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1. 发明公开

EP3164883A1 SUBSTRATE TRANSFER ROBOT END EFFECTOR 审中-公开
标题翻译：基片传输机器人末端效应器
公开(公告)号：EP3164883A1
公开(公告)日：2017-05-10
申请号：EP15815072.2
申请日：2015-06-05
申请人： Applied Materials, Inc.
发明人： AGARWAL, Pulkit , GREENBERG, Daniel , SUH, Song-Moon , BRODINE, Jeffrey , SANSONI, Steven V. , MORI, Glen
IPC分类号： H01L21/677
CPC分类号： H01L21/68707 , H01L21/67766
摘要： Embodiments of apparatus for supporting a substrate are disclosed herein. In some embodiments, an apparatus for supporting a substrate includes a support member; and a plurality of substrate contact elements protruding from the support member, wherein each of the plurality of substrate contact elements includes: a first contact surface to support a substrate when placed thereon; and a second contact surface extending from the first contact surface, wherein the second contact surface is adjacent a periphery of the substrate to prevent radial movement of the substrate, wherein the first contact surface is at a first angle with respect to the support member and the second contact surface is at a second angle with respect to the support member, and wherein the first angle is between about 3 degrees and 5 degrees.
摘要翻译：这里公开了用于支撑衬底的设备的实施例。在一些实施例中，用于支撑衬底的装置包括支撑构件; 以及从所述支撑构件突出的多个基板接触元件，其中所述多个基板接触元件中的每一个均包括：第一接触表面，用于当放置在其上时支撑基板; 以及从所述第一接触表面延伸的第二接触表面，其中所述第二接触表面邻近所述衬底的周边以防止所述衬底的径向移动，其中所述第一接触表面相对于所述支撑构件成第一角度，并且所述第二接触表面相对于所述支撑构件处于第二角度，并且其中所述第一角度在大约3度和5度之间。

2. 发明公开

EP3084818A1 SUBSTRATE SUPPORT APPARATUS HAVING REDUCED SUBSTRATE PARTICLE GENERATION 有权
标题翻译：与还原的底物颗粒生产基底承载设备
公开(公告)号：EP3084818A1
公开(公告)日：2016-10-26
申请号：EP14871014.8
申请日：2014-12-08
申请人： Applied Materials, Inc.
发明人： AGARWAL, Pulkit , SUH, Song-Moon , MORI, Glen , SANSONI, Steven V.
IPC分类号： H01L21/683
CPC分类号： H01L21/68757 , B25J11/0095 , B25J15/0014 , H01L21/68707 , H01L21/6875
摘要： Embodiments of apparatus for supporting a substrate are disclosed herein. In some embodiments, an apparatus for supporting a substrate includes: a support surface; and a plurality of substrate contact elements protruding from the support surface, wherein the plurality of substrate contact elements are formed of a material having a hardness less than or equal to a hardness of silicon, having a low adhesion, having a coefficient of static friction large enough to prevent sliding, having a surface roughness less than or equal to 10 Ra, and that is electrically conductive.

3. 发明授权

EP3084818B1 SUBSTRATE SUPPORT APPARATUS HAVING REDUCED SUBSTRATE PARTICLE GENERATION 有权
公开(公告)号：EP3084818B1
公开(公告)日：2020-11-25
申请号：EP14871014.8
申请日：2014-12-08
申请人： Applied Materials, Inc.
发明人： AGARWAL, Pulkit , SUH, Song-Moon , MORI, Glen , SANSONI, Steven V.
IPC分类号： B25J11/00 , B25J15/00 , H01L21/687

4. 发明申请

WO2020263690A1 DETACHABLE BIASABLE ELECTROSTATIC CHUCK FOR HIGH TEMPERATURE APPLICATIONS 审中-公开
公开(公告)号：WO2020263690A1
公开(公告)日：2020-12-30
申请号：PCT/US2020/038538
申请日：2020-06-18
申请人： APPLIED MATERIALS, INC.
发明人： RAO, Shreesha Yogish , SUNDARARAJAN, Mukund , TSAI, Cheng-Hsiung Matthew , KOPPA, Manjunatha P. , SANSONI, Steven V.
IPC分类号： H01L21/683 , H02N13/00 , H01L21/687 , H01L21/67 , H01J37/32
摘要： Embodiments of a substrate support are provided herein. In some embodiments, a substrate support for use in a substrate processing chamber includes a lower assembly having a base plate assembly, wherein the base plate assembly includes a plurality of electrical feedthroughs disposed about a central protrusion; a ceramic puck disposed on the lower assembly and removeably coupled to the base plate assembly, wherein the ceramic puck has an electrode disposed therein that is electrically coupled to first pair of electrical feedthroughs of the plurality of electrical feedthroughs; and a flexible connector having a spiral portion disposed between the ceramic puck and each of the plurality of electrical feedthroughs to allow for differences in thermal expansion of the ceramic puck and the base plate assembly.

