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1. 发明专利

JP2012046422A Salt maker and salt making method 审中-公开
标题翻译：盐制造和盐制造方法
公开(公告)号：JP2012046422A
公开(公告)日：2012-03-08
申请号：JP2011241394
申请日：2011-11-02
申请人： Mitsubishi Heavy Ind Ltd , Tetsuro Nakamura , 三菱重工業株式会社 , 鉄郎中村
发明人： SAWASHIMA TOMOYUKI , AKIYAMA YOSHIKATSU , MUTA TOMOHIKO , NAKAMURA TETSURO
IPC分类号： C01D3/06 , B01D61/44 , B01D61/46 , C02F1/04 , C02F1/469
摘要： PROBLEM TO BE SOLVED: To provide a salt maker that can provide good concentration efficiency of marine water in an ion exchange membrane electrodialyzer and can reduce electric consumption required for raising the temperature of the marine water, and to provide a salt making method.SOLUTION: The salt maker 1 includes: the ion exchange membrane electrodialyzer for concentrating the marine water supplied through a supply path; a vaporization crystallization unit 9 for vaporizing the concentrated marine water to crystallize salt; a first path 6 for guiding the marine water to a turbine condenser at the prior stage of the ion exchange membrane electrodialyzer to use it as a refrigerant; and a second path 7 for guiding the marine water used as the refrigerant in the turbine condenser 11, to the supply path provided downstream of the first path 6.
摘要翻译：要解决的问题：提供一种能够提供离子交换膜电渗析器中的海水的高浓度效率的盐制造机，并且可以减少提高海水温度所需的电力消耗，并提供制盐方法。解决方案：制盐机1包括：用于浓缩通过供应路径供应的海水的离子交换膜电渗析器; 蒸发结晶单元9，用于蒸发浓缩的海水以结晶盐; 第一路径6，用于在离子交换膜电渗析器的前一阶段将海水引导到涡轮冷凝器以将其用作制冷剂; 以及用于将在涡轮冷凝器11中用作制冷剂的海水引导到设置在第一路径6下游的供给路径的第二路径7.（C）2012，JPO＆INPIT

2. 发明授权

US06835888B2 Stacked photovoltaic device 有权
标题翻译：堆叠式光伏器件
公开(公告)号：US06835888B2
公开(公告)日：2004-12-28
申请号：US10422171
申请日：2003-04-23
申请人： Masafumi Sano , Tetsuro Nakamura
发明人： Masafumi Sano , Tetsuro Nakamura
IPC分类号： H01L31075
CPC分类号： H01L31/076 , H01L31/1816 , H01L31/1824 , H01L31/202 , H01L31/206 , Y02E10/545 , Y02E10/548 , Y02P70/521
摘要： A stacked photovoltaic device comprises at least three p-i-n junction constituent devices superposed in layers, each having a p-type layer, an i-type layer and an n-type layer which are formed of silicon non-single crystal semiconductors. An amorphous silicon layer is used as the i-type layer of a first p-i-n junction, a microcrystalline silicon layer is used as the i-type layer of a second p-i-n junction and a microcrystalline silicon layer is used as the i-type layer of a third p-i-n junction, the first to third layers being in order from the light incident side. In this way, a stacked photovoltaic device can be provided which is practical and low-cost and yet has high reliability and high photoelectric conversion efficiency.
摘要翻译：层叠的光伏器件包括叠层的至少三个p-i-n结构成器件，每个具有由非硅单晶半导体形成的p型层，i型层和n型层。非晶硅层用作第一pin结的i型层，微晶硅层用作第二pin结的i型层，微晶硅层用作i型层第三针结，第一至第三层从光入射侧依次排列。以这种方式，可以提供实用且低成本但具有高可靠性和高光电转换效率的叠层光伏器件。

