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    • 5. 发明授权
    • Bonding strength measuring device
    • 接合强度测量装置
    • US07980757B2
    • 2011-07-19
    • US12350643
    • 2009-01-08
    • Yi-Shao LaiTsung-Yueh TsaiHsiao-Chuan Chang
    • Yi-Shao LaiTsung-Yueh TsaiHsiao-Chuan Chang
    • G01K1/00G01N25/00
    • G01N19/04
    • A bonding strength measuring device for measuring the bonding strength between a substrate and a molding compound disposed on the substrate is provided. The measuring device includes a heating platform, a heating slide plate, and a fixing bracket. The heating platform has a first heating area and a first replaceable fixture. The substrate is disposed on the first heating area, and the first replaceable fixture is used to fix the substrate and has an opening exposing the molding compound. The heating slide plate has a second heating area and a second replaceable fixture. The second heating area is used to heat the molding compound, and the second replaceable fixture has a cavity for accommodating the molding compound. The fixing bracket is used to fix the heating slide plate above the heating platform.
    • 提供了用于测量基板和设置在基板上的模塑料之间的接合强度的接合强度测量装置。 测量装置包括加热平台,加热滑板和固定支架。 加热平台具有第一加热区域和第一可更换夹具。 基板设置在第一加热区域上,并且第一可更换夹具用于固定基板,并具有露出模塑料的开口。 加热滑板具有第二加热区域和第二可更换夹具。 第二加热区域用于加热模塑料,第二可更换夹具具有容纳模塑料的空腔。 固定支架用于将加热滑板固定在加热平台上。
    • 10. 发明申请
    • BONDING STRENGTH MEASURING DEVICE
    • 粘结强度测量装置
    • US20090175312A1
    • 2009-07-09
    • US12350643
    • 2009-01-08
    • Yi-Shao LaiTsung-Yueh TsaiHsiao-Chuan Chang
    • Yi-Shao LaiTsung-Yueh TsaiHsiao-Chuan Chang
    • G01N3/00
    • G01N19/04
    • A bonding strength measuring device for measuring the bonding strength between a substrate and a molding compound disposed on the substrate is provided. The measuring device includes a heating platform, a heating slide plate, and a fixing bracket. The heating platform has a first heating area and a first replaceable fixture. The substrate is disposed on the first heating area, and the first replaceable fixture is used to fix the substrate and has an opening exposing the molding compound. The heating slide plate has a second heating area and a second replaceable fixture. The second heating area is used to heat the molding compound, and the second replaceable fixture has a cavity for accommodating the molding compound. The fixing bracket is used to fix the heating slide plate above the heating platform.
    • 提供了用于测量基板和设置在基板上的模塑料之间的接合强度的接合强度测量装置。 测量装置包括加热平台,加热滑板和固定支架。 加热平台具有第一加热区域和第一可更换夹具。 基板设置在第一加热区域上,并且第一可更换夹具用于固定基板,并具有露出模塑料的开口。 加热滑板具有第二加热区域和第二可更换夹具。 第二加热区域用于加热模塑料,第二可更换夹具具有用于容纳模塑料的空腔。 固定支架用于将加热滑板固定在加热平台上。