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1. 发明授权

US08247516B2 Room-temperature curable organopolysiloxane composition 有权
标题翻译：室温可固化的有机聚硅氧烷组合物
公开(公告)号：US08247516B2
公开(公告)日：2012-08-21
申请号：US12739343
申请日：2008-10-06
申请人： Akiko Nabeta , Masayuki Onishi , Yoshito Ushio
发明人： Akiko Nabeta , Masayuki Onishi , Yoshito Ushio
IPC分类号： C08L83/04
CPC分类号： C08L83/04 , C08G77/18 , C08K5/0091 , C08K5/5419 , C08L2666/52 , C08L2666/44
摘要： A room-temperature curable organopolysiloxane composition comprising: (A) a diorganopolysiloxane capped at both molecular terminals with trialkoxysilyl groups and having viscosity of 100 to 1,000,000 mPas at 25° C.; (B) a diorganodimethoxysilane or a partially hydrolyzed product thereof; (C) a diorganodialkoxysilane having silicon-bonded alkoxy group with two or more carbon atoms or a partially hydrolyzed product thereof; and (D) a titanium chelate catalyst, exhibits excellent storage stability and easiness of controlling curing speed as well as by strong adhesion to a substrate with which this composition is in contact during curing along with the possibility of interfacial peeling of the cured product from the aforementioned substrate.
摘要翻译：一种室温可固化的有机基聚硅氧烷组合物，其包含：（A）在两个分子末端用三烷氧基甲硅烷基封端的二有机聚硅氧烷，并且在25℃下具有100至1,000,000mPas的粘度; （B）二有机二甲氧基硅烷或其部分水解产物; （C）具有硅键合的具有两个或更多个碳原子的烷氧基的二有机二烷氧基硅烷或其部分水解产物; 和（D）钛螯合催化剂，表现出优异的储存稳定性和控制固化速度的容易性，以及通过对固化期间该组合物接触的基材的强粘合性以及固化产物的界面剥离的可能性上述基材。

2. 发明申请

US20090263936A1 Insulating Liquid Die-Bonding Agent And Semiconductor Device 有权
标题翻译：绝缘液体封装剂和半导体器件
公开(公告)号：US20090263936A1
公开(公告)日：2009-10-22
申请号：US12065135
申请日：2006-08-23
申请人： Toyohiko Fujisawa , Yoshito Ushio
发明人： Toyohiko Fujisawa , Yoshito Ushio
IPC分类号： H01L21/58
CPC分类号： H01L23/3114 , C08G77/12 , C08G77/18 , C08G77/20 , C08L83/00 , C08L83/04 , C09J183/04 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/83 , H01L2224/2919 , H01L2224/29191 , H01L2224/2929 , H01L2224/2939 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/4824 , H01L2224/73215 , H01L2224/8385 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10329 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H01L2924/0715 , H01L2924/00 , H01L2924/3512 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/45015 , H01L2924/207
摘要： An insulating liquid die-bonding agent for bonding a semiconductor-chip-mounting member to an active surface of a semiconductor chip, said agent comprising: (A) a mixture of (a-1) an organopolysiloxane resin having alkenyl groups and (a-2) a linear-chain organopolysiloxane having in one molecule at least two alkenyl groups; (B) an organopolysiloxane having in one molecule at least two silicon-bonded hydrogen atoms; (C) an organic silicon compound having in one molecule at least one silicon-bonded alkoxy groups; (D) insulating spherical silicone rubber particles having an average diameter of 0.1 to 50 μm and having a type A durometer hardness according to JIS K 6253 equal to or below 80; and (E) a hydrosilylation-reaction catalyst, may not damage the active surface of the semiconductor chip, is well suited for screen printing, is resistant to the formation of voids on the interface between the semiconductor chip and the die-bonding agent, and does not lose its wire-bonding properties.
摘要翻译：一种用于将半导体芯片安装部件接合到半导体芯片的有源表面的绝缘液体芯片接合剂，所述试剂包括：（A）（a-1）具有烯基的有机聚硅氧烷树脂和（a- 2）在一个分子中具有至少两个烯基的直链有机聚硅氧烷; （B）在一个分子中具有至少两个与硅键合的氢原子的有机聚硅氧烷; （C）在一个分子中具有至少一个与硅键合的烷氧基的有机硅化合物; （D）平均直径为0.1〜50μm的绝缘球形硅橡胶颗粒，根据JIS K 6253的A型硬度计硬度等于或小于80; 和（E）氢化硅烷化反应催化剂不会损坏半导体芯片的活性表面，非常适合于丝网印刷，耐半导体芯片和芯片结合剂之间的界面上形成空隙，以及不会失去其引线接合性能。

