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1. 发明授权

US4801997A High packing density lead frame and integrated circuit 失效
标题翻译：高封装密度引线框架和集成电路
公开(公告)号：US4801997A
公开(公告)日：1989-01-31
申请号：US185301
申请日：1988-04-19
申请人： Michio Ono , Akihiro Kubota , Tsuyoshi Aoki , Osamu Inoue , Rikio Sugiura
发明人： Michio Ono , Akihiro Kubota , Tsuyoshi Aoki , Osamu Inoue , Rikio Sugiura
IPC分类号： H01L23/50 , H01L23/495 , H01L23/48 , H01L29/44 , H01L29/52 , H01L29/60
CPC分类号： H01L23/49541 , H01L2224/48091 , H01L2224/48247
摘要： Lead frame for mounting a semiconductor chip and improving the packing density of devices such as a plastic chip carrier type IC is disclosed. A portion of inner leads, located parallel to the chip stage and the edge of a molded case is made as thin as possible and held by inner lead supporting bars to tie bars until the molding process is finished. After molding process is finished, these bars supporting the leads and stage are cut away. Packing density is improved an amount ranging from 20% to 30%.
摘要翻译：公开了用于安装半导体芯片的引线框架和提高诸如塑料芯片载体型IC的器件的封装密度。将内引线的一部分平行于芯片台和模制外壳的边缘制成尽可能薄，并由内引线支撑杆固定到连杆上，直到模制过程完成。成型工艺完成后，将这些支撑导线和平台的条子切掉。包装密度提高了20％〜30％。

2. 发明授权

US4698660A Resin-molded semiconductor device 失效
标题翻译：树脂模制半导体器件
公开(公告)号：US4698660A
公开(公告)日：1987-10-06
申请号：US833535
申请日：1986-02-12
申请人： Akihiro Kubota , Tsuyoshi Aoki , Michio Ono , Rikio Sugiura
发明人： Akihiro Kubota , Tsuyoshi Aoki , Michio Ono , Rikio Sugiura
IPC分类号： H01L23/50 , H01L23/28 , H01L23/31 , H01L23/495 , H05K3/34 , H01L23/00
CPC分类号： H05K3/3426 , H01L23/3107 , H01L23/49555 , H01L2224/48091 , H01L2224/48247 , H01L24/48 , H01L2924/00014 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , Y02P70/613
摘要： A resin-molded semiconductor package device includes a plurality of grooves which are spaced a predetermined distance from each other in the edge portions defined by the main surface and the side surfaces of the main body of a resin-molded package, which grooves correspond to a plurality of external leads. The external leads are folded, the tips of the external leads are positioned in the grooves, and the middle portions of the external leads are located above the main surface of the package so that a predetermined standoff distance is maintained between the middle portions of the external leads and the package.
摘要翻译：树脂封装半导体封装器件包括多个槽，它们在由树脂模制封装的主体的主表面和侧表面限定的边缘部分中彼此隔开预定距离，该沟槽对应于多个外部引线。外部引线被折叠，外部引线的尖端位于槽中，并且外部引线的中间部分位于封装的主表面上方，使得在外部引线的中间部分之间保持预定的间隔距离线索和包装。

3. 发明授权

US4984059A Semiconductor device and a method for fabricating the same 失效
标题翻译：半导体装置及其制造方法
公开(公告)号：US4984059A
公开(公告)日：1991-01-08
申请号：US539781
申请日：1983-10-07
申请人： Akihiro Kubota , Rikio Sugiura , Tsuyoshi Aoki , Michio Ono
发明人： Akihiro Kubota , Rikio Sugiura , Tsuyoshi Aoki , Michio Ono
IPC分类号： H01L23/48 , H01L21/56 , H01L21/60 , H01L23/31 , H01L23/495 , H01L23/50
CPC分类号： H01L23/49537 , H01L21/565 , H01L23/3107 , H01L23/3135 , H01L23/3157 , H01L23/495 , H01L23/49503 , H01L23/49589 , H01L2224/45014 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/49171 , H01L2224/49175 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , Y10S257/916
摘要： In a plastic molded semiconductor device in which inner leads overlap a semiconductor chip in a molded plastic body, the width of the chip may be close to the width of the plastic body without a decrease in the high resistance of the inner leads to the pull out thereof from the plastic body, and the layout of the inner leads may be unrestricted since the inner leads may occupy the region above the chip.
摘要翻译：在内部引线与模制塑料体中的半导体芯片重叠的塑料模制半导体器件中，芯片的宽度可以接近塑料体的宽度，而不会使内部引线的高电阻降低到拉出并且内引线的布局可以是不受限制的，因为内引线可能占据芯片上方的区域。

