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1. 发明授权

US06467161B2 Method for making a circuit board 失效
标题翻译：制作电路板的方法
公开(公告)号：US06467161B2
公开(公告)日：2002-10-22
申请号：US09812989
申请日：2001-03-20
申请人： Achyuta Achari , Brenda Joyce Nation , Delin Li , Lakhi N. Goenka , Richard Keith McMillan , Vivek A. Jairazbhoy
发明人： Achyuta Achari , Brenda Joyce Nation , Delin Li , Lakhi N. Goenka , Richard Keith McMillan , Vivek A. Jairazbhoy
IPC分类号： H05K320
CPC分类号： H05K3/4685 , H05K3/0047 , H05K3/06 , H05K3/062 , H05K3/064 , H05K3/4038 , H05K3/4069 , H05K3/429 , H05K3/44 , H05K3/445 , H05K3/4608 , H05K3/4611 , H05K3/4623 , H05K3/4641 , H05K2201/0305 , H05K2201/0352 , H05K2201/0355 , H05K2201/0361 , H05K2201/0379 , H05K2201/0397 , H05K2201/09309 , H05K2201/09509 , H05K2201/09554 , H05K2201/09563 , H05K2201/09609 , H05K2201/09845 , H05K2201/09881 , H05K2203/0369 , H05K2203/066 , H05K2203/0733 , H05K2203/1152 , H05K2203/1184 , H05K2203/1536 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49165
摘要： A method 10, 110 for making multi-layer electronic circuit boards 82, 148 having metallized apertures 18, 20, 118, 120 which may be selectively and electrically connected to a source of ground potential.
摘要翻译：一种用于制造具有金属化孔18,20,118,120的多层电子电路板82,148的方法10,110，其可以选择性地和电连接到地电位源。

2. 发明授权

US06673723B2 Circuit board and a method for making the same 失效
标题翻译：电路板及其制作方法
公开(公告)号：US06673723B2
公开(公告)日：2004-01-06
申请号：US09815226
申请日：2001-03-22
申请人： Bharat Z. Patel , Jay D. Baker , Lakhi N. Goenka , Michael Allen Howey , Mohan R. Paruchuri , Richard Keith McMillan
发明人： Bharat Z. Patel , Jay D. Baker , Lakhi N. Goenka , Michael Allen Howey , Mohan R. Paruchuri , Richard Keith McMillan
IPC分类号： H01L21302
CPC分类号： H05K3/44 , H05K3/06 , H05K3/062 , H05K3/064 , H05K3/4038 , H05K3/429 , H05K3/445 , H05K3/4623 , H05K3/4641 , H05K2201/0305 , H05K2201/0352 , H05K2201/0361 , H05K2201/0397 , H05K2201/09509 , H05K2201/09554 , H05K2201/09609 , H05K2201/09881 , H05K2203/0369 , H05K2203/0733 , H05K2203/1184
摘要： A method 10 for making a multi-layer circuit board 70 having at least one electrically conductive interconnection portion or “via” 72 which extends within the board 70 and at least one air-bridge 74. The method 10 includes the steps of forming protuberances 13 upon a core member 12, attaching pre-circuit assemblies 32, 34 to the core member 12, thereby forming the circuit board 70 while concomitantly and selectively extending at least one of the protuberances 13 within the formed circuit board 70.
摘要翻译：制造多层电路板70的方法10具有至少一个在板70内和至少一个空气桥74上延伸的导电互连部分或“通孔”72。方法10包括以下步骤：形成突起13 在芯构件12上，将预电路组件32,34附接到芯构件12，从而形成电路板70，同时并且选择性地延伸形成的电路板70内的至少一个突起13。

3. 发明授权

US07048423B2 Integrated light and accessory assembly 有权
公开(公告)号：US07048423B2
公开(公告)日：2006-05-23
申请号：US09966634
申请日：2001-09-28
申请人： Walter Kuzma Stepanenko , Jay DeAvis Baker , Lawrence LeRoy Kneisel , Richard Keith McMillan , Brenda Joyce Nation , Cindy Maria Rutyna , Charles Frederick Schweitzer , Peter Langer
发明人： Walter Kuzma Stepanenko , Jay DeAvis Baker , Lawrence LeRoy Kneisel , Richard Keith McMillan , Brenda Joyce Nation , Cindy Maria Rutyna , Charles Frederick Schweitzer , Peter Langer
IPC分类号： B60Q1/26
CPC分类号： H05K1/0274 , B29C45/14811 , B29C2045/14868 , B29K2705/00 , B29L2031/3055 , B29L2031/747 , F21S41/00 , F21S41/17 , F21S43/14 , F21S43/195 , G01S2013/9396 , H05K1/0284 , H05K3/202 , H05K2201/09118 , H05K2201/10106 , H05K2201/10113 , H05K2201/2054
摘要： An integrated light and accessory assembly for a vehicle is disclosed. The assembly includes at least one lamp for illumination of a vehicle, and also includes reflective, conductive and insulative portions inside a housing, and a module for controlling or accessorizing the assembly. Also disclosed is a method of manufacturing the assembly. The method includes providing materials for molding or shaping the components of the assembly, selectively etching conductive materials, molding the materials into a desired configuration, connecting a lamp and an accessory module to the conductive portions, and enclosing the components in a housing. A portion of the module may be removed for emergency lighting.

