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1. 发明授权

US07449091B2 Wafer electroplating apparatus 有权
标题翻译：晶圆电镀设备
公开(公告)号：US07449091B2
公开(公告)日：2008-11-11
申请号：US11073655
申请日：2005-03-08
申请人： Chen-Chung Du , Jen-Rong Huang , Pang-Ming Chiang , Chih-Yuan Tseng , Muh-Wang Liang , Chih-Cheng Wang , Yi-Chao Weng
发明人： Chen-Chung Du , Jen-Rong Huang , Pang-Ming Chiang , Chih-Yuan Tseng , Muh-Wang Liang , Chih-Cheng Wang , Yi-Chao Weng
IPC分类号： B01D19/00 , C25B15/00
CPC分类号： C25D21/04 , C25D5/003 , C25D5/08 , C25D7/123 , C25D17/001
摘要： A wafer electroplating apparatus with a function of bubble removal includes an electroplating bath main body and a fixing device. The electroplating bath main body has an inlet device, a first de-bubble tank and at least an air hole. The fixing device has a second de-bubble tank and an outer shell. The air hole guides gathering bubbles to an outside of the electroplating bath main body so as to remove bubbles. The fixing device can be put into the first de-bubble tank within the electroplating bath main body to form a de-bubble area and is separated easily therefrom to clean the wafer electroplating apparatus. The electroplating bath main body further includes a baffle for rectifying electroplating solution flow before entering the inlet device.
摘要翻译：具有除泡功能的晶片电镀装置包括电镀浴主体和定影装置。电镀浴主体具有入口装置，第一去泡箱和至少一个空气孔。定影装置具有第二去泡箱和外壳。气孔将聚集气泡引导到电镀浴主体的外部，以便除去气泡。定影装置可以放入电镀槽主体内的第一个脱泡槽中，形成去气泡区域，并容易地分离，以清洁晶片电镀装置。电镀浴主体还包括用于在进入入口装置之前对电镀液流进行整流的挡板。

2. 发明申请

US20060137974A1 Wafer electroplating apparatus 有权
标题翻译：晶圆电镀设备
公开(公告)号：US20060137974A1
公开(公告)日：2006-06-29
申请号：US11073655
申请日：2005-03-08
申请人： Chen-Chung Du , Jen-Rong Huang , Pang-Ming Chiang , Chih-Yuan Tseng , Muh-Wang Liang , Chih-Cheng Wang , Yi-Chao Weng
发明人： Chen-Chung Du , Jen-Rong Huang , Pang-Ming Chiang , Chih-Yuan Tseng , Muh-Wang Liang , Chih-Cheng Wang , Yi-Chao Weng
IPC分类号： C25B15/08
CPC分类号： C25D21/04 , C25D5/003 , C25D5/08 , C25D7/123 , C25D17/001
摘要： A wafer electroplating apparatus with a function of bubble removal includes an electroplating bath main body and a fixing device. The electroplating bath main body has an inlet device, a first de-bubble tank and at least an air hole. The fixing device has a second de-bubble tank and an outer shell. The air hole guides gathering bubbles to an outside of the electroplating bath main body so as to remove bubbles. The fixing device can be put into the first de-bubble tank within the electroplating bath main body to form a de-bubble area and is separated easily therefrom to clean the wafer electroplating apparatus. The electroplating bath main body further includes a baffle for rectifying electroplating solution flow before entering the inlet device.
摘要翻译：具有除泡功能的晶片电镀装置包括电镀浴主体和定影装置。电镀浴主体具有入口装置，第一去泡箱和至少一个空气孔。定影装置具有第二去泡箱和外壳。气孔将聚集气泡引导到电镀浴主体的外部，以便除去气泡。定影装置可以放入电镀槽主体内的第一个脱泡槽中，形成去气泡区域，并容易地分离，以清洁晶片电镀装置。电镀浴主体还包括用于在进入入口装置之前对电镀液流进行整流的挡板。

