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1. 发明专利

JP2007043131A Thin film transistor, wiring board, and method for manufacturing them 审中-公开
标题翻译：薄膜晶体管，接线板及其制造方法
公开(公告)号：JP2007043131A
公开(公告)日：2007-02-15
申请号：JP2006185481
申请日：2006-07-05
申请人： Aomori Prefecture , Nippon Zeon Co Ltd , Tohoku Univ , 国立大学法人東北大学 , 日本ゼオン株式会社 , 青森県
发明人： SUGAWA SHIGETOSHI , MORIMOTO AKITA , FUJIMURA MAKOTO , KATO TAKEYOSHI , CHIBA MASAHIKO , YAMAGUCHI TOMOYO
IPC分类号： H01L29/786 , H01L21/28 , H01L21/288 , H01L21/336 , H01L29/423 , H01L29/49
摘要： PROBLEM TO BE SOLVED: To solve the problem that it is difficult to provide a large-scale display device since a wiring layer having no level difference and superior adhesiveness and planarity cannot be formed on a transparent substrate. SOLUTION: Adhesiveness and planarity are improved by permitting a gate electrode or a gate wiring of a thin film transistor to have a four-layer structure by successively stacking a base adhesive layer, a catalyst layer, a wiring metal layer, and a wiring metal diffusion suppressing layer. In such a case, the base adhesive layer is formed of a resin having a structure which can be coordinated with a metal, and adhesiveness to an insulating substrate is improved. Furthermore, since diffusion of the wiring metal can be prevented by providing the wiring metal diffusion suppressing layer on the wiring metal layer, characteristics of the thin film transistor can be improved. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题为了解决难以提供大型显示装置的问题，因为在透明基板上不能形成没有水平差和优良的粘合性和平坦度的布线层。解决方案：通过使薄膜晶体管的栅极电极或栅极布线依次堆叠基底粘合剂层，催化剂层，布线金属层和布线金属扩散抑制层。在这种情况下，基底粘合层由具有与金属配合的结构的树脂形成，并且提高了与绝缘基板的粘合性。此外，由于可以通过在布线金属层上设置布线金属扩散抑制层来防止布线金属的扩散，所以可以提高薄膜晶体管的特性。版权所有（C）2007，JPO＆INPIT

2. 发明专利

JP2007227567A Method of forming metal thin film layer and method of manufacturing multilayer printed wiring board 审中-公开
标题翻译：形成金属薄膜层的方法和制造多层印刷线路板的方法
公开(公告)号：JP2007227567A
公开(公告)日：2007-09-06
申请号：JP2006045766
申请日：2006-02-22
申请人： Nippon Zeon Co Ltd , 日本ゼオン株式会社
发明人： KAWASAKI MASAFUMI , FUJIMURA MAKOTO
IPC分类号： H05K3/18
摘要： PROBLEM TO BE SOLVED: To provide a method of forming a metal thin film layer which has a stable and high adhesion between an electric insulation layer and a conductor layer, and has a high soldering heat resistance.
SOLUTION: The electric insulation layer is obtained by bringing a chemical compound having a structure which allows for metal coordination into contact with the surface of an uncured or half-cured resin layer containing an electric insulation resin and a hardening agent and then hardening the resin layer. On the electric insulation layer, the metal thin film layer is formed by processes of (1) oxidation treatment, (2) neutralization and reduction, (3) cleaner and conditioner, (4) soft etching treatment, (5) acid pickling treatment, (6) addition of a catalyst, (7) activation, and (8) electroless plating. Washing water to be used for at least the processes (2), (6), and (7) is passed through at least one filter selected among an activated carbon filtration filter, reverse osmotic filter, nano filtration filter, and ultrafiltration filter. The total iron concentration in the washing water is 0.2 mg/L or below.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种形成在电绝缘层和导体层之间具有稳定和高粘附性的金属薄膜层的方法，并且具有高的焊接耐热性。解决方案：电绝缘层通过使具有允许金属配位的结构的化合物与含有电绝缘树脂和硬化剂的未固化或半固化树脂层的表面接触，然后硬化树脂层。在电绝缘层上，金属薄膜层通过（1）氧化处理，（2）中和和还原，（3）清洁剂和调理剂，（4）软蚀刻处理，（5）酸洗处理，（6）加入催化剂，（7）活化，和（8）化学镀。用于至少过程（2），（6）和（7）的洗涤水通过选自活性炭过滤器，反渗透过滤器，纳滤过滤器和超滤过滤器中的至少一种过滤器。洗涤水中的总铁浓度为0.2mg / L以下。版权所有（C）2007，JPO＆INPIT

