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1. 发明专利

JP2007043131A Thin film transistor, wiring board, and method for manufacturing them 审中-公开
标题翻译：薄膜晶体管，接线板及其制造方法
公开(公告)号：JP2007043131A
公开(公告)日：2007-02-15
申请号：JP2006185481
申请日：2006-07-05
申请人： Aomori Prefecture , Nippon Zeon Co Ltd , Tohoku Univ , 国立大学法人東北大学 , 日本ゼオン株式会社 , 青森県
发明人： SUGAWA SHIGETOSHI , MORIMOTO AKITA , FUJIMURA MAKOTO , KATO TAKEYOSHI , CHIBA MASAHIKO , YAMAGUCHI TOMOYO
IPC分类号： H01L29/786 , H01L21/28 , H01L21/288 , H01L21/336 , H01L29/423 , H01L29/49
摘要： PROBLEM TO BE SOLVED: To solve the problem that it is difficult to provide a large-scale display device since a wiring layer having no level difference and superior adhesiveness and planarity cannot be formed on a transparent substrate. SOLUTION: Adhesiveness and planarity are improved by permitting a gate electrode or a gate wiring of a thin film transistor to have a four-layer structure by successively stacking a base adhesive layer, a catalyst layer, a wiring metal layer, and a wiring metal diffusion suppressing layer. In such a case, the base adhesive layer is formed of a resin having a structure which can be coordinated with a metal, and adhesiveness to an insulating substrate is improved. Furthermore, since diffusion of the wiring metal can be prevented by providing the wiring metal diffusion suppressing layer on the wiring metal layer, characteristics of the thin film transistor can be improved. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题为了解决难以提供大型显示装置的问题，因为在透明基板上不能形成没有水平差和优良的粘合性和平坦度的布线层。解决方案：通过使薄膜晶体管的栅极电极或栅极布线依次堆叠基底粘合剂层，催化剂层，布线金属层和布线金属扩散抑制层。在这种情况下，基底粘合层由具有与金属配合的结构的树脂形成，并且提高了与绝缘基板的粘合性。此外，由于可以通过在布线金属层上设置布线金属扩散抑制层来防止布线金属的扩散，所以可以提高薄膜晶体管的特性。版权所有（C）2007，JPO＆INPIT

2. 发明专利

JP2006284797A Wired board, manufacturing method thereof and display device 有权
标题翻译：电线板及其制造方法及显示装置
公开(公告)号：JP2006284797A
公开(公告)日：2006-10-19
申请号：JP2005103142
申请日：2005-03-31
申请人： Aomori Prefecture , Tohoku Univ , 国立大学法人東北大学 , 青森県
发明人： SUGAWA SHIGETOSHI , MORIMOTO AKITA , CHIBA MASAHIKO , YAMAGUCHI TOMOYO
IPC分类号： G09F9/30 , G02F1/1343 , H01L21/288 , H01L21/3205 , H01L23/52 , H01L29/423 , H01L29/49 , H01L29/786
摘要： PROBLEM TO BE SOLVED: To provide a wired board in which the film thick of wiring is stabilized and a base metallic layer is prevented from being peeled off.
SOLUTION: The wired board 10 comprising a translucent part 2 for transmitting visible light and a wired part 4 for passing an electric signal has a transparent substrate 1 and a transparent synthetic resin composition film 3 layered on the translucent substrate 1. The wired part 4 comprises a wiring aperture 9 formed on the transparent synthetic resin composition film 3 and reached up to a junction part with the transparent substrate 1 and wires 6, 7 engaged with the aperture 9. The translucent part 2 is formed by a layered part of the transparent substrate 1 and the transparent synthetic resin composition film 3 and a cross-sectional shape orthogonal to the wiring direction of the wiring aperture 9 satisfies the relation of Wm
摘要翻译：要解决的问题：提供一种布线板，其中布线的膜厚度稳定并防止基底金属层被剥离。解决方案：包括用于透射可见光的半透明部分2和用于通过电信号的布线部分4的布线板10具有透明基板1和层叠在透光基板1上的透明合成树脂组合物膜3。部分4包括形成在透明合成树脂组合物膜3上的布线孔9，并且到达与透明基板1的接合部分和与孔9接合的电线6,7。半透明部分2由透明基板1和透明合成树脂组合物膜3和与布线孔9的布线方向正交的横截面形状满足Wm

