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1. 发明申请

US20110298156A1 METHODS AND SYSTEMS FOR LASER PROCESSING A WORKPIECE USING A PLURALITY OF TAILORED LASER PULSE SHAPES 失效
标题翻译：激光加工工艺的方法和系统使用多种激光激光脉冲形状
公开(公告)号：US20110298156A1
公开(公告)日：2011-12-08
申请号：US13076810
申请日：2011-03-31
申请人： Andrew Hooper , David Barsic , Kelly J. Bruland , Daragh S. Finn , Lynn Sheehan , Xiaoyuan Peng , Yasu Osako , Jim Dumestre , William J. Jordens
发明人： Andrew Hooper , David Barsic , Kelly J. Bruland , Daragh S. Finn , Lynn Sheehan , Xiaoyuan Peng , Yasu Osako , Jim Dumestre , William J. Jordens
IPC分类号： B29C35/08
CPC分类号： H01S3/102 , B23K26/0622 , B23K26/064 , B23K26/389 , B23K26/40 , B23K26/705 , B23K2103/172 , B23K2103/50 , H01L21/6836 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2221/68327 , H01L2224/27436 , H01L2224/2919 , H01L2224/83191 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01055 , H01L2924/01056 , H01L2924/0106 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01082 , H01L2924/0665 , H01L2924/12043 , H01L2924/13091 , H01L2924/14 , H01S3/0057 , H01S3/1305 , H01L2924/00 , H01L2924/3512
摘要： Tailored laser pulse shapes are used for processing workpieces. Laser dicing of semiconductor device wafers on die-attach film (DAF), for example, may use different tailored laser pulse shapes for scribing device layers down to a semiconductor substrate, dicing the semiconductor substrate, cutting the underlying DAF, and/or post processing of the upper die edges to increase die break strength. Different mono-shape laser pulse trains may be used for respective recipe steps or passes of a laser beam over a scribe line. In another embodiment, scribing a semiconductor device wafer includes only a single pass of a laser beam along a scribe line using a mixed-shape laser pulse train that includes at least two laser pulses that are different than one another. In addition, or in other embodiments, one or more tailored pulse shapes may be selected and provided to the workpiece on-the-fly. The selection may be based on sensor feedback.
摘要翻译：定制的激光脉冲形状用于加工工件。例如，半导体器件晶片在芯片附着膜（DAF）上的激光切割可以使用不同的定制的激光脉冲形状，用于将器件层划分到半导体衬底，切割半导体衬底，切割下面的DAF和/或后处理的上模边缘以增加冲模强度。不同的单形激光脉冲序列可以用于激光束在划线上的相应配方步骤或通过。在另一个实施例中，划线半导体器件晶片仅使用包括彼此不同的至少两个激光脉冲的混合形激光脉冲串沿着划线的激光束的单次通过。另外，或者在其他实施例中，可以选择一个或多个定制的脉冲形状并将其提供给工件。选择可以基于传感器反馈。

2. 发明申请

US20090245301A1 LASER MICROMACHINING USING PROGRAMMABLE PULSE SHAPES 有权
标题翻译：使用可编程脉冲形状的激光微型计算机
公开(公告)号：US20090245301A1
公开(公告)日：2009-10-01
申请号：US12057264
申请日：2008-03-27
申请人： Xiaoyuan Peng , Brian W. Baird , William J. Jordens , David Martin Hemenway
发明人： Xiaoyuan Peng , Brian W. Baird , William J. Jordens , David Martin Hemenway
IPC分类号： H01S3/10 , H01S3/00
CPC分类号： H01S3/0057 , B23K26/0622 , G02F1/0327
摘要： Laser pulse shaping techniques produce tailored laser pulse spectral output. The laser pulses can be programmed to have desired pulse widths and pulse shapes (such as sub-nanosecond to 10 ns-20 ns pulse widths with 1 ns to several nanoseconds leading edge rise times). Preferred embodiments are implemented with one or more electro-optical modulators receiving drive signals that selectively change the amount of incident pulsed laser emission to form a tailored pulse output. Triggering the drive signal from the pulsed laser emission suppresses jitter associated with other stages of the link processing system and substantially removes jitter associated with pulsed laser emission build-up time.
摘要翻译：激光脉冲整形技术产生定制的激光脉冲光谱输出。激光脉冲可以被编程为具有期望的脉冲宽度和脉冲形状（例如，亚纳秒到10ns-20ns脉冲宽度，1ns至几纳秒前沿上升时间）。优选实施例是用一个或多个电光调制器来实现的，该电光调制器接收有选择地改变入射脉冲激光发射量的驱动信号以形成定制的脉冲输出。从脉冲激光发射器触发驱动信号抑制与链路处理系统的其他级相关联的抖动，并且基本上消除与脉冲激光发射建立时间相关联的抖动。