3. 发明专利

JP2004292652A Flame retardant slurry and use of the same 有权
公开(公告)号：JP2004292652A
公开(公告)日：2004-10-21
申请号：JP2003087334
申请日：2003-03-27
申请人： Nippon Zeon Co Ltd , 日本ゼオン株式会社
发明人： WAKIZAKA YASUHIRO , FUJIMURA MAKOTO
IPC分类号： C09K21/02 , C09K21/12 , H01L23/14
摘要： PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board having an electrical insulating layer excellent in high-temperature high-humidity resistance and electrical insulating properties.
SOLUTION: A flame retardant slurry comprises an organic dispersion medium, a phosphate particle of a basic nitrogen-containing compound and a metallic compound hardly soluble in the organic dispersion medium (wherein the metal belongs to the 2nd group or the 13th group of a long form of the periodic table). The multilayer printed wiring board is obtained by forming an electrical insulating layer on an inner layer board using a varnish of a curable resin composition comprising an insulating polymer, a curing agent and the flame retardant slurry. The flame retardant slurry can be prepared by stirring, in a wet mill, the organic dispersion medium, the phosphate particle of the basic nitrogen-containing compound and the metallic compound hardly soluble in the organic dispersion medium (wherein the metal belongs to the 2nd group or the 13th group of the long form of the periodic table).
COPYRIGHT: (C)2005,JPO&NCIPI

4. 发明专利

JP2013077704A Insulating adhesive film, prepreg, laminate, cured product, and complex 有权
标题翻译：绝缘胶膜，PREPREG，层压板，固化产品和复合材料
公开(公告)号：JP2013077704A
公开(公告)日：2013-04-25
申请号：JP2011216842
申请日：2011-09-30
申请人： Nippon Zeon Co Ltd , 日本ゼオン株式会社
发明人： FUJIMURA MAKOTO , KAMATA KOHEI
IPC分类号： H05K3/46 , B32B15/085 , B32B27/00 , B32B27/12 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide an insulating adhesive film allowing formation of an electric insulation layer having low surface roughness, low linear expansion, excellent via hole formation property and high peel strength.SOLUTION: There is provided an insulating adhesive film which is characterized by having: a plated layer consisting of a resin composition for a plated layer containing an alicyclic olefin polymer (A1), a curing agent (A2) and an untreated inorganic filler (A3) not-subjected to surface treatment; and an adhesive layer consisting of a resin composition for an adhesive layer containing an alicyclic olefin polymer (B1), a curing agent (B2) and a surface treatment inorganic filler (B3) subjected to surface treatment.
摘要翻译：要解决的问题：提供一种能够形成具有低表面粗糙度，低线膨胀，优异的通孔形成性和高剥离强度的电绝缘层的绝缘粘合膜。解决方案：提供一种绝缘粘合剂膜，其特征在于具有：由用于含有脂环族烯烃聚合物（A1），固化剂（A2）和未处理的无机填料的镀层的树脂组合物组成的镀层（A3）不进行表面处理; 和由含有脂环式烯烃聚合物（B1），固化剂（B2）和表面处理无机填料（B3）进行表面处理的粘合剂层的树脂组合物组成的粘合剂层。版权所有（C）2013，JPO＆INPIT

5. 发明专利

JP2013055301A Manufacturing method of multilayer printed wiring board 审中-公开
标题翻译：多层印刷线路板的制造方法
公开(公告)号：JP2013055301A
公开(公告)日：2013-03-21
申请号：JP2011194224
申请日：2011-09-06
申请人： Nippon Zeon Co Ltd , 日本ゼオン株式会社
发明人： FUJIMURA MAKOTO
IPC分类号： H05K3/18 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a method of efficiently manufacturing a highly reliable multilayer printed wiring board exhibiting excellent adhesive force of plating.SOLUTION: A manufacturing method of a multilayer printed wiring board including a first insulating layer 1, first conductor layers 2a, 2b, 2c, a second insulating layer 3 containing alicyclic olefin polymer, and second conductor layers 4a, 4b, 4c, in this order, and having via holes 5 connecting the first and second conductor layers electrically includes the steps of: forming via hole openings in the second insulating layer; bringing an alkaline aqueous solution and an organic solvent into contact with the surface of the second insulating layer including the via hole openings; bringing an oxidizer aqueous solution into contact; performing neutralization and reduction treatment of the surface of the second insulating layer including the surface of the via hole openings; bringing an alkaline aqueous solution into contact following to the neutralization and reduction treatment; and forming a conductive thin film on the surface of the second insulating layer including the surface of the via hole openings by plating.
摘要翻译：要解决的问题：提供一种有效地制造显示出优异的电镀粘合力的高度可靠的多层印刷线路板的方法。解决方案：包括第一绝缘层1，第一导体层2a，2b，2c，含有脂环族烯烃聚合物的第二绝缘层3和第二导体层4a，4b，4c的多层印刷布线板的制造方法，并且具有连接第一和第二导体层的通孔5电气地包括以下步骤：在第二绝缘层中形成通孔开口; 使碱性水溶液和有机溶剂与包括通孔开口的第二绝缘层的表面接触; 使氧化剂水溶液接触; 对包括通孔开口的表面的第二绝缘层的表面进行中和和还原处理; 在中和和还原处理之后使碱性水溶液接触; 以及通过电镀在包括通孔开口的表面的第二绝缘层的表面上形成导电薄膜。版权所有（C）2013，JPO＆INPIT