3. 发明申请

US20090105441A1 Curable Organopolysiloxane Composition 有权
标题翻译：固化有机聚硅氧烷组合物
公开(公告)号：US20090105441A1
公开(公告)日：2009-04-23
申请号：US11917193
申请日：2006-06-09
申请人： Yoshito Ushio , Osamu Mitani
发明人： Yoshito Ushio , Osamu Mitani
IPC分类号： C08G77/06
CPC分类号： C08L83/04 , C08L83/14 , C08L2666/14 , C08L83/00
摘要： A curable organopolysiloxane composition comprising: (A) an organopolysiloxane (a1) that contains in one molecule at least one silicon-bonded alkoxysilyl-containing group and an average of at least 0.5 alkenyl groups; or a mixture of said organopolysiloxane (a1) with an organopolysiloxane (a2) that contains in one molecule at least two alkenyl groups and that is free of the alkoxysilyl-containing groups; (B) an organopolysiloxane that contains in one molecule at least two silicon-bonded hydrogen atoms; (C) an organosilicon compound that contains in one molecule at least one silicon-bonded alkoxy group and that is free of the alkoxysilyl-containing groups; and (D) a hydrosilylation-reaction catalyst, has good adhesion to unclean aluminum die castings, PPS resins, etc., even when cured by heating at relatively low temperatures such as 100° C.
摘要翻译：一种可固化的有机聚硅氧烷组合物，其包含：（A）在一个分子中含有至少一个含硅键合的含烷氧基甲硅烷基且平均至少含有0.5个烯基的有机聚硅氧烷（a1）或所述有机聚硅氧烷（a1）与一分子中含有至少两个烯基并且不含烷氧基甲硅烷基的有机聚硅氧烷（a2）的混合物; （B）在一个分子中含有至少两个与硅键合的氢原子的有机聚硅氧烷; （C）在一分子中含有至少一个与硅键合的烷氧基并且不含烷氧基甲硅烷基的基团的有机硅化合物; 和（D）氢化硅烷化反应催化剂，即使在相对较低的温度如100℃下加热固化，也对不干净的铝压铸件，PPS树脂等具有良好的粘合性。

4. 发明申请

US20070009748A1 Adhesive silicone elastomer sheet 失效
标题翻译：粘胶硅橡胶片
公开(公告)号：US20070009748A1
公开(公告)日：2007-01-11
申请号：US10570115
申请日：2004-08-27
申请人： Akiko Takanami , Yoshito Ushio , Osamu Mitani , Masayuki Onishi
发明人： Akiko Takanami , Yoshito Ushio , Osamu Mitani , Masayuki Onishi
IPC分类号： B32B27/00 , C09J183/04 , C08L83/04
CPC分类号： B32B25/20 , B32B25/08 , B32B2319/00 , B32B2405/00 , B32B2457/202 , C08G77/12 , C08G77/20 , C08G2170/40 , C08L83/00 , C09J7/10 , C09J7/38 , C09J183/04 , C09J2483/00 , G02F2202/28 , Y10T428/31663 , Y10T428/31786
摘要： Adhesive silicone elastomer sheet afforded by the cure of a hydrosilylation-curing silicone elastomer composition comprising: (A) an organopolysiloxane that contains at least one diorganosiloxane unit and that has at least two silicon-bonded alkenyl groups in each molecule, (B) an organopolysiloxane resin with the average unit formula: (R13SiO1/2)x(SiO4/2)1.0 in which R1 is substituted or unsubstituted monovalent hydrocarbon group and x is a number from 0.5 to 1.0, (C) an organopolysiloxane that contains at least two silicon-bonded hydrogen atoms in each molecule, and (D) a hydrosilylation catalyst. The adhesive silicone elastomer sheet is transparent, and whose surface exhibits a stable and permanent adhesiveness.
摘要翻译：通过固化氢化硅烷化固化的硅氧烷弹性体组合物提供的粘合硅氧烷弹性体片，其包含：（A）含有至少一个二有机硅氧烷单元并且在每个分子中具有至少两个硅键合的烯基的有机聚硅氧烷，（B）有机聚硅氧烷具有平均单元式的树脂：（R 1）3 SiO 2（SiO 2）x（SiO）其中R 1为取代或未取代的一价烃基，x为0.5至1.0的数，（C）有机聚硅氧烷，其中R 1为在每个分子中含有至少两个与硅键合的氢原子，和（D）氢化硅烷化催化剂。粘合性硅氧烷弹性体片是透明的，其表面具有稳定且永久的粘合性。

