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1. 发明授权

US09543185B2 Packaging process tools and systems, and packaging methods for semiconductor devices 有权
标题翻译：包装工艺和系统以及半导体器件的封装方法
公开(公告)号：US09543185B2
公开(公告)日：2017-01-10
申请号：US13309311
申请日：2011-12-01
申请人： Wei-Hung Lin , Kuei-Wei Huang , Chih-Wei Lin , Chun-Cheng Lin , Ming-Da Cheng , Chung-Shi Liu
发明人： Wei-Hung Lin , Kuei-Wei Huang , Chih-Wei Lin , Chun-Cheng Lin , Ming-Da Cheng , Chung-Shi Liu
IPC分类号： B23Q3/00 , H01L21/683 , H01L23/31 , H01L23/00 , H01L21/56
CPC分类号： H01L21/6835 , H01L21/561 , H01L21/563 , H01L23/3128 , H01L23/562 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/75 , H01L24/81 , H01L24/83 , H01L24/97 , H01L2221/68372 , H01L2224/0401 , H01L2224/05027 , H01L2224/05124 , H01L2224/05554 , H01L2224/05572 , H01L2224/05599 , H01L2224/11444 , H01L2224/1145 , H01L2224/11452 , H01L2224/11462 , H01L2224/13082 , H01L2224/13083 , H01L2224/13111 , H01L2224/13116 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13169 , H01L2224/14135 , H01L2224/16225 , H01L2224/16238 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2224/75754 , H01L2224/7698 , H01L2224/81001 , H01L2224/81136 , H01L2224/81191 , H01L2224/81203 , H01L2224/81815 , H01L2224/81907 , H01L2224/83102 , H01L2224/9205 , H01L2224/92125 , H01L2224/95001 , H01L2224/97 , H01L2924/00014 , H01L2924/15311 , H01L2924/181 , H01L2924/351 , H01L2924/3511 , H01L2924/3512 , H01L2924/3841 , Y10T29/41 , H01L2924/00 , H01L2224/81 , H01L2924/00012 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2224/05552 , H01L2924/013
摘要： Packaging process tools and systems, and packaging methods for semiconductor devices are disclosed. In one embodiment, a packaging process tool for semiconductor devices includes a mechanical structure for supporting package substrates or integrated circuit die during a packaging process for the integrated circuit die. The mechanical structure includes a low thermal conductivity material disposed thereon.
摘要翻译：公开了用于半导体器件的封装加工工具和系统以及封装方法。在一个实施例中，用于半导体器件的封装处理工具包括用于在集成电路管芯的封装工艺期间支撑封装衬底或集成电路管芯的机械结构。机械结构包括设置在其上的低热导率材料。

2. 发明授权

US09536818B2 Semiconductor package and method of forming the same 有权
标题翻译：半导体封装及其形成方法
公开(公告)号：US09536818B2
公开(公告)日：2017-01-03
申请号：US13272434
申请日：2011-10-13
申请人： Wei-Hung Lin , Ming-Da Cheng , Chung-Shi Liu , Mirng-Ji Lii , Chen-Hua Yu
发明人： Wei-Hung Lin , Ming-Da Cheng , Chung-Shi Liu , Mirng-Ji Lii , Chen-Hua Yu
IPC分类号： H01L23/498 , B23K1/20 , H01L21/48 , H01L23/00
CPC分类号： H01L23/49894 , H01L21/4864 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/0401 , H01L2224/05166 , H01L2224/05181 , H01L2224/05186 , H01L2224/05647 , H01L2224/13082 , H01L2224/13111 , H01L2224/13147 , H01L2224/16238 , H01L2224/73204 , H01L2224/81022 , H01L2224/81191 , H01L2224/81815 , H01L2924/1305 , H01L2924/13091 , H01L2924/00014 , H01L2924/01073 , H01L2924/01049 , H01L2924/0105 , H01L2924/0103 , H01L2924/01025 , H01L2924/01024 , H01L2924/01022 , H01L2924/01032 , H01L2924/01038 , H01L2924/01078 , H01L2924/01012 , H01L2924/01013 , H01L2924/0104 , H01L2924/01047 , H01L2924/01029 , H01L2924/00012 , H01L2924/01082 , H01L2924/01083 , H01L2924/01079 , H01L2924/01051 , H01L2924/04941 , H01L2924/04953 , H01L2924/00
摘要： A method of a semiconductor package includes providing a substrate having a conductive trace coated with an organic solderability preservative (OSP) layer, removing the OSP layer from the conductive trace, and then coupling a chip to the substrate to form a semiconductor package.
摘要翻译：半导体封装的方法包括提供具有涂覆有有机可焊性防腐剂（OSP）层的导电迹线的衬底，从导电迹线去除OSP层，然后将芯片耦合到衬底以形成半导体封装。

