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1. 发明申请

US20040173454A1 APPARATUS AND METHOD FOR ELECTRO CHEMICAL PLATING USING BACKSID ELECTRICAL CONTACTE 失效
标题翻译：使用背面电气接触的电化学镀层的装置和方法
公开(公告)号：US20040173454A1
公开(公告)日：2004-09-09
申请号：US09981191
申请日：2001-10-16
申请人： Applied Materials, Inc.
发明人： Donald J.K. Olgado , Michael Wood , Dmitry Lubomirsky
IPC分类号： C25D007/12 , C25D005/02
CPC分类号： C25D7/123 , C25D5/028 , C25D17/001 , C25D17/06 , H01L21/2885
摘要： An apparatus and method for securing and electrically contacting a substrate on a non-production surface of the substrate. The apparatus includes a substrate holder assembly having a substrate engaging surface formed thereon, the substrate engaging surface being configured to engage a substrate on the non-production surface. The apparatus further includes an electrical contact device positioned on the substrate engaging surface, the electrical contact device including a plurality of radially spaced electrically conductive members configured to electrically communicate with the non-production surface of the substrate positioned on the substrate engaging surface. The method includes depositing a conductive seed layer on a production surface of the substrate, and depositing a backside conductive layer on a portion of the non-production side of the substrate, the backside conductive layer extending around a bevel of the substrate to electrically communicate with the seed layer. The method further includes securing the substrate in a chuck configured to engage the non-production surface of the substrate, contacting the backside conductive layer with an electrical cathode contact on the non-production side of the substrate, and plating over the conductive seed layer via application of an electrolyte to the production surface of the substrate and applying an electrical bias to the electrical cathode contact and an anode in communication with the electrolyte.
摘要翻译：一种用于固定和电接触衬底的非生产表面上的衬底的装置和方法。该设备包括具有形成在其上的衬底接合表面的衬底保持器组件，衬底接合表面被配置为接合非生产表面上的衬底。所述装置还包括位于所述基板接合表面上的电接触装置，所述电接触装置包括多个径向隔开的导电构件，所述导电构件构造成与位于所述基板接合表面上的所述基板的非生产表面电连通。该方法包括在衬底的生产表面上沉积导电种子层，以及在衬底的非生产侧的一部分上沉积背面导电层，所述背面导电层围绕衬底的斜面延伸以与种子层。该方法还包括将衬底固定在配置成接合衬底的非生产表面的卡盘中，使背面导电层与衬底的非生产侧上的电阴极接触接触，并且在导电种子层上电镀将电解质施加到基材的生产表面上，并将电偏压施加到电阴极接触件和与电解质连通的阳极。

2. 发明申请

US20040206628A1 Electrical bias during wafer exit from electrolyte bath 审中-公开
标题翻译：晶片从电解槽出来时的电气偏压
公开(公告)号：US20040206628A1
公开(公告)日：2004-10-21
申请号：US10823840
申请日：2004-04-13
申请人： Applied Materials, Inc.
发明人： Dmitry Lubomirsky , Michael Yang
IPC分类号： C25D005/00
CPC分类号： C25D21/00 , C25D5/18 , C25D7/123 , C25D17/001 , C25D21/12 , H01L21/2885
摘要： Embodiments of the invention generally provide a method for removing a substrate from a processing fluid contained in a processing cell. The method includes tilting the substrate to a tilt angle, rotating the substrate, vertically moving the substrate upward out of the processing fluid, and applying an electrical removal bias to the substrate during the vertical movement of the substrate out of the processing fluid.
摘要翻译：本发明的实施例通常提供从处理单元中包含的处理流体中去除衬底的方法。该方法包括将衬底倾斜到倾斜角度，旋转衬底，将衬底向上垂直移动到处理流体之外，以及在衬底垂直移动到处理流体之前向衬底施加电去除偏压。

