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1. 发明专利

JP2009028779A Solidified slag coagulation agent 审中-公开
标题翻译：固化SLAG凝固剂
公开(公告)号：JP2009028779A
公开(公告)日：2009-02-12
申请号：JP2007213901
申请日：2007-08-20
申请人： Masaharu Kobayashi , 正治小林
发明人： KOBAYASHI MASAHARU
IPC分类号： B22D43/00
摘要： PROBLEM TO BE SOLVED: To provide a solidified slag coagulation agent which is economical, can be handled at ease, and prevents occurrence of defects. SOLUTION: The solidified slag coagulation agent 10 is set into a pouring vessel 11 and coagulates floating slag on the surface of molten metal 12 during a casting operation in which the molten metal 12 in the pouring vessel 11 is poured into a mold. The slag coagulation agent in a powder or granular state can be formed into a block having an open hole 13 at the center or at the eccentric position of the block. The slag coagulation agent can be prepared from natural stone containing alkaline component. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：待解决的问题：为了提供经济的固化渣凝固剂，可以容易地处理，并且防止缺陷的发生。解决方案：将浇注槽11中的熔融金属12倒入模具中的铸造操作期间，将固化的炉渣凝固剂10置于倾倒容器11中，并使熔渣12的表面上的浮渣熔化。粉末或颗粒状态的熔渣凝固剂可以形成为在块的中心或偏心位置处具有开孔13的块体。渣凝固剂可以由含有碱性成分的天然石料制成。版权所有（C）2009，JPO＆INPIT

2. 发明授权

US08835266B2 Method and structure for compound semiconductor contact 有权
标题翻译：化合物半导体接触的方法和结构
公开(公告)号：US08835266B2
公开(公告)日：2014-09-16
申请号：US13085511
申请日：2011-04-13
申请人： Norma E. Sosa Cortes , Edward W. Kiewra , Masaharu Kobayashi , Kuen-Ting Shiu
发明人： Norma E. Sosa Cortes , Edward W. Kiewra , Masaharu Kobayashi , Kuen-Ting Shiu
IPC分类号： H01L21/336 , H01L29/66 , H01L29/78 , H01L29/417
CPC分类号： H01L29/66522 , H01L29/41783 , H01L29/66628 , H01L29/66636 , H01L29/7838 , H01L29/7848
摘要： The present disclosure provides a buried channel semiconductor structure in which a crystallographic wet etch is used to tailor the profile of etched regions formed into a multilayered substrate which includes a compound semiconductor layer located atop a buried semiconductor channel material layer. The use of crystallographic wet etching on a compound semiconductor allows one to tailor the shape of a source recess region and a drain recess region formed into a multilayered substrate. This allows for the control of gate overlap/underlap. Also, the use of crystallographic wet etching on a compound semiconductor allows independent control of the length of an underlying buried semiconductor channel region.
摘要翻译：本公开提供了掩埋沟道半导体结构，其中使用结晶湿蚀刻来定制形成多层衬底的蚀刻区域的轮廓，其包括位于掩埋半导体沟道材料层顶部的化合物半导体层。在化合物半导体上使用结晶湿式蚀刻可以使形成多层基板的源极凹部区域和漏极凹陷区域的形状成为可能。这允许控制栅极重叠/欠压。此外，在化合物半导体上使用晶体湿式蚀刻可以独立控制下面的掩埋半导体沟道区的长度。

3. 发明授权

US08524614B2 III-V compound semiconductor material passivation with crystalline interlayer 有权
标题翻译： III-V化合物半导体材料钝化与晶体中间层
公开(公告)号：US08524614B2
公开(公告)日：2013-09-03
申请号：US12955203
申请日：2010-11-29
申请人： Kuen-Ting Shiu , Dechao Guo , Shu-Jen Han , Edward W. Kiewra , Masaharu Kobayashi
发明人： Kuen-Ting Shiu , Dechao Guo , Shu-Jen Han , Edward W. Kiewra , Masaharu Kobayashi
IPC分类号： H01L21/31
CPC分类号： H01L29/0603 , H01L21/28158 , H01L21/28264 , H01L29/517 , H01L29/66522 , H01L29/78 , H01L29/7833
摘要： The present disclosure reduces and, in some instances, eliminates the density of interface states in III-V compound semiconductor materials by providing a thin crystalline interlayer onto an upper surface of a single crystal III-V compound semiconductor material layer to protect the crystallinity of the single crystal III-V compound semiconductor material layer's surface atoms prior to further processing of the structure.
摘要翻译：本公开通过在单晶III-V化合物半导体材料层的上表面上提供薄的晶体中间层来减少并且在一些情况下消除III-V族化合物半导体材料中的界面态的密度，以保护单晶III-V化合物半导体材料层的结晶度单晶III-V化合物半导体材料层的表面原子在进一步处理结构之前。

