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1. 发明申请

US20100236450A1 Room-Temperature Curable Organopolysiloxane Composition 有权
标题翻译：室温固化有机聚硅氧烷组合物
公开(公告)号：US20100236450A1
公开(公告)日：2010-09-23
申请号：US12739343
申请日：2008-10-06
申请人： Akiko Nabeta , Masayuki Onishi , Yoshito Ushio
发明人： Akiko Nabeta , Masayuki Onishi , Yoshito Ushio
IPC分类号： C09D183/04
CPC分类号： C08L83/04 , C08G77/18 , C08K5/0091 , C08K5/5419 , C08L2666/52 , C08L2666/44
摘要： A room-temperature curable organopolysiloxane composition comprising: (A) a diorganopolysiloxane capped at both molecular terminals with trialkoxysilyl groups and having viscosity of 100 to 1,000,000 mPas at 25° C.; (B) a diorganodimethoxysilane or a partially hydrolyzed product thereof; (C) a diorganodialkoxysilane having silicon-bonded alkoxy group with two or more carbon atoms or a partially hydrolyzed product thereof; and (D) a titanium chelate catalyst, exhibits excellent storage stability and easiness of controlling curing speed as well as by strong adhesion to a substrate with which this composition is in contact during curing along with the possibility of interfacial peeling of the cured product from the aforementioned substrate.
摘要翻译：一种室温可固化的有机基聚硅氧烷组合物，其包含：（A）在两个分子末端用三烷氧基甲硅烷基封端的二有机聚硅氧烷，并且在25℃下具有100至1,000,000mPas的粘度; （B）二有机二甲氧基硅烷或其部分水解产物; （C）具有硅键合的具有两个或更多个碳原子的烷氧基的二有机二烷氧基硅烷或其部分水解产物; 和（D）钛螯合催化剂，表现出优异的储存稳定性和控制固化速度的容易性，以及通过对固化期间该组合物接触的基材的强粘合性以及固化产物的界面剥离的可能性上述基材。

2. 发明授权

US08247516B2 Room-temperature curable organopolysiloxane composition 有权
标题翻译：室温可固化的有机聚硅氧烷组合物
公开(公告)号：US08247516B2
公开(公告)日：2012-08-21
申请号：US12739343
申请日：2008-10-06
申请人： Akiko Nabeta , Masayuki Onishi , Yoshito Ushio
发明人： Akiko Nabeta , Masayuki Onishi , Yoshito Ushio
IPC分类号： C08L83/04
CPC分类号： C08L83/04 , C08G77/18 , C08K5/0091 , C08K5/5419 , C08L2666/52 , C08L2666/44
摘要： A room-temperature curable organopolysiloxane composition comprising: (A) a diorganopolysiloxane capped at both molecular terminals with trialkoxysilyl groups and having viscosity of 100 to 1,000,000 mPas at 25° C.; (B) a diorganodimethoxysilane or a partially hydrolyzed product thereof; (C) a diorganodialkoxysilane having silicon-bonded alkoxy group with two or more carbon atoms or a partially hydrolyzed product thereof; and (D) a titanium chelate catalyst, exhibits excellent storage stability and easiness of controlling curing speed as well as by strong adhesion to a substrate with which this composition is in contact during curing along with the possibility of interfacial peeling of the cured product from the aforementioned substrate.
摘要翻译：一种室温可固化的有机基聚硅氧烷组合物，其包含：（A）在两个分子末端用三烷氧基甲硅烷基封端的二有机聚硅氧烷，并且在25℃下具有100至1,000,000mPas的粘度; （B）二有机二甲氧基硅烷或其部分水解产物; （C）具有硅键合的具有两个或更多个碳原子的烷氧基的二有机二烷氧基硅烷或其部分水解产物; 和（D）钛螯合催化剂，表现出优异的储存稳定性和控制固化速度的容易性，以及通过对固化期间该组合物接触的基材的强粘合性以及固化产物的界面剥离的可能性上述基材。

3. 发明授权

US08546508B2 Sealant or filler for electrical and electronic components, and electrical and electrical components 有权
标题翻译：用于电气和电子部件的密封剂或填料，以及电气和电气部件
公开(公告)号：US08546508B2
公开(公告)日：2013-10-01
申请号：US13126275
申请日：2009-10-15
申请人： Akiko Nabeta , Kazumi Nakayoshi
发明人： Akiko Nabeta , Kazumi Nakayoshi
IPC分类号： C08G77/20
CPC分类号： H01L23/296 , C08G77/12 , C08G77/20 , C08L83/04 , H01L2924/0002 , C08L83/00 , H01L2924/00
摘要： A sealant or filler of the invention for electrical and electronic components comprises a two or more liquid type organopolysiloxane composition curable by a hydrosilylation reaction, the viscosity of the composition being doubled at room temperature during 10 min. or more from the initial value obtained directly after mixing all the components, and being increased at room temperature from 5-fold to 10-fold of the initial viscosity within another 10 min. The sealant or filler for electrical and electronic components can be cured to a sufficient degree at room temperature and improve reliability of the sealed or filled components.
摘要翻译：用于电气和电子部件的本发明的密封剂或填料包括两种或更多种可通过氢化硅烷化反应固化的液体型有机基聚硅氧烷组合物，组合物的粘度在室温下10分钟内翻倍。或更多，从在混合所有组分之后直接获得的初始值，并且在室温下在另外10分钟内从初始粘度的5倍增加到10倍。用于电气和电子部件的密封剂或填料可以在室温下固化至足够的程度并提高密封或填充的组分的可靠性。

4. 发明申请

US20110245426A1 Sealant Or Filler For Electrical And Electronic Components, And Electrical And Electronic Components 有权
标题翻译：电气和电子元件密封剂或填料，以及电气和电子元件
公开(公告)号：US20110245426A1
公开(公告)日：2011-10-06
申请号：US13126275
申请日：2009-10-15
申请人： Akiko Nabeta , Kazumi Nakayoshi
发明人： Akiko Nabeta , Kazumi Nakayoshi
IPC分类号： C08L83/07
CPC分类号： H01L23/296 , C08G77/12 , C08G77/20 , C08L83/04 , H01L2924/0002 , C08L83/00 , H01L2924/00
摘要： A sealant or filler of the invention for electrical and electronic components comprises a two or more liquid type organopolysiloxane composition curable by a hydrosilylation reaction, the viscosity of the composition being doubled at room temperature during 10 min. or more from the initial value obtained directly after mixing all the components, and being increased at room temperature from 5-fold to 10-fold of the initial viscosity within another 10 min. The sealant or filler for electrical and electronic components can be cured to a sufficient degree at room temperature and improve reliability of the sealed or filled components.
摘要翻译：用于电气和电子部件的本发明的密封剂或填料包括两种或更多种可通过氢化硅烷化反应固化的液体型有机基聚硅氧烷组合物，组合物的粘度在室温下10分钟内翻倍。或更多，从在混合所有组分之后直接获得的初始值，并且在室温下在另外10分钟内从初始粘度的5倍增加到10倍。用于电气和电子部件的密封剂或填料可以在室温下固化至足够的程度并提高密封或填充的组分的可靠性。

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