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1. 发明申请

US20070155060A1 Method for manufacturing high-frequency module device 失效
公开(公告)号：US20070155060A1
公开(公告)日：2007-07-05
申请号：US11710785
申请日：2007-02-26
申请人： Tsuyoshi Ogawa , Takahiko Kosemura , Akira Muto , Akihiko Okubora
发明人： Tsuyoshi Ogawa , Takahiko Kosemura , Akira Muto , Akihiko Okubora
IPC分类号： H01L21/58
CPC分类号： H01L23/5389 , H01L23/49833 , H01L23/642 , H01L23/645 , H01L24/48 , H01L2221/68345 , H01L2221/68363 , H01L2224/16235 , H01L2224/16237 , H01L2224/16238 , H01L2224/48091 , H01L2224/73253 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/16152 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H01L2924/30107 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： This invention is a method for manufacturing a high-frequency module device. A high-frequency circuit unit (2) in which first to third unit wiring layers (5) to (7), each having a capacitor (12) or the like at a part, are stacked and formed on flattened one surface of a dummy board (30) so that a third pattern wiring is exposed from a connection surface (2a) of an uppermost layer is mounted on a mounting surface (3a) of a base board (3) where an input/output terminal part (18) is exposed, in such a manner that the third pattern wiring and the input/output terminal part are connected with each other, and after that, the dummy board is removed. A high-frequency module device is thus manufactured.

2. 发明申请

US20050037535A1 Method for fabricating high frequency module 有权
标题翻译：制造高频模块的方法
公开(公告)号：US20050037535A1
公开(公告)日：2005-02-17
申请号：US10496878
申请日：2003-09-03
申请人： Tsuyoshi Ogawa , Takahiko Kosemura , Akira Muto , Akihiko Okubora
发明人： Tsuyoshi Ogawa , Takahiko Kosemura , Akira Muto , Akihiko Okubora
IPC分类号： H01L23/12 , H01L23/498 , H01L23/538 , H01L23/64 , H01L21/44
CPC分类号： H01L23/5389 , H01L23/49833 , H01L23/642 , H01L23/645 , H01L24/48 , H01L2221/68345 , H01L2221/68363 , H01L2224/16235 , H01L2224/16237 , H01L2224/16238 , H01L2224/48091 , H01L2224/73253 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/16152 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H01L2924/30107 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： This invention is a method for manufacturing a high-frequency module device. A high-frequency circuit unit (2) in which first to third unit wiring layers (5) to (7), each having a capacitor (12) or the like at a part, are stacked and formed on flattened one surface of a dummy board (30) so that a third pattern wiring is exposed from a connection surface (2a) of an uppermost layer is mounted on a mounting surface (3a) of a base board (3) where an input/output terminal part (18) is exposed, in such a manner that the third pattern wiring and the input/output terminal part are connected with each other, and after that, the dummy board is removed. A high-frequency module device is thus manufactured.
摘要翻译：本发明是制造高频模块装置的方法。一个高频电路单元（2），其中在一部分上分别具有电容器（12）等的第一至第三单元布线层（5）至（7）堆叠并形成在虚拟的平坦的一个表面上（30），使得从最上层的连接表面（2a）露出的第三图案布线安装在基板（3）的安装表面（3a）上，其中输入/输出端子部分（18）为以使得第三图案布线和输入/输出端子部分彼此连接的方式曝光，然后去除该虚拟板。由此制造高频模块装置。