4. 外观设计

USD440556S1 Speaker box 失效
公开(公告)号：USD440556S1
公开(公告)日：2001-04-17
申请号：US29119079
申请日：2000-02-23
申请人： Masaharu Kobayashi , Akihiro Akiyama
设计人： Masaharu Kobayashi , Akihiro Akiyama

5. 发明授权

US5512628A Adhesive tape for electronic parts and liquid adhesive 失效
标题翻译：电子部件和液体胶粘剂胶带
公开(公告)号：US5512628A
公开(公告)日：1996-04-30
申请号：US462367
申请日：1995-06-05
申请人： Yukinori Sakumoto , Takeshi Hashimoto , Katsuji Nakaba , Masaharu Kobayashi , Takeshi Nishigaya , Fumiyoshi Yamanashi
发明人： Yukinori Sakumoto , Takeshi Hashimoto , Katsuji Nakaba , Masaharu Kobayashi , Takeshi Nishigaya , Fumiyoshi Yamanashi
IPC分类号： C09J4/00 , C09J7/00 , C09J7/02 , C09J109/02 , C09J121/00 , H01L21/301 , H01L21/52 , H01L23/29 , H01L23/31 , H05K13/00 , C08F8/30
CPC分类号： C09J109/02 , C09J7/0203 , H01L24/29 , C08K5/3415 , C08K5/544 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/73215 , H01L2924/181 , Y10T428/28 , Y10T428/31663 , Y10T428/31667 , Y10T428/31931
摘要： This invention is to provide a liquid adhesive of the present invention can be adhered and cured at a relatively low temperature and have sufficient heat resistance and reliability, etc., and an adhesive tape using the same.The liquid adhesive of this invention is obtainable by dissolving (a) a piperazinylethylaminocarbonyl-containing butadiene-acrylonitrile copolymer having a weight average molecular weight of 10,000-200,000, an acrylonitrile content of 5-50% by weight, and an amino equivalent of 500-10,000, represented by the following formula (I): ##STR1## wherein, k, m, and n are molar ratios and taking n as 1, k is a number of 3-175, and m is a number of 0.3 to 93; and (b) a compound having at least two maleimide groups, the ratio of component (b) based on 100 parts by weight of component (a) being in the range of 10 to 900 parts by weight. This is applied to one or both surfaces of a heat resistant film or one surface of a release film to form an adhesive layer, thereby obtaining an adhesive tape for electronic parts.
摘要翻译：本发明提供一种本发明的液体粘合剂可以在相对低的温度下粘合和固化，并且具有足够的耐热性和可靠性等，以及使用它们的粘合带。本发明的液体粘合剂可通过将（a）重均分子量为10,000-200,000，丙烯腈含量为5-50重量％，氨基当量为500-200重量％的含哌嗪基乙基氨基羰基的丁二烯 - 丙烯腈共聚物， 10,000，由下式（I）表示：其中，k，m和n为摩尔比，n为1，k为3-175的数，m为数量为0.3〜93; 和（b）具有至少两个马来酰亚胺基团的化合物，组分（b）基于100重量份的组分（a）的比例在10至900重量份的范围内。将其应用于耐热膜或脱模膜的一个表面的一个或两个表面以形成粘合剂层，从而获得电子部件用胶带。

