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1. 发明授权

US07449091B2 Wafer electroplating apparatus 有权
标题翻译：晶圆电镀设备
公开(公告)号：US07449091B2
公开(公告)日：2008-11-11
申请号：US11073655
申请日：2005-03-08
申请人： Chen-Chung Du , Jen-Rong Huang , Pang-Ming Chiang , Chih-Yuan Tseng , Muh-Wang Liang , Chih-Cheng Wang , Yi-Chao Weng
发明人： Chen-Chung Du , Jen-Rong Huang , Pang-Ming Chiang , Chih-Yuan Tseng , Muh-Wang Liang , Chih-Cheng Wang , Yi-Chao Weng
IPC分类号： B01D19/00 , C25B15/00
CPC分类号： C25D21/04 , C25D5/003 , C25D5/08 , C25D7/123 , C25D17/001
摘要： A wafer electroplating apparatus with a function of bubble removal includes an electroplating bath main body and a fixing device. The electroplating bath main body has an inlet device, a first de-bubble tank and at least an air hole. The fixing device has a second de-bubble tank and an outer shell. The air hole guides gathering bubbles to an outside of the electroplating bath main body so as to remove bubbles. The fixing device can be put into the first de-bubble tank within the electroplating bath main body to form a de-bubble area and is separated easily therefrom to clean the wafer electroplating apparatus. The electroplating bath main body further includes a baffle for rectifying electroplating solution flow before entering the inlet device.
摘要翻译：具有除泡功能的晶片电镀装置包括电镀浴主体和定影装置。电镀浴主体具有入口装置，第一去泡箱和至少一个空气孔。定影装置具有第二去泡箱和外壳。气孔将聚集气泡引导到电镀浴主体的外部，以便除去气泡。定影装置可以放入电镀槽主体内的第一个脱泡槽中，形成去气泡区域，并容易地分离，以清洁晶片电镀装置。电镀浴主体还包括用于在进入入口装置之前对电镀液流进行整流的挡板。

2. 发明申请

US20060137974A1 Wafer electroplating apparatus 有权
标题翻译：晶圆电镀设备
公开(公告)号：US20060137974A1
公开(公告)日：2006-06-29
申请号：US11073655
申请日：2005-03-08
申请人： Chen-Chung Du , Jen-Rong Huang , Pang-Ming Chiang , Chih-Yuan Tseng , Muh-Wang Liang , Chih-Cheng Wang , Yi-Chao Weng
发明人： Chen-Chung Du , Jen-Rong Huang , Pang-Ming Chiang , Chih-Yuan Tseng , Muh-Wang Liang , Chih-Cheng Wang , Yi-Chao Weng
IPC分类号： C25B15/08
CPC分类号： C25D21/04 , C25D5/003 , C25D5/08 , C25D7/123 , C25D17/001
摘要： A wafer electroplating apparatus with a function of bubble removal includes an electroplating bath main body and a fixing device. The electroplating bath main body has an inlet device, a first de-bubble tank and at least an air hole. The fixing device has a second de-bubble tank and an outer shell. The air hole guides gathering bubbles to an outside of the electroplating bath main body so as to remove bubbles. The fixing device can be put into the first de-bubble tank within the electroplating bath main body to form a de-bubble area and is separated easily therefrom to clean the wafer electroplating apparatus. The electroplating bath main body further includes a baffle for rectifying electroplating solution flow before entering the inlet device.
摘要翻译：具有除泡功能的晶片电镀装置包括电镀浴主体和定影装置。电镀浴主体具有入口装置，第一去泡箱和至少一个空气孔。定影装置具有第二去泡箱和外壳。气孔将聚集气泡引导到电镀浴主体的外部，以便除去气泡。定影装置可以放入电镀槽主体内的第一个脱泡槽中，形成去气泡区域，并容易地分离，以清洁晶片电镀装置。电镀浴主体还包括用于在进入入口装置之前对电镀液流进行整流的挡板。

