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1. 发明授权

US08172992B2 Wafer electroplating apparatus for reducing edge defects 有权
标题翻译：用于减少边缘缺陷的晶圆电镀设备
公开(公告)号：US08172992B2
公开(公告)日：2012-05-08
申请号：US12633219
申请日：2009-12-08
申请人： Vinay Prabhakar , Bryan L. Buckalew , Kousik Ganesan , Shantinath Ghongadi , Zhian He , Steven T. Mayer , Robert Rash , Jonathan D. Reid , Yuichi Takada , James R. Zibrida
发明人： Vinay Prabhakar , Bryan L. Buckalew , Kousik Ganesan , Shantinath Ghongadi , Zhian He , Steven T. Mayer , Robert Rash , Jonathan D. Reid , Yuichi Takada , James R. Zibrida
IPC分类号： C25B9/02
CPC分类号： C25D17/001 , C25D7/123
摘要： Methods, apparatuses, and various apparatus components, such as base plates, lipseals, and contact ring assemblies are provided for reducing contamination of the contact area in the apparatuses. Contamination may happen during removal of semiconductor wafers from apparatuses after the electroplating process. In certain embodiments, a base plate with a hydrophobic coating, such as polyamide-imide (PAI) and sometimes polytetrafluoroethylene (PTFE), are used. Further, contact tips of the contact ring assembly may be positioned further away from the sealing lip of the lipseal. In certain embodiments, a portion of the contact ring assembly and/or the lipseal also include hydrophobic coatings.
摘要翻译：提供了诸如基板，密封圈和接触环组件的方法，装置和各种装置部件，以减少设备中接触区域的污染。在电镀工艺之后从设备中取出半导体晶片时可能发生污染。在某些实施方案中，使用具有疏水涂层的基板，例如聚酰胺 - 酰亚胺（PAI）和有时聚四氟乙烯（PTFE）。此外，接触环组件的接触尖端可以被定位成更远离唇密封的唇缘。在某些实施方案中，接触环组件和/或唇膏的一部分还包括疏水性涂层。

2. 发明申请

US20100116672A1 METHOD AND APPARATUS FOR ELECTROPLATING 有权
公开(公告)号：US20100116672A1
公开(公告)日：2010-05-13
申请号：US12481503
申请日：2009-06-09
申请人： Steven Mayer , Jingbin Feng , Zhian He , Jonathan Reid , Seshasayee Varadarajan
发明人： Steven Mayer , Jingbin Feng , Zhian He , Jonathan Reid , Seshasayee Varadarajan
IPC分类号： C25D5/00 , C25D17/10 , C25D21/12
CPC分类号： C25D17/12 , C23C18/1601 , C25D5/02 , C25D17/001 , C25D17/002 , C25D17/007 , C25D17/008 , C25D21/12 , C25D21/14 , C25F3/30 , H01L21/2885 , H01L21/32115 , H01L21/32125 , H01L21/6715 , H01L21/76873
摘要： An apparatus for electroplating a layer of metal onto the surface of a wafer includes an ionically resistive ionically permeable element located in close proximity of the wafer and an auxiliary cathode located between the anode and the ionically resistive ionically permeable element. The ionically resistive ionically permeable element serves to modulate ionic current at the wafer surface. The auxiliary cathode is configured to shape the current distribution from the anode. The provided configuration effectively redistributes ionic current in the plating system allowing plating of uniform metal layers and mitigating the terminal effect.

3. 发明申请

US20150191843A9 PLATING CUP WITH CONTOURED CUP BOTTOM 有权
标题翻译：镀银杯与配套杯底
公开(公告)号：US20150191843A9
公开(公告)日：2015-07-09
申请号：US13609037
申请日：2012-09-10
申请人： Zhian He , Jingbin Feng , Shantinath Ghongadi , Frederick D. Wilmot
发明人： Zhian He , Jingbin Feng , Shantinath Ghongadi , Frederick D. Wilmot
IPC分类号： C25D17/06 , C25D17/00
CPC分类号： C25D17/06 , C25D7/12 , C25D17/001 , C25D17/004 , C25D17/005 , C25D17/007 , C25D17/12
摘要： Disclosed herein are cups for engaging wafers during electroplating in clamshell assemblies and supplying electrical current to the wafers during electroplating. The cup can comprise an elastomeric seal disposed on the cup and configured to engage the wafer during electroplating, where upon engagement the elastomeric seal substantially excludes plating solution from a peripheral region of the wafer, and where the elastomeric seal and the cup are annular in shape, and comprise one or more contact elements for supplying electrical current to the wafer during electroplating, the one or more contact elements attached to and extending inwardly towards a center of the cup from a metal strip disposed over the elastomeric seal. A notch area of the cup can have a protrusion or an insulated portion on a portion of a bottom surface of the cup where the notch area is aligned with a notch in the wafer.
摘要翻译：这里公开了用于在电镀期间在蛤壳式组件中接合晶片并在电镀期间向晶片供应电流的杯子。杯子可以包括设置在杯子上并被配置为在电镀期间接合晶片的弹性体密封件，其中在接合时，弹性体密封件基本上排除来自晶片的周边区域的电镀溶液，并且其中弹性体密封件和杯子是环形的并且包括用于在电镀期间向晶片供应电流的一个或多个接触元件，所述一个或多个接触元件从设置在弹性体密封件上方的金属条附接到杯的中心并向内延伸。杯的切口区域可以在杯的底表面的一部分上具有突起或绝缘部分，其中凹口区域与晶片中的凹口对准。

