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1. 发明授权

US08993378B2 Flip-chip BGA assembly process 有权
标题翻译：倒装芯片BGA组装工艺
公开(公告)号：US08993378B2
公开(公告)日：2015-03-31
申请号：US13225614
申请日：2011-09-06
申请人： Yu-Chih Liu , Jing Ruei Lu , Wei-Ting Lin , Sao-Ling Chiu , Hsin-Yu Pan
发明人： Yu-Chih Liu , Jing Ruei Lu , Wei-Ting Lin , Sao-Ling Chiu , Hsin-Yu Pan
IPC分类号： H01L21/50 , H01L23/00 , H01L23/498 , H01L21/683
CPC分类号： H01L21/50 , H01L21/6836 , H01L23/49816 , H01L24/13 , H01L24/16 , H01L24/75 , H01L24/81 , H01L2221/68327 , H01L2221/68381 , H01L2224/131 , H01L2224/1601 , H01L2224/7565 , H01L2224/75701 , H01L2224/7901 , H01L2224/81011 , H01L2224/81143 , H01L2224/81191 , H01L2224/81815 , H01L2224/94 , H01L2924/1461 , H01L2224/11 , H01L2924/00014 , H01L2924/206 , H01L2924/014 , H01L2924/00
摘要： A method for assembling a flip chip ball grid array package includes mounting solder spheres to a ball grid array substrate, applying flux to a plurality of flip chip solder bumps provided on a diced wafer, aligning the ball grid array substrate over a chip on the diced wafer, picking and separating the chip from the diced wafer by urging the chip upwards towards the ball grid array substrate until the flip chip solder bumps on the chip come in contact with the ball grid array substrate, whereby the chip attaches to the ball grid array substrate in an upside-down orientation, and subjecting the chip and the ball grid array substrate to a thermal process whereby the solder spheres reflow and form solder balls and the flip chip solder bumps reflow and form solder joints between the chip and the ball grid array.
摘要翻译：用于组装倒装芯片球栅阵列封装的方法包括将焊球安装到球栅阵列衬底上，将焊剂施加到设置在切割晶片上的多个倒装芯片焊料凸块，将球栅阵列衬底对准切割的芯片晶片，通过将芯片向上推动到球栅阵列衬底，将芯片从切割晶片中分离并分离，直到芯片上的倒装芯片焊料凸块与球栅阵列衬底接触，由此芯片附接到球栅阵列衬底，并且对芯片和球栅阵列基板进行热处理，由此焊料球回流并形成焊球，并且倒装芯片焊料凸起回流并在芯片和球栅阵列之间形成焊接点。

2. 发明申请

US20130059416A1 FLIP-CHIP BGA ASSEMBLY PROCESS 有权
标题翻译： FLIP-CHIP BGA组装工艺
公开(公告)号：US20130059416A1
公开(公告)日：2013-03-07
申请号：US13225614
申请日：2011-09-06
申请人： Yu-Chih LIU , Jing Ruei LU , Wei-Ting LIN , Sao-Ling CHIU , Hsin-Yu PAN
发明人： Yu-Chih LIU , Jing Ruei LU , Wei-Ting LIN , Sao-Ling CHIU , Hsin-Yu PAN
IPC分类号： H01L21/50
CPC分类号： H01L21/50 , H01L21/6836 , H01L23/49816 , H01L24/13 , H01L24/16 , H01L24/75 , H01L24/81 , H01L2221/68327 , H01L2221/68381 , H01L2224/131 , H01L2224/1601 , H01L2224/7565 , H01L2224/75701 , H01L2224/7901 , H01L2224/81011 , H01L2224/81143 , H01L2224/81191 , H01L2224/81815 , H01L2224/94 , H01L2924/1461 , H01L2224/11 , H01L2924/00014 , H01L2924/206 , H01L2924/014 , H01L2924/00
摘要： A method for assembling a flip chip ball grid array package includes mounting solder spheres to a ball grid array substrate, applying flux to a plurality of flip chip solder bumps provided on a diced wafer, aligning the ball grid array substrate over a chip on the diced wafer, picking and separating the chip from the diced wafer by urging the chip upwards towards the ball grid array substrate until the flip chip solder bumps on the chip come in contact with the ball grid array substrate, whereby the chip attaches to the ball grid array substrate in an upside-down orientation, and subjecting the chip and the ball grid array substrate to a thermal process whereby the solder spheres reflow and form solder balls and the flip chip solder bumps reflow and form solder joints between the chip and the ball grid array.
摘要翻译：用于组装倒装芯片球栅阵列封装的方法包括将焊球安装到球栅阵列衬底上，将焊剂施加到设置在切割晶片上的多个倒装芯片焊料凸块，将球栅阵列衬底对准切割的芯片晶片，通过将芯片向上推动到球栅阵列衬底，将芯片从切割晶片中分离并分离，直到芯片上的倒装芯片焊料凸块与球栅阵列衬底接触，由此芯片附接到球栅阵列衬底，并且对芯片和球栅阵列基板进行热处理，由此焊料球回流并形成焊球，并且倒装芯片焊料凸起回流并在芯片和球栅阵列之间形成焊接点。