3. 发明申请

US20040016637A1 Multi-chemistry plating system 失效
标题翻译：多化学电镀系统
公开(公告)号：US20040016637A1
公开(公告)日：2004-01-29
申请号：US10616284
申请日：2003-07-08
申请人： APPLIED MATERIALS, INC.
发明人： Michael X. Yang , Ming Xi , Russell C. Ellwanger , Eric B. Britcher , Bernardo Donoso , Lily L. Pang , Svetlana Sherman , Henry Ho , Anh N. Nguyen , Alexander N. Lerner , Allen L. D'Ambra , Arulkumar Shanmugasundram , Tetsuya Ishikawa , Yevgeniy Rabinovich , Dmitry Lubomirsky , Yeuk-Fai Edwin Mok , Son T. Nguyen
IPC分类号： C25D017/00
CPC分类号： H01L21/6719 , A23D7/00 , A23D7/005 , A23D7/01 , A23J7/00 , B08B3/02 , C25D7/123 , C25D17/001 , C25D17/002 , C25D17/02 , C25D21/02 , C25D21/08 , H01L21/67028 , H01L21/67034 , H01L21/67051 , H01L21/67109 , H01L21/6715 , H01L21/67196 , H01L21/6723 , H01L21/68 , H01L21/6838 , H01L21/68707
摘要： Embodiments of the invention generally provide an electrochemical plating system. The plating system includes a substrate loading station positioned in communication with a mainframe processing platform, at least one substrate plating cell positioned on the mainframe, at least one substrate bevel cleaning cell positioned on the mainframe, and a stacked substrate annealing station positioned in communication with at least one of the mainframe and the loading station, each chamber in the stacked substrate annealing station having a heating plate, a cooling plate, and a substrate transfer robot therein.
摘要翻译：本发明的实施方案通常提供电化学电镀系统。电镀系统包括位于与主机处理平台连通的基板装载站，位于主机上的至少一个基板镀覆单元，位于主机上的至少一个基板斜面清洁单元，以及与主机和加载站中的至少一个，层叠基板退火站中的每个室具有加热板，冷却板和基板传送机器人。

4. 发明申请

US20040055893A1 Wafer backside electrical contact for electrochemical deposition and electrochemical mechanical polishing 审中-公开
标题翻译：晶圆背面电接触用于电化学沉积和电化学机械抛光
公开(公告)号：US20040055893A1
公开(公告)日：2004-03-25
申请号：US10253240
申请日：2002-09-23
申请人： Applied Materials, Inc.
发明人： Dmitry Lubomirsky , Michael X. Yang , Sheshraj Tulshibagwale , Yezdi Dordi , Howard E. Grunes , Jick M. Yu , Fusen Chen
IPC分类号： C25D017/00 , C25D005/02
CPC分类号： C25D7/123 , C25D17/06 , H01L21/2885
摘要： A method and apparatus for electrochemically plating on a production surface of a substrate are provided. The apparatus generally includes a plating cell having a plating solution reservoir configured to contain a volume of an electrochemical plating solution, and a substrate support member positioned above the plating solution reservoir, the substrate support member being configured to electrically engage a non-production side of a substrate secured thereto. The substrate support member generally includes a substrate support surface having at least one vacuum channel formed therein, a plurality of electrical contact pins extending from the substrate support surface and being positioned to engage a perimeter of the non-production side of the substrate secured thereto, and at least one annular seal positioned on the substrate support surface radially outward of the plurality of electrical contact pins, the at least one annular seal being configured to prevent flow of the electrochemical plating solution to the plurality of electrical contact pins. The plating cell further includes a power supply in electrical communication with an anode positioned in the electrochemical plating solution and the plurality of electrical contact pins.
摘要翻译：提供了一种用于在基板的生产表面上进行电化学电镀的方法和装置。该装置通常包括具有电镀液储存器的电镀槽，该电镀液储存器构造为容纳一定量的电化学电镀溶液，以及位于电镀液储存器上方的基板支撑构件，该基板支撑构件被构造成电接合非电解镀层固定到其上的基板。衬底支撑构件通常包括具有形成在其中的至少一个真空通道的衬底支撑表面，从衬底支撑表面延伸并定位成接合固定到其上的衬底的非生产侧的周边的多个电接触销，以及至少一个环形密封件，其定位在所述多个电接触销的径向外侧的所述基板支撑表面上，所述至少一个环形密封件构造成防止所述电化学电镀液流向所述多个电接触销。电镀单元还包括与位于电化学电镀溶液中的阳极和多个电接触针电连通的电源。