3. 发明申请

US20050051023A1 Compress and position apparatus 有权
标题翻译：压缩和定位装置
公开(公告)号：US20050051023A1
公开(公告)日：2005-03-10
申请号：US10764586
申请日：2004-01-27
申请人： Chen-Chung Du , Pang-Ming Chiang , Jen-Rong Huang , Muh-Wang Liang , Yi-Chao Weng
发明人： Chen-Chung Du , Pang-Ming Chiang , Jen-Rong Huang , Muh-Wang Liang , Yi-Chao Weng
IPC分类号： F01B15/00 , F16K17/00 , H01L21/68
CPC分类号： B30B1/38 , B30B15/068
摘要： The present invention relates to a compress and position apparatus with positioning, orientating functions and providing more uniform pressing force compliantly. The compress and position apparatus comprises a guiding column, a base, a housing, a seat, a annular portion and a pressing plate. The base has a cylinder, a plurality of locating pins and a convex portion. The annular portion has a through hole and a plurality of locating holes. The guiding column and the cylinder are disposed in the housing provided with an opening for the guiding column passing therethrough. The housing is mounted on the base and passed through a through hole of the annular portion and disposed in a cavity of the seat. A plane on the housing abuts a plane on the cavity to prevent the rotation of the housing. The guiding column is combined with the seat. The locating pin is inserted into the locating hole. The pressing plate engages the annular portion. Thus the guiding column is moved up and down by the gas supply device. The convex portion biases the pressing plate to exert force on the substrate.
摘要翻译：本发明涉及具有定位，定向功能并且提供更均匀的按压力的压缩和定位装置。压缩和定位装置包括导向柱，基座，壳体，座椅，环形部分和压板。基座具有圆柱体，多个定位销和凸起部分。环形部分具有通孔和多个定位孔。引导柱和圆柱体设置在壳体中，该壳体设置有用于引导柱通过的开口。壳体安装在基座上并穿过环形部分的通孔并设置在座椅的空腔中。壳体上的平面与空腔上的平面抵接以防止壳体旋转。引导柱与座椅结合。定位销插入定位孔。压板与环形部分接合。因此，引导塔由气体供给装置上下移动。凸起部分偏压压板以在基底上施加力。

4. 发明授权

US07021208B2 Compress and position apparatus 有权
标题翻译：压缩和定位装置
公开(公告)号：US07021208B2
公开(公告)日：2006-04-04
申请号：US10764586
申请日：2004-01-27
申请人： Chen-Chung Du , Pang-Ming Chiang , Jen-Rong Huang , Muh-Wang Liang , Yi-Chao Weng
发明人： Chen-Chung Du , Pang-Ming Chiang , Jen-Rong Huang , Muh-Wang Liang , Yi-Chao Weng
IPC分类号： B30B1/32
CPC分类号： B30B1/38 , B30B15/068
摘要： The present invention relates to a compress and position apparatus with positioning, orientating functions and providing more uniform pressing force compliantly. The compress and position apparatus comprises a guiding column, a base, a housing, a seat, a annular portion and a pressing plate. The base has a cylinder, a plurality of locating pins and a convex portion. The annular portion has a through hole and a plurality of locating holes. The guiding column and the cylinder are disposed in the housing provided with an opening for the guiding column passing therethrough. The housing is mounted on the base and passed through a through hole of the annular portion and disposed in a cavity of the seat. A plane on the housing abuts a plane on the cavity to prevent the rotation of the housing. The guiding column is combined with the seat. The locating pin is inserted into the locating hole. The pressing plate engages the annular portion. Thus the guiding column is moved up and down by the gas supply device. The convex portion biases the pressing plate to exert force on the substrate.
摘要翻译：本发明涉及具有定位，定向功能并且提供更均匀的按压力的压缩和定位装置。压缩和定位装置包括导向柱，基座，壳体，座椅，环形部分和压板。基座具有圆柱体，多个定位销和凸起部分。环形部分具有通孔和多个定位孔。引导柱和圆柱体设置在壳体中，该壳体设置有用于引导柱通过的开口。壳体安装在基座上并穿过环形部分的通孔并设置在座椅的空腔中。壳体上的平面与空腔上的平面抵接以防止壳体旋转。引导柱与座椅结合。定位销插入定位孔。压板与环形部分接合。因此，引导塔由气体供给装置上下移动。凸起部分偏压压板以在基底上施加力。