4. 发明授权

US06499214B2 Method of making a circuit board 失效
标题翻译：制作电路板的方法
公开(公告)号：US06499214B2
公开(公告)日：2002-12-31
申请号：US09812449
申请日：2001-03-20
申请人： Delin Li , Richard Keith McMillan , Zhong-You Shi
发明人： Delin Li , Richard Keith McMillan , Zhong-You Shi
IPC分类号： H05K320
CPC分类号： H05K3/429 , H05K3/0047 , H05K3/06 , H05K3/062 , H05K3/064 , H05K3/4038 , H05K3/4069 , H05K3/44 , H05K3/445 , H05K3/4608 , H05K3/4611 , H05K3/4623 , H05K3/4641 , H05K3/4685 , H05K2201/0305 , H05K2201/0352 , H05K2201/0355 , H05K2201/0361 , H05K2201/0379 , H05K2201/0397 , H05K2201/09309 , H05K2201/09509 , H05K2201/09554 , H05K2201/09563 , H05K2201/09609 , H05K2201/09845 , H05K2201/09881 , H05K2203/0369 , H05K2203/066 , H05K2203/0733 , H05K2203/1152 , H05K2203/1184 , H05K2203/1536 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165 , Y10T428/24917
摘要： A method 10, 110 for making multi-layer circuit boards having metallized apertures 38, 40, 130, 132 which may be selectively and electrically grounded and having at least one formed air-bridge 92, 178.
摘要翻译：一种用于制造具有金属化孔38,40,130,132的多层电路板的方法10,110，其可以选择性地和电接地并且具有至少一个形成的空气桥92,178。

5. 发明授权

US07102888B2 Electronically integrated vehicle structure 有权
标题翻译：电子集成车辆结构
公开(公告)号：US07102888B2
公开(公告)日：2006-09-05
申请号：US10828396
申请日：2004-04-20
申请人： Andrew Z. Glovatsky , Jay D. Baker , Richard Keith McMillan , Myron Lemecha , Daniel Roger Vander Sluis
发明人： Andrew Z. Glovatsky , Jay D. Baker , Richard Keith McMillan , Myron Lemecha , Daniel Roger Vander Sluis
IPC分类号： H05K7/20 , B62D25/14
CPC分类号： B60R16/0207
摘要： An integrated vehicle structure includes an electronic site in a plastic support structure. The electronic site has a flexible substrate with electronic components mounted thereon. The plastic support structure defines a plastic mounting surface which includes a plurality of elongated ribs projecting from the plastic support structure. Each of the ribs have a side edge forming a portion of the plastic mounting surface. The flexible substrate is mounted to the plastic mounting surface, and a plurality of air flow passageways are defined by adjacent ribs in the flexible substrate. A method support structure may also be provided which defines a metal mounting surface. One or more electronic sides may be attached to the metal and plastic mounting surfaces.
摘要翻译：集成车辆结构包括塑料支撑结构中的电子位置。该电子站点具有安装在其上的电子部件的柔性基板。塑料支撑结构限定了塑料安装表面，其包括从塑料支撑结构突出的多个细长肋。每个肋具有形成塑料安装表面的一部分的侧边缘。柔性基板安装到塑料安装表面，并且多个气流通道由柔性基板中的相邻肋限定。也可以提供限定金属安装表面的方法支撑结构。一个或多个电子侧可以附接到金属和塑料安装表面。