3. 发明授权

US09887144B2 Ring structure for chip packaging 有权
公开(公告)号：US09887144B2
公开(公告)日：2018-02-06
申请号：US13227983
申请日：2011-09-08
申请人： Wen-Yi Lin , Yu-Chih Liu , Ming-Chih Yew , Tsung-Shu Lin , Bor-Rung Su , Jing Ruei Lu , Wei-Ting Lin
发明人： Wen-Yi Lin , Yu-Chih Liu , Ming-Chih Yew , Tsung-Shu Lin , Bor-Rung Su , Jing Ruei Lu , Wei-Ting Lin
IPC分类号： H01L23/10 , H01L23/16 , H01L23/36 , H01L21/56 , H01L23/00
CPC分类号： H01L23/10 , H01L21/563 , H01L23/16 , H01L23/36 , H01L24/16 , H01L24/32 , H01L24/33 , H01L2224/131 , H01L2224/16225 , H01L2224/29099 , H01L2224/32225 , H01L2224/32245 , H01L2224/33181 , H01L2224/73204 , H01L2224/73253 , H01L2924/15311 , H01L2924/3511 , H01L2924/00012 , H01L2924/00 , H01L2924/014 , H01L2924/00014
摘要： A ring structure for chip packaging comprises a frame portion adaptable to bond to a substrate and at least one corner portion. The frame portion surrounds a semiconductor chip and defines an inside opening, and the inside opening exposes a portion of a surface of the substrate. The at least one corner portion extends from a corner of the frame portion toward the chip, and the corner portion is free of a sharp corner.

4. 发明授权

US08664039B2 Methods and apparatus for alignment in flip chip bonding 有权
标题翻译：倒装芯片接合中对准的方法和装置
公开(公告)号：US08664039B2
公开(公告)日：2014-03-04
申请号：US13276162
申请日：2011-10-18
申请人： Ming-Chung Sung , Yu-Chih Liu , Wei-Ting Lin , Chien-Hsiun Lee
发明人： Ming-Chung Sung , Yu-Chih Liu , Wei-Ting Lin , Chien-Hsiun Lee
IPC分类号： H01L21/50
CPC分类号： H01L24/81 , H01L21/6836 , H01L24/13 , H01L24/75 , H01L2221/68386 , H01L2224/131 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/75183 , H01L2224/7526 , H01L2224/75272 , H01L2224/7565 , H01L2224/75725 , H01L2224/75745 , H01L2224/75753 , H01L2224/81011 , H01L2224/81024 , H01L2224/81132 , H01L2224/81193 , H01L2224/81815 , H01L2924/01029 , H01L2924/01322 , H01L2924/12042 , H01L2924/00014 , H01L2924/00 , H01L2924/014 , H01L2924/01047
摘要： Methods and apparatus for alignment in a flip chip bonding. A method includes attaching an integrated circuit having connector terminals to a bonding arm, the bonding arm having a chuck for attaching the integrated circuit at the backside surface, the bonding arm having a plurality of CCD imagers mounted thereon; receiving a substrate having pads corresponding to the connector terminals; using the bonding arm, positioning the integrated circuit proximal to the substrate; aligning the integrated circuit connector terminals with the pads on the substrate using the CCD imagers on the bonding arm; positioning the connector terminals in contact with the pads on the substrate; and performing a solder reflow to attach the integrated circuit to the substrate. An apparatus includes a bonding arm with a chuck for carrying a component and CCD imagers mounted on the arm for alignment.
摘要翻译：用于在倒装芯片接合中对准的方法和装置。一种方法包括将具有连接器端子的集成电路附接到接合臂，所述接合臂具有用于将所述集成电路附接在所述背面的卡盘，所述接合臂具有安装在其上的多个CCD成像器; 接收具有与所述连接器端子对应的衬垫的衬底; 使用接合臂，将集成电路定位在靠近基板的位置; 使用结合臂上的CCD成像器将集成电路连接器端子与衬底上的焊盘对准; 将连接器端子定位成与衬底上的焊盘接触; 并进行焊料回流以将集成电路连接到基板。一种装置包括具有用于承载组件的卡盘和安装在臂上用于对准的CCD成像器的结合臂。