6. 发明授权

US5494757A Adhesive tape for electronic parts and liquid adhesive 失效
标题翻译：电子部件和液体胶粘剂胶带
公开(公告)号：US5494757A
公开(公告)日：1996-02-27
申请号：US326427
申请日：1994-10-20
申请人： Yukinori Sakumoto , Takeshi Hashimoto , Katsuji Nakaba , Masaharu Kobayashi , Takeshi Nishigaya , Fumiyoshi Yamanashi
发明人： Yukinori Sakumoto , Takeshi Hashimoto , Katsuji Nakaba , Masaharu Kobayashi , Takeshi Nishigaya , Fumiyoshi Yamanashi
IPC分类号： C09J4/00 , C09J7/00 , C09J7/02 , C09J109/02 , C09J121/00 , H01L21/301 , H01L21/52 , H01L23/29 , H01L23/31 , H05K13/00 , C08F8/30
CPC分类号： C09J109/02 , C09J7/0203 , H01L24/29 , C08K5/3415 , C08K5/544 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/73215 , H01L2924/181 , Y10T428/28 , Y10T428/31663 , Y10T428/31667 , Y10T428/31931
摘要： This invention is to provide a liquid adhesive of the present invention can be adhered and cured at a relatively low temperature and have sufficient heat resistance and reliability, etc., and an adhesive tape using the same.The liquid adhesive of this invention is obtainable by dissolving (a) a piperazinylethylaminocarbonyl-containing butadiene-acrylonitrile copolymer having a weight average molecular weight of 10,000-200,000, an acrylonitrile content of 5-50% by weight, and an amino equivalent of 500-10,000, represented by the following formula (I): ##STR1## wherein, k, m, and n are molar ratios and taking n as 1, k is a number of 3-175, and m is a number of 0.3 to 93; and (b) a compound having at least two maleimide groups, the ratio of component (b) based on 100 parts by weight of component (a) being in the range of 10 to 900 parts by weight. This is applied to one or both surfaces of a heat resistant film or one surface of a release film to form an adhesive layer, thereby obtaining an adhesive tape for electronic parts.
摘要翻译：本发明提供一种本发明的液体粘合剂可以在相对低的温度下粘合和固化，并且具有足够的耐热性和可靠性等，以及使用它们的粘合带。本发明的液体粘合剂可通过将（a）重均分子量为10,000-200,000，丙烯腈含量为5-50重量％，氨基当量为500-200重量％的含哌嗪基乙基氨基羰基的丁二烯 - 丙烯腈共聚物， 10,000，由下式（I）表示：其中，k，m和n为摩尔比，n为1，k为3-175的数，m为数0.3 至93; 和（b）具有至少两个马来酰亚胺基团的化合物，组分（b）基于100重量份的组分（a）的比例在10至900重量份的范围内。将其应用于耐热膜或脱模膜的一个表面的一个或两个表面以形成粘合剂层，从而获得电子部件用胶带。

7. 外观设计

USD307909S Front panel for a compact disc player 失效
公开(公告)号：USD307909S
公开(公告)日：1990-05-15
申请号：US54151
申请日：1987-05-26
申请人： Mark A. Dobies , Carol M. Repasky , Thomas R. Clark , Masaharu Kobayashi , Keisuke Tejima
设计人： Mark A. Dobies , Carol M. Repasky , Thomas R. Clark , Masaharu Kobayashi , Keisuke Tejima

8. 发明授权

US4912574A Apparatus for recording digital signal 失效
标题翻译：用于记录数字信号的装置
公开(公告)号：US4912574A
公开(公告)日：1990-03-27
申请号：US179305
申请日：1988-04-08
申请人： Masaharu Kobayashi , Takao Arai , Takaharu Noguchi
发明人： Masaharu Kobayashi , Takao Arai , Takaharu Noguchi
IPC分类号： G11B15/087 , G11B15/18 , G11B15/48 , G11B20/12 , G11B20/18 , G11B27/032
CPC分类号： G11B20/18 , G11B15/087 , G11B15/1875 , G11B15/48 , G11B20/1208 , G11B27/032 , G11B2220/90 , G11B2220/913
摘要： The present invention relates to an apparatus for recording a digitized signal. If a recording apparatus is switched from a recording mode to a non-recording mode and then switched from the non-recording mode to a recording mode, there is produced a portion between two records where the records are not continuous. When such a portion is reproduced, abnormal data come to be reproduced because of existence of discontinuity between the prior and subsequent data. And, if a digital audio signal is similarly recorded, it follows that an abnormal sound is generated when such a portion is reproduced. Then, by recording an anti-format signal in the discontinuous portion, the reproduction of abnormal data or generation of abnormal sound can be prevented from occurring.
摘要翻译：本发明涉及用于记录数字化信号的装置。如果记录装置从记录模式切换到非记录模式，然后从非记录模式切换到记录模式，则在记录不连续的两个记录之间产生一部分。当再现这样的部分时，由于存在先前和后续数据之间的不连续性，异常数据将被再现。并且，如果数字音频信号被类似地记录，则当再现这样的部分时，产生异常声音。然后，通过在不连续部分中记录反格式信号，可以防止异常数据的再现或异常声音的产生。