3. 发明授权

US07741162B2 Method for manufacturing high-frequency module device 失效
标题翻译：制造高频模块装置的方法
公开(公告)号：US07741162B2
公开(公告)日：2010-06-22
申请号：US11710785
申请日：2007-02-26
申请人： Tsuyoshi Ogawa , Takahiko Kosemura , Akira Muto , Akihiko Okubora
发明人： Tsuyoshi Ogawa , Takahiko Kosemura , Akira Muto , Akihiko Okubora
IPC分类号： H01L21/00
CPC分类号： H01L23/5389 , H01L23/49833 , H01L23/642 , H01L23/645 , H01L24/48 , H01L2221/68345 , H01L2221/68363 , H01L2224/16235 , H01L2224/16237 , H01L2224/16238 , H01L2224/48091 , H01L2224/73253 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/16152 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H01L2924/30107 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： This invention is a method for manufacturing a high-frequency module device. A high-frequency circuit unit (2) in which first to third unit wiring layers (5) to (7), each having a capacitor (12) or the like at a part, are stacked and formed on flattened one surface of a dummy board (30) so that a third pattern wiring is exposed from a connection surface (2a) of an uppermost layer is mounted on a mounting surface (3a) of a base board (3) where an input/output terminal part (18) is exposed, in such a manner that the third pattern wiring and the input/output terminal part are connected with each other, and after that, the dummy board is removed. A high-frequency module device is thus manufactured.
摘要翻译：本发明是制造高频模块装置的方法。一个高频电路单元（2），其中在一部分上分别具有电容器（12）等的第一至第三单元布线层（5）至（7）堆叠并形成在虚拟的平坦的一个表面上（30），使得从最上层的连接表面（2a）露出的第三图案布线安装在基板（3）的安装表面（3a）上，其中输入/输出端子部分（18）为以使得第三图案布线和输入/输出端子部分彼此连接的方式曝光，然后去除该虚拟板。由此制造高频模块装置。

4. 发明授权

US07183135B2 Method for manufacturing high-frequency module device 有权
标题翻译：制造高频模块装置的方法
公开(公告)号：US07183135B2
公开(公告)日：2007-02-27
申请号：US10496878
申请日：2003-09-03
申请人： Tsuyoshi Ogawa , Takahiko Kosemura , Akira Muto , Akihiko Okubora
发明人： Tsuyoshi Ogawa , Takahiko Kosemura , Akira Muto , Akihiko Okubora
IPC分类号： H01L21/50
CPC分类号： H01L23/5389 , H01L23/49833 , H01L23/642 , H01L23/645 , H01L24/48 , H01L2221/68345 , H01L2221/68363 , H01L2224/16235 , H01L2224/16237 , H01L2224/16238 , H01L2224/48091 , H01L2224/73253 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/16152 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H01L2924/30107 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： This invention is a method for manufacturing a high-frequency module device. A high-frequency circuit unit (2) in which first to third unit wiring layers (5) to (7), each having a capacitor (12) or the like at a part, are stacked and formed on flattened one surface of a dummy board (30) so that a third pattern wiring is exposed from a connection surface (2a) of an uppermost layer is mounted on a mounting surface (3a) of a base board (3) where an input/output terminal part (18) is exposed, in such a manner that the third pattern wiring and the input/output terminal part are connected with each other, and after that, the dummy board is removed. A high-frequency module device is thus manufactured.
摘要翻译：本发明是制造高频模块装置的方法。一个高频电路单元（2），其中在一部分上分别具有电容器（12）等的第一至第三单元布线层（5）至（7）堆叠并形成在虚拟的平坦的一个表面上（30），使得从最上层的连接表面（2a）露出的第三图案布线安装在基板（3）的安装表面（3a）上，其中输入/输出端子部分（18））以使得第三图案布线和输入/输出端子部彼此连接的方式露出，然后去除该虚设基板。由此制造高频模块装置。

5. 发明授权

US06889155B2 High frequency module board device 失效
公开(公告)号：US06889155B2
公开(公告)日：2005-05-03
申请号：US10416683
申请日：2002-10-03
申请人： Tatsuya Ogino , Akihiko Okubora , Takayuki Hirabayashi , Takahiko Kosemura , Kuniyuki Hayashi
发明人： Tatsuya Ogino , Akihiko Okubora , Takayuki Hirabayashi , Takahiko Kosemura , Kuniyuki Hayashi
IPC分类号： H05K3/46 , H01F17/00 , H01L23/12 , H01L23/498 , H01L23/66 , H01P1/00 , H01P3/08 , H05K1/00 , H05K1/02 , H05K1/16 , H01L27/04
CPC分类号： H05K1/162 , H01F17/0006 , H01L23/49805 , H01L23/49822 , H01L23/66 , H01L24/48 , H01L2224/05599 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2224/45099 , H01L2224/48091 , H01L2224/85399 , H01L2924/00014 , H01L2924/01078 , H01L2924/01087 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/19011 , H01L2924/19105 , H01L2924/19107 , H01L2924/30107 , H01L2924/3025 , H05K1/0224 , H05K1/024 , H05K1/0298 , H05K3/4688 , H05K2201/09672 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： The present invention relates to a high frequency module board device having a high frequency transmitting and receiving circuit for modulating and demodulating a high frequency signal. The high frequency module board device comprises a base board (2) whose main surface is formed as a build-up surface (2a) and a high frequency circuit part (3) formed on the build-up surface of the base board (2) and having passive elements formed. The base board (2) has an area (29) in which wiring is not formed in a lower layer from a fourth wiring layer (8b). The high frequency circuit part (3) has an upper electrode part (36) and a lower electrode part (35) in positions corresponding to the area (29) in which the wiring is not formed. Thus, since a capacitance (18) is provided just above the area (29) in which the wiring is not formed, a parasitic capacity that the capacitance (18) receives from ground patterns (14) is reduced. Accordingly, the characteristics of the capacitance (18) can be improved.

