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1. 发明授权

US6051500A Device and method for polishing a semiconductor substrate 失效
标题翻译：用于研磨半导体衬底的装置和方法
公开(公告)号：US6051500A
公开(公告)日：2000-04-18
申请号：US80992
申请日：1998-05-19
申请人： Alvaro Maury , Arun K. Nanda , Omar Rodriguez
发明人： Alvaro Maury , Arun K. Nanda , Omar Rodriguez
IPC分类号： B24B1/04 , B24B37/04 , H01L21/304 , H01L21/321 , H01L21/768
CPC分类号： B24B1/04 , B24B37/042 , H01L21/3212 , H01L21/7684
摘要： The present invention provides a method for polishing a semiconductor substrate having a first layer of material formed on a second layer of different material. In one embodiment, the method includes placing the semiconductor substrate against a polishing surface and polishing the semiconductor substrate, producing a first vibration by polishing and removing the first layer, producing a second vibration by polishing at least a portion of the second layer, and detecting a change from the first vibration to the second vibration with a vibration sensor. The vibration that is sensed in the present invention is physical or mechanical vibration, and it is not a vibration associated with a change in temperature. The vibration sensor may be of varying types. For example, the vibration sensor may be an acoustic sensor or an ultrasonic sensor.
摘要翻译：本发明提供一种用于研磨具有形成在不同材料的第二层上的第一材料层的半导体衬底的方法。在一个实施例中，该方法包括将半导体衬底放置在抛光表面上并抛光半导体衬底，通过抛光和去除第一层产生第一振动，通过抛光第二层的至少一部分产生第二振动，以及检测用振动传感器从第一次振动到第二次振动的变化。在本发明中感测到的振动是物理或机械振动，并且它不是与温度变化相关联的振动。振动传感器可以是不同类型的。例如，振动传感器可以是声传感器或超声波传感器。

2. 发明授权

US06281128B1 Wafer carrier modification for reduced extraction force 有权
标题翻译：晶片载体修改减少提取力
公开(公告)号：US06281128B1
公开(公告)日：2001-08-28
申请号：US09332216
申请日：1999-06-14
申请人： Alvaro Maury , John A. Maze , Frank Miceli , Jose Omar Rodriguez , Robert M. Symons
发明人： Alvaro Maury , John A. Maze , Frank Miceli , Jose Omar Rodriguez , Robert M. Symons
IPC分类号： H01L21302
CPC分类号： B24B37/30
摘要： The present invention provides a wafer carrier for use with a semiconductor wafer polishing apparatus. In one embodiment, the wafer carrier comprises a carrying head having opposing first and second surfaces, a primary channel system formed in the second surface, and a secondary channel system formed in the second surface. The first surface is coupleable to the semiconductor polishing apparatus and the second surface is adapted to receive a semiconductor wafer to be polished. The primary channel system comprises first and second intersecting channels. The secondary channel system intersects the primary channel system so that the secondary channel system and the primary channel system cooperate to occupy a substantial portion of a surface area of the second surface. Therefore, the primary channel system and the secondary channel system decrease an amount of force required to remove the semiconductor wafer from the second surface.
摘要翻译：本发明提供一种与半导体晶片抛光装置一起使用的晶片载体。在一个实施例中，晶片载体包括具有相对的第一和第二表面的承载头，形成在第二表面中的主要通道系统，以及形成在第二表面中的辅助通道系统。第一表面可耦合到半导体抛光装置，第二表面适于接收待抛光的半导体晶片。主通道系统包括第一和第二相交通道。次通道系统与主通道系统相交，使得辅助通道系统和主通道系统协同占据第二表面的表面区域的主要部分。因此，主通道系统和次通道系统减少了从第二表面移除半导体晶片所需的力。

