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1. 发明申请

WO2023091196A1 HIGH TEMPERATURE DETACHABLE VERY HIGH FREQUENCY (VHF) ELECTROSTATIC CHUCK (ESC) FOR PVD CHAMBER 审中-公开
公开(公告)号：WO2023091196A1
公开(公告)日：2023-05-25
申请号：PCT/US2022/036414
申请日：2022-07-07
申请人： APPLIED MATERIALS, INC.
发明人： JOHANSON, William R. , MILLER, Keith A. , TSAI, Cheng-Hsiung Matthew , FORSTER, John C. , SUNDARARAJAN, Mukund
IPC分类号： C23C14/50 , C23C14/54 , H01J37/32 , H01L21/683
摘要： Embodiments of substrate supports for use in substrate processing chambers are provided herein. In some embodiments, a substrate support includes: an upper assembly having a base plate assembly coupled to a lower surface of a cooling plate, wherein the base plate assembly includes a plurality of electrical feedthroughs, and wherein the cooling plate includes a plurality of openings aligned with the plurality of electrical feedthroughs; an electrostatic chuck disposed on the upper assembly and removably coupled to the cooling plate, wherein the electrostatic chuck has a chucking electrode disposed therein that is electrically coupled to a first pair of electrical feedthroughs of the plurality of electrical feedthroughs; and an inner tube coupled to the cooling plate and configured to provide an RF delivery path to the electrostatic chuck.

2. 发明申请

WO2016130496A1 SELF-CLEANING SUBSTRATE CONTACT SURFACES 审中-公开
标题翻译：自清洁衬底接触表面
公开(公告)号：WO2016130496A1
公开(公告)日：2016-08-18
申请号：PCT/US2016/017062
申请日：2016-02-09
申请人： APPLIED MATERIALS, INC.
发明人： LEW, Jen Sern , THIRUNAVUKARASU, Sriskantharajah , SUNDARARAJAN, Mukund
IPC分类号： B08B11/00 , B08B6/00
CPC分类号： H01L21/6831 , H01L21/0209 , H01L21/68785
摘要： An apparatus for removing particles from a substrate contact surface includes parallel electrodes disposed beneath the substrate contact surface; and an alternating current (AC) power supply having a first AC terminal connected to a first parallel electrode and a second AC terminal connected to a second parallel electrode adjacent to the first parallel electrode, wherein an AC output of the first AC terminal has a different phase than an AC output of the second AC terminal. A method of removing particles from a substrate contact surface includes supplying a first alternating current (AC) to a first one of parallel electrodes disposed beneath the substrate contact surface; and supplying a second alternating current to a second one of the parallel electrodes disposed adjacent to the first parallel electrode; wherein the first alternating current has a different phase than the second alternating current.
摘要翻译：用于从基板接触表面去除颗粒的装置包括设置在基板接触表面下方的平行电极; 以及具有连接到第一并联电极的第一AC端子和与第一并联电极相邻的第二并联电极连接的第二AC端子的交流（AC）电源，其中第一AC端子的AC输出具有不同的相位比第二AC端子的AC输出。从衬底接触表面去除颗粒的方法包括：将第一交流电（AC）提供给设置在衬底接触表面下方的平行电极中的第一个; 并向与所述第一并联电极相邻设置的所述平行电极中的第二个提供第二交流电; 其中所述第一交流电流具有与所述第二交流电流不同的相位。