3. 发明专利

JP2013102247A Chip component 审中-公开
标题翻译：芯片组件
公开(公告)号：JP2013102247A
公开(公告)日：2013-05-23
申请号：JP2013045602
申请日：2013-03-07
申请人： Tohoku Univ , 国立大学法人東北大学
发明人： OMI TADAHIRO , MORIMOTO AKITA
IPC分类号： H01C7/00 , H01C1/012 , H01F17/00
摘要： PROBLEM TO BE SOLVED: To provide a chip component composed of a low-k resin which has a small thermal expansion coefficient thereby causing less fluctuation of a resistance value even when a temperature in a use environment changes, and which has no problem such as disconnection and which has high quality.SOLUTION: In a chip component 10 comprising an impedance element 2 and a plurality of electrodes 3, 5 connected to the impedance element 2, which are formed on a substrate 1, the substrate 1 is composed of a low-k material having a low dielectric constant merely capable of reducing parasitic capacitance in GHz-band. In addition, the substrate 1 is composed of at least a synthetic resin and an inorganic material.
摘要翻译：要解决的问题：为了提供一种由低k树脂组成的芯片组件，其具有小的热膨胀系数，从而即使当使用环境中的温度改变时也导致较小的电阻值的波动，并且没有问题如断线，具有高质量。解决方案：在基片1上形成有阻抗元件2和连接到阻抗元件2的多个电极3,5的芯片元件10中，基片1由低k材料构成，具有低介电常数只能降低GHz频带的寄生电容。此外，基板1由至少合成树脂和无机材料构成。版权所有（C）2013，JPO＆INPIT

4. 发明专利

JP2012124165A Method for manufacturing insulating material containing magnetic material 审中-公开
标题翻译：制造含有磁性材料的绝缘材料的方法
公开(公告)号：JP2012124165A
公开(公告)日：2012-06-28
申请号：JP2011283880
申请日：2011-12-26
申请人： Tohoku Univ , 国立大学法人東北大学
发明人： OMI TADAHIRO , MORIMOTO AKITA
IPC分类号： H01B19/00 , H01B3/00 , H01F1/26 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing an insulating material containing a magnetic material, which allows the insulating material to obtain an effect of increasing magnetic permeability without relatively increasing a concentration of the magnetic material mixed in the insulating material, allows the insulating material containing the magnetic material obtained by the method to be applied to a circuit bord to enhance characteristic impedance, and thereby provides an effect of reducing power consumption to the insulating material.SOLUTION: The insulating material containing the magnetic material is obtained by the manufacturing steps which comprise: mixing a resin varnish and slurry in which the magnetic material is dispersed in a solvent; and applying, drying and baking the mixture. The slurry producing step comprises: a step of producing a dispersion solvent in which a surface active agent is added to the solvent; and a step of mixing fine powders of the magnetic material with the dispersion solvent. The mixing step of the fine powders of the magnetic material comprises: a step of stirring an aggregate with a screw; a step of irradiating the aggregate with ultrasonic waves having a frequency of less than 100 kHz; and a step of irradiating the aggregate with ultrasonic waves having a frequency of 100 kHz or more.
摘要翻译：解决问题的方案为了提供一种制造包含磁性材料的绝缘材料的方法，其允许绝缘材料获得增加磁导率的效果，而不会相对增加混合在绝缘材料中的磁性材料的浓度，允许将通过该方法获得的包含磁性材料的绝缘材料施加到电路板上以增强特性阻抗，从而提供降低绝缘材料的功率消耗的效果。解决方案：包含磁性材料的绝缘材料通过以下制造步骤获得：包括：将树脂清漆和其中磁性材料分散在溶剂中的浆料混合; 并施加，干燥和烘烤该混合物。浆料生产步骤包括：制备其中将表面活性剂加入到溶剂中的分散溶剂的步骤; 以及将该磁性材料的细粉末与分散溶剂混合的步骤。磁性材料的细粉末的混合步骤包括：用螺杆搅拌骨料的步骤; 用频率小于100kHz的超声波照射聚集体的步骤; 以及使用频率为100kHz以上的超声波照射聚集体的步骤。版权所有（C）2012，JPO＆INPIT

