C09J7/22 , C09J7/35 , C09J163/00 , C09J2203/326 , C09J2463/00 , H01L23/49572 , H01L23/49816 , H01L24/45 , H01L24/48 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/45144 , H01L2224/48095 , H01L2224/48465 , H01L2224/73265 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/0104 , H01L2924/01045 , H01L2924/01047 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/04953 , H01L2924/07802 , H01L2924/09701 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01L2924/351 , Y10T428/28 , Y10T428/2826 , Y10T428/2848 , Y10T428/287 , Y10T428/2883 , Y10T428/31511 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An adhesive sheet for a semiconductor connecting substrate consisting of a laminate having an adhesive layer on a substrate, wherein said adhesive layer contains a thermoplastic resin (A) and an epoxy resin (B) and said epoxy resin (B) contains at least one epoxy resin (B) selected from (I) dicyclopentadiene skeleton-containing epoxy resins, (II) terpene skeleton-containing epoxy resins, and (III) biphenyl skeleton-containing epoxy resins, as an essential component; an adhesive-backed tape for TAB consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film. The adhesive sheet for a semiconductor connecting substrate, the adhesive-backed tape for TAB and the adhesive-backed tape for wire bonding connection of the present invention are excellent in adhesive strength, insulatability, dimensional accuracy, etc., and can improve the reliability of a semiconductor integrated circuit connecting substrate and a semiconductor device respectively for high density packaging.
摘要翻译：一种用于半导体连接基板的粘合片，其由在基板上具有粘合剂层的层压体组成，其中所述粘合剂层包含热塑性树脂（A）和环氧树脂（B），并且所述环氧树脂（B）含有至少一种环氧树脂选自（I）含二环戊二烯骨架的环氧树脂的树脂（B），（II）含萜骨架的环氧树脂和（III）含有联苯骨架的环氧树脂作为必要成分; 用于TAB的粘合剂背衬带由在柔性有机绝缘膜上具有粘合剂层和保护膜层的层压体组成。用于半导体连接基板的粘合片，用于TAB的粘合剂背衬带和用于本发明的引线接合连接用粘合剂背衬带具有优异的粘合强度，绝缘性，尺寸精度等，并且可以提高分别用于高密度封装的半导体集成电路连接基板和半导体器件。

6. 发明授权

US06645631B2 Flame retardant phosphorus element-containing epoxy resin compositions 有权
标题翻译：含阻燃磷元素的环氧树脂组合物
公开(公告)号：US06645631B2
公开(公告)日：2003-11-11
申请号：US09734537
申请日：2000-12-11
申请人： Joseph Gan , Alan Goodson
发明人： Joseph Gan , Alan Goodson
IPC分类号： B32B2738
CPC分类号： H05K1/0326 , C08G59/304 , C08G59/3254 , C08L63/00 , H01L23/145 , H01L23/49894 , H01L2924/0002 , Y10T428/31511 , C08L61/04 , H01L2924/00
摘要： A flame retardant phosphorus element-containing epoxy resin composition substantially free of halogen, including: (I) a non-halogenated epoxy resin material selected from: (A) a non-halogenated phosphorus element-containing epoxy resin; (B) a mixture of: (1) a non-halogenated, non-phosphorus element-containing epoxy resin, and (2) a phosphorus element-containing compound; or (C) the reaction product of: (1) a non-halogenated epoxy resin; and (2) a phosphorus element-containing compound; or (D) a combination of two or more of components (A) to (C); and (II) (A) a multi-functional phenolic crosslinking agent having a hydroxy functionality of at least 2; (B) a material which forms a multifunctional phenolic crosslinking agent having a hydroxy functionality of at least 2, upon heating or (C) a mixture of components (A) and (B); in an amount of from about 50% to about 150% of the stoichiometric amount needed to cure the epoxy resin. Electrical laminate circuit boards having reduced flammability may be made from these compositions.
摘要翻译：一种基本上不含卤素的含阻燃磷元素的环氧树脂组合物，包括：（I）非卤化环氧树脂材料，其选自：（A）非卤化含磷元素的环氧树脂;（B）：（1）非卤化非含磷元素的环氧树脂，和（2）含磷元素的化合物; 或（C）反应产物：（1）非卤化环氧树脂; 和（2）含磷元素的化合物; 或（D）两种或多种组分（A）至（C）的组合; 和（II）（A）具有至少2的羟基官能度的多官能酚类交联剂; （B）在加热或（C）组分（A）和（B）的混合物时形成羟基官能度至少为2的多官能酚交联剂的材料; 其量为固化环氧树脂所需化学计量的约50％至约150％。可以由这些组合物制成具有降低的可燃性的电气层压电路板。

