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1. 发明专利

JP2013174599A Device and method for surface inspection 有权
标题翻译：用于表面检查的装置和方法
公开(公告)号：JP2013174599A
公开(公告)日：2013-09-05
申请号：JP2013076050
申请日：2013-04-01
申请人： Hitachi Ltd , 株式会社日立製作所 , Hitachi High-Technologies Corp , 株式会社日立ハイテクノロジーズ
发明人： ISHIMARU ICHIRO , NOGUCHI MINORU , MORIYAMA ICHIRO , TANABE YOSHIKAZU , HACHIKAKE YASUO , KENBO YUKIO , WATANABE KENJI , TSUCHIYAMA HIROSHI
IPC分类号： G01N21/956 , G01N21/88 , G03F7/20 , H01L21/027
摘要： PROBLEM TO BE SOLVED: To provide a surface inspection device and a surface inspection method, which can discriminate scratches in various shapes occurring on a surface of a processed object (for example, an insulator film on a semiconductor substrate) from foreign materials attached to the processed object, and perform inspection when the processed object is subjected to polishing or grinding processing such as CMP, in semiconductor manufacturing and magnetic head manufacturing.SOLUTION: The surface inspection method of the present invention performs epi-illumination and oblique illumination on scratches and foreign materials occurring on a surface of a polished or ground insulator film with substantially equal light flux, and detects a change in intensity of scattered light generated from shallow scratches and the foreign materials between the epi-illumination time and the oblique illumination time to thereby discriminate the shallow scratches from the foreign materials. The method further discriminates linear scratches from the foreign materials by detecting the directivity of the scattered light in the epi-illumination time. The device for the method is also provided.
摘要翻译：要解决的问题：提供一种表面检查装置和表面检查方法，该表面检查装置和表面检查方法可以鉴别出附着在外部材料上的处理物体（例如，半导体基板上的绝缘体膜）的表面上出现的各种形状的划痕在半导体制造和磁头制造中对被处理物进行抛光或研磨处理（例如CMP）进行检查。本发明的表面检查方法对划痕和外来物进行表面照明和倾斜照明在具有大致相等的光通量的抛光或接地绝缘体膜的表面上发生的材料，并且检测由外部光照时间和倾斜照射时间之间的浅划痕和异物产生的散射光的强度变化，从而区分来自异物的浅划痕。该方法通过检测外照射时间中的散射光的方向性来进一步鉴别异物的线性划痕。还提供了该方法的设备。

2. 发明专利

JP2009192541A Defect inspection device 有权
标题翻译：缺陷检查装置
公开(公告)号：JP2009192541A
公开(公告)日：2009-08-27
申请号：JP2009125763
申请日：2009-05-25
申请人： Hitachi High-Technologies Corp , Hitachi Ltd , 株式会社日立ハイテクノロジーズ , 株式会社日立製作所
发明人： ISHIMARU ICHIRO , NOGUCHI MINORU , MORIYAMA ICHIRO , TANABE YOSHIKAZU , HACHIKAKE YASUO , KENBO YUKIO , WATANABE KENJI , TSUCHIYAMA HIROSHI
IPC分类号： G01N21/956 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To provide a surface inspection apparatus for discriminably inspecting a scratch having various shapes occurring on the surface and an adhering foreign substance, when polishing or grinding such as CMP (Chemical Mechanical Polishing) is applied to a workpiece (for example, an insulation film on a semiconductor substrate), in manufacturing a semiconductor or a magnetic head. SOLUTION: In this surface inspection method and apparatus, epi-illumination and slanting illumination are applied to the scratch and the foreign substance occurring on the surface of the polished or ground insulation film with substantially the same light flux, a shallow scratch and a foreign substance are discriminated by detecting variation of the scattered light intensity generated from the shallow scratch and foreign substance between the epi-illumination time and slanting illumination time. Further, a linear scratch and a foreign substance are discriminated by detecting the directivity of the scattered light during the epi-illumination. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种表面检查装置，用于区分地检查在表面上发生的各种形状的刮痕和粘附的异物，当将CMP（化学机械抛光）的抛光或研磨施加到工件上时例如半导体衬底上的绝缘膜），制造半导体或磁头时。解决方案：在这种表面检查方法和装置中，对抛光或接地绝缘膜的表面上产生的划痕和异物施加外照射和倾斜照明，具有基本上相同的光通量，浅划痕和通过检测在外部照射时间和倾斜照明时间之间从浅划痕和异物产生的散射光强度的变化来区分异物。此外，通过在外照明期间检测散射光的方向性来区分线性划痕和异物。版权所有（C）2009，JPO＆INPIT

