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1. 发明授权

US08368216B2 Semiconductor package 有权
标题翻译：半导体封装
公开(公告)号：US08368216B2
公开(公告)日：2013-02-05
申请号：US12872644
申请日：2010-08-31
申请人： Yi-Shao Lai , Tsung-Yueh Tsai , Ming-Kun Chen , Hsiao-Chuan Chang , Ming-Hsiang Cheng
发明人： Yi-Shao Lai , Tsung-Yueh Tsai , Ming-Kun Chen , Hsiao-Chuan Chang , Ming-Hsiang Cheng
IPC分类号： H01L23/538 , H01L21/60 , H01L23/488
CPC分类号： H01L21/6835 , H01L21/563 , H01L21/568 , H01L23/3114 , H01L24/27 , H01L25/0652 , H01L25/50 , H01L2224/1184 , H01L2224/131 , H01L2224/1329 , H01L2224/16145 , H01L2224/2784 , H01L2224/73104 , H01L2224/73204 , H01L2224/81005 , H01L2224/81801 , H01L2224/8185 , H01L2224/831 , H01L2225/06513 , H01L2924/15311 , H01L2924/15321 , H01L2924/014
摘要： The present invention relates to a semiconductor package having at least one first layer chip, a plurality of first metal bumps, at least one second layer chip and a package body. The first layer chip includes a first active surface upon which the first metal bumps are disposed and a plurality of first signal coupling pads disposed adjacent to the first active surface. The second layer chip is electrically connected to the first layer chip, and includes a second active surface that faces the first active surface and a plurality of second signal coupling pads. The second signal coupling pads are capacitively coupled to the first signal coupling pads so as to provide proximity communication between the first layer chip and the second layer chip. The package body encapsulates the first layer chip, the first metal bumps, and the second layer chip, and the first metal bumps are partially exposed.
摘要翻译：本发明涉及具有至少一个第一层芯片，多个第一金属凸块，至少一个第二层芯片和封装体的半导体封装。第一层芯片包括设置有第一金属凸块的第一有源表面和与第一有源表面相邻设置的多个第一信号耦合焊盘。第二层芯片电连接到第一层芯片，并且包括面向第一有源表面的第二有源表面和多个第二信号耦合焊盘。第二信号耦合焊盘电容耦合到第一信号耦合焊盘，以便提供第一层芯片和第二层芯片之间的接近通信。封装体封装第一层芯片，第一金属凸块和第二层芯片，并且第一金属凸块部分地露出。

2. 发明申请

US20120153489A1 SEMICONDUCTOR PACKAGE HAVING PROXIMITY COMMUNICATION SIGNAL INPUT TERMINALS AND MANUFACTURING METHODS THEREOF 有权
标题翻译：具有接近通信信号输入终端的半导体封装及其制造方法
公开(公告)号：US20120153489A1
公开(公告)日：2012-06-21
申请号：US13252850
申请日：2011-10-04
申请人： YI-SHAO LAI , TSUNG-YUEH TSAI , MING-KUN CHEN , TAI-PING WANG , MING-HSIANG CHENG
发明人： YI-SHAO LAI , TSUNG-YUEH TSAI , MING-KUN CHEN , TAI-PING WANG , MING-HSIANG CHENG
IPC分类号： H01L23/485
CPC分类号： H01L23/48 , H01L23/3114 , H01L23/522 , H01L23/552 , H01L24/13 , H01L24/16 , H01L25/0657 , H01L2224/13009 , H01L2224/13099 , H01L2224/16145 , H01L2225/06513 , H01L2225/06531 , H01L2225/06565 , H01L2924/07811 , H01L2924/14 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor package includes a semiconductor structure. The semiconductor structure includes a plurality of dielectric layers and a plurality of conductive interconnects embedded in the semiconductor structure. The semiconductor structure also includes a plurality of proximity communication signal input terminals. At least one of the plurality of proximity communication signal input terminals includes a first electrode and a second electrode. The first electrode and the second electrode are spaced apart so as to be configured to provide proximity communication through capacitive coupling. The first electrode is exposed proximate to a surface of the semiconductor structure.
摘要翻译：半导体封装包括半导体结构。半导体结构包括多个介电层和嵌入在半导体结构中的多个导电互连。半导体结构还包括多个邻近通信信号输入端。多个邻近通信信号输入端中的至少一个包括第一电极和第二电极。间隔开第一电极和第二电极，以便配置成通过电容耦合提供邻近通信。第一电极在半导体结构的表面附近露出。