5. 发明申请

US20040016648A1 Tilted electrochemical plating cell with constant wafer immersion angle 审中-公开
标题翻译：具有恒定晶片浸入角度的倾斜电化学电镀槽
公开(公告)号：US20040016648A1
公开(公告)日：2004-01-29
申请号：US10266477
申请日：2002-10-07
申请人： Applied Materials, Inc.
发明人： Dmitry Lubomirsky , Saravjeet Singh , Yezdi N. Dordi , Sheshraj Tulshibagwale
IPC分类号： C25D017/00
CPC分类号： C25D17/02 , C25D7/123 , C25D17/001 , C25D21/00
摘要： A method and apparatus for immersing a substrate for plating operations. The apparatus generally includes a plating cell configured contain a plating solution therein. The plating cell includes at least one fluid basin, a diffusion plate position in a lower portion of the at least one fluid basin, and an anode positioned below the diffusion plate, the anode and the diffusion plate being positioned in parallel orientation with each other and in a tilted orientation with respect to horizontal. The apparatus further includes a head assembly positioned proximate the plating cell, the head assembly including a base member, an actuator positioned at a distal end of the base member, and a substrate support assembly in mechanical communication with the actuator, the substrate support assembly being configured to support a substrate in the at least one fluid basin for processing in an orientation that is generally parallel to the diffusion plate.
摘要翻译：一种用于浸渍电镀操作的基板的方法和装置。该装置通常包括在其中包含电镀液的电镀单元。所述电镀单元包括至少一个流体池，位于所述至少一个流体槽的下部的扩散板位置和位于所述扩散板下方的阳极，所述阳极和所述扩散板彼此平行取向地定位，相对于水平方向倾斜。所述装置还包括位于所述电镀单元附近的头部组件，所述头部组件包括基座构件，位于所述基座构件的远端的致动器以及与所述致动器机械连通的衬底支撑组件，所述衬底支撑组件被配置为支撑所述至少一个流体池中的基底，用于以大致平行于所述扩散板的取向进行处理。