6. 发明授权

US06445475B1 Method for practically loading transmission or receiving module for optical link and its rigid flexible board 失效
标题翻译：实际装载光纤链路传输或接收模块及其刚性柔性板的方法
公开(公告)号：US06445475B1
公开(公告)日：2002-09-03
申请号：US09323620
申请日：1999-06-01
申请人： Akihiko Okubora , Takahiko Kosemura
发明人： Akihiko Okubora , Takahiko Kosemura
IPC分类号： H04B1012
CPC分类号： G02B6/4277 , G02B6/4201 , G02B6/4202 , G02B6/423 , G02B6/4246 , G02B6/4266 , G02B6/428 , G02B6/4281 , G02B6/4283 , G02B6/4292 , H05K1/189 , H05K3/4691
摘要： A method for practically loading a small-sized and compact transmission or receiving module for an optical link in which interference between a receiving circuit and a transmission circuit can be prevented, high speed and high quality communications with a high S/N ratio can be carried out, and generated heat at the IC or the like can be discharged efficiently to a surrounding atmosphere, wherein at least a pair optical fibers 2 are installed at a fiber installing part 4, each light emitting element 5 and light receiving element 6 is arranged in a direction of an optical axis each of transmission optical fiber and receiving optical fiber installed at the fiber installing part, a first board 10 connected to root portions of the lead terminals of the light emitting element and the light receiving element is integrally formed with a second board 12 and a third board 14 respectively connected to both opposing ends of the first board through a flexible board, and the second board and the third board are folded at a substantial right angle to the first board in such a way that the second board and the third board face away from each other.
摘要翻译：一种用于实际加载用于光链路的小型紧凑型发送或接收模块的方法，其中可以防止接收电路和发送电路之间的干扰，可以承载具有高S / N比的高速和高质量通信并且在IC等产生的热量可以有效地排放到周围的大气中，其中至少一对光纤2安装在光纤安装部分4处，每个发光元件5和光接收元件6被布置在安装在光纤安装部分的传输光纤和接收光纤各自的光轴的方向，与发光元件的引线端子和光接收元件的根部连接的第一板10一体地形成有第二板12和第三板14分别通过柔性板连接到第一板的两个相对端，并且第二板和第二板14 第三板以与第一板基本成直角的方式折叠成使得第二板和第三板彼此远离。

