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1. 发明授权

US09887144B2 Ring structure for chip packaging 有权
公开(公告)号：US09887144B2
公开(公告)日：2018-02-06
申请号：US13227983
申请日：2011-09-08
申请人： Wen-Yi Lin , Yu-Chih Liu , Ming-Chih Yew , Tsung-Shu Lin , Bor-Rung Su , Jing Ruei Lu , Wei-Ting Lin
发明人： Wen-Yi Lin , Yu-Chih Liu , Ming-Chih Yew , Tsung-Shu Lin , Bor-Rung Su , Jing Ruei Lu , Wei-Ting Lin
IPC分类号： H01L23/10 , H01L23/16 , H01L23/36 , H01L21/56 , H01L23/00
CPC分类号： H01L23/10 , H01L21/563 , H01L23/16 , H01L23/36 , H01L24/16 , H01L24/32 , H01L24/33 , H01L2224/131 , H01L2224/16225 , H01L2224/29099 , H01L2224/32225 , H01L2224/32245 , H01L2224/33181 , H01L2224/73204 , H01L2224/73253 , H01L2924/15311 , H01L2924/3511 , H01L2924/00012 , H01L2924/00 , H01L2924/014 , H01L2924/00014
摘要： A ring structure for chip packaging comprises a frame portion adaptable to bond to a substrate and at least one corner portion. The frame portion surrounds a semiconductor chip and defines an inside opening, and the inside opening exposes a portion of a surface of the substrate. The at least one corner portion extends from a corner of the frame portion toward the chip, and the corner portion is free of a sharp corner.

2. 发明授权

US09147584B2 Rotating curing 有权
标题翻译：旋转固化
公开(公告)号：US09147584B2
公开(公告)日：2015-09-29
申请号：US13297390
申请日：2011-11-16
申请人： Jing Ruei Lu , Yu-Chih Liu , Ming-Chung Sung , Wei-Ting Lin , Chien-Kuo Chang
发明人： Jing Ruei Lu , Yu-Chih Liu , Ming-Chung Sung , Wei-Ting Lin , Chien-Kuo Chang
IPC分类号： H01L21/50 , H01L23/29 , H01L21/56 , H01L21/67 , H01L21/687
CPC分类号： H01L21/56 , H01L21/563 , H01L21/67109 , H01L21/68764 , H01L2924/0002 , H01L2924/00
摘要： A system for and a method of curing a material is provided. A material, such as an underfill material, is rotated during a curing process. The curing system may include a chamber, a holder to support one or more workpieces, and a rotating mechanism. The rotating mechanism rotates the workpieces during the curing process. The chamber may include one or more heat sources and fans, and may further include a controller. The curing process may include varying the rotation speed, continuously rotating, periodically rotating, or the like.
摘要翻译：提供了一种用于固化材料的系统和方法。诸如底部填充材料的材料在固化过程中旋转。固化系统可以包括腔室，用于支撑一个或多个工件的保持器和旋转机构。旋转机构在固化过程中使工件旋转。腔室可以包括一个或多个热源和风扇，并且还可以包括控制器。固化过程可以包括改变旋转速度，连续旋转，周期性旋转等。

3. 发明申请

US20130119565A1 Rotating Curing 有权
标题翻译：旋转固化
公开(公告)号：US20130119565A1
公开(公告)日：2013-05-16
申请号：US13297390
申请日：2011-11-16
申请人： Jing Ruei Lu , Yu-Chih Liu , Ming-Chung Sung , Wei-Ting Lin , Chien-Kuo Chang
发明人： Jing Ruei Lu , Yu-Chih Liu , Ming-Chung Sung , Wei-Ting Lin , Chien-Kuo Chang
IPC分类号： H01L23/29 , H05B1/02 , F24C7/08
CPC分类号： H01L21/56 , H01L21/563 , H01L21/67109 , H01L21/68764 , H01L2924/0002 , H01L2924/00
摘要： A system for and a method of curing a material is provided. A material, such as an underfill material, is rotated during a curing process. The curing system may include a chamber, a holder to support one or more workpieces, and a rotating mechanism. The rotating mechanism rotates the workpieces during the curing process. The chamber may include one or more heat sources and fans, and may further include a controller. The curing process may include varying the rotation speed, continuously rotating, periodically rotating, or the like.
摘要翻译：提供了一种用于固化材料的系统和方法。诸如底部填充材料的材料在固化过程中旋转。固化系统可以包括腔室，用于支撑一个或多个工件的保持器和旋转机构。旋转机构在固化过程中使工件旋转。腔室可以包括一个或多个热源和风扇，并且还可以包括控制器。固化过程可以包括改变旋转速度，连续旋转，周期性旋转等。