3. 发明授权

US6110012A Chemical-mechanical polishing apparatus and method 有权
标题翻译：化学机械抛光装置及方法
公开(公告)号：US6110012A
公开(公告)日：2000-08-29
申请号：US220417
申请日：1998-12-24
申请人： Alvaro Maury , Arun Kumar Nanda , Jose Omar Rodriguez
发明人： Alvaro Maury , Arun Kumar Nanda , Jose Omar Rodriguez
IPC分类号： H01L21/302 , B24B37/32 , B24B57/02 , H01L21/304 , B24B1/00 , B24B29/00
CPC分类号： B24B37/32 , B24B57/02
摘要： A method and apparatus for limiting or eliminating the edge effect in a chemical mechanical polishing apparatus comprising a substrate holder and a retaining ring spaced from and around the holder, a rotatable platen and a polishing pad on the platen, by essentially flattening the pad in the area in which it normally tends to deform. The invention is carried out by applying a fluid under pressure, preferably the polishing slurry, to the pad in the region of the gap between the retaining ring and the holder to substantially flatten the pad in the area around the edge of the substrate.
摘要翻译：一种用于限制或消除化学机械抛光装置中的边缘效应的方法和装置，其包括基板保持器和保持器间隔开并围绕保持器的可移动压板和抛光垫，通过使垫其通常倾向于变形的区域。本发明通过将压力下的流体（优选抛光浆料）施加到保持环和保持器之间的间隙区域中的垫上，以在基板边缘周围的区域中使焊盘基本上平坦化。

4. 发明授权

US06354910B1 Apparatus and method for in-situ measurement of polishing pad thickness loss 有权
标题翻译：用于现场测量抛光垫厚度损失的装置和方法
公开(公告)号：US06354910B1
公开(公告)日：2002-03-12
申请号：US09494705
申请日：2000-01-31
申请人： Richardson O. Adebanjo , William Graham Easter , Alvaro Maury , Frank Miceli , Jose Omar Rodriguez
发明人： Richardson O. Adebanjo , William Graham Easter , Alvaro Maury , Frank Miceli , Jose Omar Rodriguez
IPC分类号： B24B4900
CPC分类号： B24B37/11 , B24B49/02 , B24B53/017
摘要： A non-destructive method for measuring the thickness loss of a polishing pad due to pad conditioning includes the use of rigid planar members placed on the surfaces of both the conditioned and non-conditioned sections of the polishing pad. Measurements are made using measurement instruments which overhang the depressed conditioned section and measure the height difference between the upper surfaces of the planar members. The measurement instruments may be repositioned and measurements repeated to obtain an average thickness loss.
摘要翻译：用于测量由于衬垫调节引起的抛光垫的厚度损失的非破坏性方法包括使用放置在抛光垫的调理部分和非调节部分的表面上的刚性平面部件。使用测量仪器进行测量，该测量仪器伸出凹陷的调节部分并测量平面部件的上表面之间的高度差。可以重新定位测量仪器并重复测量以获得平均厚度损失。

5. 发明授权

US08872311B2 Semiconductor device and a method of manufacture therefor 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US08872311B2
公开(公告)日：2014-10-28
申请号：US10778453
申请日：2004-02-13
申请人： Nace Rossi , Alvaro Maury
发明人： Nace Rossi , Alvaro Maury
IPC分类号： H01L23/58 , H01L21/768 , H01L21/8238 , H01L29/66
CPC分类号： H01L21/76831 , H01L21/76832 , H01L21/76895 , H01L21/76897 , H01L21/823871 , H01L29/6659
摘要： The present invention provides a semiconductor device, a method of manufacture therefor, and an integrated circuit including the semiconductor device. The semiconductor device, in one particularly advantageous embodiment, includes a multi layer etch stop located over a substrate, wherein the multi layer etch stop has a first insulative layer and a second silicon-rich nitride layer located over the first insulative layer. Located over the multi layer etch stop is a dielectric layer having an opening formed therein that extends through at least a portion of the multi layer etch stop. A conductive plug is typically located within the opening, wherein an insulative spacer is located between the conductive plug and the second silicon-rich nitride layer.
摘要翻译：本发明提供一种半导体器件及其制造方法以及包括半导体器件的集成电路。在一个特别有利的实施例中，半导体器件包括位于衬底上的多层蚀刻停止件，其中多层蚀刻停止件具有位于第一绝缘层上方的第一绝缘层和第二富硅氮化物层。位于多层蚀刻停止点上方的是具有形成在其中的开口的电介质层，其延伸穿过多层蚀刻停止件的至少一部分。导电插塞通常位于开口内，其中绝缘垫片位于导电插塞和第二富硅氮化物层之间。

