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    • 3. 发明授权
    • Nonvolatile semiconductor device capable of increased electron injection efficiency
    • 能够提高电子注入效率的非易失性半导体器件
    • US06380585B1
    • 2002-04-30
    • US09588308
    • 2000-06-06
    • Shinji OdanakaKaori AkamatsuJunichi KatoAtsushi HoriSeiki Ogura
    • Shinji OdanakaKaori AkamatsuJunichi KatoAtsushi HoriSeiki Ogura
    • H01L29788
    • H01L29/66825H01L29/42324H01L29/7885
    • The nonvolatile semiconductor memory device of the present invention includes: a semiconductor substrate having a surface including a first surface region at a first level, a second surface region at a second level lower than the first level, and a step side region linking the first surface region and the second surface region together; a channel region formed in the first surface region of the semiconductor substrate; a source region and a drain region which are formed in the surface of the semiconductor substrate so as to interpose the channel region therebetween; a first insulating film formed on the surface of the semiconductor substrate; a floating gate formed on the first insulating film; a second insulating film formed on the floating gate; and a control gate which is capacitively coupled to the floating gate via the second insulating film. The drain region includes a low-concentration impurity layer which is formed in the second surface region and which has one end extending toward the step side region, and a high-concentration impurity layer which is connected to the low-concentration impurity layer and which is formed in a region distant from the channel region. As impurity concentration of the low-concentration impurity layer is lower than an impurity concentration of the high-concentration impurity layer. The floating gate covers the step side region and at least a part of the low-concentration impurity layer via the first insulating film.
    • 本发明的非易失性半导体存储器件包括:半导体衬底,具有包括第一层的第一表面区域,低于第一层次的第二层的第二表面区域和将第一表面 区域和第二表面区域在一起; 形成在所述半导体衬底的所述第一表面区域中的沟道区; 源极区域和漏极区域,其形成在半导体衬底的表面中,以便在其间插入沟道区域; 形成在所述半导体衬底的表面上的第一绝缘膜; 形成在第一绝缘膜上的浮栅; 形成在浮动栅极上的第二绝缘膜; 以及通过第二绝缘膜电容耦合到浮动栅极的控制栅极。 漏区包括形成在第二表面区域中并且具有朝向台阶侧区域延伸的一端的低浓度杂质层和连接到低浓度杂质层的高浓度杂质层, 形成在远离通道区域的区域中。 由于低浓度杂质层的杂质浓度低于高浓度杂质层的杂质浓度。 浮置栅极经由第一绝缘膜覆盖台阶侧区域和至少一部分低浓度杂质层。
    • 5. 发明授权
    • Method for manufacturing a nonvolatile semiconductor memory device having increased hot electron injection efficiency
    • 制造具有增加的热电子注入效率的非易失性半导体存储器件的方法
    • US06303438B1
    • 2001-10-16
    • US09017216
    • 1998-02-02
    • Atsushi HoriJunichi KatoShinji OdanakaSeiki Ogura
    • Atsushi HoriJunichi KatoShinji OdanakaSeiki Ogura
    • H01L21336
    • H01L29/66825H01L21/28273H01L29/42336H01L29/7885
    • The nonvolatile semiconductor memory device of the present invention includes: a semiconductor substrate having a surface including a first surface region at a first level, a second surface region at a second level lower than the first level, and a step side region linking the first surface region and the second surface region together; a channel region formed in the first surface region of the semiconductor substrate; a source region and a drain region which are formed in the surface of the semiconductor substrate so as to interpose the channel region therebetween; a first insulating film formed on the surface of the semiconductor substrate; a floating gate formed on the first insulating film; and a control gate which is capacitively coupled to the floating gate via a second insulating film. The first insulating film includes a first gate insulating film portion formed in the first surface region, and, a second gate insulating film portion formed in the step side region and the second surface region. The control gate is formed on the first gate insulating film portion. A part of the floating gate faces the step side region via the second gate insulating film portion, and another part of the floating gate is adjacent to the control gate via the second insulating film.
