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    • 5. 发明授权
    • System and method for controlling a polishing machine
    • 用于控制抛光机的系统和方法
    • US06561868B1
    • 2003-05-13
    • US09727187
    • 2000-11-30
    • Henry Litzmann EdwardsSung-Jen FangThomas M. Moore
    • Henry Litzmann EdwardsSung-Jen FangThomas M. Moore
    • B24B4900
    • B24B37/30B24B37/013B24B49/10
    • A system for controlling a polishing machine during polishing of a workpiece, such as a semiconductor wafer, includes a carrier which has an interface surface for engaging a workpiece and establishing ultrasonic coupling thereto. At least one crystal oscillator is ultrasonically coupled to the carrier and operates at a resonant frequency in an ultrasonic band which is indicative of a desired polishing depth of the workpiece, such as the endpoint of polishing. A detector circuit provides an output signal which is representative of an output level of the crystal oscillator. A processor circuit receives the signal from the detector circuit and provides a signal to the polishing machine when the amplitude of the signal from the detector circuit indicates that the desired polishing endpoint has been reached. A number of crystal oscillators can be spatially arranged on the carrier to establish a local polishing depth detection array.
    • 一种用于在诸如半导体晶片的工件的抛光期间控制抛光机的系统包括具有用于接合工件并与其建立超声耦合的界面的载体。 至少一个晶体振荡器被超声波耦合到载体上,并以超声波带的谐振频率工作,这表明了工件的期望的抛光深度,例如抛光的终点。 检测器电路提供表示晶体振荡器的输出电平的输出信号。 处理器电路接收来自检测器电路的信号,并且当来自检测器电路的信号的振幅指示已经达到所需的抛光端点时,向抛光机提供信号。 可以将多个晶体振荡器空间布置在载体上以建立局部抛光深度检测阵列。
    • 8. 发明申请
    • SINGLE-CHANNEL OPTICAL PROCESSING SYSTEM FOR ENERGETIC-BEAM MICROSCOPES
    • 用于能量束显微镜的单通道光学处理系统
    • US20100051802A1
    • 2010-03-04
    • US12201447
    • 2008-08-29
    • Herschel M. MarchmanThomas M. MooreRocky Kruger
    • Herschel M. MarchmanThomas M. MooreRocky Kruger
    • G01N23/00
    • H01J37/226H01J37/3045H01J2237/2482H01J2237/317H01J2237/31749
    • A single-channel optical processing system for an energetic-beam instrument has separate sources for processing radiation and illumination radiation. The processing radiation and the illumination radiation are combined in a single optical path and directed to a sample surface inside the energetic-beam instrument through a self-focusing rod lens. The self-focusing rod lens thus has a working distance from the sample surface that will not interfere with typical arrangements of ion beams and electron beams in such instruments. A combination of polarizers and beam splitters allows separation of the combined incident radiation and the combined radiation reflected from the sample surface and returned through the same optical channel, so that the reflected radiation may be directed to an optical detector, such as a camera or spectrometer. In other embodiments, additional illumination of the sample surface is provided at an angle to the central axis of the self-focusing rod lens.
    • 用于能量束仪器的单通道光学处理系统具有用于处理辐射和照射辐射的单独源。 处理辐射和照射辐射在单个光学路径中组合并通过自聚焦棒透镜指向能量束仪器内部的样品表面。 因此,自聚焦棒透镜具有与样品表面的工作距离,其不会干扰这些仪器中的离子束和电子束的典型布置。 偏振器和分束器的组合允许组合的入射辐射和从样品表面反射的组合辐射分离并通过相同的光学通道返回,使得反射的辐射可以被引导到诸如相机或光谱仪的光学检测器 。 在其他实施例中,样品表面的附加照明以与自聚焦棒透镜的中心轴成一定角度设置。
    • 10. 发明授权
    • Apparatus and method for automated stress testing of flip-chip packages
    • 倒装芯片封装自动应力测试的装置和方法
    • US07446542B2
    • 2008-11-04
    • US11367562
    • 2006-03-03
    • Lyudmila Zaykova-FeldmanThomas M. Moore
    • Lyudmila Zaykova-FeldmanThomas M. Moore
    • G01R31/302G01R31/28
    • G01R31/2881G01M7/08G01N3/00G01N3/307G01N3/313G01N2203/0044G01N2203/005G01N2203/0057G01N2203/0296G01N2203/0676G01R31/2868H01L21/67011
    • An apparatus for testing flip-chip packages has a programmed computer, a test-engine stage for applying an impact to at least one package under test, and a monitoring stage. The test-engine stage causes an impact on the package on the side opposite its ball-grid array. The test-engine stage has actuators connected to the test-engine stage and the computer, for moving and aligning the test-engine stage. The monitoring stage has a digital camera connected to the computer for transmitting digital images from the ball-grid array side of the package to the computer. A microscope is preferably connected to the digital camera. A sample stage located between the test-engine stage and the monitoring stage holds the package under test. The sample stage has an acoustic transducer capable of being removably connected to the package under test. The acoustic transducer is connected to the computer for transmitting signals from the acoustic transducer to the computer.
    • 用于测试倒装芯片封装的装置具有编程的计算机,用于对至少一个待测试包进行冲击的测试引擎阶段和监视阶段。 测试引擎级在与球栅阵列相反的一侧对包装产生影响。 测试发动机级具有连接到测试发动机级和计算机的致动器,用于移动和对准测试引擎级。 监控级具有连接到计算机的数字照相机,用于将数字图像从包装的球栅阵列侧传输到计算机。 显微镜优选地连接到数码相机。 位于测试引擎级和监控级之间的样品台保持被测试的包装。 样品台具有能够可拆卸地连接到被测试包装的声学换能器。 声学换能器连接到计算机,用于将信号从声学传感器传输到计算机。