7. 发明授权

US06605355B1 Epoxy resin composition 失效
标题翻译：环氧树脂组合物
公开(公告)号：US06605355B1
公开(公告)日：2003-08-12
申请号：US09913355
申请日：2001-08-13
申请人： Ken Nazuka
发明人： Ken Nazuka
IPC分类号： B32B2738
CPC分类号： H01L23/293 , C08G59/14 , C08L63/00 , H01L21/563 , H01L29/0657 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/07811 , H01L2924/10158 , Y10S428/901 , Y10T428/31511 , Y10T428/31515 , H01L2924/00
摘要： An epoxy resin composition comprising, as main components, (a) 100 parts by weight of a polyfunctional epoxy resin which stays liquid at an ordinary temperature and has two or more glycidyl groups in the molecule thereof, (b) 3 to 80 parts by weight of a curing agent and (c) 1 to 100 parts by weight of a modified epoxy resin, is suitable as an underfill sealing agent, is capable of heat-curing in a short time with a good productivity, is capable of surely connecting a semiconductor device such as a CSP and a BGA on a wiring board without giving an adverse effect on each part disposed on the wiring board by heat-curing at a relatively low temperature, has excellent heat shock property (temperature cycling property) and impact resistance, is free from bleeding of contaminants from its cured product, and is capable of easily detaching the CSP or BGA from the wiring board in the case where a defect is found, making it possible to reuse a normal wiring board or semiconductor device.
摘要翻译：作为主要成分的环氧树脂组合物包含（a）100重量份在常温下保持液体并在其分子中具有两个或更多个缩水甘油基的多官能环氧树脂，（b）3-80重量份的固化剂和（c）1〜100重量份的改性环氧树脂适合作为底部填充密封剂，能够在短时间内以良好的生产率进行热固化，能够可靠地连接半导体在相对低的温度下通过热固化而对配线基板上的各部件没有产生不利影响的布线基板上的CSP，BGA等器件，具有良好的热冲击性（耐温循环性）和耐冲击性没有污染物从其固化产物渗出，并且在发现缺陷的情况下能够容易地将CSP或BGA从布线板上分离，使得可以重新使用普通的布线板或半导体器件。

8. 发明授权

US06602604B2 Coating composition 失效
标题翻译：涂料组成
公开(公告)号：US06602604B2
公开(公告)日：2003-08-05
申请号：US09914561
申请日：2001-08-27
申请人： Minoru Kurisaki , Takamasa Harada , Katsuyuki Sakamoto , Junichi Fukuzawa
发明人： Minoru Kurisaki , Takamasa Harada , Katsuyuki Sakamoto , Junichi Fukuzawa
IPC分类号： B32B2738
CPC分类号： C09D201/08 , C09D201/06 , Y10T428/31511 , Y10T428/31525 , Y10T428/31663
摘要： The present invention is to provide a coating composition capable of forming a protective film excellent in adhesion properties. Such a coating composition comprises a specific polymer containing carboxyl group, a specific multifunctional epoxide-containing compound having two or more epoxy groups, an organic solvent, and an amino-containing silane coupling agent represented by the following general formula (I): H2N—R1—Si—(OR2)3 (I) wherein, R1 is an unsubstituted alkylene group, and R2's are independently an unsubstituted alkyl group.
摘要翻译：本发明提供能够形成粘合性优异的保护膜的涂料组合物。这种涂料组合物包含含羧基的特定聚合物，具有两个以上环氧基的特定多官能环氧化物的化合物，有机溶剂和由以下通式（I）表示的含氨基的硅烷偶联剂：其中， R1为未取代的亚烷基，R2为独立的未取代的烷基。