4. 发明授权

US08475637B2 Electroplating apparatus with vented electrolyte manifold 有权
标题翻译：带排气电解液歧管的电镀设备
公开(公告)号：US08475637B2
公开(公告)日：2013-07-02
申请号：US12337147
申请日：2008-12-17
申请人： Jingbin Feng , Zhian He , Robert Rash , Steven T. Mayer
发明人： Jingbin Feng , Zhian He , Robert Rash , Steven T. Mayer
IPC分类号： C25D17/00 , C25D21/04
CPC分类号： C25D7/123 , C25D17/001 , C25D17/002
摘要： Embodiments related to increasing a uniformity of an electroplated film are disclosed. For example, one disclosed embodiment provides an electroplating apparatus comprising a plating chamber, a work piece holder, a cathode contact configured to electrically contact a work piece, and an anode contact configured to electrically contact an anode disposed in the plating chamber. A diffusing barrier is disposed between the cathode contact and the anode contact to provide a uniform electrolyte flow to the work piece, and electrolyte delivery and return paths are provided for delivering electrolyte to and away from the plating chamber. Additionally, a vented electrolyte manifold is disposed in the electrolyte delivery path immediately upstream of the plating chamber, the vented electrolyte manifold comprising one or more electrolyte delivery openings that open to the plating chamber and one or more vents that open to a location other than the plating chamber.
摘要翻译：公开了与提高电镀膜的均匀性有关的实施例。例如，一个公开的实施例提供了一种电镀设备，其包括电镀室，工件保持器，构造成电接触工件的阴极接触件和被配置为电接触设置在电镀室中的阳极的阳极接触件。扩散阻挡层设置在阴极接触件和阳极接触件之间，以提供均匀的电解质流向工件，并且提供电解质输送和返回路径用于将电解质输送到电镀室和远离电镀室。另外，排气的电解液歧管设置在紧邻镀室的上游的电解质输送路径中，排出的电解质歧管包括一个或多个向电镀室敞开的电解质输送开口，以及一个或多个通向出口电镀室。

5. 发明授权

US08475636B2 Method and apparatus for electroplating 有权
标题翻译：电镀方法和装置
公开(公告)号：US08475636B2
公开(公告)日：2013-07-02
申请号：US12481503
申请日：2009-06-09
申请人： Steven Mayer , Jingbin Feng , Zhian He , Jonathan Reid , Seshasayee Varadarajan
发明人： Steven Mayer , Jingbin Feng , Zhian He , Jonathan Reid , Seshasayee Varadarajan
IPC分类号： C25D17/12 , C25D21/12
CPC分类号： C25D17/12 , C23C18/1601 , C25D5/02 , C25D17/001 , C25D17/002 , C25D17/007 , C25D17/008 , C25D21/12 , C25D21/14 , C25F3/30 , H01L21/2885 , H01L21/32115 , H01L21/32125 , H01L21/6715 , H01L21/76873
摘要： An apparatus for electroplating a layer of metal onto the surface of a wafer includes an ionically resistive ionically permeable element located in close proximity of the wafer and an auxiliary cathode located between the anode and the ionically resistive ionically permeable element. The ionically resistive ionically permeable element serves to modulate ionic current at the wafer surface. The auxiliary cathode is configured to shape the current distribution from the anode. The provided configuration effectively redistributes ionic current in the plating system allowing plating of uniform metal layers and mitigating the terminal effect.
摘要翻译：用于将金属层电镀到晶片表面上的装置包括位于晶片附近的离子电离离子可渗透元件和位于阳极和离子电离性可离子渗透元件之间的辅助阴极。离子电阻性离子渗透元件用于调节晶片表面处的离子电流。辅助阴极被配置成使来自阳极的电流分布成形。所提供的配置有效地重新分布电镀系统中的离子电流，允许电镀均匀的金属层并减轻终端效应。