5. 发明专利

JP2007088409A Multilayered circuit board and electronic equipment 有权
标题翻译：多层电路板和电子设备
公开(公告)号：JP2007088409A
公开(公告)日：2007-04-05
申请号：JP2006028655
申请日：2006-02-06
申请人： Tohoku Univ , 国立大学法人東北大学
发明人： OMI TADAHIRO , TERAMOTO AKINOBU , MORIMOTO AKITA
IPC分类号： H05K3/46
CPC分类号： H05K1/024 , H05K3/4602 , H05K3/4626 , H05K3/4673 , H05K2201/0116 , H05K2201/0195 , H05K2201/0209 , H05K2201/0254
摘要： PROBLEM TO BE SOLVED: To provide a multilayered circuit board which has a low dielectric-constant interlayer insulating film and does not cause problems including a decrease in the production yield or deterioration in the transmission characteristic of a high frequency signal because its surface in contact with the interlayer insulating film has no recesses and projections, thereby being able to greatly improve characteristics such as signal transfer characteristics of multilayered circuit boards used in a package or printed circuit board, and to provide electronic equipment using the same.
SOLUTION: A multilayered circuit board 10 comprises a plurality of wiring layers on the substrate and a plurality of insulating layers disposed between the wiring layers, wherein at least a part of the insulating layers consists of a porous insulating layer 1 containing at least one of the material selected from the porous material group consisting of a porous body, aerogel, a porous silica, a porous polymer, hollow silica, and a hollow polymer and a non-porous insulating layer 2 where at least one of its surfaces of the porous insulating layer 1 does not contain the porous material group. The electronic equipment uses the multilayered circuit board.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有低介电常数层间绝缘膜的多层电路板，并且不会引起高频信号的生产良率或传输特性的降低等问题，因为其表面与层间绝缘膜接触不具有凹凸，能够大幅度提高包装物或印刷电路板中使用的多层电路板的信号传递特性等特性，并提供使用其的电子设备。解决方案：多层电路板10包括在基板上的多个布线层和布置在布线层之间的多个绝缘层，其中绝缘层的至少一部分由多孔绝缘层1组成，多孔绝缘层1至少包含从由多孔体，气凝胶，多孔二氧化硅，多孔聚合物，中空二氧化硅和中空聚合物组成的多孔材料组中选择的材料之一和非多孔绝缘层2，其中至少一个表面的多孔绝缘层1不包含多孔材料组。电子设备采用多层电路板。版权所有（C）2007，JPO＆INPIT

6. 发明专利

JP2007157915A Photoelectric conversion element, and manufacturing method and apparatus therefor 有权
标题翻译：光电转换元件及其制造方法及装置
公开(公告)号：JP2007157915A
公开(公告)日：2007-06-21
申请号：JP2005349371
申请日：2005-12-02
申请人： Tohoku Univ , 国立大学法人東北大学
发明人： OMI TADAHIRO , TERAMOTO AKINOBU , MORIMOTO AKITA , SHIRAI YASUYUKI
IPC分类号： H01L31/04
CPC分类号： C23C16/325 , H01L31/0312
摘要： PROBLEM TO BE SOLVED: To provide a photoelectric conversion element which improves its photoelectric conversion efficiency, and a solar battery using the photoelectric conversion element.
SOLUTION: According to the photoelectric conversion element, a prescribed photoelectric conversion lamination is formed on a board to compose a photoelectric conversion film that converts incident light into electric energy. The prescribed photoelectric conversion lamination contains silicon and carbon.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种提高其光电转换效率的光电转换元件和使用该光电转换元件的太阳能电池。解决方案：根据光电转换元件，在板上形成规定的光电转换层叠，以组成将入射光转换为电能的光电转换膜。规定的光电转换层叠体含有硅和碳。版权所有（C）2007，JPO＆INPIT