6. 发明申请

US20030141018A1 Electroless deposition apparatus 有权
标题翻译：无电沉积装置
公开(公告)号：US20030141018A1
公开(公告)日：2003-07-31
申请号：US10059572
申请日：2002-01-28
申请人： APPLIED MATERIALS, INC.
发明人： Joseph J. Stevens , Dmitry Lubomirsky , Ian Pancham , Donald J. K. Olgado , Howard E. Grunes , Yeuk-Fai Edwin Mok
IPC分类号： C23F001/00 , C23C016/00
CPC分类号： H01L21/67126 , C23C18/1607 , C23C18/1619 , C23C18/1628 , C23C18/165 , C23C18/1653 , C23C18/1678 , C25D7/123 , C25D17/001
摘要： An apparatus and a method of depositing a catalytic layer comprising at least one metal selected from the group consisting of noble metals, semi-noble metals, alloys thereof, and combinations thereof in sub-micron features formed on a substrate. Examples of noble metals include palladium and platinum. Examples of semi-noble metals include cobalt, nickel, and tungsten. The catalytic layer may be deposited by electroless deposition, electroplating, or chemical vapor deposition. In one embodiment, the catalytic layer may be deposited in the feature to act as a barrier layer to a subsequently deposited conductive material. In another embodiment, the catalytic layer may be deposited over a barrier layer. In yet another embodiment, the catalytic layer may be deposited over a seed layer deposited over the barrier layer to act as a nullpatchnull of any discontinuities in the seed layer. Once the catalytic layer has been deposited, a conductive material, such as copper, may be deposited over the catalytic layer. In one embodiment, the conductive material is deposited over the catalytic layer by electroless deposition. In another embodiment, the conductive material is deposited over the catalytic layer by electroless deposition followed by electroplating or followed by chemical vapor deposition. In still another embodiment, the conductive material is deposited over the catalytic layer by electroplating or by chemical vapor deposition.
摘要翻译：一种沉积包含至少一种选自贵金属，半贵金属，其合金及其组合的金属的催化剂层的装置和方法，其形成在基板上形成的亚微米特征。贵金属的实例包括钯和铂。半贵金属的例子包括钴，镍和钨。可通过无电沉积，电镀或化学气相沉积来沉积催化层。在一个实施方案中，催化层可以沉积在特征中以用作随后沉积的导电材料的阻挡层。在另一个实施方案中，催化剂层可以沉积在阻挡层上。在另一个实施方案中，催化层可以沉积在沉积在阻挡层上的种子层上，以充当种子层中任何不连续性的“贴片”。一旦沉积了催化层，可以在催化剂层上沉积诸如铜的导电材料。在一个实施例中，导电材料通过无电沉积沉积在催化剂层上。在另一个实施方案中，导电材料通过无电沉积然后电镀或随后进行化学气相沉积沉积在催化剂层上。在另一个实施例中，导电材料通过电镀或化学气相沉积沉积在催化层上。

7. 发明申请

US20040134775A1 Electrochemical processing cell 审中-公开
标题翻译：电化学处理池
公开(公告)号：US20040134775A1
公开(公告)日：2004-07-15
申请号：US10627336
申请日：2003-07-24
申请人： APPLIED MATERIALS, INC.
发明人： Michael X. Yang , Dmitry Lubomirsky , Yezdi N. Dordi , Saravjeet Sinh , Sheshraj L. Tulshibagwale , Nicolay Y. Kovarsky
IPC分类号： C25C007/04
CPC分类号： A23D7/01 , A23D7/00 , A23D7/005 , A23J7/00 , C07F9/103 , C25D7/123 , C25D17/001 , H01L21/2885
摘要： Embodiments of the invention provide an electrochemical plating cell. The plating cell includes a fluid basin having an anolyte solution compartment and a catholyte solution compartment, an ionic membrane positioned between the anolyte solution compartment and the catholyte solution compartment, and an anode positioned in the anolyte solution compartment, wherein the ionic membrane comprises a poly tetrafluoroethylene based ionomer.
摘要翻译：本发明的实施方案提供一种电化学电镀单元。电镀槽包括具有阳极电解液隔室和阴极电解液溶液隔室的流体池，位于阳极电解液室和阴极电解液溶液室之间的离子膜和位于阳极电解液溶液室中的阳极，其中离子膜包含聚四氟乙烯基离聚物。