7. 发明申请

US20050195891A1 High frequency module board device 失效
标题翻译：高频模块板设备
公开(公告)号：US20050195891A1
公开(公告)日：2005-09-08
申请号：US11104039
申请日：2005-04-12
申请人： Tatsuya Ogino , Akihiko Okubora , Takayuki Hirabayashi , Takahiko Kosemura , Kuniyuki Hayashi
发明人： Tatsuya Ogino , Akihiko Okubora , Takayuki Hirabayashi , Takahiko Kosemura , Kuniyuki Hayashi
IPC分类号： H05K3/46 , H01F17/00 , H01L23/12 , H01L23/498 , H01L23/66 , H01P1/00 , H01P3/08 , H05K1/00 , H05K1/02 , H05K1/16 , H04L5/16
CPC分类号： H05K1/162 , H01F17/0006 , H01L23/49805 , H01L23/49822 , H01L23/66 , H01L24/48 , H01L2224/05599 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2224/45099 , H01L2224/48091 , H01L2224/85399 , H01L2924/00014 , H01L2924/01078 , H01L2924/01087 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/19011 , H01L2924/19105 , H01L2924/19107 , H01L2924/30107 , H01L2924/3025 , H05K1/0224 , H05K1/024 , H05K1/0298 , H05K3/4688 , H05K2201/09672 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： The present invention relates to a high frequency module board device having a high frequency transmitting and receiving circuit for modulating and demodulating a high frequency signal. The high frequency module board device comprises a base board (2) whose main surface is formed as a build-up surface (2a) and a high frequency circuit part (3) formed on the build-up surface of the base board (2) and having passive elements formed. The base board (2) has an area (29) in which wiring is not formed in a lower layer from a fourth wiring layer (8b). The high frequency circuit part (3) has an upper electrode part (36) and a lower electrode part (35) in positions corresponding to the area (29) in which the wiring is not formed. Thus, since a capacitance (18) is provided just above the area (29) in which the wiring is not formed, a parasitic capacity that the capacitance (18) receives from ground patterns (14) is reduced. Accordingly, the characteristics of the capacitance (18) can be improved.
摘要翻译：本发明涉及具有用于调制和解调高频信号的高频发射和接收电路的高频模块板装置。高频模块板装置包括：基板（2），其主表面形成为积层面（2a），高频电路部分（3）形成在基板（2）的积聚面上）并形成无源元件。基板（2）具有从第四布线层（8b）不在下层形成配线的区域（29）。高频电路部分（3）在对应于未形成布线的区域（29）的位置具有上电极部分（36）和下电极部分（35）。因此，由于在没有形成配线的区域29的正上方设置电容（18），电容（18）从接地图案（14）接收的寄生电容减少。因此，可以提高电容（18）的特性。

8. 发明授权

US07239851B2 High frequency module 失效
标题翻译：高频模块
公开(公告)号：US07239851B2
公开(公告)日：2007-07-03
申请号：US10475940
申请日：2003-03-05
申请人： Takahiko Kosemura , Akihiko Okubora
发明人： Takahiko Kosemura , Akihiko Okubora
IPC分类号： H04B1/44
CPC分类号： H01L23/66 , H01L23/49838 , H01L25/16 , H01L2223/6677 , H01L2224/16225 , H01L2924/15311 , H01L2924/19015 , H01L2924/19105 , H05K1/0219 , H05K1/0237 , H05K1/024 , H05K1/165 , H05K3/4602 , H05K3/4688 , H05K2201/0715 , H05K2201/09336 , H05K2201/10674
摘要： The present invention provides a high frequency module having a base substrate unit (2) which has its uppermost layer planarized to form a buildup-forming surface (16), a high frequency circuit unit (3) having multiple wiring layers which are formed on the base substrate unit (2), each of which layers has a wiring pattern and film elements formed on a dielectric insulating layer thereof, whose uppermost wiring layer (17) has plural lands (22) and ground patterns (20) formed thereon together with the wiring pattern and inductor elements (19), and a semiconductor chip (4) mounted on the wiring layer (17) of the high frequency circuit unit (3). Transmission lines (24) to connect the inductor elements (19) and lands (22) which are formed on the wiring layer (17) are directed within hollowed pattern regions (20c) formed at the ground pattern (20) to constitute coplanar type transmission lines.
摘要翻译：本发明提供了一种高频模块，其具有将其最上层平坦化以形成积层形成表面（16）的基底单元（2），具有多个布线层的高频电路单元（3）基底单元（2），其中每个层具有布线图案和形成在其绝缘层上的膜元件，其最上布线层（17）具有多个边缘（22）和与其形成的接地图案（20）布线图案和电感器元件（19）以及安装在高频电路单元（3）的布线层（17）上的半导体芯片（4）。连接形成在布线层（17）上的电感器元件（19）和焊盘（22）的传输线（24）被引导到形成在接地图案（20）处的中空图案区域（20c）内以构成共面型传输线。