3. 发明申请

US20050051023A1 Compress and position apparatus 有权
标题翻译：压缩和定位装置
公开(公告)号：US20050051023A1
公开(公告)日：2005-03-10
申请号：US10764586
申请日：2004-01-27
申请人： Chen-Chung Du , Pang-Ming Chiang , Jen-Rong Huang , Muh-Wang Liang , Yi-Chao Weng
发明人： Chen-Chung Du , Pang-Ming Chiang , Jen-Rong Huang , Muh-Wang Liang , Yi-Chao Weng
IPC分类号： F01B15/00 , F16K17/00 , H01L21/68
CPC分类号： B30B1/38 , B30B15/068
摘要： The present invention relates to a compress and position apparatus with positioning, orientating functions and providing more uniform pressing force compliantly. The compress and position apparatus comprises a guiding column, a base, a housing, a seat, a annular portion and a pressing plate. The base has a cylinder, a plurality of locating pins and a convex portion. The annular portion has a through hole and a plurality of locating holes. The guiding column and the cylinder are disposed in the housing provided with an opening for the guiding column passing therethrough. The housing is mounted on the base and passed through a through hole of the annular portion and disposed in a cavity of the seat. A plane on the housing abuts a plane on the cavity to prevent the rotation of the housing. The guiding column is combined with the seat. The locating pin is inserted into the locating hole. The pressing plate engages the annular portion. Thus the guiding column is moved up and down by the gas supply device. The convex portion biases the pressing plate to exert force on the substrate.
摘要翻译：本发明涉及具有定位，定向功能并且提供更均匀的按压力的压缩和定位装置。压缩和定位装置包括导向柱，基座，壳体，座椅，环形部分和压板。基座具有圆柱体，多个定位销和凸起部分。环形部分具有通孔和多个定位孔。引导柱和圆柱体设置在壳体中，该壳体设置有用于引导柱通过的开口。壳体安装在基座上并穿过环形部分的通孔并设置在座椅的空腔中。壳体上的平面与空腔上的平面抵接以防止壳体旋转。引导柱与座椅结合。定位销插入定位孔。压板与环形部分接合。因此，引导塔由气体供给装置上下移动。凸起部分偏压压板以在基底上施加力。

4. 发明授权

US07021208B2 Compress and position apparatus 有权
标题翻译：压缩和定位装置
公开(公告)号：US07021208B2
公开(公告)日：2006-04-04
申请号：US10764586
申请日：2004-01-27
申请人： Chen-Chung Du , Pang-Ming Chiang , Jen-Rong Huang , Muh-Wang Liang , Yi-Chao Weng
发明人： Chen-Chung Du , Pang-Ming Chiang , Jen-Rong Huang , Muh-Wang Liang , Yi-Chao Weng
IPC分类号： B30B1/32
CPC分类号： B30B1/38 , B30B15/068
摘要： The present invention relates to a compress and position apparatus with positioning, orientating functions and providing more uniform pressing force compliantly. The compress and position apparatus comprises a guiding column, a base, a housing, a seat, a annular portion and a pressing plate. The base has a cylinder, a plurality of locating pins and a convex portion. The annular portion has a through hole and a plurality of locating holes. The guiding column and the cylinder are disposed in the housing provided with an opening for the guiding column passing therethrough. The housing is mounted on the base and passed through a through hole of the annular portion and disposed in a cavity of the seat. A plane on the housing abuts a plane on the cavity to prevent the rotation of the housing. The guiding column is combined with the seat. The locating pin is inserted into the locating hole. The pressing plate engages the annular portion. Thus the guiding column is moved up and down by the gas supply device. The convex portion biases the pressing plate to exert force on the substrate.
摘要翻译：本发明涉及具有定位，定向功能并且提供更均匀的按压力的压缩和定位装置。压缩和定位装置包括导向柱，基座，壳体，座椅，环形部分和压板。基座具有圆柱体，多个定位销和凸起部分。环形部分具有通孔和多个定位孔。引导柱和圆柱体设置在壳体中，该壳体设置有用于引导柱通过的开口。壳体安装在基座上并穿过环形部分的通孔并设置在座椅的空腔中。壳体上的平面与空腔上的平面抵接以防止壳体旋转。引导柱与座椅结合。定位销插入定位孔。压板与环形部分接合。因此，引导塔由气体供给装置上下移动。凸起部分偏压压板以在基底上施加力。

