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1. 发明授权

US09130899B1 Integrated user interface for unified communications applications 有权
标题翻译：用于统一通信应用的集成用户界面
公开(公告)号：US09130899B1
公开(公告)日：2015-09-08
申请号：US13094897
申请日：2011-04-27
申请人： Randall B. Baird , Liam P. O'Gorman , Stephan E. Friedl , J. Steven Mayer , Joe Smyth
发明人： Randall B. Baird , Liam P. O'Gorman , Stephan E. Friedl , J. Steven Mayer , Joe Smyth
IPC分类号： G06F15/16 , H04L29/08 , G06F17/30
CPC分类号： H04L65/403 , G06F3/0482 , G06F3/04842 , G06F3/04847 , G06F9/45545 , G06F17/30861 , H04L67/02 , H04L67/104 , H04L67/141
摘要： Techniques are provided for establishing a Unified Communications (UC) session between a client endpoint device and remote endpoint devices, the client endpoint device managing the session using a first-party call control protocol in response to commands from a third-party control protocol and user input. A hosted virtual desktop (HVD) generates an HVD image and communicates it to the client endpoint device for display, via a virtual desktop interface (VDI) protocol. The HVD image comprises a UC user interface generated by a UC application on the HVD, the user interface comprising at least one user interface element and at least one placeholder where a client-provided user interface element may be inserted. A client UC application receives the HVD image and inserts client-provided user interface elements over the placeholders before sending the integrated image to a client operating system to be rendered on the display of client endpoint device.
摘要翻译：提供技术用于在客户机端点设备和远程端点设备之间建立统一通信（UC）会话，客户终端设备响应于来自第三方控制协议和用户的命令，使用第一方呼叫控制协议管理会话输入。托管虚拟桌面（HVD）生成HVD图像，并通过虚拟桌面接口（VDI）协议将其传送到客户端端设备进行显示。 HVD图像包括由UC应用程序在HVD上生成的UC用户界面，所述用户界面包括至少一个用户界面元素和至少一个占位符，其中可以插入客户端提供的用户界面元素。客户端UC应用程序接收HVD映像，并将客户端提供的用户界面元素插入占位符，然后将集成映像发送到客户端操作系统以在客户机端点设备的显示器上呈现。

2. 发明授权

US08562442B2 Interactive gaming via mobile playmaker 有权
标题翻译：通过移动播放器进行互动游戏
公开(公告)号：US08562442B2
公开(公告)日：2013-10-22
申请号：US13153247
申请日：2011-06-03
申请人： Chad M. Stafford , Justin Cooper , Kevin Lyon , Nicholas Glassman , Steven Mayer
发明人： Chad M. Stafford , Justin Cooper , Kevin Lyon , Nicholas Glassman , Steven Mayer
IPC分类号： G06F17/00
CPC分类号： A63F13/87 , A63F13/12 , A63F13/332 , A63F13/352 , A63F13/537 , A63F13/61 , A63F13/71 , A63F2300/204 , A63F2300/406 , A63F2300/513 , A63F2300/538 , A63F2300/5506 , A63F2300/5566 , A63F2300/5573 , A63F2300/5593 , H04L67/38 , H04W4/023 , H04W4/08
摘要： Systems and techniques relating to interactive gaming are described. A described system includes one or more site servers providing game instances to one or more devices in communication with the one or more site servers via a wired network, a wireless network, or both. The system includes a server system in communication with the one or more site servers; and one or more wireless mobile devices in communication with the server system. The server system can be configured to provide information about one or more of the gaming instances at one or more sites to the one or more mobile devices; receive, from the one or more mobile devices, an indication of a selected gaming instance of the gaming instances; relay gaming information between the one or more site servers and the one or more mobile devices; and provide gaming content and one or more gaming functions to the site servers.
摘要翻译：描述与交互式游戏相关的系统和技术。所描述的系统包括一个或多个站点服务器，其经由有线网络，无线网络或两者向一个或多个站点服务器通信的一个或多个设备提供游戏实例。该系统包括与一个或多个站点服务器通信的服务器系统; 以及与服务器系统通信的一个或多个无线移动设备。可以将服务器系统配置为向一个或多个移动设备提供关于一个或多个站点上的一个或多个游戏实例的信息; 从所述一个或多个移动设备接收所选择的游戏实例的游戏实例的指示; 在所述一个或多个站点服务器与所述一个或多个移动设备之间中继游戏信息; 并向站点服务器提供游戏内容和一个或多个游戏功能。