4. 再颁专利

USRE35109E Semiconductor device and method for fabricating the same 失效
标题翻译：半导体装置及其制造方法
公开(公告)号：USRE35109E
公开(公告)日：1995-12-05
申请号：US1613
申请日：1993-01-07
申请人： Akihiro Kubota , Rikio Sugiura , Tsuyoshi Aoki , Michio Ono
发明人： Akihiro Kubota , Rikio Sugiura , Tsuyoshi Aoki , Michio Ono
IPC分类号： H01L23/48 , H01L21/56 , H01L21/60 , H01L23/31 , H01L23/495 , H01L23/50 , H01L29/46 , H01L29/62 , H01L29/64
CPC分类号： H01L23/49537 , H01L21/565 , H01L23/3107 , H01L23/3135 , H01L23/3157 , H01L23/495 , H01L23/49503 , H01L23/49589 , H01L2224/45014 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/49171 , H01L2224/49175 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , Y10S257/916
摘要： In a plastic molded semiconductor device in which inner leads overlap a semiconductor chip in a molded plastic body, the width of the chip may be close to the width of the plastic body without a decrease in the high resistance of the inner leads to the pull out thereof from the plastic body, and the layout of the inner leads may be unrestricted since the inner leads may occupy the region above the chip.
摘要翻译：在内部引线与模制塑料体中的半导体芯片重叠的塑料模制半导体器件中，芯片的宽度可以接近塑料体的宽度，而不会使内部引线的高电阻降低到拉出并且内引线的布局可以是不受限制的，因为内引线可能占据芯片上方的区域。

5. 发明授权

US4724280A Package for integrated circuit 失效
标题翻译：集成电路封装
公开(公告)号：US4724280A
公开(公告)日：1988-02-09
申请号：US894149
申请日：1986-08-07
申请人： Kazuto Tsuji , Tsuyoshi Aoki , Michio Ono , Rikio Sugiura
发明人： Kazuto Tsuji , Tsuyoshi Aoki , Michio Ono , Rikio Sugiura
IPC分类号： H01L23/50 , H01L23/28 , H01L23/31 , H01L23/48 , H01L23/495 , H05K3/34
CPC分类号： H01L23/3107 , H01L23/49555 , H01L2224/48091 , H01L2224/48247 , H01L24/48 , H01L2924/00014 , H01L2924/01067 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H05K3/3421
摘要： PLCC (Plastic Leaded Chip Carrier) for a LSI having protuberances on the bottom along its lateral side, is provided with interconnectors between leg portions of adjacent protuberances. Each interconnector is a swelling from the bottom surface of the main body of PLCC to fill the gap, i.e. a channel, between the protuberances. The height of the filling, namely the height of the interconnector, is lower than that of prior art protuberance to leave some space. This space, a channel, serves as a duct for solvent to flow therein smoothly to and from the narrow gap between the soldered lead and the top of the protuberance and is located adjoining this narrow gap. Therefore, the undesirably remaining flux in this narrow gap is perfectly removed by this smooth flow of the solvent. The leg portion of the protuberance is strengthened by the interconnector so that the occurrence of a crack of the protuberance when the moled PLCC is ejected from the molding cavities is considerably reduced. The structure, using the interconnector, can also avoid using a slanted protuberance having a sharp top which is likely to hurt the fingers of a PLCC handler, or which has too narrow a bottom as a channel for solvent to smoothly flow.
摘要翻译：用于具有沿着其侧面的底部突起的LSI的PLCC（塑料引线芯片载体）在相邻突起的腿部之间设置有互连器。每个互连器是从PLCC的主体的底表面膨胀以填充突起之间的间隙，即通道。填充物的高度，即互连器的高度，低于现有技术的突起以留下一些空间。这个空间，一个通道，用作溶剂的流通道，平滑地流到和焊接引线与凸起顶部之间的窄间隙，并且位于邻近该窄间隙处。因此，通过溶剂的这种平滑流动，可以完全去除在该狭窄间隙中不期望的剩余通量。突起的腿部通过互连器被加强，使得当从模制腔中排出弯曲的PLCC时突起的裂纹的发生显着减少。使用互连器的结构也可以避免使用具有尖锐顶部的倾斜突起，该倾斜突起可能伤害PLCC处理器的指状物，或者具有太窄的底部作为溶剂平滑流动的通道。