5. 发明授权

US08435803B2 Method for depositing microcrystalline silicon and monitor device of plasma enhanced deposition 有权
标题翻译：沉积微晶硅的方法和等离子体增强沉积监测装置
公开(公告)号：US08435803B2
公开(公告)日：2013-05-07
申请号：US12758698
申请日：2010-04-12
申请人： Chen-Chung Du , Sheng-Lang Lee , Muh-Wang Liang , Jen-Rong Huang , Chia-Hao Chang
发明人： Chen-Chung Du , Sheng-Lang Lee , Muh-Wang Liang , Jen-Rong Huang , Chia-Hao Chang
IPC分类号： H01L21/00
CPC分类号： H01J37/32972 , H01J37/32935 , H01L21/02532 , H01L21/0262
摘要： A method for depositing a microcrystalline silicon film is disclosed, including performing an open loop and close loop plasma enhanced deposition process without and with modulating process parameters, respectively. A film is deposited by the open loop plasma enhanced deposition process till a required film crystallinity and then performing a closed loop plasma enhanced deposition process which monitors species plasma spectrum intensities SiH* and Hα and modulates process parameters of the plasma enhanced deposition process resulting in the species concentration stabilization which controls the intensities variation of SiH* and Hα within an allowed range of a target value for improving film depositing rate.
摘要翻译：公开了一种用于沉积微晶硅膜的方法，包括分别执行开路和闭环等离子体增强沉积工艺，而不需要和调制工艺参数。通过开环等离子体增强沉积工艺沉积膜直到所需的膜结晶度，然后执行监测物质等离子体光谱强度SiH *和Halpha的闭环等离子体增强沉积工艺，并调制等离子体增强沉积过程的工艺参数，物质浓度稳定化，其控制SiH *和Halpha在目标值的允许范围内的强度变化，以提高成膜速率。

6. 发明申请

US20110136269A1 METHOD FOR DEPOSITING MICROCRYSTALLINE SILICON AND MONITOR DEVICE OF PLASMA ENHANCED DEPOSITION 有权
标题翻译：沉积微晶硅的方法和等离子体增强沉积的监测装置
公开(公告)号：US20110136269A1
公开(公告)日：2011-06-09
申请号：US12758698
申请日：2010-04-12
申请人： Chen-Chung Du , Sheng-Lang Lee , Muh-Wang Liang , Jen-Rong Huang , Chia-Hao Chang
发明人： Chen-Chung Du , Sheng-Lang Lee , Muh-Wang Liang , Jen-Rong Huang , Chia-Hao Chang
IPC分类号： H01L21/66 , B05C11/00
CPC分类号： H01J37/32972 , H01J37/32935 , H01L21/02532 , H01L21/0262
摘要： A method for depositing a microcrystalline silicon film is disclosed, including performing an open loop and close loop plasma enhanced deposition process without and with modulating process parameters, respectively. A film is deposited by the open loop plasma enhanced deposition process till a required film crystallinity and then performing a closed loop plasma enhanced deposition process which monitors species plasma spectrum intensities SiH* and Hα and modulates process parameters of the plasma enhanced deposition process resulting in the species concentration stabilization which controls the intensities variation of SiH* and Hα within an allowed range of a target value for improving film depositing rate.
摘要翻译：公开了一种用于沉积微晶硅膜的方法，包括分别执行开路和闭环等离子体增强沉积工艺，而不需要和调制工艺参数。通过开环等离子体增强沉积工艺沉积膜直到所需的膜结晶度，然后执行监测物质等离子体光谱强度SiH *和Hα的闭环等离子体增强沉积过程，并调制等离子体增强沉积过程的工艺参数，从而导致物质浓度稳定化，其控制在目标值的允许范围内的SiH *和Hα的强度变化，以提高成膜速率。