6. 发明专利

JP2006229038A Manufacturing method of multilayer printed wiring board 审中-公开
标题翻译：多层印刷线路板的制造方法
公开(公告)号：JP2006229038A
公开(公告)日：2006-08-31
申请号：JP2005042247
申请日：2005-02-18
申请人： Nippon Zeon Co Ltd , 日本ゼオン株式会社
发明人： FUJIMURA MAKOTO
IPC分类号： H05K3/46 , H05K3/18
摘要： PROBLEM TO BE SOLVED: To manufacture a multilayer printed wiring board reduced in signal loss and excellent in the adhesiveness of its conductor layer. SOLUTION: The manufacturing method of the multilayer printed wiring board has a process for forming on its each inner-layer substrate having a conductor layer of its outermost layer an unhardened or semi-hardened resin layer formed by using a hardenable composition containing an insulating polymer and a hardening agent, a process for contacting with the surface thereof a compound having a coordinate-able structure to a metal, a process for so hardening thereafter the resin layer as to form an electrically insulating layer, a process for subjecting next the surface of the electrically insulating layer to such treatment as to make it hydrophilic, a process for drying thereafter the surface of the electrically insulating layer, a process for contacting further with the surface thereof a compound having a coordinate-able structure to a metal, and a process for forming thereafter the conductor layer by a plating method. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：制造多层印刷线路板，减少信号损失，并且其导体层的粘附性优异。解决方案：多层印刷线路板的制造方法具有在其每个内层基板上形成具有最外层的导体层的方法，该未硬化或半硬化树脂层通过使用可硬化组合物形成，所述可硬化组合物含有绝缘聚合物和硬化剂，与其表面接触具有与金属具有可配位结构的化合物的方法，此后使树脂层硬化以形成电绝缘层的方法，接下来将其电绝缘层的表面进行这样的处理以使其具有亲水性，其后干燥电绝缘层的表面的方法，与表面进一步接触具有可配位结构的化合物与金属的方法，以及通过电镀法形成导体层之后的工序。版权所有（C）2006，JPO＆NCIPI

7. 发明专利

JP2014198746A 硬化性エポキシ組成物、フィルム、積層フィルム、プリプレグ、積層体、硬化物、及び複合体审中-公开
标题翻译：可固化环氧组合物，膜，层压膜，PREPREG，层压板，固化产品和复合材料
公开(公告)号：JP2014198746A
公开(公告)日：2014-10-23
申请号：JP2013073848
申请日：2013-03-29
申请人：日本ゼオン株式会社 , Nippon Zeon Co Ltd
发明人： FUJIMURA MAKOTO , SANUKI HIDEAKI , FUJITA SHIGERU
IPC分类号： C08G59/24 , B32B27/00 , B32B27/38 , C08G59/42 , H05K1/03
摘要：【課題】耐熱性と電気特性に優れ、さらにデスミア性にも優れた電気絶縁層を形成することができる硬化性エポキシ組成物を提供すること。【解決手段】エポキシ化合物(A)と活性エステル化合物(B)とを含む硬化性エポキシ組成物であって、前記エポキシ化合物(A)が、脂環式縮合多環構造を有する多価エポキシ化合物(A−1)とエポキシ変性ゴム(A−2)とを含み、かつ前記エポキシ化合物(A)中、前記多価エポキシ化合物(A−1)の含有割合が30重量%以上である、硬化性エポキシ組成物。【選択図】なし
摘要翻译：要解决的问题：提供能够形成耐热性，电特性和去污性能优异的电绝缘层的可固化环氧组合物。溶解性：可固化环氧组合物含有环氧化合物（A）和活性酯化合物（B ）。环氧化合物（A）含有具有脂环稠合多环结构的多价环氧化合物（A-1）和环氧改性橡胶（A-2）。在环氧化合物（A）中，多价环氧化合物（A-1）的含有比例为30重量％以上。