3. 发明授权

US08878352B2 Semiconductor packaging structure and method 有权
公开(公告)号：US08878352B2
公开(公告)日：2014-11-04
申请号：US13357379
申请日：2012-01-24
申请人： Chun-Cheng Lin , Chung-Shi Liu , Kuei-Wei Huang , Cheng-Ting Chen , Wei-Hung Lin , Ming-Da Cheng
发明人： Chun-Cheng Lin , Chung-Shi Liu , Kuei-Wei Huang , Cheng-Ting Chen , Wei-Hung Lin , Ming-Da Cheng
IPC分类号： H01L23/02
摘要： A system and method for packaging semiconductor dies is provided. An embodiment comprises a first package with a first contact and a second contact. A post-contact material is formed on the first contact in order to adjust the height of a joint between the contact pad a conductive bump. In another embodiment a conductive pillar is utilized to control the height of the joint between the contact pad and external connections.

4. 发明申请

US20140045300A1 WARPAGE CONTROL IN A PACKAGE-ON-PACKAGE STRUCTURE 有权
标题翻译：包装式包装结构中的保温控制
公开(公告)号：US20140045300A1
公开(公告)日：2014-02-13
申请号：US13571665
申请日：2012-08-10
申请人： Meng-Tse Chen , Wei-Hung Lin , Kuei-Wei Huang , Tsai-Tsung Tsai , Ai-Tee Ang , Ming-Da Cheng , Chung-Shi Liu
发明人： Meng-Tse Chen , Wei-Hung Lin , Kuei-Wei Huang , Tsai-Tsung Tsai , Ai-Tee Ang , Ming-Da Cheng , Chung-Shi Liu
IPC分类号： H01L21/50 , H05B3/00
CPC分类号： H01L21/67288 , H01L25/105 , H01L25/50 , H01L2224/16225 , H01L2224/73204 , H01L2225/1058 , H01L2924/0002 , H01L2924/15311 , H05B6/6447 , H05B6/80 , H01L2924/0001
摘要： The present disclosure relates to a tool arrangement and method to reduce warpage within a package-on-package semiconductor structure, while minimizing void formation within an electrically-insulating adhesive which couples the packages. A pressure generator and a variable frequency microwave source are coupled to a process chamber which encapsulates a package-on-package semiconductor structure. The package-on-package semiconductor structure is simultaneously heated by the variable frequency microwave source at variable frequency, variable temperature, and variable duration and exposed to an elevated pressure by the pressure generator. This combination for microwave heating and elevated pressure limits the amount of warpage introduced while preventing void formation within an electrically-insulating adhesive which couples the substrates of the package-on-package semiconductor structure.
摘要翻译：本公开涉及一种减少封装封装半导体结构内的翘曲的工具布置和方法，同时最小化耦合封装的电绝缘粘合剂内的空隙形成。压力发生器和可变频率微波源耦合到封装封装的封装半导体结构的处理室。封装的封装半导体结构由可变频率，可变温度和可变持续时间的可变频率微波源同时加热，并通过压力发生器暴露于高压。这种用于微波加热和升高压力的组合限制了引入的翘曲量，同时防止在封装封装半导体结构的衬底的电绝缘粘合剂中形成空隙。

5. 发明授权

US08609462B2 Methods for forming 3DIC package 有权
公开(公告)号：US08609462B2
公开(公告)日：2013-12-17
申请号：US13272032
申请日：2011-10-12
申请人： Meng-Tse Chen , Chun-Cheng Lin , Kuei-Wei Huang , Yu-Peng Tsai , Wei-Hung Lin , Ming-Da Cheng , Chung-Shi Liu
发明人： Meng-Tse Chen , Chun-Cheng Lin , Kuei-Wei Huang , Yu-Peng Tsai , Wei-Hung Lin , Ming-Da Cheng , Chung-Shi Liu
IPC分类号： H01L21/44
CPC分类号： B23Q3/18 , H01L21/50 , H01L21/561 , H01L21/563 , H01L23/49827 , H01L23/5389 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/75 , H01L24/81 , H01L24/83 , H01L2224/131 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/75733 , H01L2224/75744 , H01L2224/75754 , H01L2224/7598 , H01L2224/75983 , H01L2224/81191 , H01L2224/81815 , H01L2224/83104 , H01L2224/83862 , H01L2224/83868 , H01L2224/83874 , H01L2224/97 , H01L2924/3511 , Y10T29/41 , H01L2924/00 , H01L2924/00014 , H01L2224/81 , H01L2924/00012 , H01L2924/014
摘要： A method includes dispensing an underfill between a first package component and a second package component, wherein the first package component is placed on a lower jig, and the second package component is over and bonded to the first package component. A through-opening is in the lower jig and under the first package component. The underfill is cured, wherein during the step of curing the underfill, a force is applied to flatten the first package component. The force is applied by performing an action selected from the group consisting of vacuuming and air blowing through the through-opening.