3. 发明授权

US07396706B2 Synchronization technique for forming a substantially stable laser output pulse profile having different wavelength peaks 有权
标题翻译：用于形成具有不同波长峰值的基本稳定的激光输出脉冲分布的同步技术
公开(公告)号：US07396706B2
公开(公告)日：2008-07-08
申请号：US11067299
申请日：2005-02-25
申请人： Yunlong Sun , Richard Harris , William J. Jordens , Lei Sun
发明人： Yunlong Sun , Richard Harris , William J. Jordens , Lei Sun
IPC分类号： B23K26/36 , H01L35/34 , H01L21/30
CPC分类号： H01L23/5258 , B23K26/0604 , B23K26/0613 , B23K26/0622 , B23K26/067 , B23K26/361 , B23K26/40 , B23K2103/08 , B23K2103/10 , B23K2103/12 , B23K2103/14 , B23K2103/172 , B23K2103/26 , B23K2103/50 , H01L2924/0002 , H01S3/10046 , H01S3/2383 , Y10S438/94 , H01L2924/00
摘要： A specially shaped laser pulse energy profile characterized by different laser wavelengths at different times of the profile provides reduced, controlled jitter to enable semiconductor device micromachining that achieves high quality processing and a smaller possible spot size.
摘要翻译：在轮廓不同时刻，不同激光波长的特殊形状的激光脉冲能量分布提供了减少的受控抖动，从而能够实现高质量处理和较小可能光斑尺寸的半导体器件微机械加工。

4. 发明授权

US08404998B2 Acousto-optic deflector applications in laser processing of dielectric or other materials 有权
标题翻译：声光偏转器应用于电介质或其他材料的激光加工
公开(公告)号：US08404998B2
公开(公告)日：2013-03-26
申请号：US12790082
申请日：2010-05-28
申请人： Mark A. Unrath , William J. Jordens , James Ismail , Hisashi Matsumoto , Brian J. Lineburg
发明人： Mark A. Unrath , William J. Jordens , James Ismail , Hisashi Matsumoto , Brian J. Lineburg
IPC分类号： B23K26/14 , B23K26/16
CPC分类号： B23K26/032 , B23K26/046 , B23K26/0648 , B23K26/0665 , B23K26/08 , B23K26/082 , B23K26/40 , B23K2101/40 , B23K2103/50
摘要： A laser processing system for micromachining a workpiece includes a laser source to generate laser pulses for processing a feature in a workpiece, a galvanometer-driven (galvo) subsystem to impart a first relative movement of a laser beam spot position along a processing trajectory with respect to the surface of the workpiece, and an acousto-optic deflector (AOD) subsystem to effectively widen a laser beam spot along a direction perpendicular to the processing trajectory. The AOD subsystem may include a combination of AODs and electro-optic deflectors. The AOD subsystem may vary an intensity profile of laser pulses as a function of deflection position along a dither direction to selectively shape the feature in the dither direction. The shaping may be used to intersect features on the workpiece. The AOD subsystem may also provide rastering, galvo error position correction, power modulation, and/or through-the-lens viewing of and alignment to the workpiece.
摘要翻译：用于微加工工件的激光处理系统包括激光源以产生用于处理工件中的特征的激光脉冲，电流计驱动（电流）子系统，以相对于处理轨迹赋予激光束光斑位置的第一相对运动到达工件的表面，以及声光偏转器（AOD）子系统，以沿垂直于处理轨迹的方向有效地加宽激光束点。 AOD子系统可以包括AOD和电光偏转器的组合。 AOD子系统可以根据抖动方向改变作为偏转位置的函数的激光脉冲的强度分布，以选择性地在抖动方向上成形特征。成形可以用于与工件上的特征相交。 AOD子系统还可以提供对工件的扫描，Galvo错误位置校正，功率调制和/或透镜观察并对准工件。