7. 发明专利

JP2006024716A Solar cell panel 有权
标题翻译：太阳能电池板
公开(公告)号：JP2006024716A
公开(公告)日：2006-01-26
申请号：JP2004201019
申请日：2004-07-07
申请人： Tohoku Univ , 国立大学法人東北大学
发明人： OMI TADAHIRO , MORIMOTO AKITA , TAKEHISA KIWAMU
IPC分类号： H01L31/042
CPC分类号： H01L31/055 , H01L31/02168 , Y02E10/52
摘要： PROBLEM TO BE SOLVED: To provide a solar cell panel for developing a color without decreasing power generation efficiency which may drop since the solar cell panel is generally black and inferior cosmetically and in which the visible light of sunlight may be reflected and scattered as a means for allowing the solar cell panel to develop the color conventionally. SOLUTION: A solar cell is covered with a transparent plate for absorbing infrared rays and emitting visible light, thus developing a color by energy constituents without contributing to power generation, and hence preventing power generation efficiency from dropping. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种太阳能电池板，用于显影颜色，而不会降低由于太阳能电池板通常是黑色和劣质的并且可以反射和散射太阳光的可见光的发电效率而降低的发电效率作为允许太阳能电池板通常形成颜色的手段。解决方案：太阳能电池被透明板覆盖，用于吸收红外线并发出可见光，从而通过能量成分显色而不会发电，从而防止发电效率下降。版权所有（C）2006，JPO＆NCIPI

8. 发明专利

JP2007096193A Multilayer circuit board with built-in semiconductor element 有权
标题翻译：具有内置半导体元件的多层电路板
公开(公告)号：JP2007096193A
公开(公告)日：2007-04-12
申请号：JP2005286441
申请日：2005-09-30
申请人： Ibiden Co Ltd , Tohoku Univ , イビデン株式会社 , 国立大学法人東北大学
发明人： ENOMOTO AKIRA , OMI TADAHIRO , MORIMOTO AKITA
IPC分类号： H01L25/10 , H01L25/11 , H01L25/18
CPC分类号： H01L2224/24 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01074 , H01L2924/01322 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To enable to efficiently radiate heat generated in a semiconductor element through an insulated base material by joining the semiconductor element to a recess so as to be closely bonded, in an operation temperature region of a semiconductor element circuit board; and to provide a circuit board with a built-in semiconductor element which can securely electrically connect an electronic component such as a semiconductor element with a short wiring and also enables high-density mounting of semiconductor elements, miniaturization and increase in operation speed.
SOLUTION: In the multilayer circuit board with built-in semiconductor elements, a plurality of boards with a built-in semiconductor element, which is housed in a recess provided on an insulated base material, are stacked. In this circuit board, a high-temperature transmissive ceramic is used for the insulated base material, a difference in a temperature range 20-300°C between the thermal expansion rate of the insulated base material and that of the semiconductor element is less than 1×10
-5 /K.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了通过将半导体元件接合到紧密接合的凹部来通过绝缘基材有效地辐射半导体元件中产生的热，在半导体元件电路板的操作温度区域 ; 并且提供具有内置半导体元件的电路板，其可以将诸如半导体元件的电子部件与短布线牢固地电连接，并且还能够实现半导体元件的高密度安装，小型化和增加操作速度。解决方案：在具有内置半导体元件的多层电路板中，堆叠容纳在设置在绝缘基材上的凹部中的具有内置半导体元件的多个板。在该电路基板中，绝缘基材使用高温透过性陶瓷，绝缘基材的热膨胀率与半导体元件的热膨胀率之间的温度范围为20〜300℃的差异小于1 ×10 -5 / K。版权所有（C）2007，JPO＆INPIT