6. 发明授权

US4903114A Resin-molded semiconductor 失效
标题翻译：树脂成型半导体
公开(公告)号：US4903114A
公开(公告)日：1990-02-20
申请号：US207929
申请日：1988-06-15
申请人： Tsuyoshi Aoki , Michio Ono , Kazuhiro Maeda , Hiroyuki Kitasako
发明人： Tsuyoshi Aoki , Michio Ono , Kazuhiro Maeda , Hiroyuki Kitasako
IPC分类号： H01L23/28 , H01L23/02 , H01L23/495 , H01L23/538 , H01L25/065
CPC分类号： H01L23/49517 , H01L23/49531 , H01L23/5383 , H01L24/49 , H01L25/0655 , H01L2224/05554 , H01L2224/48091 , H01L2224/48247 , H01L2224/48472 , H01L2224/4911 , H01L2224/73265 , H01L24/48 , H01L2924/00014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/181 , H01L2924/19107
摘要： A resin-molded semiconductor device applying an insulation plate unit mounted on a metal die-stage of a metal lead-frame. On the insulating plate unit, an integrated circuit semiconductor chips or a plurality of integrated circuit semiconductor chips are mounted and a plurality of relay-pads for relaying wire bonding connection between the semiconductor chip or chips and inner leads of the lead-frame are formed and arranged so as to correspond to the inner-leads, for electrically insulating the semiconductor chip or chips and the relay-pads from the metal die-stage.
摘要翻译：一种树脂模制半导体器件，其应用安装在金属引线框架的金属裸片台上的绝缘板单元。在绝缘板单元上安装集成电路半导体芯片或多个集成电路半导体芯片，并且形成用于中继半导体芯片或芯片之间的引线接合连接的多个继电器焊盘和引线框架的内部引线，被布置成对应于内部引线，用于将半导体芯片或芯片以及继电器垫与金属模具级电绝缘。

7. 发明授权

US06811728B2 Multi-layered holographic read-only memory and data retrieval method 失效
标题翻译：多层全息只读存储器和数据检索方法
公开(公告)号：US06811728B2
公开(公告)日：2004-11-02
申请号：US10374906
申请日：2003-02-24
申请人： Shougo Yagi , Tadayuki Imai , Michio Ono , Hiroki Yamazaki , Haruki Kozawaguchi
发明人： Shougo Yagi , Tadayuki Imai , Michio Ono , Hiroki Yamazaki , Haruki Kozawaguchi
IPC分类号： B29D1100
CPC分类号： G11B7/0065 , G03H2001/2226 , G03H2001/2615 , G11B7/24
摘要： An inexpensive multi-layered holographic read-only memory having a large capacity is provided. In the memory in which single-mode slab waveguides are multi-layered, a periodic scattering center whose period approximately agrees with the period of the guided mode is provided in at least one of a core layer and a clad layer in each waveguide so that a guided wave in the waveguide is diffracted by the periodic scattering center to the outside of the waveguide and a holographic image is generated.
摘要翻译：提供了一种具有大容量的便宜的多层全息只读存储器。在单模平板波导为多层的存储器中，在每个波导管中的芯层和覆层中的至少一个中提供周期大约与引导周期大致相同的周期性散射中心，使得波导中的导波被周期性散射中心衍射到波导的外部，并且产生全息图像。

8. 发明授权

US6121182A Polyolefin production catalyst and method of preparing polyolefins 失效
标题翻译：聚烯烃生产催化剂及其制备方法
公开(公告)号：US6121182A
公开(公告)日：2000-09-19
申请号：US981545
申请日：1997-12-11
申请人： Yoshikuni Okumura , Tsutomu Sakuragi , Michio Ono , Shintaro Inazawa
发明人： Yoshikuni Okumura , Tsutomu Sakuragi , Michio Ono , Shintaro Inazawa
IPC分类号： C08F4/64 , C08F4/642 , C08F4/659 , C08F4/6592 , C08F10/00 , C08F110/06 , B01J31/16
CPC分类号： C08F10/00 , C08F110/06 , C08F4/65908 , C08F4/65912 , C08F4/65927 , Y10S526/943
摘要： A catalyst component for polyolefin production catalysts comprising a metallocene compound represented by general formula (1) (symbols have the meanings as described in the specification), polyolefin production catalyst containing the component, and method for producing polyolefin with the catalyst are provided. Use of a catalyst containing the novel metallocene compound as a catalyst component of the invention in polymerization of .alpha.-olefin, particularly propylene, enables one to prepare high rigid, high melting point isotactic polypropylene useful as an industrial material for automobiles and the like, more specifically isotactic polypropylene having highly controlled stereoregulartity and regioregularity, particularly the one having a high regioregularity that has been difficult to achieve with conventional metallocene catalysts. ##STR1##
摘要翻译： PCT No.PCT / JP97 / 01387 Sec。 371 1997年12月11日第 102（e）日期1997年12月11日PCT 1997年4月22日提交PCT公布。公开号WO97 / 40075 PCT 日期：1997年10月30日一种用于聚烯烃生产催化剂的催化剂组分，其包含由通式（1）表示的茂金属化合物（符号具有说明书中所述的含义），含有该组分的聚烯烃生产催化剂，以及使用催化剂制备聚烯烃的方法被提供。使用含有新型茂金属化合物的催化剂作为本发明的催化剂组分在α-烯烃，特别是丙烯的聚合中，使得能够制备用作汽车等的工业材料的高刚性，高熔点全同立构聚丙烯，更多特别是具有高度控制的立体结构和区域均匀性的全同立构聚丙烯，特别是具有高常规金属茂催化剂难以达到的高定向度的聚丙烯。