4. 发明授权

US08993378B2 Flip-chip BGA assembly process 有权
标题翻译：倒装芯片BGA组装工艺
公开(公告)号：US08993378B2
公开(公告)日：2015-03-31
申请号：US13225614
申请日：2011-09-06
申请人： Yu-Chih Liu , Jing Ruei Lu , Wei-Ting Lin , Sao-Ling Chiu , Hsin-Yu Pan
发明人： Yu-Chih Liu , Jing Ruei Lu , Wei-Ting Lin , Sao-Ling Chiu , Hsin-Yu Pan
IPC分类号： H01L21/50 , H01L23/00 , H01L23/498 , H01L21/683
CPC分类号： H01L21/50 , H01L21/6836 , H01L23/49816 , H01L24/13 , H01L24/16 , H01L24/75 , H01L24/81 , H01L2221/68327 , H01L2221/68381 , H01L2224/131 , H01L2224/1601 , H01L2224/7565 , H01L2224/75701 , H01L2224/7901 , H01L2224/81011 , H01L2224/81143 , H01L2224/81191 , H01L2224/81815 , H01L2224/94 , H01L2924/1461 , H01L2224/11 , H01L2924/00014 , H01L2924/206 , H01L2924/014 , H01L2924/00
摘要： A method for assembling a flip chip ball grid array package includes mounting solder spheres to a ball grid array substrate, applying flux to a plurality of flip chip solder bumps provided on a diced wafer, aligning the ball grid array substrate over a chip on the diced wafer, picking and separating the chip from the diced wafer by urging the chip upwards towards the ball grid array substrate until the flip chip solder bumps on the chip come in contact with the ball grid array substrate, whereby the chip attaches to the ball grid array substrate in an upside-down orientation, and subjecting the chip and the ball grid array substrate to a thermal process whereby the solder spheres reflow and form solder balls and the flip chip solder bumps reflow and form solder joints between the chip and the ball grid array.
摘要翻译：用于组装倒装芯片球栅阵列封装的方法包括将焊球安装到球栅阵列衬底上，将焊剂施加到设置在切割晶片上的多个倒装芯片焊料凸块，将球栅阵列衬底对准切割的芯片晶片，通过将芯片向上推动到球栅阵列衬底，将芯片从切割晶片中分离并分离，直到芯片上的倒装芯片焊料凸块与球栅阵列衬底接触，由此芯片附接到球栅阵列衬底，并且对芯片和球栅阵列基板进行热处理，由此焊料球回流并形成焊球，并且倒装芯片焊料凸起回流并在芯片和球栅阵列之间形成焊接点。

