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1. 发明申请

US20130059416A1 FLIP-CHIP BGA ASSEMBLY PROCESS 有权
标题翻译： FLIP-CHIP BGA组装工艺
公开(公告)号：US20130059416A1
公开(公告)日：2013-03-07
申请号：US13225614
申请日：2011-09-06
申请人： Yu-Chih LIU , Jing Ruei LU , Wei-Ting LIN , Sao-Ling CHIU , Hsin-Yu PAN
发明人： Yu-Chih LIU , Jing Ruei LU , Wei-Ting LIN , Sao-Ling CHIU , Hsin-Yu PAN
IPC分类号： H01L21/50
CPC分类号： H01L21/50 , H01L21/6836 , H01L23/49816 , H01L24/13 , H01L24/16 , H01L24/75 , H01L24/81 , H01L2221/68327 , H01L2221/68381 , H01L2224/131 , H01L2224/1601 , H01L2224/7565 , H01L2224/75701 , H01L2224/7901 , H01L2224/81011 , H01L2224/81143 , H01L2224/81191 , H01L2224/81815 , H01L2224/94 , H01L2924/1461 , H01L2224/11 , H01L2924/00014 , H01L2924/206 , H01L2924/014 , H01L2924/00
摘要： A method for assembling a flip chip ball grid array package includes mounting solder spheres to a ball grid array substrate, applying flux to a plurality of flip chip solder bumps provided on a diced wafer, aligning the ball grid array substrate over a chip on the diced wafer, picking and separating the chip from the diced wafer by urging the chip upwards towards the ball grid array substrate until the flip chip solder bumps on the chip come in contact with the ball grid array substrate, whereby the chip attaches to the ball grid array substrate in an upside-down orientation, and subjecting the chip and the ball grid array substrate to a thermal process whereby the solder spheres reflow and form solder balls and the flip chip solder bumps reflow and form solder joints between the chip and the ball grid array.
摘要翻译：用于组装倒装芯片球栅阵列封装的方法包括将焊球安装到球栅阵列衬底上，将焊剂施加到设置在切割晶片上的多个倒装芯片焊料凸块，将球栅阵列衬底对准切割的芯片晶片，通过将芯片向上推动到球栅阵列衬底，将芯片从切割晶片中分离并分离，直到芯片上的倒装芯片焊料凸块与球栅阵列衬底接触，由此芯片附接到球栅阵列衬底，并且对芯片和球栅阵列基板进行热处理，由此焊料球回流并形成焊球，并且倒装芯片焊料凸起回流并在芯片和球栅阵列之间形成焊接点。

2. 发明申请

US20130062752A1 RING STRUCTURE FOR CHIP PACKAGING 有权
标题翻译：芯片包装环形结构
公开(公告)号：US20130062752A1
公开(公告)日：2013-03-14
申请号：US13227983
申请日：2011-09-08
申请人： Wen-Yi LIN , Yu-Chih LIU , Ming-Chih YEW , Tsung-Shu LIN , Bor-Rung SU , Jing Ruei LU , Wei-Ting LIN
发明人： Wen-Yi LIN , Yu-Chih LIU , Ming-Chih YEW , Tsung-Shu LIN , Bor-Rung SU , Jing Ruei LU , Wei-Ting LIN
IPC分类号： H01L23/58
CPC分类号： H01L23/10 , H01L21/563 , H01L23/16 , H01L23/36 , H01L24/16 , H01L24/32 , H01L24/33 , H01L2224/131 , H01L2224/16225 , H01L2224/29099 , H01L2224/32225 , H01L2224/32245 , H01L2224/33181 , H01L2224/73204 , H01L2224/73253 , H01L2924/15311 , H01L2924/3511 , H01L2924/00012 , H01L2924/00 , H01L2924/014 , H01L2924/00014
摘要： A ring structure for chip packaging comprises a frame portion adaptable to bond to a substrate and at least one corner portion. The frame portion surrounds a semiconductor chip and defines an inside opening, and the inside opening exposes a portion of a surface of the substrate. The at least one corner portion extends from a corner of the frame portion toward the chip, and the corner portion is free of a sharp corner.
摘要翻译：用于芯片封装的环形结构包括适于粘合到基底和至少一个角部的框架部分。框架部分围绕半导体芯片并且限定内部开口，并且内部开口暴露基板表面的一部分。所述至少一个角部从所述框架部分的角部朝向所述芯片延伸，并且所述拐角部分没有尖角。