5. 发明授权

US08435803B2 Method for depositing microcrystalline silicon and monitor device of plasma enhanced deposition 有权
标题翻译：沉积微晶硅的方法和等离子体增强沉积监测装置
公开(公告)号：US08435803B2
公开(公告)日：2013-05-07
申请号：US12758698
申请日：2010-04-12
申请人： Chen-Chung Du , Sheng-Lang Lee , Muh-Wang Liang , Jen-Rong Huang , Chia-Hao Chang
发明人： Chen-Chung Du , Sheng-Lang Lee , Muh-Wang Liang , Jen-Rong Huang , Chia-Hao Chang
IPC分类号： H01L21/00
CPC分类号： H01J37/32972 , H01J37/32935 , H01L21/02532 , H01L21/0262
摘要： A method for depositing a microcrystalline silicon film is disclosed, including performing an open loop and close loop plasma enhanced deposition process without and with modulating process parameters, respectively. A film is deposited by the open loop plasma enhanced deposition process till a required film crystallinity and then performing a closed loop plasma enhanced deposition process which monitors species plasma spectrum intensities SiH* and Hα and modulates process parameters of the plasma enhanced deposition process resulting in the species concentration stabilization which controls the intensities variation of SiH* and Hα within an allowed range of a target value for improving film depositing rate.
摘要翻译：公开了一种用于沉积微晶硅膜的方法，包括分别执行开路和闭环等离子体增强沉积工艺，而不需要和调制工艺参数。通过开环等离子体增强沉积工艺沉积膜直到所需的膜结晶度，然后执行监测物质等离子体光谱强度SiH *和Halpha的闭环等离子体增强沉积工艺，并调制等离子体增强沉积过程的工艺参数，物质浓度稳定化，其控制SiH *和Halpha在目标值的允许范围内的强度变化，以提高成膜速率。

6. 发明申请

US20110136269A1 METHOD FOR DEPOSITING MICROCRYSTALLINE SILICON AND MONITOR DEVICE OF PLASMA ENHANCED DEPOSITION 有权
标题翻译：沉积微晶硅的方法和等离子体增强沉积的监测装置
公开(公告)号：US20110136269A1
公开(公告)日：2011-06-09
申请号：US12758698
申请日：2010-04-12
申请人： Chen-Chung Du , Sheng-Lang Lee , Muh-Wang Liang , Jen-Rong Huang , Chia-Hao Chang
发明人： Chen-Chung Du , Sheng-Lang Lee , Muh-Wang Liang , Jen-Rong Huang , Chia-Hao Chang
IPC分类号： H01L21/66 , B05C11/00
CPC分类号： H01J37/32972 , H01J37/32935 , H01L21/02532 , H01L21/0262
摘要： A method for depositing a microcrystalline silicon film is disclosed, including performing an open loop and close loop plasma enhanced deposition process without and with modulating process parameters, respectively. A film is deposited by the open loop plasma enhanced deposition process till a required film crystallinity and then performing a closed loop plasma enhanced deposition process which monitors species plasma spectrum intensities SiH* and Hα and modulates process parameters of the plasma enhanced deposition process resulting in the species concentration stabilization which controls the intensities variation of SiH* and Hα within an allowed range of a target value for improving film depositing rate.
摘要翻译：公开了一种用于沉积微晶硅膜的方法，包括分别执行开路和闭环等离子体增强沉积工艺，而不需要和调制工艺参数。通过开环等离子体增强沉积工艺沉积膜直到所需的膜结晶度，然后执行监测物质等离子体光谱强度SiH *和Hα的闭环等离子体增强沉积过程，并调制等离子体增强沉积过程的工艺参数，从而导致物质浓度稳定化，其控制在目标值的允许范围内的SiH *和Hα的强度变化，以提高成膜速率。