3. 发明申请

US20100116672A1 METHOD AND APPARATUS FOR ELECTROPLATING 有权
公开(公告)号：US20100116672A1
公开(公告)日：2010-05-13
申请号：US12481503
申请日：2009-06-09
申请人： Steven Mayer , Jingbin Feng , Zhian He , Jonathan Reid , Seshasayee Varadarajan
发明人： Steven Mayer , Jingbin Feng , Zhian He , Jonathan Reid , Seshasayee Varadarajan
IPC分类号： C25D5/00 , C25D17/10 , C25D21/12
CPC分类号： C25D17/12 , C23C18/1601 , C25D5/02 , C25D17/001 , C25D17/002 , C25D17/007 , C25D17/008 , C25D21/12 , C25D21/14 , C25F3/30 , H01L21/2885 , H01L21/32115 , H01L21/32125 , H01L21/6715 , H01L21/76873
摘要： An apparatus for electroplating a layer of metal onto the surface of a wafer includes an ionically resistive ionically permeable element located in close proximity of the wafer and an auxiliary cathode located between the anode and the ionically resistive ionically permeable element. The ionically resistive ionically permeable element serves to modulate ionic current at the wafer surface. The auxiliary cathode is configured to shape the current distribution from the anode. The provided configuration effectively redistributes ionic current in the plating system allowing plating of uniform metal layers and mitigating the terminal effect.

4. 发明授权

US08475644B2 Method and apparatus for electroplating 有权
公开(公告)号：US08475644B2
公开(公告)日：2013-07-02
申请号：US12606030
申请日：2009-10-26
申请人： Steven Mayer , Jingbin Feng , Zhian He , Jonathan Reid , Seshasayee Varadarajan
发明人： Steven Mayer , Jingbin Feng , Zhian He , Jonathan Reid , Seshasayee Varadarajan
IPC分类号： C25D21/12 , C25D7/12 , C25D3/38
CPC分类号： C25D17/12 , C23C18/1601 , C25D5/02 , C25D17/001 , C25D17/002 , C25D17/007 , C25D17/008 , C25D21/12 , C25D21/14 , C25F3/30 , H01L21/2885 , H01L21/32115 , H01L21/32125 , H01L21/6715 , H01L21/76873
摘要： An apparatus for electroplating a layer of metal onto the surface of a wafer includes an ionically resistive ionically permeable element located in close proximity of the wafer and an auxiliary cathode located between the anode and the ionically resistive ionically permeable element. The ionically resistive ionically permeable element serves to modulate ionic current at the wafer surface. The auxiliary cathode is configured to shape the current distribution from the anode. The provided configuration effectively redistributes ionic current in the plating system allowing plating of uniform metal layers and mitigating the terminal effect.

5. 发明申请

US20050282371A1 Sequential station tool for wet processing of semiconductor wafers 失效
标题翻译：用于半导体晶圆湿法处理的顺序工具
公开(公告)号：US20050282371A1
公开(公告)日：2005-12-22
申请号：US10693223
申请日：2003-10-24
申请人： Evan Patton , Theodore Cacouris , Eliot Broadbent , Steven Mayer
发明人： Evan Patton , Theodore Cacouris , Eliot Broadbent , Steven Mayer
IPC分类号： C25D3/38 , C25D5/10 , H01L21/00 , H01L21/288 , H01L21/44 , H01L21/677
CPC分类号： C25D17/001 , C25D3/38 , C25D5/10 , H01L21/2885 , H01L21/67161 , H01L21/6719 , H01L21/6723 , H01L21/67751 , H01L21/76877 , Y10T29/41
摘要： Methods and apparatus are provided for processing semiconductor wafers sequentially. Sequential processes employ multi-station processing modules, where particular encompassing wafer processes are divided into sub-processes, each optimized for increasing wafer to wafer uniformity, result quality, and overall wafer throughput. In one example, a copper electroplating module includes separate stations for wetting, initiation, seed layer repair, fill, overburden, reclaim, and rinse.
摘要翻译：提供了顺序处理半导体晶片的方法和装置。顺序过程采用多工位处理模块，其中特别包含的晶片工艺被分为子工艺，每个子工艺被优化用于增加晶圆到晶片的均匀性，结果质量和整个晶片生产量。在一个示例中，铜电镀模块包括用于润湿，起始，种子层修复，填充，覆盖层，回收和冲洗的分离站。