9. 发明授权

US4905104A Rotary head type digital signal recording and/or reproducing apparatus for recording and/or reproducing with a variable speed 失效
标题翻译：用于以可变速度记录和/或再现的旋转头型数字信号记录和/或再现装置
公开(公告)号：US4905104A
公开(公告)日：1990-02-27
申请号：US76604
申请日：1987-07-22
申请人： Hiroo Okamoto , Takaharu Noguchi , Masaharu Kobayashi , Taihei Nakama
发明人： Hiroo Okamoto , Takaharu Noguchi , Masaharu Kobayashi , Taihei Nakama
IPC分类号： G11B5/09 , G11B15/12 , G11B15/18 , G11B15/467 , G11B20/10 , G11B20/12 , G11B27/00
CPC分类号： G11B20/10527 , G11B15/125 , G11B15/1875 , G11B27/005 , G11B15/4673 , G11B2220/90 , G11B2220/913
摘要： A rotary head type digital signal recording and/or reproducing apparatus wherein for 1/2 speed recording and/or reproducing from a magnetic tape, a tape feed speed is decreased to 1/2 times the normal speed, and a recording/reproducing interval becomes 2 times that of the normal mode of operation utilizing at least two rotary heads mounted at adjacent positions on a rotating cylinder with one of the rotary heads having a plus azimuth angle and the other having a minus azimuth angle. For 2 times speed recording/reproducing, a tape feed speed increases to 2 times the normal speed, and a recording/reproducing interval becomes 1/2 that of the normal mode of operation utilizing at least two rotary heads mounted on a rotating cylinder at opposite positions of a rotary axis of the cylinder, with one of the two rotary heads having a plus azimuth angle and the other having a minus azimuth angle.
摘要翻译：一种旋转磁头式数字信号记录和/或再现装置，其中对于从磁带进行1/2速度记录和/或再现，磁带进给速度降低到正常速度的1/2倍，并且记录/再现间隔变为使用安装在旋转圆筒上的相邻位置的至少两个旋转头的正常操作模式的2倍，其中一个旋转头具有正方位角，而另一个具有负方位角。对于2倍速度记录/再现，磁带进给速度增加到正常速度的2倍，并且记录/再现间隔变为使用安装在相反的旋转圆柱体上的至少两个旋转磁头的正常操作模式的记录/再现间隔的1/2 两个旋转头中的一个具有正方位角，另一个具有负方位角。

10. 发明授权

US4825276A Integrated circuit semiconductor device having improved wiring structure 失效
标题翻译：具有改进的布线结构的集成电路半导体器件
公开(公告)号：US4825276A
公开(公告)日：1989-04-25
申请号：US64996
申请日：1987-06-18
申请人： Masaharu Kobayashi
发明人： Masaharu Kobayashi
IPC分类号： H01L21/82 , H01L21/3205 , H01L23/52 , H01L23/528 , H01L27/118 , H01L27/10 , H01L27/02 , H01L29/34
CPC分类号： H01L23/5286 , H01L23/528 , H01L2924/0002
摘要： An integrated circuit semiconductor device having an improved power supply wiring structure is disclosed. The wiring includes a wide conductive layer and a plurality of stripe type narrow conductive layers formed on the wide conductive layer via an insulating film. Each of stripe type conductive layers is connected to the wide conductive layer through a plurality of contact holes provided in the insulating film.
摘要翻译：公开了一种具有改进的电源布线结构的集成电路半导体器件。布线包括宽导电层和经由绝缘膜形成在宽导电层上的多个条纹型窄导电层。每个条形导电层通过设置在绝缘膜中的多个接触孔连接到宽导电层。

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