9. 发明授权

US5736299A Silver halide color photographic material comprising a magenta or cyan coupler and a hydrazine compound 失效
标题翻译：卤化银彩色照相材料，包括品红色或青色成色剂和肼化合物
公开(公告)号：US5736299A
公开(公告)日：1998-04-07
申请号：US590323
申请日：1996-01-23
申请人： Toshiyuki Watanabe , Hiroshi Fukuzawa , Michio Ono , Takashi Nakamura
发明人： Toshiyuki Watanabe , Hiroshi Fukuzawa , Michio Ono , Takashi Nakamura
IPC分类号： G03C7/30 , G03C7/392 , G03C7/32
CPC分类号： G03C7/39288 , G03C7/3003 , G03C7/301
摘要： A silver halide color photographic material is disclosed, wherein it comprises a support having thereon one or more constituent layers including at least one silver halide emulsion layer, wherein at least one hydrophilic colloid layer of said constituent layers contains a coupler represented by the following formula (M) or formula (I) and at least one hydrophilic colloid layer of said constituent layers contains a compound represented by the following formula (H): ##STR1##
摘要翻译：公开了一种卤化银彩色照相材料，其中它包括其上具有一个或多个包含至少一个卤化银乳剂层的构成层的载体，其中所述构成层的至少一个亲水胶体层包含由下式表示的成色剂 M）或式（I），并且所述构成层的至少一个亲水胶体层含有下式（H）表示的化合物：（I）

10. 发明授权

US4904575A Silver halide color photographic material with heterocylic fused phenol coupler 失效
标题翻译：卤化银彩色照相材料与杂环稠合酚醛偶合剂
公开(公告)号：US4904575A
公开(公告)日：1990-02-27
申请号：US216573
申请日：1988-07-08
申请人： Michio Ono , Minoru Sakai , Kozo Aoki
发明人： Michio Ono , Minoru Sakai , Kozo Aoki
IPC分类号： C07D209/34 , C07D263/56 , C07D263/57 , C07D498/04 , G03C7/34
CPC分类号： C07D263/56 , C07D209/34 , C07D263/57 , G03C7/342
摘要： A silver halide color photographic material comprising a support having coated thereon at least one silver halide emulsion layer, the silver halide color photographic material containing a photographic cyan dye forming coupler represented by the following general formula (I): ##STR1## wherein R.sub.1 represents an aliphatic group, an aromatic group, heterocyclic group or a substituted amino group; R.sub.2 and R.sub.3, which may be the same or different, each represents an aliphatic group, an aromatic group or a heterocyclic group, or R.sub.2 and R.sub.3 may combine with each other to form a ring; and X represents a group capable of beiing released upon an oxidative coupling with a developing agent (including a hydrogen atom).The photographic cyan dye forming coupler has a high color forming rate and provides a high maximum color density even when a color developing solution which does not contain benzyl alcohol is used, and exhibits substantially no reduction in color density in the case of processing in a bleaching solution having a weak oxidation power or an exhausted bleaching solution.The silver halide color photographic material containing the photographic cyan dye forming coupler can provide color images having excellent fastness and color reproducibility and less stain in white background area.
摘要翻译：一种卤化银彩色照相材料，其包含在其上涂覆有至少一个卤化银乳剂层的载体，所述卤化银彩色照相材料含有由以下通式（I）表示的照相青色染料形成成色剂：其中 R1表示脂族基，芳基，杂环基或取代氨基; R 2和R 3可以相同或不同，各自表示脂族基团，芳族基团或杂环基团，或者R 2和R 3可以彼此结合形成环; X表示与显影剂（包括氢原子）氧化偶合时能够释放的基团。感光青色染料成色剂具有高的成色速率，并且即使使用不含苄醇的显色溶液也能提供高的最大色密度，并且在漂白处理的情况下基本上不会降低色浓度溶液具有弱氧化能力或耗尽的漂白溶液。含有照相青色染料形成成色剂的卤化银彩色照相材料可以提供在白色背景区域中具有优异的牢度和颜色再现性以及较少污渍的彩色图像。

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