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    • 6. 发明授权
    • Conditioner head in a substrate polisher and method
    • 基材抛光机中的调节头和方法
    • US6036583A
    • 2000-03-14
    • US890781
    • 1997-07-11
    • Ilya PerlovEugene Gantvarg
    • Ilya PerlovEugene Gantvarg
    • B24B53/017B24B37/04B24B53/007B24B53/02H01L21/304B24B1/00
    • B24B53/017
    • In one aspect, an apparatus and a method for use in substrate polishing are described wherein a conditioner head is provided for receiving an end effector for conditioning a polishing pad surface; the conditioner head is supported above the polishing pad surface to be conditioned; and the conditioner head is driven with an actuating force from a position that lies along a line that is substantially normal to the polishing pad surface to be conditioned so that an end effector attached to the conditioner head can condition the surface of the polishing pad. In another aspect, pneumatic pressure is supplied through the conditioner head support arm to apply actuating force to the conditioner head so that an end effector attached to the conditioner head can condition the surface of the polishing pad. In yet another aspect, the conditioner head support arm has a fluid channel extending therein and a fluid port, wherein the fluid channel is constructed to receive rinsing fluid and fluid port is constructed to direct rinsing fluid from the fluid channel toward the polishing pad surface to be conditioned.
    • 一方面,描述了一种用于衬底抛光的装置和方法,其中设置有用于接收用于调节抛光垫表面的末端执行器的调节头; 调节头被支撑在待调理的抛光垫表面上方; 并且调节头由来自位于基本上垂直于待调理的抛光垫表面的线的位置的致动力驱动,使得附接到调节头的末端执行器可调节抛光垫的表面。 另一方面,通过调节器头支撑臂供给气压,以向致动器头施加致动力,使得附接到调节头的末端执行器可调节抛光垫的表面。 在另一方面,调节器头支撑臂具有在其中延伸的流体通道和流体端口,其中流体通道被构造成接收冲洗流体,并且流体端口被构造成将冲洗流体从流体通道朝向抛光垫表面引导到 被调节。