6. 发明申请

US20110233056A1 ELECTROPLATING CUP ASSEMBLY 有权
标题翻译：电镀杯组装
公开(公告)号：US20110233056A1
公开(公告)日：2011-09-29
申请号：US13154224
申请日：2011-06-06
申请人： Robert Rash , Shantinath Ghongadi , Kousik Ganesan , Zhian He , Tariq Majid , Jeff Hawkins , Seshasayee Varadarajan , Bryan Buckalew
发明人： Robert Rash , Shantinath Ghongadi , Kousik Ganesan , Zhian He , Tariq Majid , Jeff Hawkins , Seshasayee Varadarajan , Bryan Buckalew
IPC分类号： C25D17/06 , F16J15/02
CPC分类号： C25D17/001 , C25D7/123 , C25D17/02
摘要： Embodiments of a closed-contact electroplating cup are disclosed. One embodiment comprises a cup bottom comprising an opening, and a seal disposed on the cup bottom around the opening. The seal comprises a wafer-contacting peak located substantially at an inner edge of the seal. The embodiment also comprises an electrical contact structure disposed over a portion of the seal, wherein the electrical contact structure comprises an outer ring and a plurality of contacts extending inwardly from the outer ring, and wherein each contact has a generally flat wafer-contacting surface. The embodiment further comprises a wafer-centering mechanism configured to center a wafer in the cup.
摘要翻译：公开了一种闭式电镀杯的实施例。一个实施例包括一个包括一个开口的杯底，以及一个围绕开口设置在杯底的密封件。密封件包括基本上位于密封件的内边缘处的与晶片接触的峰。该实施例还包括设置在密封件的一部分上的电接触结构，其中电接触结构包括外环和从外环向内延伸的多个触点，并且其中每个触头具有大致平坦的晶片接触表面。该实施例还包括晶圆定心机构，其配置成使晶片位于杯中心。

7. 发明申请

US20090107836A1 Closed Contact Electroplating Cup Assembly 有权
标题翻译：闭合式电镀杯组装
公开(公告)号：US20090107836A1
公开(公告)日：2009-04-30
申请号：US11929638
申请日：2007-10-30
申请人： Robert Rash , Shantinath Ghongadi , Kousik Ganesan , Zhian He , Tariq Majid , Jeff Hawkins , Seshasayee Varadarajan , Bryan Buckalew
发明人： Robert Rash , Shantinath Ghongadi , Kousik Ganesan , Zhian He , Tariq Majid , Jeff Hawkins , Seshasayee Varadarajan , Bryan Buckalew
IPC分类号： C25D17/06 , F16J15/34
CPC分类号： C25D17/001 , C25D7/123 , C25D17/02
摘要： Embodiments of a closed-contact electroplating cup are disclosed. One embodiment comprises a cup bottom comprising an opening, and a seal disposed on the cup bottom around the opening. The seal comprises a wafer-contacting peak located substantially at an inner edge of the seal. The embodiment also comprises an electrical contact structure disposed over a portion of the seal, wherein the electrical contact structure comprises an outer ring and a plurality of contacts extending inwardly from the outer ring, and wherein each contact has a generally flat wafer-contacting surface. The embodiment further comprises a wafer-centering mechanism configured to center a wafer in the cup.
摘要翻译：公开了一种闭式电镀杯的实施例。一个实施例包括一个包括一个开口的杯底，以及一个围绕开口设置在杯底的密封件。密封件包括基本上位于密封件的内边缘处的与晶片接触的峰。该实施例还包括设置在密封件的一部分上的电接触结构，其中电接触结构包括外环和从外环向内延伸的多个接触件，并且其中每个接触件具有大致平坦的晶片接触表面。该实施例还包括晶圆定心机构，其配置成使晶片位于杯中心。

