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    • 5. 发明授权
    • Semiconductor package and method for making the same
    • 半导体封装及其制造方法
    • US08072064B1
    • 2011-12-06
    • US12819796
    • 2010-06-21
    • Yi-Shao LaiTsung-Yueh TsaiMing-Kun ChenHsiao-Chuan ChangMing-Hsiang Cheng
    • Yi-Shao LaiTsung-Yueh TsaiMing-Kun ChenHsiao-Chuan ChangMing-Hsiang Cheng
    • H01L21/00
    • H01L23/48H01L23/481H01L24/48H01L25/0657H01L2224/16225H01L2224/48091H01L2224/48227H01L2225/06513H01L2225/06531H01L2225/06541H01L2924/00014H01L2924/1815H01L2224/45099H01L2224/45015H01L2924/207
    • The present invention relates to a semiconductor package and a method for making the same. The semiconductor package includes a first chip and a second chip. The first chip comprises a first active surface, at least one first non-top metal layer and a plurality of first signal coupling pads. The first non-top metal layer is disposed adjacent to and spaced apart from the first active surface by a second distance. The first signal coupling pads are disposed on the first non-top metal layer. The second chip is electrically connected to the first chip. The second chip comprises a second active surface, at least one second non-top metal layer and a plurality of third signal coupling pads. The second active surface faces the first active surface of the first chip. The second non-top metal layer is disposed adjacent to and spaced apart from the second active surface by a fourth distance. The third signal coupling pads are disposed on the second non-top metal layer and capacitively coupled to the first signal coupling pads of the first chip, so as to provide proximity communication between the first chip and the second chip. Whereby, the gap variation between the first signal coupling pads of the first chip and the third signal coupling pads of the second chip is under stringent control of the second distance and the fourth distance. Therefore, the mass-production yield of the semiconductor package is increased.
    • 半导体封装及其制造方法技术领域本发明涉及半导体封装及其制造方法。 半导体封装包括第一芯片和第二芯片。 第一芯片包括第一有源表面,至少一个第一非顶部金属层和多个第一信号耦合焊盘。 第一非顶部金属层设置成与第一有源表面相邻并间隔开第二距离。 第一信号耦合焊盘设置在第一非顶部金属层上。 第二芯片电连接到第一芯片。 第二芯片包括第二有源表面,至少一个第二非顶部金属层和多个第三信号耦合焊盘。 第二活性表面面向第一芯片的第一有效表面。 第二非顶部金属层被布置成与第二有源表面相邻并且与第二有源表面间隔开第四距离。 第三信号耦合焊盘设置在第二非顶部金属层上,并电容耦合到第一芯片的第一信号耦合焊盘,从而提供第一芯片与第二芯片之间的接近通信。 由此,第一芯片的第一信号耦合焊盘与第二芯片的第三信号耦合焊盘之间的间隙变化受到第二距离和第四距离的严格控制。 因此,半导体封装的批量生产量增加。
    • 8. 发明申请
    • LASER DISTANCE MEASURING APPARATUS AND CONTROL METHOD THEREOF
    • 激光测距仪及其控制方法
    • US20100157281A1
    • 2010-06-24
    • US12575569
    • 2009-10-08
    • Yin-Long LuoTsung-Yueh Tsai
    • Yin-Long LuoTsung-Yueh Tsai
    • G01C3/08
    • G01C3/08G01S7/481G01S7/497G01S17/36
    • A laser distance measuring apparatus and control method thereof includes an emitter, a first and second liquid crystal display module, a receiver, a condensing lens, and a control unit. The emitter emits measuring light. The control unit sets the first liquid crystal display module to a second state and the second liquid crystal display module to a first state to receive the reflected light. When the reflected light is larger than a predetermined value, the control unit adjusts a transmittance of the first liquid crystal display module until the reflected light is lower than the predetermined value, and calculates a distance value based on phase difference between the reference light and the reflected light.
    • 激光测距装置及其控制方法包括发射器,第一和第二液晶显示模块,接收器,聚光透镜和控制单元。 发射器发射测量光。 控制单元将第一液晶显示模块设置为第二状态,将第二液晶显示模块设置为接收反射光的第一状态。 当反射光大于预定值时,控制单元调节第一液晶显示模块的透射率,直到反射光低于预定值,并且基于参考光和第一液晶显示模块之间的相位差来计算距离值 反射光。