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    • 1. 发明授权
    • Process for electrodepositing zinc oxide film
    • 电沉积氧化锌膜的工艺
    • US06632346B2
    • 2003-10-14
    • US09897947
    • 2001-07-05
    • Kozo AraoNoboru ToyamaYuichi SonodaYusuke Miyamoto
    • Kozo AraoNoboru ToyamaYuichi SonodaYusuke Miyamoto
    • C25D1100
    • H01G9/2027C25D9/08C25D21/02H01L31/03921H01L31/1836Y02E10/542Y02P70/521
    • The present process for electrodepositing a zinc oxide film comprises the steps of immersing a substrate and an opposing electrode in an electrodeposition bath which contains zinc nitrate and is kept heated, and forming the zinc oxide film on the substrate by passing a current between the substrate and the opposing electrode, wherein the process further includes a step of trapping the particles of zinc oxide precipitated in the electrodeposition bath by circulating or stirring the bath before the formation of the zinc oxide film, whereby the present process can prevent the generated zinc oxide powder from depositing on the surfaces of the substrate and the zinc oxide film formed by electrodeposition when restarting or starting the formation of a zinc oxide film by the electrodeposition using an electrodeposition apparatus, and hence the formation of a uniform zinc oxide film free from defects.
    • 本发明的电沉积氧化锌膜的方法包括以下步骤:将基材和相对电极浸入含有硝酸锌的电沉积浴中并保持加热,并通过在基板和基板之间传递电流而在基板上形成氧化锌膜 所述对置电极,其中,所述方法还包括通过在形成所述氧化锌膜之前循环或搅拌所述浴来捕集在所述电沉积浴中析出的氧化锌颗粒的步骤,由此本发明的方法可以防止所产生的氧化锌粉末 当通过使用电沉积装置的电沉积来重新启动或开始形成氧化锌膜时,通过电沉积形成的基板和氧化锌膜的表面上沉积,从而形成均匀的没有缺陷的氧化锌膜。 PTEXT>
    • 5. 发明授权
    • Electrodeposition method
    • 电沉积法
    • US06475367B1
    • 2002-11-05
    • US09501522
    • 2000-02-09
    • Noboru ToyamaKozo AraoYuichi SonodaYusuke Miyamoto
    • Noboru ToyamaKozo AraoYuichi SonodaYusuke Miyamoto
    • C25D706
    • C25D9/08C25D7/0614C25D7/0657
    • There is disclosed an electrodeposition method capable of suppressing the drop in the power supply voltage and minimizing the heat loss by the electrodeposition current, thereby achieving uniform film formation with satisfactory characteristics. A conductive substrate is dipped in an electrodeposition bath held in an electrodeposition tank, and an oxide is electrolytically deposited on the conductive substrate. An electricity feed means as at least one electrode of the electrodeposition tank is composed of a conductive member so provided as to be in contact with a back surface of the conductive substrate, wherein the contact position of the electricity feed means and the conductive substrate is outside the electrodeposition bath, and wherein the resistance, including contact resistance, between the closer to the electricity feed means of a position of entry of the conductive substrate into the electrodeposition bath and a position of discharge of the conductive substrate from the electrodeposition bath, and the contact position of the conductive substrate with the electricity feed means is 20&OHgr; or less.
    • 公开了一种能够抑制电源电压降低并且通过电沉积电流最小化热损失的电沉积方法,从而获得具有令人满意的特性的均匀成膜。 将导电性基材浸渍在保持在电沉积槽中的电沉积浴中,氧化物电解沉积在导电性基材上。 一种供电装置,其特征在于,所述电沉积槽的至少一个电极由导电构件构成,所述导电构件设置为与所述导电基板的背面接触,其中所述供电装置和所述导电基板的接触位置在外部 电沉积浴,并且其中在导电基底进入电沉积浴的位置更接近馈电装置之间的电阻(包括接触电阻)和导电基底从电沉积浴放电的位置,以及 导电基板与供电装置的接触位置为20OMEGA以下。