5. 发明申请

US20140023929A1 Silicon-Containing Carbonaceous Composite Material 审中-公开
标题翻译：含硅含碳复合材料
公开(公告)号：US20140023929A1
公开(公告)日：2014-01-23
申请号：US13982673
申请日：2012-01-27
申请人： Hiroshi Fukui , Yukinari Harimoto , Masayasu Akasaka , Son Thanh Phan , Takakazu Hino , Katsuya Eguchi , Yoshito Ushio
发明人： Hiroshi Fukui , Yukinari Harimoto , Masayasu Akasaka , Son Thanh Phan , Takakazu Hino , Katsuya Eguchi , Yoshito Ushio
IPC分类号： H01M4/36 , H01M4/134 , H01M4/133 , H01M4/38 , H01M4/48
CPC分类号： H01M4/364 , C01B32/907 , H01M4/133 , H01M4/134 , H01M4/362 , H01M4/386 , H01M4/48 , H01M4/587 , H01M10/0525
摘要： Using a silicon-containing carbon-based composite material represented by the compositional formula: SiOxCyHz. In this formula, “x” is from 0.8 to 1.7, “y” is from 1.4 to 7.5, and “z” is from 0.3 to 1.3. The composite material is preferably obtained by: obtaining a cured product by crosslinking (A) a crosslinkable group-containing organic compound, and (B) a silicon-containing compound capable of crosslinking the crosslinkable group-containing organic compound, and heat treating the obtained cured product. The composite material of the present invention has high reversible capacity and stable charge and discharge cycle characteristics, and has high initial charge and discharge efficiency. Therefore, the composite material of the present invention is suitable for an electrode of an electricity storage device, particularly of a lithium or lithium-ion secondary battery.
摘要翻译：使用由以下组成式表示的含硅碳基复合材料：SiOxCyHz。在该式中，“x”为0.8〜1.7，“y”为1.4〜7.5，“z”为0.3〜1.3。复合材料优选通过以下方式获得：通过交联（A）含交联性基团的有机化合物获得固化产物，和（B）能够交联含可交联基团的有机化合物的含硅化合物，并将所得到的固化产品。本发明的复合材料具有高的可逆容量和稳定的充放电循环特性，并且具有高的初始充放电效率。因此，本发明的复合材料适用于蓄电装置的电极，特别是锂或锂离子二次电池的电极。

6. 发明授权

US07897717B2 Insulating liquid die-bonding agent and semiconductor device 有权
标题翻译：绝缘液体芯片粘合剂和半导体器件
公开(公告)号：US07897717B2
公开(公告)日：2011-03-01
申请号：US12065135
申请日：2006-08-23
申请人： Toyohiko Fujisawa , Yoshito Ushio
发明人： Toyohiko Fujisawa , Yoshito Ushio
IPC分类号： C08G77/20
CPC分类号： H01L23/3114 , C08G77/12 , C08G77/18 , C08G77/20 , C08L83/00 , C08L83/04 , C09J183/04 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/83 , H01L2224/2919 , H01L2224/29191 , H01L2224/2929 , H01L2224/2939 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/4824 , H01L2224/73215 , H01L2224/8385 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10329 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H01L2924/0715 , H01L2924/00 , H01L2924/3512 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/45015 , H01L2924/207
摘要： An insulating liquid die-bonding agent for bonding a semiconductor-chip-mounting member to an active surface of a semiconductor chip, said agent comprising: (A) a mixture of (a-1) an organopolysiloxane resin having alkenyl groups and (a-2) a linear-chain organopolysiloxane having in one molecule at least two alkenyl groups; (B) an organopolysiloxane having in one molecule at least two silicon-bonded hydrogen atoms; (C) an organic silicon compound having in one molecule at least one silicon-bonded alkoxy groups; (D) insulating spherical silicone rubber particles having an average diameter of 0.1 to 50 μm and having a type A durometer hardness according to JIS K 6253 equal to or below 80; and (E) a hydrosilylation-reaction catalyst, may not damage the active surface of the semiconductor chip, is well suited for screen printing, is resistant to the formation of voids on the interface between the semiconductor chip and the die-bonding agent, and does not lose its wire-bonding properties.
摘要翻译：一种用于将半导体芯片安装部件接合到半导体芯片的有源表面的绝缘液体芯片接合剂，所述试剂包括：（A）（a-1）具有烯基的有机聚硅氧烷树脂和（a- 2）在一个分子中具有至少两个烯基的直链有机聚硅氧烷; （B）在一个分子中具有至少两个与硅键合的氢原子的有机聚硅氧烷; （C）在一个分子中具有至少一个与硅键合的烷氧基的有机硅化合物; （D）绝缘球形硅橡胶颗粒，其平均直径为0.1至50μm，并且具有根据JIS K 6253等于或低于80的A型硬度计硬度; 和（E）氢化硅烷化反应催化剂不会损坏半导体芯片的活性表面，非常适合于丝网印刷，耐半导体芯片和芯片结合剂之间的界面上形成空隙，以及不会失去其引线接合性能。

