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1. 发明专利

DE10041354A1 Foreign particle or defect checking system for inspection of substrate or wafer, has size information processing device which processes size of foreign particle or defect on predetermined object 未知
公开(公告)号：DE10041354A1
公开(公告)日：2001-04-12
申请号：DE10041354
申请日：2000-08-23
申请人： HITACHI ELECTR ENG , HITACHI LTD
发明人： NISHIYAMA HIDETOSHI , NOGUCHI MINORI , OHSHIMA YOSHIMASA , SAIKI KEIICHI , WATANABE KENJI , WATANABE TETSUYA , NAKAMURA HISATO , JINGU TAKAHIRO , INOUE YUKO
IPC分类号： H01L21/66 , G01N21/898
摘要： A signal processing circuit (105) performs the processing of the predetermined size of the foreign particle or defect information the registered signal in an defect detector. An output device performs the output of the size information of the foreign particle or defect from the defect detector and the output signal of the signal processing circuit. An illumination device (101) radiates light to a predetermined object to be checked. A light inspection device (104) determines the reflected light from the illuminated object, or the radiated light scattered by the illumination device. An defect detector registers a foreign particle or an defect on the object by synchronous processing of the detection signal. An independent claim is also included for a foreign particle or defect registering method.

2. 发明专利

JP2001255278A SURFACE INSPECTION DEVICE AND ITS METHOD 失效
公开(公告)号：JP2001255278A
公开(公告)日：2001-09-21
申请号：JP2000068593
申请日：2000-03-08
申请人： HITACHI LTD , HITACHI ELECTR ENG
发明人： ISHIMARU ICHIRO , NOGUCHI MINORU , MORIYAMA ICHIRO , TANABE YOSHIKAZU , HACHIKAKE YASUO , KENBO YUKIO , WATANABE KENJI , TSUCHIYAMA YOJI
IPC分类号： G01B11/30 , G01B11/24 , G01B11/245 , G01N21/95 , G01N21/956 , G06T1/00 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To provide a surface inspection device and its method capable of discriminating a scratch having a various shape generated on the surface from adhering foreign matter and inspecting it, when polishing or grinding such as CMP or the like is performed onto a machining object (for example, an insulating film on a semiconductor substrate) in semiconductor production or magnetic head production. SOLUTION: This surface inspection method and its device are characterized by executing downward illumination and oblique illumination by nearly the same beam onto the scratch generated on the surface of the polished or ground insulating film and the foreign matter, detecting the change of the intensity of scattered light generated from the shallow scratch and the foreign matter between the downward illumination and the oblique illumination to discriminate the shallow scratch from the foreign matter, and detecting directivity of the scattered light at the downward illumination to discriminate the linear scratch from the foreign matter.

3. 发明专利

JPH09269294A MANUFACTURE OF ELECTRONIC PART 失效
公开(公告)号：JPH09269294A
公开(公告)日：1997-10-14
申请号：JP8020096
申请日：1996-04-02
申请人： HITACHI LTD , HITACHI ELECTR ENG
发明人： SHIBA MASATAKA , WATANABE KENJI , HAMADA TOSHIMITSU , ISHIKAWA SEIJI , GO NAOKI , YANAI TOSHIAKI , WATANABE TETSUYA , JINGU TAKAHIRO
IPC分类号： G01N21/84 , B23Q41/08 , G05B19/418 , G06Q50/00 , G06Q50/04 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To establish an optimum examination device and a frequency of examination in manufacture of semiconductor wafers and the like. SOLUTION: Each examination device of a group 1 of examination devices is connected to a network 8, and after an examination is finished, the result is transferred to a data gathering system 2. Where a predetermined badness mode is confirmed, same waferes selected from a predetermined process are examined by examination devices of different type of the group of examinations devices 1 and the data are gathered and analyzed to calculate the degree of correlation between types of device 4. On the other hand, a mean frequency of occurrence of badness may be obtained by analyzing the badness occurrence progress in the same process 5. Then, an optimum examination device and a frequency of examination are successively obtained on the basis of the results of calculations of calculation processing of the degree of correlation between types of device and of calculation processing of frequency of occurrence of badness 6, and the method of introduction of wafers into the group of examination devices 1 or the like is indicated through a system 7 managing the group of examination devices. It is thus possible to easily establish complicated conditions of examination such as an applied examination device, a frequency of examination and the like in manufacture of electronic parts as well as dramatically improve the economic efficiency of examination by performing an expected value minimization of the overall loss.