7. 发明授权

US06622883B1 Door for wafer container having rotatable cammed member and movable links 失效
标题翻译：具有旋转凸轮部件和活动连接件的晶片容器的门
公开(公告)号：US06622883B1
公开(公告)日：2003-09-23
申请号：US09644653
申请日：2000-08-24
申请人： Tzong-Ming Wu , Jen-Rong Huang , Muh-Wang Liang
发明人： Tzong-Ming Wu , Jen-Rong Huang , Muh-Wang Liang
IPC分类号： B65D4528
CPC分类号： H01L21/67373 , Y10T292/0837 , Y10T292/0839
摘要： A Modified door for wafer container, includes a rotatable cammed member, two first links coupled to the rotatable cammed member and vertically aligned and moved in and out of respective first latch holes on the wafer transport module upon rotary motion of the rotatable cammed member, and two second links respectively coupled to the first links and horizontally moved in and out of respective second latch holes on the wafer transport module upon movement of the first links. The links each have a slope adapted to be moved with the respective link over a respective bearing means of the door body to force the door body inwards against the wafer transport module, keeping the wafer transport module well sealed.
摘要翻译：一种用于晶片容器的修改门，包括可旋转的凸轮构件，两个第一连杆，其联接到可旋转的凸轮构件，并且在可旋转的凸轮构件的旋转运动时垂直对准并移入和移出晶片传送模块上的相应的第一闩锁孔;以及两个第二链节分别耦合到第一链节并且在第一链节移动时水平地移入和移出晶片传送模块上的相应的第二闩锁孔。连接件各自具有适于与相应的连杆一起移动到相应的门体的相应轴承装置上的斜面，以将门体向内抵靠晶片传送模块，从而保持晶片传送模块的良好密封。

8. 发明授权

US06653245B2 Method for liquid phase deposition 失效
标题翻译：液相沉积方法
公开(公告)号：US06653245B2
公开(公告)日：2003-11-25
申请号：US09874108
申请日：2001-06-06
申请人： Muh-Wang Liang , Pang-Min Chiang , Chen Max , Jen-Rong Huang , Ching-Fa Yeh
发明人： Muh-Wang Liang , Pang-Min Chiang , Chen Max , Jen-Rong Huang , Ching-Fa Yeh
IPC分类号： H01L2131
CPC分类号： H01L21/67086 , H01L21/316 , Y10T137/4643 , Y10T137/4891 , Y10T137/5386 , Y10T137/5474 , Y10T137/8593 , Y10T307/779
摘要： A method for liquid phase deposition, including the steps of providing at least two raw materials from at least two supply devices of a saturation reaction system into a mixture trough and stirring until saturation occurs, filtering out unnecessary solid-state particles, and providing saturated and filtered liquid into an over-saturation reaction trough of a steady-flow over-saturation loop reaction system and stopping the saturated and filtered liquid when the over-saturation reaction trough is filled and the saturated and filtered liquid over-flows into a liquid level control trough to a pre-determined level. The method also includes the steps of providing a substrate in the over-saturation reaction trough, providing reactants from at least two supply devices into the over-saturation reaction trough, and depositing a thin film onto the substrate when the saturated liquid becomes over-saturated.
摘要翻译：一种用于液相沉积的方法，包括以下步骤：将饱和反应体系的至少两个供应装置的至少两种原料提供到混合物槽中，并搅拌直到饱和发生，过滤不需要的固态颗粒，并提供饱和和过滤液体进入稳流过饱和环路反应系统的过饱和反应槽，当过饱和反应槽填满时停止饱和和过滤的液体，饱和和过滤的液体过量流入液位控制低谷达到预定水平。该方法还包括以下步骤：在过饱和反应槽中提供衬底，将反应物从至少两个供应装置提供到过饱和反应槽中，并且当饱和液体变得过度饱和时，将薄膜沉积到衬底上。