9. 发明授权

US07064630B2 High-frequency module and its manufacturing method 失效
标题翻译：高频模块及其制造方法
公开(公告)号：US07064630B2
公开(公告)日：2006-06-20
申请号：US10312248
申请日：2002-04-25
申请人： Takayuki Hirabayashi , Takahiko Kosemura , Akihiko Okubora , Tatsuya Ogino , Kuniyuki Hayashi
发明人： Takayuki Hirabayashi , Takahiko Kosemura , Akihiko Okubora , Tatsuya Ogino , Kuniyuki Hayashi
IPC分类号： H01P1/20
CPC分类号： H05K3/4688 , H01L23/49822 , H01L23/66 , H01L25/16 , H01L2223/6677 , H01L2224/16225 , H01L2224/32245 , H01L2224/73253 , H01L2924/01078 , H01L2924/01087 , H01L2924/15313 , H01L2924/16152 , H01L2924/19105 , H01L2924/3011 , H01L2924/3025 , H05K1/024 , H05K1/165 , H05K3/4602 , H05K3/4652
摘要： The present invention provides a high-frequency module device having a distributed constant circuit formed therein, the device comprising: a base board (2) having a high-frequency element layer forming surface (3) formed by performing flattening processing on an uppermost layer of a multilayer printed wiring part in which a printed wiring layer having a ground part and a dielectric insulating layer made of a dielectric insulating material are formed in a multilayer form on one major surface of a core board (6); and a high-frequency element layer part (5) having a passive element and a circuit element for receiving power or a signal supplied from the base board (2) via a dielectric insulating part made of a dielectric insulating material, on the high-frequency element layer forming surface (3) of the base board (2). The base board (2) has a distributed constant circuit (4) formed by pattern wiring.
摘要翻译：本发明提供一种其中形成有分布常数电路的高频模块装置，该装置包括：具有高频元件层形成表面（3）的基板（2），其通过在最上层进行平坦化处理而形成在芯板（6）的一个主表面上以多层形式形成具有接地部分的印刷布线层和由介电绝缘材料制成的介电绝缘层的多层印刷布线部分; 以及高频元件层部分（5），其具有无源元件和用于接收功率的电路元件或通过由介电绝缘材料制成的介电绝缘部分从基板（2）提供的信号，在高频基板（2）的元件层形成表面（3）。基板（2）具有由图案布线形成的分布常数电路（4）。

10. 发明授权

US06800936B2 High-frequency module device 有权
标题翻译：高频模块设备
公开(公告)号：US06800936B2
公开(公告)日：2004-10-05
申请号：US10332015
申请日：2003-01-03
申请人： Takahiko Kosemura , Akihiko Okubora , Takayuki Hirabayashi , Tatsuya Ogino , Kuniyuki Hayashi
发明人： Takahiko Kosemura , Akihiko Okubora , Takayuki Hirabayashi , Tatsuya Ogino , Kuniyuki Hayashi
IPC分类号： H01L2324
CPC分类号： H01L23/66 , H01F17/0006 , H01L23/49822 , H01L2224/16 , H01L2924/01078 , H01L2924/01087 , H05K1/165 , H05K3/4602 , H05K3/4664 , H05K3/467 , H05K2201/0195 , H05K2201/09881
摘要： The present invention provides a high-frequency module configuring a micro communication functional module, which includes a base substrate (2) which has multiple pattern wiring layers (6a) (6b) (9a) (9b) and dielectric insulating layers (5) (8) (11) formed therein, and has a buildup surface for smoothing the upper layer thereof, and a high-frequency element layer (4) formed on the buildup surface, which has an inductor (20) formed therein via an insulating layer (19) formed on the buildup surface. The base substrate (2) is provided with a region (30) where the pattern wiring layers (6a) (6b) (9a) (9b) are not formed from the upper layer to at least the mid portion thereof along the thickness direction, and the inductor (20) of the high-frequency element layer (4) is formed directly above the region (30).
摘要翻译：本发明提供构成微通信功能模块的高频模块，其包括具有多个图案布线层（6a）（6b）（9a）（9b）和介电绝缘层（5）的基底（2） 8）（11），并且具有用于使其上层平坦化的积层表面和形成在积累表面上的高频元件层（4），该高频元件层（4）具有经由绝缘层形成在其中的电感器（20） 19）形成在积聚表面上。基底基板（2）具有区域（30），其中图形布线层（6a）（6b）（9a）（9b））不沿着厚度方向至少至少其中间部分形成，并且高频元件层（4）的电感器（20）直接形成在区域（30）的正上方。

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