    • 本发明的非易失性半导体存储器件包括:半导体衬底,具有包括第一层的第一表面区域,低于第一层次的第二层的第二表面区域和将第一表面 区域和第二表面区域在一起; 形成在所述半导体衬底的所述第一表面区域中的沟道区; 源极区域和漏极区域,其形成在半导体衬底的表面中,以便在其间插入沟道区域; 形成在所述半导体衬底的表面上的第一绝缘膜; 形成在第一绝缘膜上的浮栅; 以及通过第二绝缘膜电容耦合到浮置栅极的控制栅极。 第一绝缘膜包括形成在第一表面区域中的第一栅极绝缘膜部分和形成在台阶侧区域和第二表面区域中的第二栅极绝缘膜部分。 控制栅极形成在第一栅极绝缘膜部分上。 浮栅的一部分经由第二栅极绝缘膜部分面对台阶侧区域,浮栅的另一部分经由第二绝缘膜与控制栅极相邻。
    • 6. 发明授权
    • Nonvolatile semiconductor memory device and method for fabricating the
same and semiconductor integrated circuit
    • 非易失性半导体存储器件及其制造方法和半导体集成电路
    • US6121655A
    • 2000-09-19
    • US848
    • 1997-12-30
    • Shinji OdanakaKaori AkamatsuJunichi KatoAtsushi HoriSeiki Ogura
    • Shinji OdanakaKaori AkamatsuJunichi KatoAtsushi HoriSeiki Ogura
    • G11C16/04H01L21/336H01L21/8247H01L27/115H01L29/423H01L29/788H01L29/792H01L29/76
    • H01L29/66825H01L29/42324H01L29/7885
    • The nonvolatile semiconductor memory device of the present invention includes: a semiconductor substrate having a surface including a first surface region at a first level, a second surface region at a second level lower than the first level, and a step side region linking the first surface region and the second surface region together; a channel region formed in the first surface region of the semiconductor substrate; a source region and a drain region which are formed in the surface of the semiconductor substrate so as to interpose the channel region therebetween; a first insulating film formed on the surface of the semiconductor substrate; a floating gate formed on the first insulating film; a second insulating film formed on the floating gate; and a control gate which is capacitively coupled to the floating gate via the second insulating film. The drain region includes a low-concentration impurity layer which is formed in the second surface region and which has one end extending toward the step side region, and a high-concentration impurity layer which is connected to the low-concentration impurity layer and which is formed in a region distant from the channel region. As impurity concentration of the low-concentration impurity layer is lower than an impurity concentration of the high-concentration impurity layer. The floating gate covers the step side region and at least a part of the low-concentration impurity layer via the first insulating film.
    • 本发明的非易失性半导体存储器件包括:半导体衬底,具有包括第一层的第一表面区域,低于第一层次的第二层的第二表面区域和将第一表面 区域和第二表面区域在一起; 形成在所述半导体衬底的所述第一表面区域中的沟道区; 源极区域和漏极区域,其形成在半导体衬底的表面中,以便在其间插入沟道区域; 形成在所述半导体衬底的表面上的第一绝缘膜; 形成在第一绝缘膜上的浮栅; 形成在浮动栅极上的第二绝缘膜; 以及通过第二绝缘膜电容耦合到浮动栅极的控制栅极。 漏区包括形成在第二表面区域中并且具有朝向台阶侧区域延伸的一端的低浓度杂质层和连接到低浓度杂质层的高浓度杂质层, 形成在远离通道区域的区域中。 由于低浓度杂质层的杂质浓度低于高浓度杂质层的杂质浓度。 浮置栅极经由第一绝缘膜覆盖台阶侧区域和至少一部分低浓度杂质层。
    • 7. 发明授权
    • Semiconductor device and method for fabricating the same
    • 半导体装置及其制造方法
    • US6147379A
    • 2000-11-14
    • US58803
    • 1998-04-13
    • Atsushi HoriJunichi KatoShinji OdanakaSeiki OguraKaori Akamatsu
    • Atsushi HoriJunichi KatoShinji OdanakaSeiki OguraKaori Akamatsu
    • H01L21/8247H01L27/115H01L29/788H01L29/792
    • H01L29/7885
    • The nonvolatile semiconductor memory device of the invention includes: a semiconductor substrate having a surface including a first surface region at a first level, a second surface region at a second level lower than the first level, and a step side region linking the first and second surface regions; a channel region formed in the first surface region of the semiconductor substrate; a source region and a drain region which are formed in the surface of the semiconductor substrate so as to interpose the channel region therebetween; a first insulating film formed on the surface of the semiconductor substrate; a floating gate formed on the first insulating film; and a control gate capacitively coupled to the floating gate via a second insulating film. The first surface region is an upper surface of an epitaxially grown layer formed on the second surface region. The drain region includes: a low-concentration impurity layer formed in the second surface region and having one end extending toward the step side region; and a high-concentration impurity layer connected to the low-concentration impurity layer and formed in a region distant from the channel region. An impurity concentration of the low-concentration impurity layer is lower than that of the high-concentration impurity layer. The floating gate covers the step side region and at least a part of the low-concentration impurity layer via the first insulating film.