6. 发明授权

US07163438B2 Zone polishing using variable slurry solid content 有权
标题翻译：使用可变浆料固体含量进行区域抛光
公开(公告)号：US07163438B2
公开(公告)日：2007-01-16
申请号：US11208829
申请日：2005-08-22
申请人： Alvaro Maury , Jovin Lim , Nace Layadi , Sebastian Ouek
发明人： Alvaro Maury , Jovin Lim , Nace Layadi , Sebastian Ouek
IPC分类号： B24B49/00 , B24B7/00 , B24B1/00
CPC分类号： B24B37/04 , B24B57/02
摘要： A slurry dispensing apparatus for use with a chemical mechanical polishing tool for planarizing semiconductor substrates having irregular topology. The apparatus includes a slurry dispensing manifold with a first end suspended over a polishing pad, and a second end for mounting to the chemical mechanical polishing tool. The slurry dispensing manifold has a linear array of nozzles positioned under the suspended manifold. Each nozzle provides an adjusted slurry mixture that is supplied from bifurcated supply lines. A first branch supplying a slurry, and a second branch supplying deionized water. Each nozzle is capable of providing a particular slurry concentration to either decrease or to increase polishing rate in specific zonal areas on a substrate according to its surface topology.
摘要翻译：一种用于与化学机械抛光工具一起用于平坦化具有不规则拓扑的半导体衬底的浆料分配装置。该设备包括具有悬挂在抛光垫上的第一端的浆料分配歧管和用于安装到化学机械抛光工具的第二端。浆料分配歧管具有位于悬浮歧管下方的线性阵列的喷嘴。每个喷嘴提供从分叉供应管线供应的经调节的浆料混合物。供应浆料的第一分支和供应去离子水的第二分支。根据其表面拓扑结构，每个喷嘴能够提供特定的浆料浓度以降低或提高基材上特定区带区域的抛光速率。

7. 发明授权

US06910907B2 Contact for use in an integrated circuit and a method of manufacture therefor 失效
标题翻译：用于集成电路的接触及其制造方法
公开(公告)号：US06910907B2
公开(公告)日：2005-06-28
申请号：US10716299
申请日：2003-11-18
申请人： Nace Layadi , Alvaro Maury
发明人： Nace Layadi , Alvaro Maury
IPC分类号： H01L21/768 , H01R13/28 , H01R25/00
CPC分类号： H01L21/76877
摘要： The present invention provides a contact for use in an integrated circuit, a method of manufacture therefor, and an integrated circuit including the aforementioned contact. The contact, in accordance with the principles of the present invention, may include a via located in a substrate, and a contact plug located in the via, wherein the contact plug has a first portion having a notch removed therefrom and a second portion filling the notch.
摘要翻译：本发明提供了一种用于集成电路的接点及其制造方法，以及包括上述接触的集成电路。根据本发明的原理的触点可以包括位于基板中的通孔和位于通孔中的接触塞，其中接触插塞具有从其中移除的凹口的第一部分和填充该通孔的第二部分缺口。

