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    • 2. 发明授权
    • Giant magnetoresistive (GMR) sensor element with enhanced magnetoresistive (MR) coefficient
    • 具有增强磁阻(MR)系数的巨磁阻(GMR)传感器元件
    • US06292336B1
    • 2001-09-18
    • US09408703
    • 1999-09-30
    • Cheng T. HorngRu-Ying TongKochan JuMao-Min ChenJei-Wei ChangSimon H. Liao
    • Cheng T. HorngRu-Ying TongKochan JuMao-Min ChenJei-Wei ChangSimon H. Liao
    • G11B5127
    • B82Y25/00B82Y10/00G01R33/093G11B5/3903G11B5/3967G11B2005/3996H01F10/3268
    • A method for forming a giant magnetoresistive (GMR) sensor element, and a giant magnetoresistive (GMR) sensor element formed in accord with the method. In accord with the method, there is first provided a substrate. There is then formed over the substrate a seed layer formed of a magnetoresistive (MR) resistivity sensitivity enhancing material selected from the group consisting or nickel-chromium alloys and nickel-iron-chromium alloys. There is then formed over the seed layer a nickel oxide material layer. Finally, there is then formed over the nickel oxide material layer a free ferromagnetic layer separated from a pinned ferromagnetic layer in turn formed thereover by a non-magnetic conductor spacer layer, where the pinned ferromagnetic layer in turn has a pinning material layer formed thereover. The method contemplates a giant magnetoresistive (GMR) sensor element formed in accord with the method. The nickel oxide material layer provides the giant magnetoresistive (GMR) sensor element with an enhanced magnetoresistive (MR) resistivity sensitivity.
    • 一种用于形成巨磁阻(GMR)传感器元件的方法,以及根据该方法形成的巨磁阻(GMR)传感元件。 根据该方法,首先提供基板。 然后在衬底上形成由选自镍铬合金和镍 - 铁 - 铬合金的磁阻(MR)电阻率敏感度增强材料形成的晶种层。 然后在种子层上形成氧化镍材料层。 最后,然后在氧化镍材料层上形成与被钉扎的铁磁性层分离的自由铁磁层,然后由非磁性导体间隔层形成,其中钉扎的铁磁层又形成有钉扎材料层。 该方法考虑了根据该方法形成的巨磁阻(GMR)传感器元件。 氧化镍材料层提供具有增强的磁阻(MR)电阻率敏感性的巨磁阻(GMR)传感器元件。
    • 6. 发明授权
    • Method of fabrication of striped magnetoresistive (SMR) and dual stripe magnetoresistive (DSMR) heads with anti-parallel exchange configuration
    • 具有反并联交换配置的带状磁阻(SMR)和双条磁阻(DSMR)头的制造方法
    • US06430015B2
    • 2002-08-06
    • US09773743
    • 2001-02-02
    • Kochan JuMao-Min ChenCheng T. HorngJei-Wei Chang
    • Kochan JuMao-Min ChenCheng T. HorngJei-Wei Chang
    • G11B539
    • B82Y25/00B82Y10/00G11B5/3163G11B5/3903G11B5/3932G11B5/3948G11B2005/3996
    • A longitudinally magnetically biased dual stripe magnetoresistive (DSMR) sensor element comprises a first patterned magnetoresistive (MR) layer. There are contacts at the opposite ends of the patterned magnetoresistive (MR) layer with a first pair of stacks defining a track width of the first magnetoresistive (MR) layer with a first pair of stacks defining a track width of the first magnetoresistive (MR) layer, each of the stacks including a first Anti-Ferro-Magnetic (AFM) layer and a first lead layer. With the first MR layer in place the device was annealed in the presence of a longitudinal external magnetic field. A second patterned magnetoresistive (MR) layer was formed above the previous structure. There are contacts at the opposite ends of the second patterned magnetoresistive (MR) layer with a second pair of stacks defining a second track width of the second patterned magnetoresistive (MR) layer. Each of the second pair of stacks includes spacer layer is composed of a metal, a Ferro-Magnetic (FM) layer, a second Anti-Ferro-Magnetic (AFM) layer and a second lead layer. With the second MR layer in place, the device was annealed in the presence of a second longitudinal external magnetic field.