7. 发明申请

US20120240855A1 TRANSMISSION MECHANISM AND THE DEPOSITION APPARATUS USING THE SAME 审中-公开
标题翻译：传输机制和使用它的沉积装置
公开(公告)号：US20120240855A1
公开(公告)日：2012-09-27
申请号：US13177006
申请日：2011-07-06
申请人： Chen-Chung Du , Ming-Tung Chiang , Muh-Wang Liang , Kuan-Chou Chen , Tean-Mu Shen , Jung-Chen Ho
发明人： Chen-Chung Du , Ming-Tung Chiang , Muh-Wang Liang , Kuan-Chou Chen , Tean-Mu Shen , Jung-Chen Ho
IPC分类号： C23C16/50 , F16H57/00
CPC分类号： C23C14/564 , C23C14/568 , C23C16/4401 , C23C16/54 , Y10T74/19642
摘要： The deposition apparatus has a plurality of said transmission mechanisms arranged therein in a symmetrical manner. Each transmission mechanism comprises: a drive shaft, formed with a tapered end; a driving wheel, configured with a shaft hole for the tapered end to bore coaxially therethrough; a plurality of slide pieces, radially mounted to the driving wheel; a first elastic member, mounted enabling the plural slide pieces to be ensheathed thereby; a second elastic member, disposed between the first elastic member and the first axial end of the drive shaft while being mounted to the periphery of the driving wheel; an enclosure, configured with an opening; wherein, the driving wheel that is moving in a reciprocating manner drives the sliding pieces to slide in radial directions, thereby, causing the outer diameter of the first elastic member to change accordingly and enabling the opening of the enclosure to open or close in consequence.
摘要翻译：沉积装置具有以对称的方式布置在其中的多个所述传动机构。每个传动机构包括：形成有锥形端的驱动轴; 驱动轮，其构造有用于锥形端轴同轴地穿过其中的轴孔; 多个滑动件，径向安装在驱动轮上; 第一弹性构件，其安装成使得能够使多个滑动件嵌套; 第二弹性构件，其安装在所述第一弹性构件和所述驱动轴的所述第一轴向端之间，同时安装到所述驱动轮的周边; 一个配有开口的外壳; 其中，以往复方式移动的驱动轮驱动滑动件在径向方向上滑动，从而使第一弹性构件的外径相应地变化，从而能够打开或关闭外壳。

8. 发明申请

US20100116623A1 TRANSMISSION DEVICE FOR THIN AND BRITTLENESS SUBSTRATE 审中-公开
标题翻译：用于薄和不牢固基板的传输装置
公开(公告)号：US20100116623A1
公开(公告)日：2010-05-13
申请号：US12420553
申请日：2009-04-08
申请人： Chen-Chung Du , Kang-Feng Lee , Muh-Wang Liang , Chan-Hsing Lo , Tung-Chuan Wu
发明人： Chen-Chung Du , Kang-Feng Lee , Muh-Wang Liang , Chan-Hsing Lo , Tung-Chuan Wu
IPC分类号： B65G29/00
CPC分类号： H01L21/67706 , B65G39/02
摘要： A transmission device for thin and brittleness substrate is disclosed, which comprises: a plurality of transportation rollers and a plurality of pinch rollers. Each transportation roller further comprises: a rigid spindle; and a plurality of elastic supporting wheels, mounted on the spindle. Each pinch roller comprises: a sleeve; a spindle, ensheathed in the sleeve; and a plurality of pressing wheels, mounted on the sleeve at positions corresponding to the supporting wheels. When the transportation rollers are driven to rotate, a substrate sandwiched between the supporting wheels and the pressing wheels will be push to move while subjecting to a friction originated from a sufficient holding force by the supporting wheels and the pressing wheels, and consequently, providing an improved buffering capability for deformation absorption that enables the transmission device to guide the thin substrate to move smoothly without causing buckling or scratching to the thin substrate.
摘要翻译：公开了一种用于薄脆性基片的传动装置，包括：多个输送辊和多个夹送辊。每个传送辊还包括：刚性主轴; 以及安装在主轴上的多个弹性支承轮。每个夹送辊包括：套筒; 一个主轴，套在套筒中; 以及多个按压轮，其安装在所述套筒上对应于所述支撑轮的位置处。当传送辊被驱动旋转时，夹在支撑轮和按压轮之间的基板将被推动移动，同时受到由支撑轮和按压轮产生的足够的夹持力的摩擦，因此，改进了变形吸收的缓冲能力，使得传输装置能够引导薄衬底平稳移动，而不会对薄衬底造成翘曲或划伤。