3. 发明申请

WO2016191621A1 METHODS AND APPARATUS FOR A MICROWAVE BATCH CURING PROCESS 审中-公开
标题翻译：用于微波焊接固化方法的方法和装置
公开(公告)号：WO2016191621A1
公开(公告)日：2016-12-01
申请号：PCT/US2016/034489
申请日：2016-05-26
申请人： APPLIED MATERIALS, INC.
发明人： RATHI, Saket , JUPUDI, Ananthkrishna , SUNDARARAJAN, Mukund , VENKATASWAMAPPA, Manjunath Handenahalli
IPC分类号： H01L21/67 , H01L21/324 , H01L21/205 , H01L21/02
CPC分类号： H05B6/80 , F27B5/04 , F27B5/14 , H05B6/6402 , H05B6/6447 , H05B6/645
摘要： In some embodiments, a process chamber for a microwave batch curing process includes: an annular body having an outer surface and an inner surface defining a central opening of the annular body, wherein the inner surface comprises a plurality of angled surfaces defining a first volume; a first lip extending radially outward from the outer surface of the annular body proximate a first end of the annular body; a second lip extending radially outward from the outer surface of the annular body proximate a second end of the annular body; an exhaust disposed between the first lip and the second lip and fluidly coupled to the first volume, wherein the exhaust comprises a plurality of first openings; a plurality of second openings fluidly coupled to the first volume, wherein the plurality of second openings are configured to expose the first volume to microwave energy; and one or more ports fluidly coupled to the first volume.
摘要翻译：在一些实施例中，用于微波批量固化方法的处理室包括：环形体，其具有外表面和限定环形体的中心开口的内表面，其中内表面包括限定第一体积的多个倾斜表面; 靠近所述环形体的第一端从所述环形体的外表面径向向外延伸的第一唇缘; 靠近所述环形体的第二端从所述环形体的外表面径向向外延伸的第二唇缘; 布置在所述第一唇缘和所述第二唇部之间并且流体地联接到所述第一体积的排气口，其中所述排气口包括多个第一开口; 多个第二开口，其流体地联接到所述第一容积，其中所述多个第二开口被配置为将所述第一容积暴露于微波能量; 以及流体地联接到第一容积的一个或多个端口。

4. 发明申请

WO2020263690A1 DETACHABLE BIASABLE ELECTROSTATIC CHUCK FOR HIGH TEMPERATURE APPLICATIONS 审中-公开
公开(公告)号：WO2020263690A1
公开(公告)日：2020-12-30
申请号：PCT/US2020/038538
申请日：2020-06-18
申请人： APPLIED MATERIALS, INC.
发明人： RAO, Shreesha Yogish , SUNDARARAJAN, Mukund , TSAI, Cheng-Hsiung Matthew , KOPPA, Manjunatha P. , SANSONI, Steven V.
IPC分类号： H01L21/683 , H02N13/00 , H01L21/687 , H01L21/67 , H01J37/32
摘要： Embodiments of a substrate support are provided herein. In some embodiments, a substrate support for use in a substrate processing chamber includes a lower assembly having a base plate assembly, wherein the base plate assembly includes a plurality of electrical feedthroughs disposed about a central protrusion; a ceramic puck disposed on the lower assembly and removeably coupled to the base plate assembly, wherein the ceramic puck has an electrode disposed therein that is electrically coupled to first pair of electrical feedthroughs of the plurality of electrical feedthroughs; and a flexible connector having a spiral portion disposed between the ceramic puck and each of the plurality of electrical feedthroughs to allow for differences in thermal expansion of the ceramic puck and the base plate assembly.

5. 发明公开

EP4433622A1 HIGH TEMPERATURE DETACHABLE VERY HIGH FREQUENCY (VHF) ELECTROSTATIC CHUCK (ESC) FOR PVD CHAMBER 审中-实审
公开(公告)号：EP4433622A1
公开(公告)日：2024-09-25
申请号：EP22896274.2
申请日：2022-07-07
申请人： Applied Materials, Inc.
发明人： JOHANSON, William R. , MILLER, Keith A. , TSAI, Cheng-Hsiung Matthew , FORSTER, John C. , SUNDARARAJAN, Mukund
IPC分类号： C23C14/50 , C23C14/54 , H01J37/32 , H01L21/683
CPC分类号： H01J37/32082 , H01J37/32724 , H01J37/34 , H01J37/32715

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