    • 纵向磁偏置双条磁阻(DSMR)传感器元件包括第一图案化磁阻(MR)层。 在图案化磁阻(MR)层的相对端处存在触点,第一对叠层限定第一磁阻(MR)层的轨道宽度,第一对堆叠限定第一磁阻(MR)的磁道宽度, 层,每个堆叠包括第一抗铁磁(AFM)层和第一引线层。 在第一MR层就位的情况下,器件在存在纵向外部磁场的情况下退火。 在先前结构之上形成第二图案化磁阻(MR)层。 在第二图案化磁阻(MR)层的相对端具有限定第二图案化磁阻(MR)层的第二磁道宽度的第二对叠层的触点。 第二对堆叠中的每一个包括间隔层由金属,铁磁(FM)层,第二抗铁磁(AFM)层和第二引线层组成。 在第二MR层就位的情况下,器件在第二纵向外部磁场的存在下退火。
    • 7. 发明授权
    • Method of fabrication of striped magnetoresistive (SMR) and dual stripe magnetoresistive (DSMR) heads with anti-parallel exchange configuration
    • 具有反并联交换配置的带状磁阻(SMR)和双条磁阻(DSMR)头的制造方法
    • US06204071B1
    • 2001-03-20
    • US09408491
    • 1999-09-30
    • Kochan JuMao-Min ChenCheng T. HorngJei-Wei Chang
    • Kochan JuMao-Min ChenCheng T. HorngJei-Wei Chang
    • H01L2100
    • B82Y25/00B82Y10/00G11B5/3163G11B5/3903G11B5/3932G11B5/3948G11B2005/3996
    • A method for forming a longitudinally magnetically biased dual stripe magnetoresistive (DSMR) sensor element comprises forming a first patterned magnetoresistive (MR) layer. Contact the opposite ends of the patterned magnetoresistive (MR) layer with a first pair of stacks defining a track width of the first magnetoresistive (MR) layer, each of the stacks including a first Anti-Ferro-Magnetic (AFM) layer and a first lead layer. Then anneal the device in the presence of a longitudinal external magnetic field. Next, form a second patterned magnetoresistive (MR) layer above the previous structure. Contact the opposite ends of the second patterned magnetoresistive (MR) layer with a second pair of stacks defining a second track width of the second patterned magnetoresistive (MR) layer. Each of the second pair of stacks includes spacer layer composed of a metal, a Ferro-Magnetic (FM) layer, a second Anti-Ferro-Magnetic (AFM) layer and a second lead layer. Then anneal the device in the presence of a second longitudinal external magnetic field.
    • 用于形成纵向磁偏置双条磁阻(DSMR)传感器元件的方法包括形成第一图案化磁阻(MR)层。 用限定第一磁阻(MR)层的轨道宽度的第一对叠层接触图案化磁阻(MR)层的相对端,每个堆叠包括第一抗铁磁(AFM)层和第一 铅层。 然后在存在纵向外部磁场的情况下退火该器件。 接下来,在先前的结构之上形成第二图案化磁阻(MR)层。 用限定第二图案化磁阻(MR)层的第二磁道宽度的第二对叠层接触第二图案化磁阻(MR)层的相对端。 第二对堆叠中的每一个包括由金属,铁磁(FM)层,第二抗铁磁(AFM)层和第二引线层组成的间隔层。 然后在存在第二纵向外部磁场的情况下退火该器件。
    • 8. 发明授权
    • Structure and method to fabricate high performance MTJ devices for MRAM applications
    • 制造用于MRAM应用的高性能MTJ器件的结构和方法
    • US07211447B2
    • 2007-05-01
    • US11080868
    • 2005-03-15
    • Cheng T. HorngRu-Ying TongMao-Min ChenLiubo HongMin Li
    • Cheng T. HorngRu-Ying TongMao-Min ChenLiubo HongMin Li
    • H01L21/00
    • H01L43/12
    • A method of forming a high performance MTJ in an MRAM array is disclosed. A Ta/Ru capping layer in a bottom conductor is sputter etched to remove the Ru layer and form an amorphous Ta capping layer. A key feature is a subsequent surface treatment of the Ta capping layer in a transient vacuum chamber where a self-annealing occurs and a surfactant layer is formed on the Ta surface. The resulting smooth and flat Ta surface promotes a smooth and flat surface in the MTJ layers which are subsequently formed on the surfactant layer. For a 0.3×0.6 micron MTJ bit size, a 35 to 40 Angstrom thick NiFe(18%) free layer, an AlOx barrier layer generated from a ROX oxidation of an 9 to 10 Angstrom thick Al layer, and a Ru/Ta/Ru capping layer are employed to give a dR/R of >40% and an RA of about 4000 ohm-μm2.
    • 公开了一种在MRAM阵列中形成高性能MTJ的方法。 溅射蚀刻底部导体中的Ta / Ru覆盖层以去除Ru层并形成无定形Ta覆盖层。 一个关键的特征是在瞬态真空室中Ta覆盖层的后续表面处理,其中发生自退火并且在Ta表面上形成表面活性剂层。 所得到的平滑且平坦的Ta表面促进在表面活性剂层上随后形成的MTJ层中的光滑和平坦的表面。 对于0.3×0.6微米的MTJ位尺寸,35至40埃厚的NiFe(18%)自由层,由9至10埃厚的Al层的ROX氧化产生的AlO x势垒层,以及Ru / Ta / 使用Ru覆盖层来产生大于40%的dR / R和约4000欧姆 - 姆2的RA。