6. 发明授权

US06299469B1 Flexible circuit board splice clamp 失效
标题翻译：柔性电路板接头夹
公开(公告)号：US06299469B1
公开(公告)日：2001-10-09
申请号：US09553204
申请日：2000-04-20
申请人： Andrew Zachary Glovatsky , Pawel Kalinowski , Richard Keith McMillan
发明人： Andrew Zachary Glovatsky , Pawel Kalinowski , Richard Keith McMillan
IPC分类号： H01R1362
CPC分类号： F02M35/10144 , F02D9/02 , F02D41/187 , F02D41/3005 , F02D2200/0404 , F02D2400/18 , F02D2400/21 , F02M35/10019 , F02M35/10111 , F02M35/10242 , F02M35/10249 , F02M35/10321 , F02P3/02 , F05C2225/08 , G01F1/684 , H01R12/616 , H01R13/26 , H05K1/189
摘要： Disclosed herein is a method and apparatus for splicing flexible circuit boards, particularly those having one or more flexible strip extensions with conductor runs. The splice clamp of the present invention has two hinged plates that clamp over unconnected ends of two flexible circuit board segments. The splice clamp includes alignment guides for aligning the segments in the clamp so that one or more jumpers contact and provide an electrical bridge between the conductors of the segments when the plates are clamped together. The jumpers contact conductive pads of larger size than the conductor runs to ensure electrical coupling between the flexible circuit board segments. The jumpers may have pointed tips that cut through insulation. The clamp includes flexible clasps on one plate that engage with catch surfaces on the other plate to lock the flexible circuit board segments spliced together.
摘要翻译：本文公开了一种用于拼接柔性电路板的方法和装置，特别是具有一个或多个具有导体线的柔性带延伸部的电路板。本发明的接头夹具具有两个铰接板，其夹紧两个柔性电路板段的未连接端。接头夹具包括用于对准夹具中的段的对准引导件，使得当板被夹在一起时，一个或多个跳线接触并且在段的导体之间提供电桥。跳线接触比导体运行更大尺寸的导电焊盘，以确保柔性电路板段之间的电气耦合。跳线可能有尖端的切口穿过绝缘。夹具包括在一个板上的柔性扣环，其与另一个板上的卡扣表面接合，以将拼接在一起的柔性电路板段锁定。

7. 发明授权

US06501031B1 Electrical circuit board and a method for making the same 失效
标题翻译：电路板及其制造方法
公开(公告)号：US06501031B1
公开(公告)日：2002-12-31
申请号：US09655809
申请日：2000-09-06
申请人： Andrew Z. Glovatsky , Jay D. Baker , Robert Edward Belke , Myron Lemecha , Richard Keith McMillan , Thomas B. Krautheim
发明人： Andrew Z. Glovatsky , Jay D. Baker , Robert Edward Belke , Myron Lemecha , Richard Keith McMillan , Thomas B. Krautheim
IPC分类号： H05K111
CPC分类号： H05K3/445 , H05K3/386 , H05K3/4038 , H05K3/4092 , H05K2201/0305 , H05K2201/0361 , H05K2201/0394 , H05K2201/0397 , H05K2201/09554 , H05K2201/09581 , H05K2203/1438 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165 , Y10T29/49172
摘要： A multi-layer electronic circuit board design 10 having a core member 12, a pair of dielectric layers 14, 16 disposed thereon, and a first circuit portion 20 which is coupled to the dielectric layer 14 and core member 12 using a layer of adhesive material 18. Circuit board design 10 further having selectively formed “blind” apertures, vias or cavities 22 formed through the first circuit portion 20, dielectric layer 14, and adhesive layer 18, thereby exposing core member 12.
摘要翻译：具有芯构件12，设置在其上的一对电介质层14,16的多层电子电路板设计10以及使用粘合材料层连接到电介质层14和芯构件12的第一电路部分20 电路板设计10还具有选择性地形成通过第一电路部分20形成的“盲”孔，通孔或空腔22，电介质层14和粘合层18，从而露出芯构件12。