9. 发明授权

US5878911A Solder-ball supplying apparatus 失效
标题翻译：焊球供给装置
公开(公告)号：US5878911A
公开(公告)日：1999-03-09
申请号：US881900
申请日：1997-06-23
申请人： Ching-Lin Lin , Meng-Chun Chen , Chen-Chung Du , Jing-Ching Lin , Chyi-Liou Lin
发明人： Ching-Lin Lin , Meng-Chun Chen , Chen-Chung Du , Jing-Ching Lin , Chyi-Liou Lin
IPC分类号： B23K3/06 , H05K3/34 , B65G59/00
CPC分类号： B23K3/0623 , B23K2201/40 , H05K3/3478
摘要： A solder-ball supplying apparatus for a ball-grid array (BGA) IC packaging process is provided, which can supply solder balls of diameters from 0.5 mm to 1.0 mm at a preset amount to a solder-ball implanting machine. The solder-ball supplying apparatus is fully automated, in which vacuum means is used to suck out a preset amount of solder balls from a storage tank that are to be supplied. Rotary pneumatic cylinder means in conjunction with valve means are used to control the conveyance of the solder balls to the container. This solder-ball supplying apparatus can supply solder balls fast and in a non-contact manner that can prevent damage to the solder balls being supplied. It is fully automated so that manual labor is reduced and the quality of the solder balls being supplied can be assured.
摘要翻译：提供了一种用于球栅阵列（BGA）IC封装工艺的焊球提供装置，其可以将预定量的直径为0.5mm至1.0mm的焊球提供给焊球注入机。焊球供给装置是完全自动化的，其中使用真空装置从要供应的储罐中抽出预定量的焊球。旋转气缸装置结合阀装置用于控制焊球向容器的传送。该焊球供给装置能够以非接触的方式快速地供给焊球，能够防止对所供给的焊球的损坏。它完全自动化，从而减少手工劳动，并且可以确保供应的焊球的质量。

10. 发明授权

US07721673B2 Hollow cathode discharging apparatus 有权
标题翻译：中空阴极排放装置
公开(公告)号：US07721673B2
公开(公告)日：2010-05-25
申请号：US11700023
申请日：2007-01-31
申请人： Chen-Chung Du , Ming-Tung Chiang , Fu-Ching Tung , Chin-Feng Cheng , Tean-Mu Shen
发明人： Chen-Chung Du , Ming-Tung Chiang , Fu-Ching Tung , Chin-Feng Cheng , Tean-Mu Shen
IPC分类号： C23C16/00 , C23F1/00 , H01L21/306
CPC分类号： H01J37/3244 , H01J37/32009 , H01J37/32596
摘要： The present invention provides a hollow cathode discharging apparatus including a hollow anode electrode, a hollow cathode electrode insulatedly fixed in the hollow anode electrode, a gas distribution pipe fixed in the hollow cathode electrode. The hollow anode electrode and the hollow cathode electrode are formed with anode openings and cathode openings respectively. Defined by the gas distribution pipe and the hollow cathode electrode and along the axis thereof is a spiral pathway winding through the cathode openings, so as to form a plurality of continuous and communicated reaction chambers. The gas distribution pipe is disposed with gas separation apertures communicated and adapted to introduce a reactive gas into the reaction chambers. The communicated reaction chambers enable uniform distribution of the reactive gas and thereby facilitate scale-up of the apparatus in axial. Accordingly, the present invention overcomes drawbacks of the prior art.
摘要翻译：本发明提供一种中空阴极喷射装置，其包括中空阳极电极，绝缘地固定在中空阳极电极中的中空阴极电极，固定在中空阴极电极中的气体分配管。中空阳极电极和中空阴极电极分别形成有阳极开口和阴极开口。由气体分配管和空心阴极电极及其轴线限定为通过阴极开口卷绕的螺旋路径，以形成多个连续且连通的反应室。气体分配管设置有连通并适于将反应性气体引入反应室的气体分离孔。所传送的反应室能够均匀分布反应气体，从而有助于装置在轴向上放大。因此，本发明克服了现有技术的缺陷。

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