9. 发明专利

JP2006269979A Flexible rigid printed-wiring board and its manufacturing method 有权
标题翻译：柔性刚性印刷电路板及其制造方法
公开(公告)号：JP2006269979A
公开(公告)日：2006-10-05
申请号：JP2005089551
申请日：2005-03-25
申请人： Daisho Denshi:Kk , Tohoku Univ , 国立大学法人東北大学 , 株式会社大昌電子
发明人： SATO AKIHIRO , SASAKI MASAHIRO , OMI TADAHIRO , MORIMOTO AKITA
IPC分类号： H05K1/02 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a flexible rigid printed-wiring board capable of improving a bending endurance of the flexible part with a flexibility of the flexible part secured and securing the conductivity of the rigid part, and to provide its manufacturing method.
SOLUTION: The flexible rigid printed-wiring board with the conductive layer formed on at least one surface of the base film has one region including the base film as the rigid region, and the other region including the base film as the flexible region. The average thickness tf of the conductive layer on the base film formed in the flexible region and the average thickness tR of the conductive layer on the base film formed in the rigid region satisfies the relation of tf
摘要翻译：要解决的问题：提供一种柔性刚性印刷电路板，其能够通过柔性部件的柔性改善柔性部件的弯曲耐久性并且确保刚性部件的导电性，并提供其制造方法。解决方案：具有形成在基膜的至少一个表面上的导电层的柔性刚性印刷电路板具有包括基膜作为刚性区域的一个区域，并且包括基膜作为柔性区域的另一区域。形成在柔性区域的基底膜上的导电层的平均厚度tf和形成在刚性区域中的基底膜上的导电层的平均厚度t R满足tf

10. 发明专利

JP2006269134A Insulator containing magnetic substance, and circuit board and electronic device using same 有权
标题翻译：含有磁性物质的绝缘体，使用同一电路的电路板和电子设备
公开(公告)号：JP2006269134A
公开(公告)日：2006-10-05
申请号：JP2005082653
申请日：2005-03-22
申请人： Tohoku Univ , 国立大学法人東北大学
发明人： OMI TADAHIRO , MORIMOTO AKITA
IPC分类号： H01B3/00 , H01B17/64 , H05K1/03
CPC分类号： H05K1/0373 , H05K1/0233 , H05K2201/0215 , H05K2201/0266 , H05K2201/086 , Y10T428/2495
摘要： PROBLEM TO BE SOLVED: To provide an insulator containing a magnetic substance wherein an effect of increasing a permeability can be obtained without increasing a density of the magnetic substance in a mixture not so much, a characteristic impedance can be improved by using the insulator containing the magnetic substance for a circuit board, and an effect of reducing a power consumption can also be obtained, and to provide circuit boards and electric devices using the same. SOLUTION: The insulator 10 containing a magnetic substance includes two or more particles 1a and 1b of a magnetic substance, and an insulator 2 holding the two or more particles 1a and 1b of the magnetic substance. A group of particles of the magnetic substance is composed of particles of at least two or more particle sizes. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了提供含有磁性物质的绝缘体，其中在不增加混合物中的磁性物质的密度的情况下可以获得增加磁导率的效果，而不会增加混合物中的磁性物质的密度，可以通过使用也可以获得包含用于电路板的磁性物质的绝缘体和降低功耗的效果，并且提供使用其的电路板和电气装置。解决方案：包含磁性物质的绝缘体10包括两个或更多个磁性物质的颗粒1a和1b，以及保持磁性物质的两个或更多个颗粒1a和1b的绝缘体2。一组磁性物质的颗粒由至少两种或更多种粒径的颗粒组成。版权所有（C）2007，JPO＆INPIT

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