7. 发明授权

US07534659B2 Silicone-based adhesive sheet, method of bonding a semiconductor chip to a chip attachment component, and a semiconductor device 失效
标题翻译：硅酮系粘合片，将半导体芯片接合到芯片安装部件的方法以及半导体装置
公开(公告)号：US07534659B2
公开(公告)日：2009-05-19
申请号：US10521287
申请日：2003-07-14
申请人： Manabu Sutoh , Yoshito Ushio , Toyohiko Fujisawa , Katsutoshi Mine
发明人： Manabu Sutoh , Yoshito Ushio , Toyohiko Fujisawa , Katsutoshi Mine
IPC分类号： H01L21/00 , C08G77/12 , C08G77/20 , C08G77/04
CPC分类号： H01L21/6836 , C08L83/00 , C09J5/06 , C09J7/35 , C09J183/04 , C09J2201/128 , C09J2203/326 , C09J2483/00 , H01L24/27 , H01L24/29 , H01L24/45 , H01L24/73 , H01L24/83 , H01L2221/68327 , H01L2224/274 , H01L2224/29 , H01L2224/2919 , H01L2224/29191 , H01L2224/29298 , H01L2224/32145 , H01L2224/32225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83191 , H01L2224/83194 , H01L2224/83855 , H01L2224/85207 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/01043 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01052 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01092 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/1301 , H01L2924/14 , H01L2924/181 , H01L2924/19043 , H01L2924/00014 , H01L2924/0715 , H01L2924/00 , H01L2924/00012 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2924/20753
摘要： A silicone-based adhesive sheet has either a layer of clay-like curable silicone composition on one side and a layer of slower curing clay-like curable silicone composition than the first composition layer on the other side, or a cured silicone layer on one side and a layer of clay-like curable silicone composition on the other side. The silicone-based adhesive sheet may be used in a method for bonding semiconductor chip and a chip attachment component. A semiconductor device may be prepared by the method.
摘要翻译：硅酮类粘合片在一侧具有一层粘土状可固化硅酮组合物，另一侧具有比另一侧的第一组合物层更慢的固化粘土状可固化硅氧烷组合物层，或者一侧的固化的硅氧烷层和另一侧的粘土状可固化硅氧烷组合物层。硅酮类粘合片可以用于半导体芯片和芯片安装部件的接合方法。可以通过该方法制备半导体器件。

8. 发明授权

US07198853B2 Adhesive sheet of cross-linked silicone, method of manufacturing thereof, and device 有权
标题翻译：交联硅胶的粘合片，其制造方法和装置
公开(公告)号：US07198853B2
公开(公告)日：2007-04-03
申请号：US10489789
申请日：2002-09-30
申请人： Yoshito Ushio , Katsuyuki Nakayama , Toyohiko Fujisawa
发明人： Yoshito Ushio , Katsuyuki Nakayama , Toyohiko Fujisawa
IPC分类号： B32B9/04
CPC分类号： H01L24/83 , C09J7/10 , C09J7/40 , C09J183/04 , C09J2483/00 , H01L23/3121 , H01L24/29 , H01L24/45 , H01L24/48 , H01L2224/05599 , H01L2224/29 , H01L2224/2919 , H01L2224/29191 , H01L2224/29298 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48463 , H01L2224/73265 , H01L2224/8319 , H01L2224/8385 , H01L2224/85424 , H01L2224/85444 , H01L2224/8547 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01059 , H01L2924/01061 , H01L2924/01078 , H01L2924/01079 , H01L2924/01092 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/1301 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , Y10T428/31663 , H01L2924/00014 , H01L2924/0715 , H01L2924/00 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2924/00012
摘要： A cross-linked silicone adhesive sheet has stability of peeling surfaces during peeling protective films away from both sides of the sheet. An adhesive sheet of a cross-linked silicone has protective films on both sides of the sheet. The protective films each have a thickness of 100 μm or less. A force of peeling of the protective films from the sheet is equal to or below 5.0 N/m. The difference between peeling forces of the films is equal to or exceeds 0.2 N/m. A method of manufacturing the adhesive sheet of a cross-linked silicone includes the steps of forming a film-like body by placing a cross-linkable silicone composition in a layer having a thickness of 100 μm or less between two protective films of different materials and then cross-linking the composition.
摘要翻译：交联的硅氧烷粘合片在从片材的两侧剥离保护膜时具有剥离表面的稳定性。交联硅树脂的粘合片在片材的两侧具有保护膜。保护膜的厚度为100μm以下。保护膜从片材剥离的力等于或低于5.0N / m。膜的剥离力之差等于或超过0.2N / m。制造交联硅氧烷粘合片的方法包括以下步骤：通过将可交联的硅氧烷组合物放置在不同材料的两个保护膜之间的厚度为100μm以下的层中，形成膜状体，以及然后交联组合物。