3. 发明授权

US5477047A Direct-contact type image sensor device, an image sensor unit, and methods for producing the same 失效
标题翻译：直接接触型图像传感器装置，图像传感器单元及其制造方法
公开(公告)号：US5477047A
公开(公告)日：1995-12-19
申请号：US141328
申请日：1993-10-21
申请人： Masahiro Nakagawa , Tetsuro Nakamura , Shinji Fujiwara , Eiichiro Tanaka
发明人： Masahiro Nakagawa , Tetsuro Nakamura , Shinji Fujiwara , Eiichiro Tanaka
IPC分类号： H04N1/031 , H01J40/14
CPC分类号： H04N1/0316 , H04N1/0313
摘要： A direct-contact type image sensor device according to the present invention includes: a light-transmitting substrate having an upper surface and a lower surface; a patterned conductor layer formed over the upper surface of the light-transmitting substrate; a transparent electrically conductive layer formed on the lower surface of the light-transmitting substrate; an image sensor chip mounted face-down on the upper surface of the light-transmitting substrate, with an insulating resin layer being interposed between the image sensor chip and the upper surface of the light-transmitting substrate, the image sensor chip being mounted by a flip-chip-bonding method, a light-interrupting layer provided between the patterned conductor layer and the upper surface of the light-transmitting substrate; and a light-interrupting portion for interrupting a portion of a light beam, the light beam being radiated on an original through the light-transmitting substrate by a light source disposed above the light-transmitting substrate. The image sensor chip and the light-interrupting portion serve as an optical throttle for the light beam.
摘要翻译：根据本发明的直接接触型图像传感器装置包括：具有上表面和下表面的透光基底; 形成在所述透光基板的上表面上的图案化导体层; 形成在所述透光基板的下表面上的透明导电层; 图像传感器芯片，其面向下安装在透光基板的上表面上，绝缘树脂层插入在图像传感器芯片和透光基板的上表面之间，图像传感器芯片由倒装芯片接合方法，设置在图案化导体层和透光基板的上表面之间的遮光层; 以及用于中断光束的一部分的遮光部，通过透光基板通过设置在透光基板上方的光源将光束照射在原稿上。图像传感器芯片和遮光部分用作光束的光学节流阀。

4. 发明授权

US5448055A Direct-contact type image sensor using optical fiber array with light absorbing cladding 失效
标题翻译：直接接触式图像传感器，采用光吸收包层光纤阵列
公开(公告)号：US5448055A
公开(公告)日：1995-09-05
申请号：US161123
申请日：1993-12-02
申请人： Tetsuro Nakamura , Eiji Kawamoto , Shinji Fujiwara
发明人： Tetsuro Nakamura , Eiji Kawamoto , Shinji Fujiwara
IPC分类号： G02B6/08 , H04N1/031 , H01J40/14
CPC分类号： H04N1/0312 , G02B6/08 , H04N1/0311 , H04N1/0315
摘要： The present invention provides a direct-contact type image sensor device in which an image sensor chip having electrodes and a photosensitive element array is mounted on an optical fiber array plate by a flip-chip-bonding method. The optical fiber array plate includes a first opaque substrate, a second opaque substrate, an optical fiber array formed by arranging a plurality of optical fibers, and a transparent member disposed in contact with a side face of the optical fiber array, the optical fiber array and the transparent member being interposed between the first and second opaque substrates. Each of the plurality of optical fibers includes a center core, a clad provided on an outer surface of the core, and a light absorbing layer provided on an outer surface of the clad. The image sensor chip is provided in such a way that the photosensitive element array is disposed along an upper end of the optical fiber array and in a portion of the optical fiber array plate except the transparent member, the transparent member forming a slit for transmitting light.
摘要翻译：本发明提供一种直接接触型图像传感器装置，其中具有电极和感光元件阵列的图像传感器芯片通过倒装芯片接合方法安装在光纤阵列板上。光纤阵列板包括：第一不透明基板，第二不透明基板，通过布置多根光纤形成的光纤阵列;以及与光纤阵列的侧面接触设置的透明部件，所述光纤阵列并且所述透明构件插入在所述第一和第二不透明基板之间。多个光纤中的每一个包括中心芯，设置在芯的外表面上的包层以及设置在包层的外表面上的光吸收层。图像传感器芯片以这样的方式设置，使得光敏元件阵列沿着光纤阵列的上端布置，并且在除了透明构件之外的光纤阵列板的一部分中，透明构件形成用于透射光的狭缝。