5. 发明申请

US20140001652A1 PACKAGE-ON-PACKAGE STRUCTURE HAVING POLYMER-BASED MATERIAL FOR WARPAGE CONTROL 有权
标题翻译：具有聚合物材料的包装封装结构进行温度控制
公开(公告)号：US20140001652A1
公开(公告)日：2014-01-02
申请号：US13539136
申请日：2012-06-29
申请人： Meng-Tse CHEN , Yu-Chih LIU , Hui-Min HUANG , Wei-Hung LIN , Jing Ruei LU , Ming-Da CHENG , Chung-Shi LIU
发明人： Meng-Tse CHEN , Yu-Chih LIU , Hui-Min HUANG , Wei-Hung LIN , Jing Ruei LU , Ming-Da CHENG , Chung-Shi LIU
IPC分类号： H01L23/52 , H01L21/50
CPC分类号： H01L25/0652 , H01L21/561 , H01L21/563 , H01L23/00 , H01L23/293 , H01L23/3121 , H01L23/562 , H01L24/17 , H01L25/0655 , H01L25/50 , H01L2224/16 , H01L2224/32225 , H01L2224/73204 , H01L2224/92125 , H01L2225/06513 , H01L2225/06517 , H01L2225/06555 , H01L2225/06582 , H01L2924/15311
摘要： A package on package structure providing mechanical strength and warpage control includes a first package component, a second package component, and a first set of conductive elements coupling the first package component to the second package component. A first polymer-comprising material is molded on the first package component and surrounds the first set of conductive elements. The first polymer-comprising material has an opening therein exposing a top surface of the second package component. A third package component and a second set of conductive elements couples the second package component to the third package component.
摘要翻译：提供机械强度和翘曲控制的封装结构的封装包括第一封装元件，第二封装元件和将第一封装元件连接到第二封装元件的第一组导电元件。第一含聚合物的材料被模制在第一包装部件上并包围第一组导电元件。第一含聚合物的材料在其中具有露出第二包装部件的顶表面的开口。第三包装部件和第二组导电元件将第二包装部件耦合到第三包装部件。