8. 发明授权

US06372605B1 Additional etching to decrease polishing time for shallow-trench isolation in semiconductor processing 有权
标题翻译：附加蚀刻以减少半导体处理中浅沟槽隔离的抛光时间
公开(公告)号：US06372605B1
公开(公告)日：2002-04-16
申请号：US09603340
申请日：2000-06-26
申请人： Stephen C. Kuehne , Alvaro Maury , Scott F. Shive
发明人： Stephen C. Kuehne , Alvaro Maury , Scott F. Shive
IPC分类号： H01L2176
CPC分类号： H01L21/76229
摘要： During formation of shallow-trench isolation (STI) structures during semiconductor processing, an additional oxide-reduction etching step is performed prior to chemical-mechanical processing. In one implementation wet-etching and/or sputter etch-back (SEB) is performed prior to applying a reverse-tone mask. In another implementation a wet etching step is performed after the reverse-tone mask is stripped. One significant result of each of these steps is a reduction in the height and width of at least some of the oxide horns that remain after the reverse-tone mask is stripped. As such, the oxide structures that need to be planarized during CMP will be smaller than those of the prior art. Moreover, since the resulting oxide structures that need to be planarized by CMP processing are smaller, the oxide layer can be initially applied at a smaller thickness than that of the prior art. As such, the duration of CMP processing can be correspondingly shorter, resulting in polished semiconductor wafer surfaces with greater uniformity than that provided by the prior art.
摘要翻译：在半导体处理期间形成浅沟槽隔离（STI）结构期间，在化学机械处理之前执行附加的氧化物还原蚀刻步骤。在一个实施方式中，在应用反向色调掩模之前执行湿蚀刻和/或溅射蚀回（SEB）。在另一实施方案中，在剥离反色调掩模之后执行湿蚀刻步骤。这些步骤中的每一个的一个显着结果是减少在消除反色调掩模之后残留的至少一些氧化物喇叭的高度和宽度。因此，在CMP期间需要平坦化的氧化物结构将小于现有技术的氧化物结构。此外，由于需要通过CMP处理进行平坦化的所得到的氧化物结构较小，所以可以以比现有技术更薄的厚度开始施加氧化物层。因此，CMP处理的持续时间可以相应地更短，导致抛光的半导体晶片表面具有比现有技术提供的更大的均匀性。

9. 发明授权

US6110831A Method of mechanical polishing 失效
标题翻译：机械抛光方法
公开(公告)号：US6110831A
公开(公告)日：2000-08-29
申请号：US923316
申请日：1997-09-04
申请人： James Thomas Cargo , Ronald James Alexander Holmes , Ruichen Liu , Alvaro Maury
发明人： James Thomas Cargo , Ronald James Alexander Holmes , Ruichen Liu , Alvaro Maury
IPC分类号： H01L21/3205 , H01L21/304 , H01L21/3105 , H01L21/66 , H01L23/544 , H01L21/465
CPC分类号： B24B37/013 , H01L21/31053 , H01L22/26 , H01L22/34 , H01L2924/0002
摘要： A method of manufacturing integrated circuits utilizing chemical mechanical polishing (CMP) is disclosed. A dielectric layer, illustratively, having a dopant, dye, etc. termed a "marker layer" is formed upon a wafer having partially fabricated integrated circuits thereon. An undoped, undyed layer is deposited upon the marker layer. The undoped or undyed layer is polished and the waste slurry is monitored until a signal indicating the exposure of the signal layer is obtained. Analysis of the signal provides an indication of when the CMP process should be terminated.
摘要翻译：公开了利用化学机械抛光（CMP）制造集成电路的方法。示例性地，具有称为“标记层”的掺杂剂，染料等的介电层形成在其上具有部分制造的集成电路的晶片上。未标记的未染色层沉积在标记层上。对未掺杂或未染色的层进行抛光，并监测废料浆料，直到获得指示信号层曝光的信号。信号分析提供了CMP过程何时终止的指示。

10. 发明授权

US06033293A Apparatus for performing chemical-mechanical polishing 失效
标题翻译：用于进行化学机械抛光的装置
公开(公告)号：US06033293A
公开(公告)日：2000-03-07
申请号：US947178
申请日：1997-10-08
申请人： Annette Margaret Crevasse , Alvaro Maury , Sanjay Patel , John Thomas Sowell
发明人： Annette Margaret Crevasse , Alvaro Maury , Sanjay Patel , John Thomas Sowell
IPC分类号： B24B37/11 , B24B45/00 , B24D9/10
CPC分类号： B24B37/11 , B24B45/00
摘要： An apparatus and method for performing chemical-mechanical polishing is disclosed in which the pad is secured to the platen without the use of adhesives. A polishing pad and a platen are secured together by a releasable attractive force; the force may comprise a vacuum or electromagnetic force, and the pad has a hard or magnetic backside layer for facing the plating and responding to the attractive force. This invention has particular application to chemical-mechanical polishing for use in planarizing dielectrics.
摘要翻译：公开了一种用于进行化学机械抛光的装置和方法，其中垫不用粘合剂固定在压板上。抛光垫和压板通过可释放的吸引力固定在一起; 力可以包括真空或电磁力，并且垫具有用于面对镀层并响应于吸引力的硬或磁性背面层。本发明特别适用于平面化电介质中使用的化学机械抛光。

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