8. 发明专利

JP2014185228A Curable epoxy composition, film, laminate film, prepreg, laminate, hardened material and composite body 审中-公开
标题翻译：可固化环氧组合物，膜，层压膜，PREPREG，层压板，硬化材料和复合体
公开(公告)号：JP2014185228A
公开(公告)日：2014-10-02
申请号：JP2013060436
申请日：2013-03-22
申请人： Nippon Zeon Co Ltd , 日本ゼオン株式会社
发明人： SHINDO NATSUKO , FUJIMURA MAKOTO
IPC分类号： C08G59/20 , B32B7/02 , B32B27/00 , B32B27/38 , C08J5/24 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a curable epoxy composition which can form an electric insulation layer excellent in desmear properties, electric characteristics, heat resistance and adhesiveness to a conductor layer.SOLUTION: A curable epoxy composition comprises (A-1) an epoxy compound having a specified structure, (B) an active ester compound and (C) a hardening accelerator.
摘要翻译：要解决的问题：提供一种固化型环氧组合物，其可以形成对导体层的去污性，电特性，耐热性和粘合性优异的电绝缘层。溶解性：可固化环氧组合物包含（A-1）环氧化合物具有特定结构，（B）活性酯化合物和（C）硬化促进剂。

9. 发明专利

JP2014185218A Curable epoxy composition, film, laminate film, prepreg, laminate, hardened material and composite body 有权
标题翻译：可固化环氧组合物，膜，层压膜，PREPREG，层压板，硬化材料和复合体
公开(公告)号：JP2014185218A
公开(公告)日：2014-10-02
申请号：JP2013060187
申请日：2013-03-22
申请人： Nippon Zeon Co Ltd , 日本ゼオン株式会社
发明人： CHIBA MAYUKA , KAMATA KOHEI , FUJIMURA MAKOTO
IPC分类号： C08G59/20 , B32B27/38 , C08G59/42 , C08J5/24 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a curable epoxy composition which can form an electric insulation layer excellent in desmear properties, electric characteristics and heat resistance.SOLUTION: A curable epoxy composition comprises (A) a polyvalent epoxy compound having a condensed polycyclic structure and/or a biphenyl structure, (B) a water-soluble epoxy compound and (C) an active ester compound.
摘要翻译：要解决的问题：提供一种可形成脱粘性，电特性和耐热性优异的电绝缘层的可固化环氧组合物。溶解性：可固化环氧组合物包含（A）具有缩合多环结构的多价环氧化合物和/ 或联苯结构，（B）水溶性环氧化合物和（C）活性酯化合物。

10. 发明专利

JP2006278922A Manufacturing method for multilayer circuit board 审中-公开
标题翻译：多层电路板的制造方法
公开(公告)号：JP2006278922A
公开(公告)日：2006-10-12
申请号：JP2005098825
申请日：2005-03-30
申请人： Nippon Zeon Co Ltd , 日本ゼオン株式会社
发明人： KAWASAKI MASAFUMI , FUJIMURA MAKOTO , ITO AZUMI
IPC分类号： H05K3/46 , C08G59/42 , C08K5/09 , C08L63/00 , C08L101/08 , H05K3/38
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer circuit board that is smooth at its surface, has an electrical insulating layer excellent in insulating performance, and is high in adherence between the electrical insulating layer and a conductor layer for obtaining a circuit board that is high in electrical reliability even if its density is increased. SOLUTION: The manufacturing method for the multilayer circuit board includes steps of forming an uncured or a semi-cured resin layer of a hardening resin composition over an inner substrate whose outermost layer is a conductor layer (step a), bringing a compound of such a structure that it can be coordinated in metal into contact with the surface of the resin layer (step b), curing the resin layer to form an electrical insulating layer (step c), forming a metal thin film layer over the surface of the electrical insulating layer (step d), and forming a conductor layer including the metal thin film layer (step e). The hardening resin composition used in the step (a) contains a polymer (A) containing an electrical insulating carboxyl group, a carboxylic anhydride (B) containing two or more acid anhydride radicals in a molecule, polyvalent epoxy compound (C), and an organic solvent (D). COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：解决的问题：为了提供一种制造其表面光滑的多层电路板的方法，具有绝缘性能优异的电绝缘层，并且电绝缘层和导体层之间的粘附性高获得电可靠性高的电路板，即使其密度增加。解决方案：多层电路板的制造方法包括以下步骤：在最外层为导体层的内基板上形成硬化树脂组合物的未固化或半固化树脂层（步骤a），使化合物具有能够与金属配合以与树脂层的表面接触的结构（步骤b），使树脂层固化形成电绝缘层（步骤c），在其表面上形成金属薄膜层电绝缘层（步骤d），并形成包括金属薄膜层的导体层（步骤e）。步骤（a）中使用的硬化树脂组合物含有分子中含有电绝缘性羧基的聚合物（A）和含有两个以上的酸酐基的羧酸酐（B），多价环氧化合物（C）和有机溶剂（D）。版权所有（C）2007，JPO＆INPIT

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