9. 发明授权

US06572972B2 Aqueous binders 失效
标题翻译：水性粘合剂
公开(公告)号：US06572972B2
公开(公告)日：2003-06-03
申请号：US09929330
申请日：2001-08-14
申请人： Willibald Paar , Maximilian Friedl
发明人： Willibald Paar , Maximilian Friedl
IPC分类号： B32B2738
CPC分类号： C09D163/00 , C08G59/182 , C08G59/184 , Y10T428/31529
摘要： Aqueous binders comprising organic bismuth compounds and reaction products, having a number-average molar mass Mn of at least 5000 g/mol, of epoxy resins, optionally fatty acids and amines are obtained by reacting epoxide compounds containing at least two epoxide groups per molecule and reaction products of epoxide compounds, optionally fatty acids and amines, and are suitable as binders for aqueous systems for corrosion protection.
摘要翻译：通过使每分子含有至少两个环氧基的环氧化物化合物和每个分子中含有至少两个环氧基团的环氧化合物反应，得到包含有机铋化合物和反应产物的水性粘合剂，其数均摩尔质量Mn至少为5000g / mol，环氧树脂，任选的脂肪酸和胺，环氧化合物，任选的脂肪酸和胺的反应产物，并且适合作为用于防腐蚀的水性体系的粘合剂。

10. 发明授权

US06565975B2 Multilayered resin plate and process for producing the same 失效
标题翻译：多层树脂板及其制造方法
公开(公告)号：US06565975B2
公开(公告)日：2003-05-20
申请号：US09736179
申请日：2000-12-15
申请人： Toshiyuki Umehara , Yoshimasa Sakata
发明人： Toshiyuki Umehara , Yoshimasa Sakata
IPC分类号： B32B2738
CPC分类号： B32B27/08 , B29C39/203 , B32B27/18 , B32B27/38 , B32B37/0007 , B32B2038/0076 , B32B2305/72 , B32B2307/734 , B32B2310/0831 , B32B2363/00 , B32B2457/12 , B32B2457/208 , Y10T428/1086 , Y10T428/24612 , Y10T428/31511
摘要： A cured resin plate which is reduced in undulation and has excellent flatness even when having a thickness of 100 &mgr;m or larger or a size exceeding 2 inches; and a process for efficiently mass-producing the resin plate. The process comprises spreading a resinous coating fluid A on a support (5) having a smooth surface to form an unsolidified or solidified coating layer, spreading thereon a resinous coating fluid B which is the same as or different from the coating fluid A to form two or more superposed layers of the coating fluid B, and solidifying the layers (12, 22, and 42) separately or simultaneously to thereby form superposed resin layers (1, 2, and 4) adhered to each other which comprise two or more adjacent cured resin layers (1 and 2). The multilayered resin plate comprises superposed layers adhered to each other which are composed of a thermoset epoxy resin layer and superposed thereon a thermoset epoxy resin layer having a smaller thickness than that layer. The multilayered resin plate can be continuously produced by the process in which resinous coating fluids are spread. The resin plate can be reduced in undulation because it comprises cured resin layers superposed on each other.
摘要翻译：固化树脂板，即使在厚度为100μm以上或者尺寸超过2英寸的情况下，起伏减小，平坦度也优异，以及有效地批量生产树脂板的方法。该方法包括将树脂涂布液A铺展在具有光滑表面的支撑体（5）上以形成未固化或固化的涂层，在其上铺展与涂布液A相同或不同的树脂涂布液B，形成两个或更多的涂层流体B的叠层，并且分别或同时地固化层（12,22和42），从而形成彼此粘附的叠置的树脂层（1,2和4），所述叠置树脂层（1,2和4）包括两个或更多个相邻的固化树脂层（1和2）。多层树脂板包括由热固性环氧树脂层构成的彼此粘合的叠层，并且叠置有厚度小于该层的热固性环氧树脂层。可以通过涂布树脂涂布液的方法连续制造多层树脂板。由于树脂板包括彼此重叠的固化树脂层，所以可以减少起伏的波动。

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