5. 发明授权

US08288208B1 Apparatus and methods for semiconductor packages with improved warpage 有权
标题翻译：具有改善翘曲的半导体封装的装置和方法
公开(公告)号：US08288208B1
公开(公告)日：2012-10-16
申请号：US13192379
申请日：2011-07-27
申请人： Yu-Chih Liu , Jing Ruei Lu , Wei-Ting Lin , Sao-Ling Chiu , Chien-Kuo Chang
发明人： Yu-Chih Liu , Jing Ruei Lu , Wei-Ting Lin , Sao-Ling Chiu , Chien-Kuo Chang
IPC分类号： H01L21/44
CPC分类号： H01L23/3677 , H01L21/50 , H01L21/563 , H01L23/42 , H01L23/562 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/01322 , H01L2924/10253 , H01L2924/1461 , H01L2924/00
摘要： Methods for making a substrate for semiconductor packaging with improved warpage and an apparatus. A method includes providing on a die side of a substrate at least one flip chip mounted integrated circuit die. The substrate may include through substrate vias (TSVs). An underfill is dispensed between the integrated circuit die and the substrate. Initially the underfill is left uncured. A thermal interface material is provided on the upper surface of the at least one integrated circuit die. A heat sink is mounted over the integrated circuit die and in thermal contact with the thermal interface material. A thermal cure is performed to simultaneously cure the underfill material and the thermal interface material. In another embodiment, the thermal cure may simultaneously cure an adhesive mounting the heat sink to the substrate. Solder balls are disposed on a board surface of the substrate to form a ball grid array package.
摘要翻译：用于制造具有改进的翘曲的半导体封装用基板的方法和装置。一种方法包括在衬底的裸片侧提供至少一个倒装芯片安装的集成电路管芯。衬底可以包括通过衬底通孔（TSV）。在集成电路管芯和衬底之间分配底部填充物。最初，底部填充物未固化。在所述至少一个集成电路管芯的上表面上设置热界面材料。散热器安装在集成电路管芯上并与热界面材料热接触。进行热固化以同时固化底部填充材料和热界面材料。在另一个实施例中，热固化可以同时固化将散热器安装到基板上的粘合剂。焊球设置在基板的板表面上以形成球栅阵列封装。

6. 发明授权

US08916419B2 Lid attach process and apparatus for fabrication of semiconductor packages 有权
标题翻译：用于制造半导体封装的盖子附接工艺和装置
公开(公告)号：US08916419B2
公开(公告)日：2014-12-23
申请号：US13494814
申请日：2012-06-12
申请人： Chin-Liang Chen , Wei-Ting Lin , Yu-Chih Liu , Kuan-Lin Ho , Jason Shen
发明人： Chin-Liang Chen , Wei-Ting Lin , Yu-Chih Liu , Kuan-Lin Ho , Jason Shen
IPC分类号： H01L21/00
CPC分类号： H01L21/56 , H01L21/565 , H01L24/27 , H01L24/743 , H01L24/75 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2224/75611 , H01L2924/16152 , H01L2924/00
摘要： A semiconductor package assembly process that includes attaching one or more dies to a substrate; applying an adhesive material on a periphery of the substrate by an adhesive dispenser having a stamp-type dispensing head; applying a thermal interface material (TIM) on a top surface of the die by a TIM dispenser having a stamp-type dispensing head; and positioning a lid over the one or more dies and placing the lid on top of the adhesive material and the TIM by a lid carrier to encapsulate the one or more dies.
摘要翻译：一种半导体封装组装工艺，包括将一个或多个管芯附接到衬底; 通过具有印模式分配头的粘合剂分配器将粘合剂材料施加在基材的周边上; 通过具有印模式分配头的TIM分配器将热界面材料（TIM）施加在模具的顶表面上; 以及将盖子定位在所述一个或多个模具上，并且通过盖子载体将所述盖子放置在所述粘合剂材料和所述TIM的顶部上以封装所述一个或多个模具。

7. 发明申请

US20130093094A1 Method and Apparatus for Die Assembly 有权
标题翻译：模具组装方法与装置
公开(公告)号：US20130093094A1
公开(公告)日：2013-04-18
申请号：US13276184
申请日：2011-10-18
申请人： Ming-Chung Sung , Yu-Chih Liu , Wei-Ting Lin , Chien-Hsiun Lee
发明人： Ming-Chung Sung , Yu-Chih Liu , Wei-Ting Lin , Chien-Hsiun Lee
IPC分类号： H01L23/48 , H01L21/78
CPC分类号： H01L23/3114 , H01L21/561 , H01L21/6836 , H01L21/78 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , H01L2224/73104
摘要： Methods and apparatus for die assembly. A method includes forming a trench extending from an active surface of a semiconductor substrate comprising a plurality of integrated circuit dies having connector terminals extending from the active surface, the trench extending into, but not through, the semiconductor substrate; forming a protective layer overlying the active surface of the semiconductor substrate and the trench, and covering the lower portion of the connector terminals; opening a pre-dicing opening in the protective layer and within the trench; applying a tape over the active surface of the semiconductor wafer, the protective layer and the connector terminals; and performing an operation on a backside of the semiconductor substrate to remove material until the pre-dicing opening is exposed on the backside of the semiconductor wafer. An apparatus includes a semiconductor substrate with integrated circuits and a protective layer surrounding connector terminals of integrated circuits.
摘要翻译：模具组装的方法和装置一种方法包括形成从半导体衬底的有源表面延伸的沟槽，其包括多个集成电路管芯，所述多个集成电路管芯具有从所述有源表面延伸的连接器端子，形成覆盖在半导体衬底和沟槽的有源表面上的保护层，并覆盖连接器端子的下部; 在保护层和沟槽内打开预切割开口; 在半导体晶片的有源表面，保护层和连接器端子上施加带; 以及在半导体衬底的背面进行操作以去除材料，直到在半导体晶片的背面露出预切割开口。一种装置包括具有集成电路的半导体衬底和围绕集成电路的连接器端子的保护层。