5. 发明申请

WO2015094743A1 SUBSTRATE SUPPORT APPARATUS HAVING REDUCED SUBSTRATE PARTICLE GENERATION 审中-公开
标题翻译：基板支撑装置具有减少的基板颗粒生成
公开(公告)号：WO2015094743A1
公开(公告)日：2015-06-25
申请号：PCT/US2014/069031
申请日：2014-12-08
申请人： APPLIED MATERIALS, INC.
发明人： AGARWAL, Pulkit , SUH, Song-Moon , MORI, Glen , SANSONI, Steven V.
IPC分类号： H01L21/683
CPC分类号： H01L21/68757 , B25J11/0095 , B25J15/0014 , H01L21/68707 , H01L21/6875
摘要： Embodiments of apparatus for supporting a substrate are disclosed herein. In some embodiments, an apparatus for supporting a substrate includes: a support surface; and a plurality of substrate contact elements protruding from the support surface, wherein the plurality of substrate contact elements are formed of a material having a hardness less than or equal to a hardness of silicon, having a low adhesion, having a coefficient of static friction large enough to prevent sliding, having a surface roughness less than or equal to 10 Ra, and that is electrically conductive.
摘要翻译：本文公开了用于支撑衬底的装置的实施例。在一些实施例中，用于支撑衬底的装置包括：支撑表面; 以及从所述支撑面突出的多个基板接触元件，其中，所述多个基板接触元件由硬度小于或等于硅的硬度的材料形成，具有低粘附性，具有较大的静摩擦系数足以防止具有小于或等于10Ra的表面粗糙度并且是导电的滑动。

6. 发明申请

WO2018102492A1 PROCESS KIT DESIGN FOR IN-CHAMBER HEATER AND WAFER ROTATING MECHANISM 审中-公开
公开(公告)号：WO2018102492A1
公开(公告)日：2018-06-07
申请号：PCT/US2017/063844
申请日：2017-11-30
申请人： APPLIED MATERIALS, INC.
发明人： RASHEED, Muhammad M. , MUSTAFA, Muhannad , TAVASSOLI, Hamid , SANSONI, Steven V. , TSAI, Cheng-Hsiung , BANTHIA, Vikash
IPC分类号： H01L21/67 , H01L21/687 , H01L21/683
CPC分类号： C23C16/46 , C23C16/4584 , C23C16/4586 , H01L21/67103 , H01L21/67248 , H01L21/6831 , H01L21/68735 , H01L21/68742 , H01L21/68785
摘要： Embodiments of the present disclosure are directed process kits for use with an in-chamber heater and substrate rotating mechanism. In some embodiments consistent with the present disclosure, a process kit for use with a rotatable substrate support heater pedestal for supporting a substrate in a process chamber may include an upper edge ring including a top ledge and a skirt the extends downward from the top ledge, a lower edge ring that at least partially supports the upper edge ring and aligns the upper edge ring with the substrate support heater pedestal, a bottom plate disposed on a bottom of the process chamber that supports the upper edge ring when the substrate support heater pedestal is in a lowered non-processing position, and a shadow ring that couples with the upper edge ring when the substrate support heater pedestal is in a raised processing position.

7. 发明申请

WO2015156968A1 METHODS AND APPARATUS FOR RAPIDLY COOLING A SUBSTRATE 审中-公开
标题翻译：快速冷却基板的方法和装置
公开(公告)号：WO2015156968A1
公开(公告)日：2015-10-15
申请号：PCT/US2015/020905
申请日：2015-03-17
申请人： APPLIED MATERIALS, INC.
发明人： RAVI, Jallepally , SANSONI, Steven V. , SAVANDAIAH, Kirankumar
IPC分类号： H01L21/02
CPC分类号： H01L21/67109
摘要： Methods and apparatus for rapidly cooling a substrate are provided herein. In some embodiments, a cooling chamber includes: a chamber body having an inner volume; a substrate support disposed in the volume and having a substrate support surface; a plate disposed in the chamber body opposite the substrate support and movable with respect to the substrate support between a first position and a second position, wherein the first position disposes the substrate support and plate away from each other to expose the support surface to a first volume, and the second position disposes the substrate support and plate adjacent to each other to expose the support surface to a second volume smaller than the first volume; a plurality of flow channels disposed in one or more of the plate or the substrate support to flow a coolant; and a gas inlet to provide a gas into the second volume.
摘要翻译：本文提供了快速冷却基板的方法和装置。在一些实施例中，冷却室包括：具有内部容积的室主体; 设置在所述体积中并具有基板支撑表面的基板支撑件; 设置在所述室主体中与所述基板支撑件相对并且可相对于所述基板支撑件在第一位置和第二位置之间移动的板，其中所述第一位置将所述基板支撑件和板彼此远离以将所述支撑表面暴露于第一位置并且第二位置将基板支撑件和板彼此相邻地布置以将支撑表面暴露于小于第一体积的第二体积; 设置在所述板或所述基板支撑件中的一个或多个中以流过冷却剂的多个流动通道; 以及将气体提供到第二容积中的气体入口。