3. 发明申请

US20140001652A1 PACKAGE-ON-PACKAGE STRUCTURE HAVING POLYMER-BASED MATERIAL FOR WARPAGE CONTROL 有权
标题翻译：具有聚合物材料的包装封装结构进行温度控制
公开(公告)号：US20140001652A1
公开(公告)日：2014-01-02
申请号：US13539136
申请日：2012-06-29
申请人： Meng-Tse CHEN , Yu-Chih LIU , Hui-Min HUANG , Wei-Hung LIN , Jing Ruei LU , Ming-Da CHENG , Chung-Shi LIU
发明人： Meng-Tse CHEN , Yu-Chih LIU , Hui-Min HUANG , Wei-Hung LIN , Jing Ruei LU , Ming-Da CHENG , Chung-Shi LIU
IPC分类号： H01L23/52 , H01L21/50
CPC分类号： H01L25/0652 , H01L21/561 , H01L21/563 , H01L23/00 , H01L23/293 , H01L23/3121 , H01L23/562 , H01L24/17 , H01L25/0655 , H01L25/50 , H01L2224/16 , H01L2224/32225 , H01L2224/73204 , H01L2224/92125 , H01L2225/06513 , H01L2225/06517 , H01L2225/06555 , H01L2225/06582 , H01L2924/15311
摘要： A package on package structure providing mechanical strength and warpage control includes a first package component, a second package component, and a first set of conductive elements coupling the first package component to the second package component. A first polymer-comprising material is molded on the first package component and surrounds the first set of conductive elements. The first polymer-comprising material has an opening therein exposing a top surface of the second package component. A third package component and a second set of conductive elements couples the second package component to the third package component.
摘要翻译：提供机械强度和翘曲控制的封装结构的封装包括第一封装元件，第二封装元件和将第一封装元件连接到第二封装元件的第一组导电元件。第一含聚合物的材料被模制在第一包装部件上并包围第一组导电元件。第一含聚合物的材料在其中具有露出第二包装部件的顶表面的开口。第三包装部件和第二组导电元件将第二包装部件耦合到第三包装部件。

4. 发明申请

US20130260511A1 LID ATTACH PROCESS AND APPARATUS FOR FABRICATION OF SEMICONDUCTOR PACKAGES 有权
标题翻译： LID连接过程和半导体封装的制造设备
公开(公告)号：US20130260511A1
公开(公告)日：2013-10-03
申请号：US13494814
申请日：2012-06-12
申请人： Chin-Liang CHEN , Wei-Ting LIN , Yu-Chih LIU , Kuan-Lin HO , Jason SHEN
发明人： Chin-Liang CHEN , Wei-Ting LIN , Yu-Chih LIU , Kuan-Lin HO , Jason SHEN
IPC分类号： H01L21/52 , B05C1/00
CPC分类号： H01L21/56 , H01L21/565 , H01L24/27 , H01L24/743 , H01L24/75 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2224/75611 , H01L2924/16152 , H01L2924/00
摘要： A semiconductor package assembly process that includes attaching one or more dies to a substrate; applying an adhesive material on a periphery of the substrate by an adhesive dispenser having a stamp-type dispensing head; applying a thermal interface material (TIM) on a top surface of the die by a TIM dispenser having a stamp-type dispensing head; and positioning a lid over the one or more dies and placing the lid on top of the adhesive material and the TIM by a lid carrier to encapsulate the one or more dies.
摘要翻译：一种半导体封装组装工艺，包括将一个或多个管芯附接到衬底; 通过具有印模式分配头的粘合剂分配器将粘合剂材料施加在基材的周边上; 通过具有印模式分配头的TIM分配器将热界面材料（TIM）施加在模具的顶表面上; 以及将盖子定位在所述一个或多个模具上，并且通过盖子载体将所述盖子放置在所述粘合剂材料和所述TIM的顶部上以封装所述一个或多个模具。

5. 发明申请

US20080025484A1 COMPUTER INTEGRATED WITH TRADITIONAL TELEPHONE AND VOIP 审中-公开
标题翻译：计算机与传统电话和电话集成
公开(公告)号：US20080025484A1
公开(公告)日：2008-01-31
申请号：US11831577
申请日：2007-07-31
申请人： Yu-Chih LIU , Jhe-Jen Shih , Shu-Fen Chen
发明人： Yu-Chih LIU , Jhe-Jen Shih , Shu-Fen Chen
IPC分类号： H04M11/00
CPC分类号： H04M7/0069 , H04M7/0057
摘要： A computer integrated with traditional telephone and VoIP includes a network module, a south bridge chip and a telecom adapter module. The network module is connected to the Internet for providing an Internet connection function to enable the computer to make or receive a VoIP call. The south bridge chip is connected to the network module. The telecom adapter module includes a first telecom port for connecting to a traditional phone, a second telecom port for connecting to a PSTN, and a connection interface. The telecom adapter module is connected to the south bridge chip via the connection interface to thereby enable the traditional phone to make or answer a VoIP call via the telecom adapter module, the south bridge and the network module.
摘要翻译：与传统电话和VoIP集成的计算机包括网络模块，南桥芯片和电信适配器模块。网络模块连接到因特网以提供因特网连接功能，使计算机能够进行或接收VoIP呼叫。南桥芯片连接到网络模块。电信适配器模块包括用于连接到传统电话的第一电信端口，用于连接到PSTN的第二电信端口和连接接口。电信适配器模块通过连接接口连接到南桥芯片，从而使传统电话能够通过电信适配器模块，南桥和网络模块进行或接听VoIP呼叫。

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