3. 发明专利

JP2008261893A Inspection apparatus 有权
标题翻译：检查装置
公开(公告)号：JP2008261893A
公开(公告)日：2008-10-30
申请号：JP2008205955
申请日：2008-08-08
申请人： Hitachi High-Technologies Corp , Hitachi Ltd , 株式会社日立ハイテクノロジーズ , 株式会社日立製作所
发明人： ISHIMARU ICHIRO , NOGUCHI MINORU , MORIYAMA ICHIRO , TANABE YOSHIKAZU , HACHIKAKE YASUO , KENBO YUKIO , WATANABE KENJI , TSUCHIYAMA YOJI
IPC分类号： G01N21/956
摘要： PROBLEM TO BE SOLVED: To provide a surface inspection apparatus which enables an inspection discriminating between scratches, which are generated on a surface and have various shapes, and foreign substances sticking to the surface when a polishing or grinding like CMP etc. is performed on an object to be processed (for example, an insulation film on a semiconductor substrate) in semiconductor manufacture or magnetic head manufacture, and to provide its method. SOLUTION: The inspection apparatus is characterized by the followings. Epi illumination and oblique illumination with almost the same luminous flux are applied on the scratches and foreign substances generated on the polished or grinded surface of the insulation film. Discrimination between shallow scratches and the foreign substances is performed by detecting variations in the intensities of scattered light arising from the shallow scratches and foreign substances during the epi illumination and oblique illumination, further, discrimination between linear scratches and the foreign substances is performed by detecting the directivity of the scattered light during the epi illumination. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种表面检查装置，其能够进行检查，以区分在表面上产生并具有各种形状的划痕和当像CMP等的研磨或研磨时粘附到表面的异物在半导体制造或磁头制造中对被处理物体（例如，半导体衬底上的绝缘膜）进行，并提供其方法。
解决方案：检查装置的特征如下。 Epi照明和具有几乎相同光通量的倾斜照明被施加在在绝缘膜的抛光或研磨表面上产生的划痕和异物上。通过检测在epi照明和倾斜照明期间由浅刮痕和异物产生的散射光的强度的变化来进行浅痕迹和异物之间的区别，此外，通过检测线性划痕和异物来区分线性划痕在epi照明期间散射光的方向性。版权所有（C）2009，JPO＆INPIT

4. 发明专利

JP2014211440A 表面検査装置およびその方法有权
标题翻译：用于表面检查的装置和方法
公开(公告)号：JP2014211440A
公开(公告)日：2014-11-13
申请号：JP2014113696
申请日：2014-06-02
申请人：株式会社日立製作所 , Hitachi Ltd , 株式会社日立ハイテクノロジーズ , Hitachi High-Technologies Corp
发明人： ISHIMARU ICHIRO , NOGUCHI MINORU , MORIYAMA ICHIRO , TANABE YOSHIKAZU , HACHIKAKE YASUO , KENBO YUKIO , WATANABE KENJI , TSUCHIYAMA HIROSHI
IPC分类号： G01N21/88 , G01B11/02 , G01B11/30 , G01N21/84 , G01N21/956 , H01L21/027
CPC分类号： G01B11/02 , G01B11/30 , G01N21/84 , G01N21/88 , G01N21/95 , H01L21/30
摘要：【課題】半導体製造や磁気ヘッド製造において、被加工対象物(例えば、半導体基板上の絶縁膜)に対してCMPなどの研磨または研削加工を施した際、その表面に生じる様々な形状を有するスクラッチと付着する異物とを弁別して検査することができるようにした表面検査装置およびその方法を提供することにある。【解決手段】本発明は、研磨または研削された絶縁膜の表面に発生したスクラッチや異物に対してほぼ同じ光束で落射照明と斜方照明とを行い、該落射照明時と斜方照明時との間において浅いスクラッチと異物とから発生する散乱光強度の変化を検出することによって浅いスクラッチと異物とを弁別し、さらに、前記落射照明時における散乱光の指向性を検出することによって線状スクラッチと異物とを弁別することを特徴とする表面検査方法およびその装置である。【選択図】図1
摘要翻译：要解决的问题：提供一种表面检查装置和表面检查方法，该表面检查装置和表面检查方法可以鉴别出附着在外部材料上的处理物体（例如，半导体基板上的绝缘体膜）的表面上出现的各种形状的划痕在半导体制造和磁头制造中对被处理物进行抛光或研磨处理（例如CMP）进行检查。本发明的表面检查方法对划痕和外来物进行表面照明和倾斜照明在具有大致相等的光通量的抛光或接地绝缘体膜的表面上发生的材料，并且检测由外部光照时间和倾斜照明时间之间的浅划痕和异物产生的散射光的强度变化，从而区分来自异物的浅划痕。该方法通过检测外照射时间中的散射光的方向性来进一步鉴别异物的线性划痕。还提供了该方法的设备。