8. 发明授权

US09045841B1 Control of electrolyte composition in a copper electroplating apparatus 有权
标题翻译：铜电镀设备中电解质组成的控制
公开(公告)号：US09045841B1
公开(公告)日：2015-06-02
申请号：US13359343
申请日：2012-01-26
申请人： Bryan Buckalew , Jonathan Reid , John Sukamto , Zhian He , Seshasayee Varadarajan , Steven T. Mayer
发明人： Bryan Buckalew , Jonathan Reid , John Sukamto , Zhian He , Seshasayee Varadarajan , Steven T. Mayer
IPC分类号： C25D3/02 , C25D21/14
CPC分类号： C25D21/14 , C25D17/001 , C25D17/002
摘要： In a copper electroplating apparatus having separate anolyte and catholyte portions, the concentration of anolyte components (e.g., acid or copper salt) is controlled by providing a diluent to the recirculating anolyte. The dosing of the diluent can be controlled by the user and can follow a pre-determined schedule. For example, the schedule may specify the diluent dosing parameters, so as to prevent precipitation of copper salt in the anolyte. Thus, precipitation-induced anode passivation can be minimized.
摘要翻译：在具有单独阳极电解液和阴极电解液部分的铜电镀设备中，通过向循环阳极电解液提供稀释剂来控制阳极电解液组分（例如酸或铜盐）的浓度。稀释剂的剂量可以由用户控制，并且可以遵循预定的时间表。例如，时间表可以指定稀释剂配量参数，以防止铜盐在阳极电解液中沉淀。因此，沉淀诱导的阳极钝化可以最小化。

9. 发明授权

US08540857B1 Plating method and apparatus with multiple internally irrigated chambers 有权
标题翻译：具有多个内部灌溉室的电镀方法和装置
公开(公告)号：US08540857B1
公开(公告)日：2013-09-24
申请号：US13571199
申请日：2012-08-09
申请人： Steven Mayer , Shantinath Ghongadi , Kousik Ganesan , Zhian He , Jingbin Feng
发明人： Steven Mayer , Shantinath Ghongadi , Kousik Ganesan , Zhian He , Jingbin Feng
IPC分类号： C25B9/00 , C25D17/00 , C25D7/12
CPC分类号： C25D17/001 , C25D5/08 , C25D17/002 , C25D17/008
摘要： An apparatus for electroplating a layer of metal onto a work piece surface includes a membrane separating the chamber of the apparatus into a catholyte chamber and an anolyte chamber. In the catholyte chamber is a catholyte manifold region that includes a catholyte manifold and at least one flow distribution tube. The catholyte manifold and at least one flow distribution tube serve to mix and direct catholyte flow in the catholyte chamber. The provided configuration effectively reduces failure and improves the operational ranges of the apparatus.
摘要翻译：用于将金属层电镀到工件表面上的装置包括将装置的室分离成阴极电解液室和阳极电解液室的膜。在阴极电解液室中是阴极电解液歧管区域，其包括阴极电解液歧管和至少一个流量分布管。阴极电解液歧管和至少一个分流管用于混合和引导阴极电解液在阴极电解液室中的流动。所提供的配置有效地减少故障并改善设备的操作范围。

10. 发明授权

US08377268B2 Electroplating cup assembly 有权
标题翻译：电镀杯组装
公开(公告)号：US08377268B2
公开(公告)日：2013-02-19
申请号：US13154224
申请日：2011-06-06
申请人： Robert Rash , Shantinath Ghongadi , Kousik Ganesan , Zhian He , Tariq Majid , Jeff Hawkins , Seshasayee Varadarajan , Bryan Buckalew
发明人： Robert Rash , Shantinath Ghongadi , Kousik Ganesan , Zhian He , Tariq Majid , Jeff Hawkins , Seshasayee Varadarajan , Bryan Buckalew
IPC分类号： C25D17/06 , C25D7/12
CPC分类号： C25D17/001 , C25D7/123 , C25D17/02
摘要： Embodiments of a closed-contact electroplating cup are disclosed. One embodiment comprises a cup bottom comprising an opening, and a seal disposed on the cup bottom around the opening. The seal comprises a wafer-contacting peak located substantially at an inner edge of the seal. The embodiment also comprises an electrical contact structure disposed over a portion of the seal, wherein the electrical contact structure comprises an outer ring and a plurality of contacts extending inwardly from the outer ring, and wherein each contact has a generally flat wafer-contacting surface. The embodiment further comprises a wafer-centering mechanism configured to center a wafer in the cup.
摘要翻译：公开了一种闭式电镀杯的实施例。一个实施例包括一个包括一个开口的杯底，以及一个围绕开口设置在杯底的密封件。密封件包括基本上位于密封件的内边缘处的与晶片接触的峰。该实施例还包括设置在密封件的一部分上的电接触结构，其中电接触结构包括外环和从外环向内延伸的多个触点，并且其中每个触头具有大致平坦的晶片接触表面。该实施例还包括晶圆定心机构，其配置成使晶片位于杯中心。

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