3. 发明申请

US20110278739A1 Semiconductor Package 审中-公开
标题翻译：半导体封装
公开(公告)号：US20110278739A1
公开(公告)日：2011-11-17
申请号：US12777442
申请日：2010-05-11
申请人： Yi-Shao Lai , Tsung-Yueh Tsai , Ming-Kun Chen , Hsiao-Chuan Chang , Ming-Hsiang Cheng
发明人： Yi-Shao Lai , Tsung-Yueh Tsai , Ming-Kun Chen , Hsiao-Chuan Chang , Ming-Hsiang Cheng
IPC分类号： H01L23/52
CPC分类号： H01L23/49827 , H01L23/147 , H01L23/48 , H01L23/481 , H01L24/48 , H01L25/0657 , H01L2224/05571 , H01L2224/05573 , H01L2224/16146 , H01L2224/16225 , H01L2224/16227 , H01L2224/48227 , H01L2225/0651 , H01L2225/06513 , H01L2225/06531 , H01L2225/06541 , H01L2225/06548 , H01L2225/06568 , H01L2225/06572 , H01L2924/00014 , H01L2924/10253 , H01L2924/1815 , H01L2924/19104 , H01L2924/19105 , H01L2924/00 , H01L2224/05599 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The present invention relates to a semiconductor package. The semiconductor package includes a substrate, a first chip and an interposer. The first chip is mechanically and electrically connected to the substrate. Some signal pads of the interposer are capacitively coupled to some signal pads of the first chip, so as to provide proximity communication between the first chip and the interposer. Whereby, the capacitively coupled signal pads can be made in fine pitch, and therefore the size of the semiconductor package is reduced and the density of the signal pads is increased.
摘要翻译：本发明涉及半导体封装。半导体封装包括衬底，第一芯片和插入器。第一芯片机械地和电连接到基板。插入器的一些信号焊盘电容耦合到第一芯片的一些信号焊盘，以便在第一芯片和插入器之间提供接近通信。由此，电容耦合的信号焊盘可以以细间距制成，因此半导体封装的尺寸减小，信号焊盘的密度增加。

4. 发明授权

US08053906B2 Semiconductor package and method for processing and bonding a wire 有权
标题翻译：用于加工和焊接电线的半导体封装和方法
公开(公告)号：US08053906B2
公开(公告)日：2011-11-08
申请号：US12501285
申请日：2009-07-10
申请人： Hsiao Chuan Chang , Tsung Yueh Tsai , Yi Shao Lai , Ho Ming Tong , Jian Cheng Chen , Wei Chi Yih , Chang Ying Hung , Cheng Tsung Hsu , Chih Cheng Hung
发明人： Hsiao Chuan Chang , Tsung Yueh Tsai , Yi Shao Lai , Ho Ming Tong , Jian Cheng Chen , Wei Chi Yih , Chang Ying Hung , Cheng Tsung Hsu , Chih Cheng Hung
IPC分类号： H01L23/48
CPC分类号： H01L24/85 , H01L23/3128 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/78 , H01L2224/05624 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/48624 , H01L2224/73265 , H01L2224/78301 , H01L2224/85043 , H01L2224/85045 , H01L2224/85047 , H01L2224/85201 , H01L2224/85365 , H01L2224/85947 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01079 , H01L2924/15311 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2224/48824 , H01L2924/00012
摘要： A copper bonding wire includes a line portion and a non-spherical block portion. The non-spherical block portion is physically connected to the line portion, and the cross-sectional area of the non-spherical block portion is bigger than that of the line portion.
摘要翻译：铜接合线包括线部分和非球形块部分。非球形块部分物理连接到线路部分，非球形块部分的横截面面积大于线路部分的横截面面积。