5. 发明专利

JP2006201179A Surface inspection device and its method 有权
标题翻译：表面检测装置及其方法
公开(公告)号：JP2006201179A
公开(公告)日：2006-08-03
申请号：JP2006028261
申请日：2006-02-06
申请人： Hitachi High-Technologies Corp , Hitachi Ltd , 株式会社日立ハイテクノロジーズ , 株式会社日立製作所
发明人： ISHIMARU ICHIRO , NOGUCHI MINORU , MORIYAMA ICHIRO , TANABE YOSHIKAZU , HACHIKAKE YASUO , KENBO YUKIO , WATANABE KENJI , TSUCHIYAMA YOJI
IPC分类号： G01N21/956 , G01B11/30 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To provide a surface inspection device and its method where a scratch, having various shapes occurring on the surface of a processed object (for example, an insulating film on a semiconductor substrate) and an adhering foreign substance are discriminated and inspected, when the processed object is polished or ground through CMP or the like, in the manufacturing of semiconductors or of magnetic heads. SOLUTION: In the surface inspection method and its device, epi-illumination and oblique illumination are applied to the scratch and the foreign substance occurring on the surface of the polished or ground insulating film with substantially the same luminous flux, a shallow scratch and foreign substance are discriminated by detecting variation of the intensity of the scattered light generated from the shallow scratch and foreign substance between the epi-illumination and oblique illumination, and a linear scratch and foreign substance are discriminated, by detecting the directivity of the scattered light in the epi-illumination. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：解决问题：提供一种表面检查装置及其方法，其中在加工对象（例如半导体基板上的绝缘膜）的表面上出现各种形状的刮痕和附着的异物为通过CMP等对被处理物进行抛光或研磨时，在半导体或磁头的制造中进行鉴别和检查。解决方案：在表面检查方法及其装置中，外露照明和倾斜照明被施加到具有基本上相同的光通量的抛光或接地绝缘膜的表面上产生的划痕和异物，浅划痕通过检测从外部照明和倾斜照明之间的浅划痕和异物产生的散射光的强度的变化来区分外来物质，并且通过检测散射光的方向性来区分线性划痕和异物在epi照明。版权所有（C）2006，JPO＆NCIPI