9. 发明授权

US07238265B2 Electroplating apparatus with functions of voltage detection and flow rectification 有权
标题翻译：具有电压检测和流量整流功能的电镀设备
公开(公告)号：US07238265B2
公开(公告)日：2007-07-03
申请号：US10743496
申请日：2003-12-23
申请人： Chih-Cheng Wang , Chih-Yuan Tseng , Jen-Rong Huang , Sheng-Lang Lee , Chia-Ming Chen , Pang-Ming Chiang
发明人： Chih-Cheng Wang , Chih-Yuan Tseng , Jen-Rong Huang , Sheng-Lang Lee , Chia-Ming Chen , Pang-Ming Chiang
IPC分类号： C25B9/04 , C25F7/00
CPC分类号： C25D5/08 , C25D17/001 , C25D17/008 , C25D21/10
摘要： The present invention provides a fountain-type electroplating apparatus with functions of voltage detection and flow rectification, comprising: an electroplating tank, a rectification device, and an overflow tank, wherein the electroplating tank is positioned inside the overflow tank, and the rectification device is arranged under the electroplating tank, in addition, the electroplating tank is composed of a shell, a cathode electrode, and an mesh shaped anode. The apparatus of the present invention further comprises: a power supplier, a switcher, a plurality of detection circuits, and a plurality of connecting line, which is used for monitoring the same.
摘要翻译：本发明提供一种具有电压检测和整流功能的喷泉型电镀设备，包括：电镀槽，整流装置和溢流槽，其中电镀槽位于溢流槽内，整流装置为另外，电镀槽由电镀槽构成，由电解槽，阴极电极和网状阳极构成。本发明的装置还包括：电源，切换器，多个检测电路和多个连接线，用于对其进行监视。

10. 发明申请

US20050051425A1 Electroplating apparatus with functions of voltage detection and flow rectification 有权
标题翻译：具有电压检测和流量整流功能的电镀设备
公开(公告)号：US20050051425A1
公开(公告)日：2005-03-10
申请号：US10743496
申请日：2003-12-23
申请人： Chih-Cheng Wang , Chih-Yuan Tseng , Jen-Rong Huang , Sheng-Lang Lee , Chia-Ming Chen , Pang-Ming Chiang
发明人： Chih-Cheng Wang , Chih-Yuan Tseng , Jen-Rong Huang , Sheng-Lang Lee , Chia-Ming Chen , Pang-Ming Chiang
IPC分类号： C25C7/00 , C25D5/08 , C25D17/00 , C25D21/10 , G01R19/00
CPC分类号： C25D5/08 , C25D17/001 , C25D17/008 , C25D21/10
摘要： The present invention provides a fountain-type electroplating apparatus with functions of voltage detection and flow rectification, comprising: an electroplating tank, a rectification device, and an overflow tank, wherein the electroplating tank is positioned inside the overflow tank, and the rectification device is arranged under the electroplating tank, in addition, the electroplating tank is composed of a shell, a cathode electrode, and an mesh shaped anode. The apparatus of the present invention further comprises: a power supplier, a switcher, a plurality of detection circuits, and a plurality of connecting line, which is used for monitoring the same.
摘要翻译：本发明提供一种具有电压检测和整流功能的喷泉型电镀设备，包括：电镀槽，整流装置和溢流槽，其中电镀槽位于溢流槽内，整流装置为另外，电镀槽由电镀槽构成，由电解槽，阴极电极和网状阳极构成。本发明的装置还包括：电源，切换器，多个检测电路和多个连接线，用于对其进行监视。

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