8. 发明授权

US08652939B2 Method and apparatus for die assembly 有权
标题翻译：模具组装方法和装置
公开(公告)号：US08652939B2
公开(公告)日：2014-02-18
申请号：US13276184
申请日：2011-10-18
申请人： Ming-Chung Sung , Yu-Chih Liu , Wei-Ting Lin , Chien-Hsiun Lee
发明人： Ming-Chung Sung , Yu-Chih Liu , Wei-Ting Lin , Chien-Hsiun Lee
IPC分类号： H01L21/00
CPC分类号： H01L23/3114 , H01L21/561 , H01L21/6836 , H01L21/78 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , H01L2224/73104
摘要： Methods and apparatus for die assembly. A method includes forming a trench extending from an active surface of a semiconductor substrate comprising a plurality of integrated circuit dies having connector terminals extending from the active surface, the trench extending into, but not through, the semiconductor substrate; forming a protective layer overlying the active surface of the semiconductor substrate and the trench, and covering the lower portion of the connector terminals; opening a pre-dicing opening in the protective layer and within the trench; applying a tape over the active surface of the semiconductor wafer, the protective layer and the connector terminals; and performing an operation on a backside of the semiconductor substrate to remove material until the pre-dicing opening is exposed on the backside of the semiconductor wafer. An apparatus includes a semiconductor substrate with integrated circuits and a protective layer surrounding connector terminals of integrated circuits.
摘要翻译：模具组装的方法和装置一种方法包括形成从半导体衬底的有源表面延伸的沟槽，其包括多个集成电路管芯，所述多个集成电路管芯具有从所述有源表面延伸的连接器端子，形成覆盖在半导体衬底和沟槽的有源表面上的保护层，并覆盖连接器端子的下部; 在保护层和沟槽内打开预切割开口; 在半导体晶片的有源表面，保护层和连接器端子上施加带; 以及在半导体衬底的背面进行操作以去除材料，直到在半导体晶片的背面露出预切割开口。一种装置包括具有集成电路的半导体衬底和围绕集成电路的连接器端子的保护层。