4. 发明专利

JP2003098111A METHOD FOR INSPECTING DEFECT AND APPARATUS THEREFOR 审中-公开
公开(公告)号：JP2003098111A
公开(公告)日：2003-04-03
申请号：JP2001288013
申请日：2001-09-21
申请人： HITACHI LTD , HITACHI ELECTR ENG
发明人： NISHIYAMA HIDETOSHI , NOGUCHI MINORU , OSHIMA YOSHIMASA , HAMAMATSU REI , WATANABE KENJI , WATANABE TETSUYA , JINGU TAKAHIRO
IPC分类号： G01B11/30 , G01B11/24 , G01N21/956 , G06T1/00 , G06T7/60 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To solve the problem that it takes an enormous amount of time to analyze detected foreign objects when the number of detected objects by an inspecting apparatus is large, leading to a delay in taking countermeasures against failures of a manufacturing process while a total number of detected objects is outputted as the detected result of the foreign object defect-inspecting apparatus and the countermeasure against failures of the manufacturing process is taken by analyzing foreign objects/defects detected by the inspecting apparatus conventionally. SOLUTION: In the defect inspecting apparatus which inspects by an optical system, failure causes are related to sizes of foreign objects or defects in the result, and a data processing means points out the failure cause from statistics of the inspection result and displays information on the inspection result. A threshold where a semiconductor wafer or the like becomes defective is set for each region of the semiconductor wafer or the like, and a defect analysis is carried out by statistically evaluating foreign objects.

5. 发明专利

JP2001250852A MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, INSPECTION CONDITION OBTAINING METHOD, SELECTION METHOD THEREOF, AND INSPECTION DEVICE AND METHOD THEREFOR 失效
公开(公告)号：JP2001250852A
公开(公告)日：2001-09-14
申请号：JP2000061836
申请日：2000-03-02
申请人： HITACHI LTD , HITACHI ELECTR ENG
发明人： HAMAMATSU REI , NOGUCHI MINORU , OSHIMA YOSHIMASA , NISHIYAMA HIDETOSHI , OKA KENJI , NINOMIYA TAKANORI , TANAKA MAKI , WATANABE KENJI , WATANABE TETSUYA , MORISHIGE YOSHIO
IPC分类号： G01N21/956 , G06T7/00 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To provide an inspection device and method for inspecting, under optimum conditions, such objects as foreign objects to be detected while matching the surface state of an object such as a semiconductor wafer manufac tured in diversified manufacturing processes. SOLUTION: A process for detecting at least the data of an object for each condition by collectively inspecting the object under a plurality of preset inspection conditions in the inspection device, a process for creating comparison data by comparing the inspection object for each inspection condition that has been detected, a process for classifying the inspection object by performing analysis based on the comparison result data for the created inspection object, a process for creating data regarding the classified inspection object for each inspection condition by giving the data of the classified inspection object to the coordinates data of the detection object for each inspection condition, and a process for selecting proper inspection conditions based on data regarding the classified inspection object for each created inspection condition, are provided.

6. 发明专利

DE69738979D1 未知
公开(公告)号：DE69738979D1
公开(公告)日：2008-10-23
申请号：DE69738979
申请日：1997-03-19
申请人： HITACHI LTD , HITACHI INSTRUMENTS ENG
发明人： MIZUNO FUMIO , ISOGAI SEIJI , WATANABE KENJI , YOSHITAKE YASUHIRO , ASAKAWA TERUSHIGE , OHYAMA YUICHI , SUGIMOTO HIDEKUNI , ISHIKAWA SEIJI , SHIBA MASATAKA , NAKAZATO JUN , ARIGA MAKOTO , YOKOUCHI TETSUJI , HAMADA TOSHIMITSU , SUZUKI IKUO , IKOTA MASAMI , NOZOE MARI , MIYAZAKI ISAO , SHIGYO YOSHIHARU
IPC分类号： H01L21/66 , G01B11/30 , G01N21/88 , G06F15/00 , G09C1/00 , H04K1/00