9. 发明申请

US20060057779A1 Silicone-based adhesive sheet, method of bonding a semiconductor chip to a chip attachment component, and a semiconductor device 失效
公开(公告)号：US20060057779A1
公开(公告)日：2006-03-16
申请号：US10521287
申请日：2003-07-14
申请人： Manabu Sutoh , Yoshito Ushio , Toyohiko Fujisawa , Katsutoshi Mine
发明人： Manabu Sutoh , Yoshito Ushio , Toyohiko Fujisawa , Katsutoshi Mine
IPC分类号： H01L21/50
CPC分类号： H01L21/6836 , C08L83/00 , C09J5/06 , C09J7/35 , C09J183/04 , C09J2201/128 , C09J2203/326 , C09J2483/00 , H01L24/27 , H01L24/29 , H01L24/45 , H01L24/73 , H01L24/83 , H01L2221/68327 , H01L2224/274 , H01L2224/29 , H01L2224/2919 , H01L2224/29191 , H01L2224/29298 , H01L2224/32145 , H01L2224/32225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83191 , H01L2224/83194 , H01L2224/83855 , H01L2224/85207 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/01043 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01052 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01092 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/1301 , H01L2924/14 , H01L2924/181 , H01L2924/19043 , H01L2924/00014 , H01L2924/0715 , H01L2924/00 , H01L2924/00012 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2924/20753
摘要： A silicone-based adhesive sheet has either a layer of clay-like curable silicone composition on one side and a layer of slower curing clay-like curable silicone composition than the first composition layer on the other side, or a cured silicone layer on one side and a layer of clay-like curable silicone composition on the other side. The silicone-based adhesive sheet may be used in a method for bonding semiconductor chip and a chip attachment component. A semiconductor device may be prepared by the method.

10. 发明授权

US06379792B1 Silicone adhesive sheet and method for manufacturing 失效
标题翻译：硅胶片及其制造方法
公开(公告)号：US06379792B1
公开(公告)日：2002-04-30
申请号：US09611204
申请日：2000-07-06
申请人： Minoru Isshiki , Kimio Yamakawa , Yoshito Ushio , Ryoto Shima , Katsutoshi Mine
发明人： Minoru Isshiki , Kimio Yamakawa , Yoshito Ushio , Ryoto Shima , Katsutoshi Mine
IPC分类号： B32B2718
CPC分类号： H01L24/29 , C08K5/549 , C08L2666/44 , C09J7/10 , C09J183/04 , C09J2203/326 , H01L24/83 , H01L2224/16225 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/29191 , H01L2224/29298 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/8319 , H01L2224/8385 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01016 , H01L2924/0102 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/1301 , H01L2924/19041 , H01L2924/19043 , Y10T428/1471 , Y10T428/1476 , Y10T428/23 , Y10T428/28 , Y10T428/2852 , Y10T428/31663 , C08L83/04 , H01L2924/00014 , H01L2924/0715 , H01L2924/00 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： A silicone adhesive sheet for bonding a semiconductor chip to a chip attachment component comprising a crosslinkable silicone composition containing a silatrane derivative, and a method for manufacturing a silicone adhesive sheet by subjecting a crosslinkable silicone composition containing a silatrane derivative to a crosslinking reaction between backing materials that do not stick to the crosslinked product of said composition, where at least one of the backing materials has a larger dielectric constant than that of the crosslinked product. The present silicone adhesive sheet allows a semiconductor chip and a chip attachment component to be bonded in a short time at a relatively low temperature.
摘要翻译：一种用于将半导体芯片接合到芯片附着部件的硅氧烷粘合片，其包含含有硅烷衍生物的可交联硅氧烷组合物，以及通过使含有硅烷衍生物的可交联硅氧烷组合物在背衬材料之间进行交联反应来制造硅氧烷粘合片的方法其不粘附于所述组合物的交联产物，其中至少一种背衬材料具有比交联产物更大的介电常数。本发明的硅氧烷粘合片允许半导体芯片和芯片附着部件在较短的时间内以较低的温度结合。

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