6. 发明授权

US08603860B2 Process for forming packages 有权
标题翻译：成型包装的工艺
公开(公告)号：US08603860B2
公开(公告)日：2013-12-10
申请号：US13280163
申请日：2011-10-24
申请人： Meng-Tse Chen , Kuei-Wei Huang , Wei-Hung Lin , Wen-Hsiung Lu , Ming-Da Cheng , Chung-Shi Liu
发明人： Meng-Tse Chen , Kuei-Wei Huang , Wei-Hung Lin , Wen-Hsiung Lu , Ming-Da Cheng , Chung-Shi Liu
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L24/75 , H01L24/13 , H01L24/16 , H01L24/81 , H01L24/94 , H01L24/97 , H01L2224/131 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/75272 , H01L2224/75314 , H01L2224/75704 , H01L2224/7598 , H01L2224/81191 , H01L2224/81208 , H01L2224/8121 , H01L2224/81815 , H01L2224/94 , H01L2224/97 , H01L2924/00012 , H01L2924/00014 , H01L2224/81 , H01L2924/014
摘要： A method includes loading a first package component on a concave boat, and placing a second package component over the first package component. A load clamp is placed over the second package component, wherein the load clamp is supported by a temperature-variable spacer of the concave boat. A reflow step is performed to bond the second package component to the first package component. During a temperature-elevation step of the reflow step, the temperature-variable spacer is softened in response to an increase in temperature, and a height of the softened temperature-variable spacer is reduced, until the load clamp is stopped by a rigid spacer of the concave boat.
摘要翻译：一种方法包括将第一包装部件装载在凹形船上，以及将第二包装部件放置在第一包装部件上。负载夹具放置在第二包装部件上，其中负载夹具由凹形舟皿的温度可变的间隔件支撑。执行回流步骤以将第二包装部件粘合到第一包装部件。在回流步骤的升温步骤期间，温度可变的间隔件响应于温度升高而软化，并且软化的温度可变间隔件的高度减小，直到负载夹具被刚性间隔件凹船。

7. 发明申请

US20130093076A1 SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME 有权
标题翻译：半导体封装及其形成方法
公开(公告)号：US20130093076A1
公开(公告)日：2013-04-18
申请号：US13272434
申请日：2011-10-13
申请人： Wei-Hung LIN , Ming-Da CHENG , Chung-Shi LIU , Mirng-Ji LII , Chen-Hua YU
发明人： Wei-Hung LIN , Ming-Da CHENG , Chung-Shi LIU , Mirng-Ji LII , Chen-Hua YU
IPC分类号： H01L23/498 , B23K1/20
CPC分类号： H01L23/49894 , H01L21/4864 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/0401 , H01L2224/05166 , H01L2224/05181 , H01L2224/05186 , H01L2224/05647 , H01L2224/13082 , H01L2224/13111 , H01L2224/13147 , H01L2224/16238 , H01L2224/73204 , H01L2224/81022 , H01L2224/81191 , H01L2224/81815 , H01L2924/1305 , H01L2924/13091 , H01L2924/00014 , H01L2924/01073 , H01L2924/01049 , H01L2924/0105 , H01L2924/0103 , H01L2924/01025 , H01L2924/01024 , H01L2924/01022 , H01L2924/01032 , H01L2924/01038 , H01L2924/01078 , H01L2924/01012 , H01L2924/01013 , H01L2924/0104 , H01L2924/01047 , H01L2924/01029 , H01L2924/00012 , H01L2924/01082 , H01L2924/01083 , H01L2924/01079 , H01L2924/01051 , H01L2924/04941 , H01L2924/04953 , H01L2924/00
摘要： A method of a semiconductor package includes providing a substrate having a conductive trace coated with an organic solderability preservative (OSP) layer, removing the OSP layer from the conductive trace, and then coupling a chip to the substrate to form a semiconductor package.
摘要翻译：半导体封装的方法包括提供具有涂覆有有机可焊性防腐剂（OSP）层的导电迹线的衬底，从导电迹线去除OSP层，然后将芯片耦合到衬底以形成半导体封装。