5. 发明授权

US07980757B2 Bonding strength measuring device 有权
标题翻译：接合强度测量装置
公开(公告)号：US07980757B2
公开(公告)日：2011-07-19
申请号：US12350643
申请日：2009-01-08
申请人： Yi-Shao Lai , Tsung-Yueh Tsai , Hsiao-Chuan Chang
发明人： Yi-Shao Lai , Tsung-Yueh Tsai , Hsiao-Chuan Chang
IPC分类号： G01K1/00 , G01N25/00
CPC分类号： G01N19/04
摘要： A bonding strength measuring device for measuring the bonding strength between a substrate and a molding compound disposed on the substrate is provided. The measuring device includes a heating platform, a heating slide plate, and a fixing bracket. The heating platform has a first heating area and a first replaceable fixture. The substrate is disposed on the first heating area, and the first replaceable fixture is used to fix the substrate and has an opening exposing the molding compound. The heating slide plate has a second heating area and a second replaceable fixture. The second heating area is used to heat the molding compound, and the second replaceable fixture has a cavity for accommodating the molding compound. The fixing bracket is used to fix the heating slide plate above the heating platform.
摘要翻译：提供了用于测量基板和设置在基板上的模塑料之间的接合强度的接合强度测量装置。测量装置包括加热平台，加热滑板和固定支架。加热平台具有第一加热区域和第一可更换夹具。基板设置在第一加热区域上，并且第一可更换夹具用于固定基板，并具有露出模塑料的开口。加热滑板具有第二加热区域和第二可更换夹具。第二加热区域用于加热模塑料，第二可更换夹具具有容纳模塑料的空腔。固定支架用于将加热滑板固定在加热平台上。

6. 发明申请

US20110156243A1 SEMICONDUCTOR PACKAGE 有权
标题翻译：半导体封装
公开(公告)号：US20110156243A1
公开(公告)日：2011-06-30
申请号：US12651087
申请日：2009-12-31
申请人： Hsiao-Chuan CHANG , Tsung-Yueh TSAI , Yi-Shao LAI , Chang-Lin YEH , Ming-Hsiang CHENG
发明人： Hsiao-Chuan CHANG , Tsung-Yueh TSAI , Yi-Shao LAI , Chang-Lin YEH , Ming-Hsiang CHENG
IPC分类号： H01L23/14
CPC分类号： H01L23/16 , H01L23/13 , H01L23/3121 , H01L23/48 , H01L23/562 , H01L24/17 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/91 , H01L25/0652 , H01L25/0657 , H01L2224/13099 , H01L2224/16145 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/73207 , H01L2224/73265 , H01L2224/83192 , H01L2224/838 , H01L2225/06517 , H01L2225/06531 , H01L2225/06562 , H01L2924/00014 , H01L2924/01013 , H01L2924/01014 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/12044 , H01L2924/15787 , H01L2924/30107 , H01L2924/00 , H01L2924/3512 , H01L2224/45099 , H01L2224/05599
摘要： A semiconductor package is provided. The semiconductor package includes an organic substrate, a stiffness layer, and a chip subassembly. The stiffness layer is formed on the organic substrate. The chip subassembly is disposed on the stiffness layer. The chip subassembly includes at least a first chip, a second chip, and a third chip. The second chip is disposed between the first chip and the third chip in a stacked orientation. The first chip, the second chip, and the third chip have the function of proximity communication.
摘要翻译：提供半导体封装。半导体封装包括有机衬底，刚度层和芯片子组件。刚性层形成在有机基底上。芯片组件设置在刚度层上。芯片子组件至少包括第一芯片，第二芯片和第三芯片。第二芯片以堆叠取向布置在第一芯片和第三芯片之间。第一芯片，第二芯片和第三芯片具有接近通信的功能。

7. 发明申请

US20100007009A1 SEMICONDUCTOR PACKAGE AND METHOD FOR PROCESSING AND BONDING A WIRE 有权
标题翻译：半导体封装和处理和接线的方法
公开(公告)号：US20100007009A1
公开(公告)日：2010-01-14
申请号：US12501285
申请日：2009-07-10
申请人： Hsiao Chuan CHANG , Tsung Yueh TSAI , Yi Shao LAI , Ho Ming TONG , Jian Cheng CHEN , Wei Chi YIH , Chang Ying HUNG , Cheng Tsung HSU , Chih Cheng HUNG
发明人： Hsiao Chuan CHANG , Tsung Yueh TSAI , Yi Shao LAI , Ho Ming TONG , Jian Cheng CHEN , Wei Chi YIH , Chang Ying HUNG , Cheng Tsung HSU , Chih Cheng HUNG
IPC分类号： H01L23/498 , H01L21/60
CPC分类号： H01L24/85 , H01L23/3128 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/78 , H01L2224/05624 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/48624 , H01L2224/73265 , H01L2224/78301 , H01L2224/85043 , H01L2224/85045 , H01L2224/85047 , H01L2224/85201 , H01L2224/85365 , H01L2224/85947 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01079 , H01L2924/15311 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2224/48824 , H01L2924/00012
摘要： A copper bonding wire includes a line portion and a non-spherical block portion. The non-spherical block portion is physically connected to the line portion, and the cross-sectional area of the non-spherical block portion is bigger than that of the line portion.
摘要翻译：铜接合线包括线部分和非球形块部分。非球形块部分物理连接到线路部分，非球形块部分的横截面面积大于线路部分的横截面面积。