6. 发明授权

US08308931B2 Method and apparatus for electroplating 有权
标题翻译：电镀方法和装置
公开(公告)号：US08308931B2
公开(公告)日：2012-11-13
申请号：US12291356
申请日：2008-11-07
申请人： Jonathan Reid , Bryan Buckalew , Zhian He , Seyang Park , Seshasayee Varadarajan , Bryan Pennington , Thomas Ponnuswamy , Patrick Breling , Glenn Ibarreta , Steven Mayer
发明人： Jonathan Reid , Bryan Buckalew , Zhian He , Seyang Park , Seshasayee Varadarajan , Bryan Pennington , Thomas Ponnuswamy , Patrick Breling , Glenn Ibarreta , Steven Mayer
IPC分类号： C25D21/12 , C25D7/12 , C25D3/38
CPC分类号： C25D17/008 , C25D7/123 , C25D17/001 , C25D17/007 , C25D21/12 , H01L21/2885 , H01L21/76873
摘要： An apparatus for electroplating a layer of metal on the surface of a wafer includes an ionically resistive ionically permeable element located in close proximity of the wafer (preferably within 5 mm of the wafer surface) which serves to modulate ionic current at the wafer surface, and a second cathode configured to divert a portion of current from the wafer surface. The ionically resistive ionically permeable element in a preferred embodiment is a disk made of a resistive material having a plurality of perforations formed therein, such that perforations do not form communicating channels within the body of the disk. The provided configuration effectively redistributes ionic current in the plating system allowing plating of uniform metal layers and mitigating the terminal effect.
摘要翻译：用于在晶片表面上电镀一层金属的装置包括位于晶片附近（优选地在晶片表面的5mm内）的离子电离性离子渗透元件，其用于调节晶片表面处的离子电流，以及第二阴极，被配置为使来自晶片表面的一部分电流转向。在优选实施例中的离子电阻性离子渗透元件是由电阻材料制成的盘，其中形成有多个穿孔，使得穿孔在盘的主体内不形成连通通道。所提供的配置有效地重新分布电镀系统中的离子电流，允许电镀均匀的金属层并减轻终端效应。

7. 发明授权

US08621261B2 Support for virtualized unified communications clients when host server connectivity is lost 有权
标题翻译：当主机服务器连接丢失时，支持虚拟化统一通信客户端
公开(公告)号：US08621261B2
公开(公告)日：2013-12-31
申请号：US12953706
申请日：2010-11-24
申请人： Randall Bernard Baird , J. Steven Mayer , Joe Smyth
发明人： Randall Bernard Baird , J. Steven Mayer , Joe Smyth
IPC分类号： G06F11/00
CPC分类号： G06F11/2012 , G06F11/1479 , H04L67/08
摘要： Techniques are provided for establishing a Virtual Desktop Interface (VDI) connection at a virtual desktop thin client (VDTC) device, between a VDI client in the VDTC device and a VDI server in a hosted virtual desktop server (HVDS). A unified communications (UC) control connection is established between a UC protocol stack on the VDTC device and a primary call agent, where the UC control connection is configured to allow the UC protocol stack to register with the primary call agent, and to send or receive commands from the primary call agent that are based on signals from a UC control application running on the HVDS. A UC control backup application is started on the virtual desktop thin client device in a standby mode that is configured to switch to an active mode in response to a failure to establish or maintain the UC control connection, or a failure to establish or maintain the VDI connection. A user interface is launched on the virtual desktop thin client device that is configured to perform UC backup functions.
摘要翻译：提供了在虚拟桌面瘦客户机（VDTC）设备，VDTC设备中的VDI客户端和托管虚拟桌面服务器（HVDS）中的VDI服务器之间建立虚拟桌面接口（VDI）连接的技术。在VDTC设备上的UC协议栈和主呼叫代理之间建立统一通信（UC）控制连接，其中UC控制连接被配置为允许UC协议栈向主呼叫代理注册，并且发送或接收来自主呼叫代理的基于来自在HVDS上运行的UC控制应用的信号的命令。在虚拟桌面瘦客户端设备上启动UC控制备份应用程序，该备用模式被配置为响应于建立或维护UC控制连接的故障而切换到活动模式，或者未能建立或维护VDI 连接。在配置为执行UC备份功能的虚拟桌面瘦客户端设备上启动用户界面。