8. 发明授权

US08254132B2 Flash drive and housing assembly thereof 有权
标题翻译：闪存驱动器及其壳体组件
公开(公告)号：US08254132B2
公开(公告)日：2012-08-28
申请号：US12605869
申请日：2009-10-26
申请人： Wei-Hung Lin
发明人： Wei-Hung Lin
IPC分类号： H05K7/00 , H05K5/00
CPC分类号： G06K19/07 , G06K19/07732 , H01R13/4538
摘要： A flash drive and a housing assembly thereof is provided. The housing assembly comprises a housing, a base and a rotating mechanism. The housing has a first opening, a second opening, and a space, the first opening is situated at a side surface of the housing, and the second opening is situated on a top surface of the housing. The base is used for accommodating a storage device which has a connecting member, the base is movably disposed in the space and has a slot facing the second opening. The rotating mechanism is disposed at the second opening and mounted to the housing, the rotating mechanism has a protrusion portion movably engaged in the slot. When the rotating mechanism rotates relative to the housing, the protrusion portion moves along the slot and drives the base to reciprocate between a first position and a second position.
摘要翻译：提供闪存驱动器及其壳体组件。壳体组件包括壳体，基座和旋转机构。壳体具有第一开口，第二开口和空间，第一开口位于壳体的侧表面处，并且第二开口位于壳体的顶表面上。基座用于容纳具有连接构件的存储装置，基座可移动地设置在该空间中，并且具有面向第二开口的槽。旋转机构设置在第二开口处并且安装到壳体，旋转机构具有可移动地接合在槽中的突出部。当旋转机构相对于壳体旋转时，突起部分沿着狭槽移动并驱动基座在第一位置和第二位置之间往复运动。

9. 发明授权

US07754598B2 Method for manufacturing coreless packaging substrate 有权
标题翻译：无芯封装基板的制造方法
公开(公告)号：US07754598B2
公开(公告)日：2010-07-13
申请号：US12068256
申请日：2008-02-05
申请人： Wei-Hung Lin , Zao-Kuo Lai
发明人： Wei-Hung Lin , Zao-Kuo Lai
IPC分类号： H01L21/4763
CPC分类号： H05K3/4682 , H01L21/4857 , H01L21/6835 , H01L23/49822 , H01L2924/0002 , H01L2924/3011 , H05K3/205 , H05K3/28 , H05K3/4007 , H05K2201/0367 , H05K2203/1105 , H01L2924/00
摘要： Method for making a coreless packaging substrate are disclosed in the present invention. The coreless packaging substrate is made by first providing a metal adhesion layer having a melting point lower than that of the substrate, and removing a core board connected with the substrate therefrom through melting the metal adhesion layer. In addition, the disclosed packaging substrate further includes a circuit built-up structure of which has the electrical pads embedded under a surface. The disclosed packaging substrate can achieve the purposes of reducing the thickness, increasing circuit layout density, and facilitating the manufacturing of the substrate.
摘要翻译：制造无芯封装基板的方法在本发明中公开。无芯封装基板通过首先提供熔点低于基板的金属粘附层，并且通过熔化金属粘合层来除去与基板相连的芯板。此外，所公开的封装基板还包括电路组合结构，其中电垫嵌入在表面下。所公开的封装基板可以实现减小厚度，增加电路布局密度以及促进基板的制造的目的。

10. 发明授权

US07672122B2 Flash memory disk with rotatable and telescopic protection structure and method using the same 有权
标题翻译：具有可旋转和伸缩保护结构的闪存盘及使用其的方法
公开(公告)号：US07672122B2
公开(公告)日：2010-03-02
申请号：US12033278
申请日：2008-02-19
申请人： Wei-Hung Lin , Yu-Ting Tseng , Hung-Yi Chung
发明人： Wei-Hung Lin , Yu-Ting Tseng , Hung-Yi Chung
IPC分类号： H05K5/00
CPC分类号： H05K5/0278 , Y10T29/49826
摘要： A flash memory disk includes a holder, a plug, a housing and a pulling ring. The plug is joined with the holder and exposed out of the holder. The housing has a containing space for accommodating the holder and the plug, wherein two sides opposite to each other respectively have a through sliding groove and the third side of the housing there has an opening. The two arms of the pulling ring have sliding blocks, and the sliding blocks are moveable and matched with the through sliding grooves, wherein the pulling ring is rotated about the axis connecting both the sliding blocks, and when the sliding blocks of the pulling ring is moved, the holder would be located between a first position where the plug is entirely accommodated in the containing space and a second position where the plug is entirely protruded out of the opening.
摘要翻译：闪存盘包括保持器，插头，壳体和拉环。插头与支架连接并露出支架。壳体具有用于容纳保持器和插头的容纳空间，其中彼此相对的两侧分别具有通过滑动槽，并且壳体的第三侧具有开口。牵引环的两个臂具有滑动块，并且滑动块可移动并与通过滑动槽匹配，其中拉环围绕连接两个滑动块的轴线旋转，并且当拉环的滑块为移动时，支架将位于插头完全容纳在容纳空间中的第一位置和插头完全突出于开口的第二位置之间。

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