8. 发明授权

US06316736B1 Anti-bridging solder ball collection zones 失效
标题翻译：抗桥接焊球收集区
公开(公告)号：US06316736B1
公开(公告)日：2001-11-13
申请号：US09092821
申请日：1998-06-08
申请人： Vivek Amir Jairazbhoy , Richard Keith McMillan
发明人： Vivek Amir Jairazbhoy , Richard Keith McMillan
IPC分类号： H01R909
CPC分类号： H05K3/3442 , H01L2224/10175 , H01L2924/384 , H01L2924/3841 , H05K1/111 , H05K3/3452 , H05K2201/0939 , H05K2201/0989 , H05K2201/10636 , H05K2201/10689 , Y02P70/611 , Y02P70/613
摘要： There is disclosed herein a printed circuit board (PCB) having improved resistance against solder bridging and component decentering/tombstoning. The printed circuit board (PCB) includes a substrate 10 having a top surface 12; at least two mounting pads 14 disposed on the top surface in matched relation with terminations 26 of an electronic component 24; and a solder mask 16 disposed on the top surface and having at least two apertures 18 therethrough, wherein each aperture generally conforms in shape with and is arranged about a respective one of the mounting pads 14. Each aperture 18 has at least one inner aperture edge 22i generally within a projected footprint F of the electronic component and at least one outer aperture edge 22o generally outside the footprint F. Each aperture 18 includes a notch 20 in one or more of the at least one outer aperture edge 22o, wherein each notch 20 extends generally outward from its respective mounting pad 14. The notch 20 provides a reservoir in the solder mask aperture 18 about each pad 14, into which flux, other solder paste effluents, and solder balls may be channeled and remain contained.
摘要翻译：这里公开了具有改进的抗焊料桥接和元件偏心/墓碑的电阻的印刷电路板（PCB）。印刷电路板（PCB）包括具有顶面12的基板10; 至少两个安装焊盘14，其配置在与电子部件24的端子26相匹配的顶表面上; 以及设置在顶表面上并且具有穿过其中的至少两个孔18的焊接掩模16，其中每个孔基本上与形状相配合并围绕相应的一个安装焊盘14布置。每个孔18具有至少一个内孔边缘 22i通常在电子部件的投影占地面积F内和通常在封面F外部的至少一个外部孔边缘22o中。每个孔口18包括位于至少一个外部孔口边缘22o中的一个或多个中的凹口20，其中每个凹口20 凹槽20围绕每个焊盘14在焊料掩模孔18中提供储存器，焊剂，其它焊膏流出物和焊球可以被引导并保持在其中。

9. 发明申请

US20170108959A1 TWO PIECE LENS ASSEMBLY 审中-公开
公开(公告)号：US20170108959A1
公开(公告)日：2017-04-20
申请号：US14884029
申请日：2015-10-15
申请人： Richard Keith McMillan , Robert Edward Belke , Daren Lee Harris
发明人： Richard Keith McMillan , Robert Edward Belke , Daren Lee Harris
IPC分类号： G06F3/041 , G02B1/11
CPC分类号： G06F3/041 , B29D11/00817 , B29K2105/0058 , B29K2105/0097 , G02B1/04 , G02B1/11 , G02B3/12
摘要： A lens assembly for an electronic display, and a method of manufacturing said lens assembly is provided herein. The lens assembly includes a first lens layer, the first lens layer defining a surface opposing a viewer of the lens assembly; a second lens layer opposing a second surface of the first lens layer, the second surface being on an opposite side of the surface; a reservoir formed by the first lens layer and the second lens layer placed on a border, a liquid optical clear adhesive (loca) deposited into the reservoir; and a touch sensor attached to either the first lens layer and the second lens layer.

10. 发明授权

US06772733B2 Optically controlled IPCS circuitry 失效
标题翻译：光控IPCS电路
公开(公告)号：US06772733B2
公开(公告)日：2004-08-10
申请号：US10271205
申请日：2002-10-15
申请人： Zhong-You Shi , Bernard A. Meyer , Harvinder Singh , Jay DeAvis Baker , Lawrence Leroy Kneisel , Richard Keith McMillan , David James Steinert
发明人： Zhong-You Shi , Bernard A. Meyer , Harvinder Singh , Jay DeAvis Baker , Lawrence Leroy Kneisel , Richard Keith McMillan , David James Steinert
IPC分类号： F02P500
CPC分类号： F02D41/28 , F02B75/22 , F02B77/085 , F02B77/089 , F02D41/26 , F02D2400/18 , F02M51/005 , F05C2225/08 , G01F23/2925 , G01L11/02 , G01L23/16 , G02B6/12004 , G02B6/12007 , G02B6/122 , G02B6/4298 , G02B6/43 , G02B2006/12104 , G02B2006/12109 , G08C23/02 , G08C2201/31 , G08C2201/41
摘要： An integrated control system comprising an integrated circuit that controls at least one component or subsystem of an engine and a first light source that generates a first light signal when triggered through the integrated circuit. The first light signal propagates from the first light source through an LCC that may also serve as a substrate, wherein the signal that actuates the component of the engine can be the first light signal or a signal generated after the first light signal is produced. The component or subsystem of the engine may be an ignition system or a fuel injection system. The present invention is also directed to a method of controlling a component or subsystem of an engine.
摘要翻译：一种集成控制系统，包括控制发动机的至少一个部件或子系统的集成电路和当通过集成电路触发时产生第一光信号的第一光源。第一光信号从第一光源传播通过也可以用作衬底的LCC，其中致动发动机部件的信号可以是第一光信号或在产生第一光信号之后产生的信号。发动机的部件或子系统可以是点火系统或燃料喷射系统。本发明还涉及一种控制发动机的部件或子系统的方法。

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