9. 发明授权

US08664039B2 Methods and apparatus for alignment in flip chip bonding 有权
标题翻译：倒装芯片接合中对准的方法和装置
公开(公告)号：US08664039B2
公开(公告)日：2014-03-04
申请号：US13276162
申请日：2011-10-18
申请人： Ming-Chung Sung , Yu-Chih Liu , Wei-Ting Lin , Chien-Hsiun Lee
发明人： Ming-Chung Sung , Yu-Chih Liu , Wei-Ting Lin , Chien-Hsiun Lee
IPC分类号： H01L21/50
CPC分类号： H01L24/81 , H01L21/6836 , H01L24/13 , H01L24/75 , H01L2221/68386 , H01L2224/131 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/75183 , H01L2224/7526 , H01L2224/75272 , H01L2224/7565 , H01L2224/75725 , H01L2224/75745 , H01L2224/75753 , H01L2224/81011 , H01L2224/81024 , H01L2224/81132 , H01L2224/81193 , H01L2224/81815 , H01L2924/01029 , H01L2924/01322 , H01L2924/12042 , H01L2924/00014 , H01L2924/00 , H01L2924/014 , H01L2924/01047
摘要： Methods and apparatus for alignment in a flip chip bonding. A method includes attaching an integrated circuit having connector terminals to a bonding arm, the bonding arm having a chuck for attaching the integrated circuit at the backside surface, the bonding arm having a plurality of CCD imagers mounted thereon; receiving a substrate having pads corresponding to the connector terminals; using the bonding arm, positioning the integrated circuit proximal to the substrate; aligning the integrated circuit connector terminals with the pads on the substrate using the CCD imagers on the bonding arm; positioning the connector terminals in contact with the pads on the substrate; and performing a solder reflow to attach the integrated circuit to the substrate. An apparatus includes a bonding arm with a chuck for carrying a component and CCD imagers mounted on the arm for alignment.
摘要翻译：用于在倒装芯片接合中对准的方法和装置。一种方法包括将具有连接器端子的集成电路附接到接合臂，所述接合臂具有用于将所述集成电路附接在所述背面的卡盘，所述接合臂具有安装在其上的多个CCD成像器; 接收具有与所述连接器端子对应的衬垫的衬底; 使用接合臂，将集成电路定位在靠近基板的位置; 使用结合臂上的CCD成像器将集成电路连接器端子与衬底上的焊盘对准; 将连接器端子定位成与衬底上的焊盘接触; 并进行焊料回流以将集成电路连接到基板。一种装置包括具有用于承载组件的卡盘和安装在臂上用于对准的CCD成像器的结合臂。

10. 发明申请

US20130095607A1 Methods and Apparatus For Alignment In Flip Chip Bonding 有权
标题翻译：倒装芯片接合中对准的方法和装置
公开(公告)号：US20130095607A1
公开(公告)日：2013-04-18
申请号：US13276162
申请日：2011-10-18
申请人： Ming-Chung Sung , Yu-Chih Liu , Wei-Ting Lin , Chien-Hsiun Lee
发明人： Ming-Chung Sung , Yu-Chih Liu , Wei-Ting Lin , Chien-Hsiun Lee
IPC分类号： H01L21/50 , B29C65/78
CPC分类号： H01L24/81 , H01L21/6836 , H01L24/13 , H01L24/75 , H01L2221/68386 , H01L2224/131 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/75183 , H01L2224/7526 , H01L2224/75272 , H01L2224/7565 , H01L2224/75725 , H01L2224/75745 , H01L2224/75753 , H01L2224/81011 , H01L2224/81024 , H01L2224/81132 , H01L2224/81193 , H01L2224/81815 , H01L2924/01029 , H01L2924/01322 , H01L2924/12042 , H01L2924/00014 , H01L2924/00 , H01L2924/014 , H01L2924/01047
摘要： Methods and apparatus for alignment in a flip chip bonding. A method includes attaching an integrated circuit having connector terminals to a bonding arm, the bonding arm having a chuck for attaching the integrated circuit at the backside surface, the bonding arm having a plurality of CCD imagers mounted thereon; receiving a substrate having pads corresponding to the connector terminals; using the bonding arm, positioning the integrated circuit proximal to the substrate; aligning the integrated circuit connector terminals with the pads on the substrate using the CCD imagers on the bonding arm; positioning the connector terminals in contact with the pads on the substrate; and performing a solder reflow to attach the integrated circuit to the substrate. An apparatus includes a bonding arm with a chuck for carrying a component and CCD imagers mounted on the arm for alignment.
摘要翻译：用于在倒装芯片接合中对准的方法和装置。一种方法包括将具有连接器端子的集成电路附接到接合臂，所述接合臂具有用于将所述集成电路附接在所述背面的卡盘，所述接合臂具有安装在其上的多个CCD成像器; 接收具有与所述连接器端子对应的衬垫的衬底; 使用接合臂，将集成电路定位在靠近基板的位置; 使用结合臂上的CCD成像器将集成电路连接器端子与衬底上的焊盘对准; 将连接器端子定位成与衬底上的焊盘接触; 并进行焊料回流以将集成电路连接到基板。一种装置包括具有用于承载组件的卡盘和安装在臂上用于对准的CCD成像器的结合臂。

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