6. 发明专利

JPS61105447A Light collector for inspecting surface plate defect 失效
标题翻译：用于检查表面板缺陷的集光器
公开(公告)号：JPS61105447A
公开(公告)日：1986-05-23
申请号：JP23525885
申请日：1985-10-23
申请人： Hitachi Electronics Eng Co Ltd , Hitachi Ltd
发明人： TAKAHASHI KENSAKU , HACHIKAKE YASUO , IWATANI FUKUO , ITO MAKOTO , TAKAMI KATSUMI , SUDA TADASHI
IPC分类号： G01N21/88 , G01B11/30 , G01N21/89 , G01N21/956 , H01L21/66
CPC分类号： G01N21/8901
摘要： PURPOSE:To eliminate the need to make a division scan over the entire surface plate and shorten the necessary time of inspection greatly by collecting scattered light which is generated over a wide scanning range with small sensitivity deviation. CONSTITUTION:A light source P emits light and a light beam within a range of an angle phi1 is reflected by flanks 9-1 and 9-2 to both reach a projection surface 9-4 and projected. A component exceeding an angle phi2, on the other hand, is reflected totally by the projection surface 9-4 to return to the inside, or returns when reflected by the flanks 9-1 and 9-2, so that the light is divided into a component transmitted through an incidence surface 9-3 and a component which is reflected totally and travels forward inside again. Namely, components of incident light which are within the range of the angle phi2 are collected efficiently. Even when the light source shifts to right or left from the center like a light source P' or P'', a light collector having small deviation is obtained. Further, incident light transmitted through the incidence surface 9-3 is all projected from the projection surface 9-4 through the refracting operation of the incidence surface 9-3 and the mirror surface reflecting operation of surfaces 9-5 and 9-6.
摘要翻译：目的：为了消除在整个平板上划分扫描的需要，通过收集在较小的灵敏度偏差的宽扫描范围内产生的散射光，可以大大缩短检查时间。构成：光源P发光，并且在角度phi1的范围内的光束被侧面9-1和9-2反射，以到达投影面9-4并投影。另一方面，超过角度phi2的分量被投影面9-4完全反射回到内部，或者当被侧面9-1,9-2反射时返回，使得光被分成通过入射面9-3透射的分量和被全反射并再次向前行进的分量。即，有效地收集在角度phi2的范围内的入射光的分量。即使当光源像光源P'或P“一样从中心向右或向左移动时，获得具有小偏差的集光体。此外，穿过入射表面9-3的入射光全部通过入射表面9-3的折射操作和表面9-5和9-6的镜面反射操作从突出表面9-4投影。

7. 发明专利

JPS54130153A MEASURING APPARATUS OF DEVIATIONS OF TROLLEY WIRES 失效
公开(公告)号：JPS54130153A
公开(公告)日：1979-10-09
申请号：JP3675678
申请日：1978-03-31
申请人： HITACHI LTD , TOKYO PREFECTURE , HITACHI ELECTR ENG
发明人： IRIKOU KUNIHIKO , SUZUKI TAMIO , TANIGAWA MITSUNOBU , HACHIKAKE YASUO , ABE SHINJI
IPC分类号： G01B7/00 , G01B7/02 , G01B7/04
摘要： PURPOSE:To enable the quantity of deviations of one or two lengths of trolley wires to be measured with a simple construction by using two sets of series resistance element groups of resistance voltage dividing system and providing relay groups in opposition to contact pieces. CONSTITUTION:When trolley wires 5a, 5b are respectively in contact with contact pieces 2a, 2b, relays 6a, 6b actuate and their contacts 6a-1, 6b-1, 6a-2, 6b-2 close to the operation contact r side. At this time, the potentials of the connection points 7, 8 of a series resistance element group 31 go toward output terminal 12 through their respective operation points r but the voltage at the connection point 7 is cut by the contact constitution of the contact 6b-1 and only the potential of the connection point 8 appears in the terminal 12 and this becomes the deviation signal b of the trolley wire 5b. Similarly the potential of the connection point 9 appears at output terminal 11 and this becomes the deviation signal a of the trolley wire 5a. For one length of trolley wire, the same deviation quantity is recorded in each channel.