8. 发明申请

US20040074777A1 Method for removing electrolyte from electrical contacts and wafer touching areas 失效
标题翻译：从电触点和晶片接触区域去除电解质的方法
公开(公告)号：US20040074777A1
公开(公告)日：2004-04-22
申请号：US10273539
申请日：2002-10-18
申请人： Applied Materials, Inc.
发明人： Dmitry Lubomirsky , Michael X. Yang , Girish A. Dixit , Vincent E. Burkhart , Allen L. D'Ambra , Yeuk-Fai Edwin Mok , Harald Herchen
IPC分类号： C25D005/48
CPC分类号： C25D7/12 , C25D21/00 , H01L21/2885
摘要： A method for cleaning the electrical contact areas or substrate contact areas of an electrochemical plating contact ring is provided. Embodiments of the method include positioning a substrate on a substrate support member having one or more electrical contacts, chemically plating a metal layer on at least a portion of a surface of the substrate, removing the processed substrate from the support member, and cleaning the one or more electrical contacts with a vapor mixture comprising an alcohol. In another aspect, the method includes spraying the vapor mixture on the electrical contacts while rotating the substrate support member.
摘要翻译：提供了一种用于清洁电化学电镀接触环的电接触区域或衬底接触区域的方法。该方法的实施例包括将基板定位在具有一个或多个电触点的基板支撑构件上，在基板表面的至少一部分上化学镀覆金属层，从处理基板移除经处理的基板，并清洁该基板或更多的与包含醇的蒸汽混合物的电接触。在另一方面，该方法包括在旋转衬底支撑构件的同时将蒸气混合物喷射到电触点上。

9. 发明申请

US20040016636A1 Electrochemical processing cell 失效
标题翻译：电化学处理池
公开(公告)号：US20040016636A1
公开(公告)日：2004-01-29
申请号：US10268284
申请日：2002-10-09
申请人： Applied Materials, Inc.
发明人： Michael X. Yang , Dmitry Lubomirsky , Yezdi Dordi , Saravjeet Singh , Sheshraj Tulshibagwale , Nicolay Kovarsky
IPC分类号： C25B013/02
CPC分类号： H01L21/2885 , A23D7/00 , A23D7/005 , A23D7/01 , A23J7/00 , C07F9/103 , C25D7/123 , C25D17/001
摘要： Embodiments of the invention may generally provide a small volume electrochemical plating cell. The plating cell generally includes a fluid basin configured to contain a plating solution therein, the fluid basin having a substantially horizontal weir. The cell further includes an anode positioned in a lower portion of the fluid basin, the anode having a plurality of parallel channels formed therethrough, and a base member configured to receive the anode, the base member having a plurality of groves formed into an anode receiving surface, each of the plurality of grooves terminating into an annular drain channel. A membrane support assembly configured to position a membrane immediately above the anode in a substantially planar orientation with respect to the anode surface is provided, the membrane support assembly having a plurality of channels and bores formed therein.
摘要翻译：本发明的实施方案通常可以提供小体积的电化学电镀单元。电镀槽通常包括配置成在其中容纳电镀液的流体池，流体池具有基本上水平的堰。电池还包括位于流体槽的下部的阳极，阳极具有穿过其形成的多个平行通道，以及构造成容纳阳极的基座构件，底座构件具有形成为阳极接收的多个槽多个槽中的每一个终止于环形排水通道。提供了一种膜支撑组件，其被配置为将膜垂直于阳极定位在相对于阳极表面的基本上平面的方向上，膜支撑组件具有形成在其中的多个通道和孔。

10. 发明申请

US20030209443A1 Substrate support with fluid retention band 失效
标题翻译：基体支架带流体保持带
公开(公告)号：US20030209443A1
公开(公告)日：2003-11-13
申请号：US10143212
申请日：2002-05-09
申请人： Applied Materials, Inc.
发明人： Dmitry Lubomirsky
IPC分类号： C25D005/48
CPC分类号： C25D7/12 , C25D17/001 , C25D17/06
摘要： An apparatus and method for supporting a substrate is provided. In one embodiment, an apparatus for supporting a substrate includes a body having a band extending therefrom. The band is adapted to retain a fluid on the body thereby forming a shallow processing bath for processing the substrate. The band is adapted to deflect under centrifugal force to release the fluid from the substrate as the body is rotated above a predetermined rate.
摘要翻译：提供一种用于支撑衬底的装置和方法。在一个实施例中，用于支撑衬底的装置包括具有从其延伸的带的主体。该带适于将流体保持在主体上，从而形成用于处理基板的浅加工槽。该带适合于在离心力作用下偏转，以便当主体旋转超过预定速率时，将流体从衬底释放。

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