6. 发明申请

US20130095607A1 Methods and Apparatus For Alignment In Flip Chip Bonding 有权
标题翻译：倒装芯片接合中对准的方法和装置
公开(公告)号：US20130095607A1
公开(公告)日：2013-04-18
申请号：US13276162
申请日：2011-10-18
申请人： Ming-Chung Sung , Yu-Chih Liu , Wei-Ting Lin , Chien-Hsiun Lee
发明人： Ming-Chung Sung , Yu-Chih Liu , Wei-Ting Lin , Chien-Hsiun Lee
IPC分类号： H01L21/50 , B29C65/78
CPC分类号： H01L24/81 , H01L21/6836 , H01L24/13 , H01L24/75 , H01L2221/68386 , H01L2224/131 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/75183 , H01L2224/7526 , H01L2224/75272 , H01L2224/7565 , H01L2224/75725 , H01L2224/75745 , H01L2224/75753 , H01L2224/81011 , H01L2224/81024 , H01L2224/81132 , H01L2224/81193 , H01L2224/81815 , H01L2924/01029 , H01L2924/01322 , H01L2924/12042 , H01L2924/00014 , H01L2924/00 , H01L2924/014 , H01L2924/01047
摘要： Methods and apparatus for alignment in a flip chip bonding. A method includes attaching an integrated circuit having connector terminals to a bonding arm, the bonding arm having a chuck for attaching the integrated circuit at the backside surface, the bonding arm having a plurality of CCD imagers mounted thereon; receiving a substrate having pads corresponding to the connector terminals; using the bonding arm, positioning the integrated circuit proximal to the substrate; aligning the integrated circuit connector terminals with the pads on the substrate using the CCD imagers on the bonding arm; positioning the connector terminals in contact with the pads on the substrate; and performing a solder reflow to attach the integrated circuit to the substrate. An apparatus includes a bonding arm with a chuck for carrying a component and CCD imagers mounted on the arm for alignment.
摘要翻译：用于在倒装芯片接合中对准的方法和装置。一种方法包括将具有连接器端子的集成电路附接到接合臂，所述接合臂具有用于将所述集成电路附接在所述背面的卡盘，所述接合臂具有安装在其上的多个CCD成像器; 接收具有与所述连接器端子对应的衬垫的衬底; 使用接合臂，将集成电路定位在靠近基板的位置; 使用结合臂上的CCD成像器将集成电路连接器端子与衬底上的焊盘对准; 将连接器端子定位成与衬底上的焊盘接触; 并进行焊料回流以将集成电路连接到基板。一种装置包括具有用于承载组件的卡盘和安装在臂上用于对准的CCD成像器的结合臂。

7. 发明申请

US20130082920A1 CONTENT-DRIVEN INPUT APPARATUS AND METHOD FOR CONTROLLING ELECTRONIC DEVICES 审中-公开
标题翻译：内装式输入装置及控制电子装置的方法
公开(公告)号：US20130082920A1
公开(公告)日：2013-04-04
申请号：US13600215
申请日：2012-08-31
申请人： Tun-Hao You , Yu-Chih Liu , Yi-Jen Yeh
发明人： Tun-Hao You , Yu-Chih Liu , Yi-Jen Yeh
IPC分类号： G09G5/00
CPC分类号： G11B19/027
摘要： A content-driven apparatus for controlling electronic devices integrates all control command functions for at least one controlled electronic device. Content information transmitted from one of the controlled electronic devices is received by a communication module, and is passed to a processing element for parsing the content information, including types of the content information, desired command actions to be proceeded, controlled electronic devices required to cooperate, and how to operate for a user. The processing element decides a user interface and an operation method for the user after the parsing, and issues corresponding control messages to the controlled electronic devices required to cooperate after the user uses the operation method to select specific control commands.
摘要翻译：用于控制电子设备的内容驱动设备将用于至少一个受控电子设备的所有控制命令功能集成。从受控电子设备之一发送的内容信息由通信模块接收，并被传送到处理元件，用于解析内容信息的类型，内容信息的类型，要进行的期望命令动作，所需的控制电子设备，以及如何为用户操作。处理单元在解析之后决定用户界面和用户的操作方法，并且在用户使用操作方法选择特定控制命令之后，向需要协作的受控电子设备发出相应的控制消息。

8. 发明申请

US20050094504A1 Method of opening/closing a disk tray in a disk drive 失效
标题翻译：打开/关闭磁盘驱动器中的磁盘托盘的方法
公开(公告)号：US20050094504A1
公开(公告)日：2005-05-05
申请号：US10700556
申请日：2003-11-05
申请人： Yu-Chih Liu
发明人： Yu-Chih Liu
IPC分类号： G11B7/085 , G11B17/04
CPC分类号： G11B17/056
摘要： A method for opening/closing a disk tray of a disk drive. The method includes the steps of when a first event occurs, sending a load/unload command to the disk drive, to which the disk drive responds with a second or third event, and resends the load/unload command to the disk drive when the disk drive responds to the previous load/unload command with the second event.
摘要翻译：一种用于打开/关闭磁盘驱动器的盘托盘的方法。该方法包括以下步骤：当第一个事件发生时，向磁盘驱动器发送加载/卸载命令，磁盘驱动器用第二个或第三个事件进行响应，并且当磁盘驱动器重新发送加载/卸载命令到磁盘驱动器驱动器响应先前的加载/卸载命令与第二个事件。