7. 发明专利

DE10115442B4 未知
公开(公告)号：DE10115442B4
公开(公告)日：2006-04-20
申请号：DE10115442
申请日：2001-03-29
申请人： HITACHI LTD , HITACHI CAR ENG CO LTD
发明人： AMOU KIYOSHI , OKAMOTO YOSHIO , KOWATARI TAKEHIKO , MIYAJIMA AYUMU , KADOMUKAI YUZO , ISHIKAWA TORU , NAGANO MASAMI , ICHIHARA TAKANOBU , SAEKI HIROAKI , WATANABE KENJI
IPC分类号： F02M69/04 , F02M31/135 , F02M53/06 , F02M61/16 , F02M69/08 , F02M69/32
摘要： Atomizing air flowing in an atomizing gas passage is merged with a fuel spray to promote atomization of the fuel, and carrier air flowing in a carrier gas passage is merged with the fuel spray at a further downstream position so as to surround the fuel spray. By doing so, the atomized fuel spray is carried to the downstream side so as to prevent the fuel spray from adhering onto the wall surface. The starting-up performance, fuel consumption and exhaust gas cleaning of an internal combustion engine are improved in this way.

8. 发明专利

HK1138821A1 ELEVATOR GROUP MANAGEMENT SYSTEM 未知
公开(公告)号：HK1138821A1
公开(公告)日：2010-09-03
申请号：HK10104920
申请日：2010-05-19
申请人： HITACHI LTD
发明人： YOSHIKAWA TOSHIFUMI , TORIYABE SATORU , HOSHINO TAKAMICHI , AIDA KEIICHI , WATANABE KENJI , KUMATA KAZUNARI , NISHIDA TAKEHISA
IPC分类号： B66B20060101

9. 发明专利

DE10115442A1 未知
公开(公告)号：DE10115442A1
公开(公告)日：2001-10-25
申请号：DE10115442
申请日：2001-03-29
申请人： HITACHI LTD , HITACHI CAR ENG CO LTD
发明人： AMOU KIYOSHI , OKAMOTO YOSHIO , KOWATARI TAKEHIKO , MIYAJIMA AYUMU , KADOMUKAI YUZO , ISHIKAWA TORU , NAGANO MASAMI , ICHIHARA TAKANOBU , SAEKI HIROAKI , WATANABE KENJI
IPC分类号： F02M61/16 , F02M69/32 , F02M69/08 , F02M31/02
摘要： Atomizing air flowing in an atomizing gas passage is merged with a fuel spray to promote atomization of the fuel, and carrier air flowing in a carrier gas passage is merged with the fuel spray at a further downstream position so as to surround the fuel spray. By doing so, the atomized fuel spray is carried to the downstream side so as to prevent the fuel spray from adhering onto the wall surface. The starting-up performance, fuel consumption and exhaust gas cleaning of an internal combustion engine are improved in this way.

10. 发明公开

EP0910123A4 PROCESS CONTROL SYSTEM 失效
标题翻译：过程控制系统
公开(公告)号：EP0910123A4
公开(公告)日：2000-08-23
申请号：EP97907383
申请日：1997-03-19
申请人： HITACHI LTD , HITACHI INSTRUMENTS ENG
发明人： MIZUNO FUMIO , ISOGAI SEIJI , WATANABE KENJI , YOSHITAKE YASUHIRO , ASAKAWA TERUSHIGE , OHYAMA YUICHI , SUGIMOTO HIDEKUNI , ISHIKAWA SEIJI , SHIBA MASATAKA , NAKAZATO JUN , ARIGA MAKOTO , YOKOUCHI TETSUJI , HAMADA TOSHIMITSU , SUZUKI IKUO , IKOTA MASAMI , NOZOE MARI , MIYAZAKI ISAO , SHIGYO YOSHIHARU
IPC分类号： H01L21/66 , G01B11/30 , G01N21/88 , G06F15/00 , G09C1/00 , H04K1/00
CPC分类号： H01L22/20 , G01N21/9501 , G01R31/2894 , G01R33/06 , H01L2223/54466 , H01L2924/0002 , H01L2924/00
摘要： A process control system which collects inspection information and picture information collected by means of inspection devices which inspect wafers for defects and are connected to each other through a communication network, builds a database or picture file, and defines a defect by combining elements featuring the defect based on the inspection information and picture information obtained by the inspection devices. Since the system can recognize a defect by dividing the features of the defect into small items by defining the defect, the system can identify the cause of the defect.

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