9. 发明申请

US20090230564A1 CHIP STRUCTURE AND STACKED CHIP PACKAGE AS WELL AS METHOD FOR MANUFACTURING CHIP STRUCTURES 有权
标题翻译：芯片结构和堆叠芯片包装作为制造芯片结构的方法
公开(公告)号：US20090230564A1
公开(公告)日：2009-09-17
申请号：US12188621
申请日：2008-08-08
申请人： Tsung Yueh TSAI , Yi Shao Lai , Cheng Wei Huang
发明人： Tsung Yueh TSAI , Yi Shao Lai , Cheng Wei Huang
IPC分类号： H01L23/49 , H01L21/304
CPC分类号： H01L24/83 , H01L21/6835 , H01L21/6836 , H01L21/78 , H01L24/26 , H01L24/48 , H01L24/85 , H01L24/96 , H01L25/0657 , H01L29/0657 , H01L2221/68327 , H01L2224/48091 , H01L2224/48227 , H01L2224/8385 , H01L2224/85 , H01L2225/0651 , H01L2225/06555 , H01L2225/06575 , H01L2924/00014 , H01L2924/01033 , H01L2924/07802 , H01L2924/10155 , H01L2924/10158 , H01L2924/14 , H01L2924/181 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A chip structure according to the present invention is provided. A plurality of pedestals extends from the back surface of the chip structure. Each of the pedestals is located at a position away from the edge of the back surface for a non-zero distance so that the pedestals of an upper chip structure will not damage the bonding pads positioned on the edge of the active surface of a lower chip structure when the upper chip structure is stacked on the active surface of the lower chip structure with the pedestals.
摘要翻译：提供了根据本发明的芯片结构。多个基座从芯片结构的后表面延伸。每个基座位于远离背面的边缘的位置处非零距离，使得上部芯片结构的基座不会损坏位于下部芯片的有源表面的边缘上的接合焊盘当上芯片结构被堆叠在具有基座的下芯片结构的有源表面上时的结构。

10. 发明申请

US20090175312A1 BONDING STRENGTH MEASURING DEVICE 有权
标题翻译：粘结强度测量装置
公开(公告)号：US20090175312A1
公开(公告)日：2009-07-09
申请号：US12350643
申请日：2009-01-08
申请人： Yi-Shao Lai , Tsung-Yueh Tsai , Hsiao-Chuan Chang
发明人： Yi-Shao Lai , Tsung-Yueh Tsai , Hsiao-Chuan Chang
IPC分类号： G01N3/00
CPC分类号： G01N19/04
摘要： A bonding strength measuring device for measuring the bonding strength between a substrate and a molding compound disposed on the substrate is provided. The measuring device includes a heating platform, a heating slide plate, and a fixing bracket. The heating platform has a first heating area and a first replaceable fixture. The substrate is disposed on the first heating area, and the first replaceable fixture is used to fix the substrate and has an opening exposing the molding compound. The heating slide plate has a second heating area and a second replaceable fixture. The second heating area is used to heat the molding compound, and the second replaceable fixture has a cavity for accommodating the molding compound. The fixing bracket is used to fix the heating slide plate above the heating platform.
摘要翻译：提供了用于测量基板和设置在基板上的模塑料之间的接合强度的接合强度测量装置。测量装置包括加热平台，加热滑板和固定支架。加热平台具有第一加热区域和第一可更换夹具。基板设置在第一加热区域上，并且第一可更换夹具用于固定基板，并具有露出模塑料的开口。加热滑板具有第二加热区域和第二可更换夹具。第二加热区域用于加热模塑料，第二可更换夹具具有用于容纳模塑料的空腔。固定支架用于将加热滑板固定在加热平台上。

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