5. 发明授权

US5266828A Image sensors with an optical fiber array 失效
标题翻译：具有光纤阵列的图像传感器
公开(公告)号：US5266828A
公开(公告)日：1993-11-30
申请号：US884826
申请日：1992-05-18
申请人： Tetsuro Nakamura , Takahiko Murata , Shinji Fujiwara
发明人： Tetsuro Nakamura , Takahiko Murata , Shinji Fujiwara
IPC分类号： G02B6/42 , H04N1/031 , H01L27/14
CPC分类号： H04N1/0312 , G02B6/4249 , H01L27/14618 , H01L27/14625 , H04N1/0311 , H04N1/0316 , H01L2224/16 , H01L2924/01014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/12041
摘要： This invention relates to an image sensor with photo sensors (13). An object thereof is to simplify mounting operation of an image sensor chip (12) provided with the photo sensors (13). In order to accomplish this object, according to this invention, the photo sensors (13) and electrodes (15) are disposed on the underside of the image sensor chip (12). The image sensor chip (12) is bonded to the upper side of a transparent substrate (18) by means of a transparent photo-setting type insulating resin (16), so that the electrodes (15) come into contact with circuit conductor layers (17) disposed on the upper side of the transparent substrate (18). With the above-mentioned construction, since fine metal wire (75) by which the electrodes (15) and the circuit conductor layers (17) are connected to each other is not required, mounting operation can be simplified.
摘要翻译：本发明涉及具有光传感器（13）的图像传感器。其目的在于简化设置有光传感器（13）的图像传感器芯片（12）的安装操作。为了实现该目的，根据本发明，光传感器（13）和电极（15）设置在图像传感器芯片（12）的下侧。图像传感器芯片12通过透明光固定型绝缘树脂16与透明基板18的上侧接合，使得电极15与电路导体层（ 17）设置在透明基板（18）的上侧。利用上述结构，由于不需要将电极（15）和电路导体层（17）彼此连接的细金属线（75），因此可以简化安装操作。

6. 发明授权

US5138145A Method for producing image sensors with current flow into chip and with simplified chip mounting 失效
标题翻译：用于生产图像传感器的方法，电流流入芯片并具有简化的芯片安装
公开(公告)号：US5138145A
公开(公告)日：1992-08-11
申请号：US739562
申请日：1991-08-21
申请人： Tetsuro Nakamura , Takahiko Murata , Shinji Fujiwara
发明人： Tetsuro Nakamura , Takahiko Murata , Shinji Fujiwara
IPC分类号： G02B6/42 , H04N1/031
CPC分类号： H04N1/0312 , G02B6/4249 , H01L27/14618 , H01L27/14683 , H04N1/0311 , H04N1/0316 , H01L2224/16 , H01L2924/01014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/12041
摘要： Methods for the production of image sensors having simplified chip mounting are provided which comprise disposing a photo-setting type insulating resin on the upper side of a substrate, a portion of the substrate being transparent and having circuit conductor layers on its upper side; bringing an image sensor chip, the underside of which has electrodes, into contact with the upper side of the substrate so that the photo-setting type resin is wedged away and the electrodes come into contact with the corresponding circuit conductor layers; flowing current into the image sensor chip through the circuit conductor layers to determine that the image sensor chip operates in a normal manner; and irradiating the photo-setting type resin with light so that the resin is hardened.

7. 发明授权

US07116345B2 Image forming apparatus having a cooler for an organic electroluminescence element 失效
标题翻译：具有用于有机电致发光元件的冷却器的图像形成装置
公开(公告)号：US07116345B2
公开(公告)日：2006-10-03
申请号：US10726594
申请日：2003-12-04
申请人： Akira Gyoutoku , Takafumi Hamano , Yuuji Toyomura , Tetsuro Nakamura , Yuzo Kawano , Kenichi Masumoto
发明人： Akira Gyoutoku , Takafumi Hamano , Yuuji Toyomura , Tetsuro Nakamura , Yuzo Kawano , Kenichi Masumoto
IPC分类号： B41J2/45
CPC分类号： B41J29/377 , G03G15/04072 , G03G15/326 , G03G2215/00037 , G03G2215/0412
摘要： An image forming apparatus includes an exposer including an organic electroluminescence element including at least an anode for injecting a hole, a luminescent layer having a luminescent region and a cathode for injecting an electron on a board. A photosensitive member is formed with an electrostatic latent image by exposing light of the exposer, a developer forms a toner image on the photosensitive member by supplying a toner to the electrostatic latent image, and a cooler cools the organic electroluminescence element such that the temperature of the organic electroluminescence element can be controlled.
摘要翻译：图像形成装置包括曝光器，其包括至少包括用于注入孔的阳极的有机电致发光元件，具有发光区域的发光层和用于在电路板上注入电子的阴极。感光构件通过曝光曝光器的光而形成有静电潜像，显影剂通过向静电潜像供应调色剂而在感光构件上形成调色剂图像，并且冷却器冷却有机电致发光元件，使得温度可以控制有机电致发光元件。