8. 发明专利

JPS60214238A Fine particle detector 失效
标题翻译：精细粒子检测器
公开(公告)号：JPS60214238A
公开(公告)日：1985-10-26
申请号：JP7088584
申请日：1984-04-11
申请人： Hitachi Electronics Eng Co Ltd , Hitachi Ltd
发明人： SAITOU SUSUMU , SUZUKI MICHIO , SUDA TADASHI , HACHIKAKE YASUO , TSUKADA KAZUYA
IPC分类号： G01N21/53 , G01N15/02 , G01N15/14 , G01N21/39 , G01N21/49
CPC分类号： G01N15/0205 , G01N15/14 , G01N2021/391
摘要： PURPOSE:To detect fine particles in an aerosol stably with high precision by arranging a detection cell through which the aerosol to be measured is passed in an external resonator which resonates with the output of a laser oscillator, and measuring scattered light. CONSTITUTION:The laser output light 6 from the laser oscillator 1 is made incident on the Fabry-Perot optical resonator constituted by placing mirrors 2 and 2' opposite to each other. Laser light 8 is reflected repeatedly between mirrors 2 and 2' to obtain a value nearly equal to the light intensity in the laser resonator. The aerosol 7 to be measured is passed through a detection cell 3 in the resonator from a suction nozzle 4 while crossing the laser luminous flux and discharged through a discharge nozzle 5. Laser light scattered by fine particles in the aerosol is converged through a condenser lens optical system 9 and converted into an electric signal by a photodetector 10.
摘要翻译：目的：通过在与激光振荡器的输出共振的外部谐振器中设置待测量气溶胶通过的检测单元，并测量散射光，以高精度稳定地检测气溶胶中的微粒。构成：将来自激光振荡器1的激光输出光6入射到通过将镜子2和2'彼此相对放置而构成的法布里 - 珀罗光学谐振器。激光8在反射镜2和2'之间反复反射以获得几乎等于激光谐振器中的光强度的值。被测量的气溶胶7在与激光光束交叉的同时从吸嘴4通过谐振器中的检测单元3，并通过排出喷嘴5排出。气溶胶中的细颗粒散射的激光被会聚在聚光透镜光学系统9，并由光电检测器10转换成电信号。

9. 发明专利

JPS5630629A INSPECTION JIG FOR OPTICAL TYPE FACE PLATE FAULT DETECTOR 失效
公开(公告)号：JPS5630629A
公开(公告)日：1981-03-27
申请号：JP10610079
申请日：1979-08-22
申请人： HITACHI LTD , HITACHI ELECTR ENG
发明人： HACHIKAKE YASUO , EGARASHI ETSUROU , SUZUKI MICHIO
IPC分类号： G01B11/00 , G01N21/88 , G01N21/93 , G01N21/95 , G01N21/956
摘要： PURPOSE:To obtain an inspection jig easy to handle and having high inspection accuracy by providing stepped parts each having a width dimension larger than the diameter of a light spot irradiated from a detector, on a face plate in a combination of a plurality of rows. CONSTITUTION:Stepped parts 2 each having a width dimension larger than the diameter D of a light spot irradiated from an optical type fault detector and having a thickness dimension d of several steps, is provided on a face plate 1 in a combination of a plurality of rows. For example, on the surface of the silicone wafer 1, there are provided rectilear silicone stepped parts 2 each having the thickness d of suitable four steps, and a pattern width w larger than the diameter D of the light spot irradiated are arranged and formed, four each in three directions, i.e., rectangular direction, and 45 deg. direction. The relation of a scattered light detecting signal voltage v of the light receiver 4 with respect to the thickness d of the stepped part is measured in advance, and the measured relation is used for the presumption of the size of the fault forming a linear shape and inspection of the detection function of the detector.

10. 发明专利

JP2001255278A SURFACE INSPECTION DEVICE AND ITS METHOD 失效
公开(公告)号：JP2001255278A
公开(公告)日：2001-09-21
申请号：JP2000068593
申请日：2000-03-08
申请人： HITACHI LTD , HITACHI ELECTR ENG
发明人： ISHIMARU ICHIRO , NOGUCHI MINORU , MORIYAMA ICHIRO , TANABE YOSHIKAZU , HACHIKAKE YASUO , KENBO YUKIO , WATANABE KENJI , TSUCHIYAMA YOJI
IPC分类号： G01B11/30 , G01B11/24 , G01B11/245 , G01N21/95 , G01N21/956 , G06T1/00 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To provide a surface inspection device and its method capable of discriminating a scratch having a various shape generated on the surface from adhering foreign matter and inspecting it, when polishing or grinding such as CMP or the like is performed onto a machining object (for example, an insulating film on a semiconductor substrate) in semiconductor production or magnetic head production. SOLUTION: This surface inspection method and its device are characterized by executing downward illumination and oblique illumination by nearly the same beam onto the scratch generated on the surface of the polished or ground insulating film and the foreign matter, detecting the change of the intensity of scattered light generated from the shallow scratch and the foreign matter between the downward illumination and the oblique illumination to discriminate the shallow scratch from the foreign matter, and detecting directivity of the scattered light at the downward illumination to discriminate the linear scratch from the foreign matter.

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