8. 发明申请

WO2016003598A1 SUBSTRATE TRANSFER ROBOT END EFFECTOR 审中-公开
标题翻译：基台转移机器人终端效应器
公开(公告)号：WO2016003598A1
公开(公告)日：2016-01-07
申请号：PCT/US2015/034333
申请日：2015-06-05
申请人： APPLIED MATERIALS, INC.
发明人： AGARWAL, Pulkit , GREENBERG, Daniel , SUH, Song-Moon , BRODINE, Jeffrey , SANSONI, Steven V. , MORI, Glen
IPC分类号： H01L21/677
CPC分类号： H01L21/68707 , H01L21/67766
摘要： Embodiments of apparatus for supporting a substrate are disclosed herein. In some embodiments, an apparatus for supporting a substrate includes a support member; and a plurality of substrate contact elements protruding from the support member, wherein each of the plurality of substrate contact elements includes: a first contact surface to support a substrate when placed thereon; and a second contact surface extending from the first contact surface, wherein the second contact surface is adjacent a periphery of the substrate to prevent radial movement of the substrate, wherein the first contact surface is at a first angle with respect to the support member and the second contact surface is at a second angle with respect to the support member, and wherein the first angle is between about (3) degrees and (5) degrees.
摘要翻译：本文公开了用于支撑衬底的装置的实施例。在一些实施例中，用于支撑衬底的装置包括支撑构件; 以及从所述支撑构件突出的多个基板接触元件，其中所述多个基板接触元件中的每一个包括：当放置在其上时支撑基板的第一接触表面; 以及从所述第一接触表面延伸的第二接触表面，其中所述第二接触表面邻近所述衬底的周边以防止所述衬底的径向移动，其中所述第一接触表面相对于所述支撑构件处于第一角度，第二接触表面相对于支撑构件成第二角度，并且其中第一角度在约（3）度和（5）度之间。

9. 发明申请

WO2015020791A1 IN-SITU REMOVABLE ELECTROSTATIC CHUCK 审中-公开
标题翻译：现场可拆卸静电卡盘
公开(公告)号：WO2015020791A1
公开(公告)日：2015-02-12
申请号：PCT/US2014/047656
申请日：2014-07-22
申请人： APPLIED MATERIALS, INC.
发明人： COX, Michael S. , HAWRYLCHAK, Lara , SANSONI, Steven V.
IPC分类号： H01L21/683 , H02N13/00 , B23Q3/15
CPC分类号： H01L21/6833 , Y10T29/49815
摘要： Embodiments described herein generally relate to an electrostatic chuck (ESC). The ESC may contain a first plurality of electrodes adapted to electrostatically couple a substrate to the ESC and a second plurality of electrodes adapted to electrostatically couple the ESC to a substrate support. Instead of being integrally disposed within the substrate support, the ESC may be easily removed from the substrate support and removed from a chamber for maintenance or replacement purposes.
摘要翻译：本文描述的实施例一般涉及静电卡盘（ESC）。 ESC可以包含适于将衬底静电耦合到ESC的第一多个电极和适于使ESC与衬底支撑件静电耦合的第二多个电极。代替整体地设置在基板支撑件内，ESC可以容易地从基板支撑件移除并从腔室移除以进行维护或替换。

10. 发明申请

WO2014025918A1 LINKED VACUUM PROCESSING TOOLS AND METHODS OF USING THE SAME 审中-公开
标题翻译：连接真空加工工具及其使用方法
公开(公告)号：WO2014025918A1
公开(公告)日：2014-02-13
申请号：PCT/US2013/054001
申请日：2013-08-07
申请人： APPLIED MATERIALS, INC
发明人： ENGLHARDT, Eric A. , SZUDARSKI, Steve , CORNELIUS, Andrew S. , PURI, Amitabh , RICE, Michael R. , HUDGENS, Jeffrey C. , SANSONI, Steven V. , DECOTTIGNIES, Robert Irwin , HRUZEK, Dean C. , IRWIN, Peter , MERRY, Nir
IPC分类号： H01L21/02 , H01L21/677
CPC分类号： H01L21/67739 , H01L21/67161 , H01L21/67184
摘要： In some embodiments, a linked processing tool system is provided that includes (1) a first processing tool having at least a first transfer chamber configured to couple to a plurality of processing chambers; (2) a second processing tool having at least a second transfer chamber configured to couple to a plurality of processing chambers; (3) a third transfer chamber coupled between the first and second processing tools and configured to transfer substrates between the first and second processing tools; and (4) a single sequencer that controls substrate transfer operations between the first processing tool, the second processing tool and the third transfer chamber of the linked processing tool system. Numerous other aspects are provided.
摘要翻译：在一些实施例中，提供了一种链接的加工工具系统，其包括：（1）具有至少第一传送室的第一处理工具，所述第一传送室被配置为耦合到多个处理室; （2）具有至少第二传送室的第二处理工具，所述第二传送室被配置为耦合到多个处理室; （3）耦合在所述第一和第二处理工具之间并被配置为在所述第一和第二处理工具之间传送衬底的第三传送室; 以及（4）单个定序器，其控制所述连接的处理工具系统的第一处理工具，第二处理工具和第三传送室之间的衬底传送操作。提供了许多其他方面。

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