    • 本发明的非易失性半导体存储器件包括:半导体衬底,具有包括第一电平的第一表面区域,低于第一电平的第二电平的第二表面区域和连接第一和第二电极的台阶侧区域的表面 表面区域 形成在所述半导体衬底的所述第一表面区域中的沟道区; 源极区域和漏极区域,其形成在半导体衬底的表面中,以便在其间插入沟道区域; 形成在所述半导体衬底的表面上的第一绝缘膜; 形成在第一绝缘膜上的浮栅; 以及经由第二绝缘膜电容耦合到浮置栅极的控制栅极。 第一表面区域是形成在第二表面区域上的外延生长层的上表面。 漏极区域包括:形成在第二表面区域中并且具有朝向台阶侧区域延伸的一端的低浓度杂质层; 以及连接到低浓度杂质层并形成在远离沟道区的区域中的高浓度杂质层。 低浓度杂质层的杂质浓度低于高浓度杂质层的杂质浓度。 浮置栅极经由第一绝缘膜覆盖台阶侧区域和至少一部分低浓度杂质层。
    • 9. 发明授权
    • Semiconductor device for protecting an internal circuit from
electrostatic damage
    • 用于保护内部电路免受静电损坏的半导体器件
    • US5514893A
    • 1996-05-07
    • US207426
    • 1994-03-08
    • Isao MiyanagaKazumi KurimotoAtsushi HoriShinji Odanaka
    • Isao MiyanagaKazumi KurimotoAtsushi HoriShinji Odanaka
    • H01L27/02H03K19/003H01L23/62H02H3/20H02H9/00H03K17/60
    • H01L27/0259H01L27/0266H03K19/00315
    • A semiconductor device includes an input/output terminal, an internal circuit connected to the input/output terminal, a first terminal for providing a first electrical potential, and a second terminal for providing a second electrical potential which is lower than the first electrical potential, the device further including: a first n-channel MOS transistor having a drain connected to the input/output terminal, a source connected to the second terminal, and a gate to be electrically connected to the first terminal; and a first switching element for switching between an electrically conductive state and a non-conductive state between the drain and the gate of the first n-channel MOS transistor, the switching element forming the electrically conductive state between the drain and the gate of the first n-channel MOS transistor when 1) a surge voltage lower than the first electrical potential is applied to the input/output terminal, and 2) an electrical potential difference between the drain and the gate of the first n-channel MOS transistor exceeds a predetermined voltage lower than a breakdown voltage of the gate of the first n-channel MOS transistor. The formation of the electrically conductive state prevents the gate oxide of the first n-channel MOS transistor from being damaged.
    • 半导体器件包括输入/​​输出端子,连接到输入/输出端子的内部电路,用于提供第一电位的第一端子和用于提供低于第一电位的第二电位的第二端子, 该器件还包括:第一n沟道MOS晶体管,具有连接到输入/输出端子的漏极,连接到第二端子的源极和与第一端子电连接的栅极; 以及用于在第一n沟道MOS晶体管的漏极和栅极之间切换导电状态和非导通状态的第一开关元件,所述开关元件在第一N沟道MOS晶体管的漏极和栅极之间形成导电状态 n沟道MOS晶体管,当1)低于第一电位的浪涌电压被施加到输入/输出端时,以及2)第一n沟道MOS晶体管的漏极和栅极之间的电位差超过预定的 电压低于第一n沟道MOS晶体管的栅极的击穿电压。 导电状态的形成防止了第一n沟道MOS晶体管的栅极氧化物被损坏。
    • 10. 发明授权
    • Method for fabricating nonvolatile semiconductor memory device
    • 制造非易失性半导体存储器件的方法
    • US6051465A
    • 2000-04-18
    • US126272
    • 1998-07-30
    • Junichi KatoAtsushi Hori
    • Junichi KatoAtsushi Hori
    • H01L21/336H01L21/8247
    • H01L29/66825
    • A method for fabricating a nonvolatile semiconductor memory device according to the present invention includes the steps of: forming a first mask to define a channel of a memory cell in a semiconductor substrate; doping an impurity into the semiconductor substrate by using the first mask, thereby forming a first doped region in the semiconductor substrate; forming a second mask so as to overlap at least one of a first region of the semiconductor substrate where a source is to be formed and a second region of the semiconductor substrate where a drain is to be formed and at least part of the first mask; etching the semiconductor substrate by using the first and second masks, thereby forming a recessed portion in a region of the semiconductor substrate that is not covered with the first and second masks; forming a second doped region in the recessed portion of the semiconductor substrate; and removing the first and second masks, and forming a gate structure including a first insulating film, a floating gate electrode, a second insulating film and a control gate electrode at least over a side surface of the recessed portion and the channel defined by the first mask.
    • 根据本发明的制造非易失性半导体存储器件的方法包括以下步骤:形成第一掩模以限定半导体衬底中的存储单元的沟道; 通过使用第一掩模将杂质掺杂到半导体衬底中,从而在半导体衬底中形成第一掺杂区; 形成第二掩模,以便与要形成源极的半导体衬底的第一区域和要形成漏极的半导体衬底的第二区域和第一掩模的至少一部分中的至少一个重叠; 通过使用第一和第二掩模蚀刻半导体衬底,从而在未被第一和第二掩模覆盖的半导体衬底的区域中形成凹陷部分; 在所述半导体衬底的凹陷部分中形成第二掺杂区域; 以及去除第一和第二掩模,并且至少在凹部的侧表面上形成包括第一绝缘膜,浮栅电极,第二绝缘膜和控制栅电极的栅结构,以及由第一绝缘膜, 面具。