9. 发明授权

US06698559B1 Hydraulic damping device 失效
标题翻译：液压减震装置
公开(公告)号：US06698559B1
公开(公告)日：2004-03-02
申请号：US10347342
申请日：2003-01-21
申请人： Wen-Guey Liou , Chao-Hsuan Liu , Yu-Chih Liu , Chieh-Feng Liu
发明人： Wen-Guey Liou , Chao-Hsuan Liu , Yu-Chih Liu , Chieh-Feng Liu
IPC分类号： F16F949
CPC分类号： B62K25/04 , F16F9/3487 , F16F9/516
摘要： A hydraulic damping device has a cylinder, a rod, a piston, a first biasing member, a seal and a second biasing member. The rod moveably extends into the cylinder. The piston is securely attached to the rod to divide the cylinder into two chambers. The piston has multiple first channels and multiple second channels communicating with the chambers, wherein each first channel has a diameter larger than that of each second channel. The first biasing member is connected to the rod to provide a recoil force to the rod. The seal is moveably mounted on the rod and abuts against the piston to close the first channels in the piston. The second biasing member is mounted on the rod to provide a force to push the seal. Accordingly, the hydraulic damping device has a capability of adjusting the damping effect and has a simplified structure.
摘要翻译：液压阻尼装置具有气缸，杆，活塞，第一偏压构件，密封件和第二偏压构件。杆可移动地延伸到气缸中。活塞牢固地连接到杆上，以将气缸分成两个腔室。活塞具有多个第一通道和与室连通的多个第二通道，其中每个第一通道的直径大于每个第二通道的直径。第一偏置构件连接到杆以向杆提供反冲力。密封件可移动地安装在杆上并抵靠活塞以封闭活塞中的第一通道。第二偏置构件安装在杆上以提供推动密封的力。因此，液压阻尼装置具有调节阻尼效果的能力，并且具有简化的结构。

10. 发明授权

US09349663B2 Package-on-package structure having polymer-based material for warpage control 有权
标题翻译：包装封装结构，具有用于翘曲控制的聚合物基材料
公开(公告)号：US09349663B2
公开(公告)日：2016-05-24
申请号：US13539136
申请日：2012-06-29
申请人： Meng-Tse Chen , Yu-Chih Liu , Hui-Min Huang , Wei-Hung Lin , Jing Ruei Lu , Ming-Da Cheng , Chung-Shi Liu
发明人： Meng-Tse Chen , Yu-Chih Liu , Hui-Min Huang , Wei-Hung Lin , Jing Ruei Lu , Ming-Da Cheng , Chung-Shi Liu
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40 , H01L23/00 , H01L23/31 , H01L21/56 , H01L25/065
CPC分类号： H01L25/0652 , H01L21/561 , H01L21/563 , H01L23/00 , H01L23/293 , H01L23/3121 , H01L23/562 , H01L24/17 , H01L25/0655 , H01L25/50 , H01L2224/16 , H01L2224/32225 , H01L2224/73204 , H01L2224/92125 , H01L2225/06513 , H01L2225/06517 , H01L2225/06555 , H01L2225/06582 , H01L2924/15311
摘要： A package on package structure providing mechanical strength and warpage control includes a first package component, a second package component, and a first set of conductive elements coupling the first package component to the second package component. A first polymer-comprising material is molded on the first package component and surrounds the first set of conductive elements. The first polymer-comprising material has an opening therein exposing a top surface of the second package component. A third package component and a second set of conductive elements couples the second package component to the third package component.
摘要翻译：提供机械强度和翘曲控制的封装结构的封装包括第一封装元件，第二封装元件和将第一封装元件连接到第二封装元件的第一组导电元件。第一含聚合物的材料被模制在第一包装部件上并包围第一组导电元件。第一含聚合物的材料在其中具有露出第二包装部件的顶表面的开口。第三包装部件和第二组导电元件将第二包装部件耦合到第三包装部件。

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