8. 发明申请

US20060092123A1 Display device, electronic paper and electronic paper file 审中-公开
公开(公告)号：US20060092123A1
公开(公告)日：2006-05-04
申请号：US11290503
申请日：2005-12-01
申请人： Tetsuro Nakamura , Masichiro Tatekawa
发明人： Tetsuro Nakamura , Masichiro Tatekawa
IPC分类号： G09G3/36
CPC分类号： G02F1/133615 , G02F1/13473 , G02F1/13718 , G02F2001/133616 , G02F2001/13456 , G02F2203/02 , G06F3/14 , Y10S345/901
摘要： The invention comprises a display sheet, a light guide sheet and a light source provided to at least one side of the light guide sheet. And an electronic paper of the invention has a configuration for color display that the display sheet is made up by laminating respective display sheets for red, green and blue colors.

9. 发明授权

US07023418B2 Display device, electronic paper and electronic paper file 失效
公开(公告)号：US07023418B2
公开(公告)日：2006-04-04
申请号：US09906002
申请日：2001-07-17
申请人： Tetsuro Nakamura , Masichiro Tatekawa
发明人： Tetsuro Nakamura , Masichiro Tatekawa
IPC分类号： G09G3/36
CPC分类号： G02F1/133615 , G02F1/13473 , G02F1/13718 , G02F2001/133616 , G02F2001/13456 , G02F2203/02 , G06F3/14 , Y10S345/901
摘要： The invention comprises a display sheet, a light guide sheet and a light source provided to at least one side of the light guide sheet. And an electronic paper of the invention has a configuration for color display that the display sheet is made up by laminating respective display sheets for red, green and blue colors.

10. 发明授权

US06068755A Process for forming zinc oxide film and processes for producing semiconductor device plate and photo-electricity generating device using the film 失效
标题翻译：用于形成氧化锌膜的方法和使用该膜的半导体器件板和光电发生器件的制造方法
公开(公告)号：US06068755A
公开(公告)日：2000-05-30
申请号：US986826
申请日：1997-12-08
申请人： Koichi Matsuda , Yuichi Sonoda , Tetsuro Nakamura
发明人： Koichi Matsuda , Yuichi Sonoda , Tetsuro Nakamura
IPC分类号： C25D5/20 , C25D7/06 , C25D9/08 , H01L31/052 , H01L31/18 , C25D9/00
CPC分类号： C25D9/08 , C25D5/20 , C25D7/0621 , H01L31/056 , H01L31/1836 , H01L31/1884 , Y02E10/52
摘要： A zinc oxide film is formed on an electroconductive substrate by electrodeposition. The electrodeposition is performed by immersing an electroconductive substrate and an electrode in an aqueous solution containing nitrate ion and zinc ion, and supplying a current passing through a gap between the electroconductive substrate and the electrode while vibrating the electroconductive substrate to stably form a uniform zinc oxide film free from anomalous growth of a crystal on the electroconductive substrate. The zinc oxide film is excellent in adhesive properties with the electroconductive substrate and suitable for a light-confining layer of a photo-electricity generating device.
摘要翻译：通过电沉积在导电性基体上形成氧化锌膜。通过将导电性基材和电极浸渍在含有硝酸根离子和锌离子的水溶液中，通过导电性基板与电极间的间隙供给电流，同时使导电性基板振动而稳定地形成均匀的氧化锌导电基材上的晶体不会发生异常生长。氧化锌膜与导电性基材的粘合性优异，适用于光电发生装置的光束限制层。

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