8. 发明授权

US08475636B2 Method and apparatus for electroplating 有权
标题翻译：电镀方法和装置
公开(公告)号：US08475636B2
公开(公告)日：2013-07-02
申请号：US12481503
申请日：2009-06-09
申请人： Steven Mayer , Jingbin Feng , Zhian He , Jonathan Reid , Seshasayee Varadarajan
发明人： Steven Mayer , Jingbin Feng , Zhian He , Jonathan Reid , Seshasayee Varadarajan
IPC分类号： C25D17/12 , C25D21/12
CPC分类号： C25D17/12 , C23C18/1601 , C25D5/02 , C25D17/001 , C25D17/002 , C25D17/007 , C25D17/008 , C25D21/12 , C25D21/14 , C25F3/30 , H01L21/2885 , H01L21/32115 , H01L21/32125 , H01L21/6715 , H01L21/76873
摘要： An apparatus for electroplating a layer of metal onto the surface of a wafer includes an ionically resistive ionically permeable element located in close proximity of the wafer and an auxiliary cathode located between the anode and the ionically resistive ionically permeable element. The ionically resistive ionically permeable element serves to modulate ionic current at the wafer surface. The auxiliary cathode is configured to shape the current distribution from the anode. The provided configuration effectively redistributes ionic current in the plating system allowing plating of uniform metal layers and mitigating the terminal effect.
摘要翻译：用于将金属层电镀到晶片表面上的装置包括位于晶片附近的离子电离离子可渗透元件和位于阳极和离子电离性可离子渗透元件之间的辅助阴极。离子电阻性离子渗透元件用于调节晶片表面处的离子电流。辅助阴极被配置成使来自阳极的电流分布成形。所提供的配置有效地重新分布电镀系统中的离子电流，允许电镀均匀的金属层并减轻终端效应。

9. 发明申请

US20120131377A1 Support for Virtualized Unified Communications Clients When Host Server Connectivity is Lost 有权
标题翻译：当主机服务器连接丢失时，支持虚拟化统一通信客户端
公开(公告)号：US20120131377A1
公开(公告)日：2012-05-24
申请号：US12953706
申请日：2010-11-24
申请人： Randall Bernard Baird , J. Steven Mayer
发明人： Randall Bernard Baird , J. Steven Mayer
IPC分类号： G06F11/16
CPC分类号： G06F11/2012 , G06F11/1479 , H04L67/08
摘要： Techniques are provided for establishing a Virtual Desktop Interface (VDI) connection at a virtual desktop thin client (VDTC) device, between a VDI client in the VDTC device and a VDI server in a hosted virtual desktop server (HVDS). A unified communications (UC) control connection is established between a UC protocol stack on the VDTC device and a primary call agent, where the UC control connection is configured to allow the UC protocol stack to register with the primary call agent, and to send or receive commands from the primary call agent that are based on signals from a UC control application running on the HVDS. A UC control backup application is started on the virtual desktop thin client device in a standby mode that is configured to switch to an active mode in response to a failure to establish or maintain the UC control connection, or a failure to establish or maintain the VDI connection. A user interface is launched on the virtual desktop thin client device that is configured to perform UC backup functions.
摘要翻译：提供了在虚拟桌面瘦客户机（VDTC）设备，VDTC设备中的VDI客户端和托管虚拟桌面服务器（HVDS）中的VDI服务器之间建立虚拟桌面接口（VDI）连接的技术。在VDTC设备上的UC协议栈和主呼叫代理之间建立统一通信（UC）控制连接，其中UC控制连接被配置为允许UC协议栈向主呼叫代理注册，并且发送或接收来自主呼叫代理的基于来自在HVDS上运行的UC控制应用的信号的命令。在虚拟桌面瘦客户端设备上启动UC控制备份应用程序，该备用模式被配置为响应于建立或维护UC控制连接的故障而切换到活动模式，或者未能建立或维护VDI 连接。在配置为执行UC备份功能的虚拟桌面瘦客户端设备上启动用户界面。

10. 发明授权

US08540857B1 Plating method and apparatus with multiple internally irrigated chambers 有权
标题翻译：具有多个内部灌溉室的电镀方法和装置
公开(公告)号：US08540857B1
公开(公告)日：2013-09-24
申请号：US13571199
申请日：2012-08-09
申请人： Steven Mayer , Shantinath Ghongadi , Kousik Ganesan , Zhian He , Jingbin Feng
发明人： Steven Mayer , Shantinath Ghongadi , Kousik Ganesan , Zhian He , Jingbin Feng
IPC分类号： C25B9/00 , C25D17/00 , C25D7/12
CPC分类号： C25D17/001 , C25D5/08 , C25D17/002 , C25D17/008
摘要： An apparatus for electroplating a layer of metal onto a work piece surface includes a membrane separating the chamber of the apparatus into a catholyte chamber and an anolyte chamber. In the catholyte chamber is a catholyte manifold region that includes a catholyte manifold and at least one flow distribution tube. The catholyte manifold and at least one flow distribution tube serve to mix and direct catholyte flow in the catholyte chamber. The provided configuration effectively reduces failure and improves the operational ranges of the apparatus.
摘要翻译：用于将金属层电镀到工件表面上的装置包括将装置的室分离成阴极电解液室和阳极电解液室的膜。在阴极电解液室中是阴极电解液歧管区域，其包括阴极电解液歧管和至少一个流量分布管。阴极电解液歧管和至少一个分流管用于混合和引导阴极电解液在阴极电解液室中的流动。所提供的配置有效地减少故障并改善设备的操作范围。

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