5. 发明授权

US08374206B2 Combining multiple laser beams to form high repetition rate, high average power polarized laser beam 失效
标题翻译：组合多个激光束形成高重复率，高平均功率偏振激光束
公开(公告)号：US08374206B2
公开(公告)日：2013-02-12
申请号：US12934928
申请日：2009-03-27
申请人： Xiaoyuan Peng , William J. Jordens
发明人： Xiaoyuan Peng , William J. Jordens
IPC分类号： H01S3/10
CPC分类号： H01S3/2383 , H01S3/005 , H01S3/0085 , H01S3/0092 , H01S3/0941 , H01S3/10046 , H01S3/10061 , H01S3/115 , H01S3/117 , H01S5/0085 , H01S5/0092 , H01S5/4012 , H01S5/4025
摘要： Two pulsed lasers (14) or sets of lasers propagate beams of pulses (20) having orthogonally related polarization states. A beam combiner (24) combines the orthogonal beams to form a combined beam propagating along a common beam path (16) to intersect an optical modulator (30) that selectively changes the polarization state of selected pulses of either beam to provide a composite beam (18) including similarly polarized pulses from the orthogonal beams. The composite polarized beam has a composite average power and a composite repetition rate that are greater than those provided by either laser. The optical modulator can also selectively control the polarization states of pulses from either laser to pass through or be blocked by a downstream polarizer (32). Additional modulators may facilitate pulse shaping of the pulses. The system is scalable by addition of sets of single lasers or pairs of lasers with beam combiners and modulators.
摘要翻译：两个脉冲激光器（14）或一组激光器传播具有正交相关极化状态的脉冲（20）。光束组合器（24）组合正交光束以形成沿着公共光束路径（16）传播的组合光束以与选择性地改变任一光束的选定脉冲的偏振态的光调制器（30）相交，以提供复合光束 18）包括来自正交光束的类似偏振脉冲。复合极化光束具有大于由任一激光器提供的复合平均功率和复合重复率。光学调制器还可以选择性地控制来自任一激光器的脉冲的偏振态通过或被下游偏振器（32）阻挡。附加的调制器可以促进脉冲的脉冲整形。该系统通过添加单个激光器组或激光器组合与光束组合器和调制器可扩展。

6. 发明授权

US08598490B2 Methods and systems for laser processing a workpiece using a plurality of tailored laser pulse shapes 失效
标题翻译：使用多个定制的激光脉冲形状激光加工工件的方法和系统
公开(公告)号：US08598490B2
公开(公告)日：2013-12-03
申请号：US13076810
申请日：2011-03-31
申请人： Andrew Hooper , David Barsic , Kelly J. Bruland , Daragh S. Finn , Lynn Sheehan , Xiaoyuan Peng , Yasu Osako , Jim Dumestre , William J. Jordens
发明人： Andrew Hooper , David Barsic , Kelly J. Bruland , Daragh S. Finn , Lynn Sheehan , Xiaoyuan Peng , Yasu Osako , Jim Dumestre , William J. Jordens
IPC分类号： H01L21/78
CPC分类号： H01S3/102 , B23K26/0622 , B23K26/064 , B23K26/389 , B23K26/40 , B23K26/705 , B23K2103/172 , B23K2103/50 , H01L21/6836 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2221/68327 , H01L2224/27436 , H01L2224/2919 , H01L2224/83191 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01055 , H01L2924/01056 , H01L2924/0106 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01082 , H01L2924/0665 , H01L2924/12043 , H01L2924/13091 , H01L2924/14 , H01S3/0057 , H01S3/1305 , H01L2924/00 , H01L2924/3512
摘要： Tailored laser pulse shapes are used for processing workpieces. Laser dicing of semiconductor device wafers on die-attach film (DAF), for example, may use different tailored laser pulse shapes for scribing device layers down to a semiconductor substrate, dicing the semiconductor substrate, cutting the underlying DAF, and/or post processing of the upper die edges to increase die break strength. Different mono-shape laser pulse trains may be used for respective recipe steps or passes of a laser beam over a scribe line. In another embodiment, scribing a semiconductor device wafer includes only a single pass of a laser beam along a scribe line using a mixed-shape laser pulse train that includes at least two laser pulses that are different than one another. In addition, or in other embodiments, one or more tailored pulse shapes may be selected and provided to the workpiece on-the-fly. The selection may be based on sensor feedback.
摘要翻译：定制的激光脉冲形状用于加工工件。例如，半导体器件晶片在芯片附着膜（DAF）上的激光切割可以使用不同的定制的激光脉冲形状，用于将器件层划分到半导体衬底，切割半导体衬底，切割下面的DAF和/或后处理的上模边缘以增加冲模强度。不同的单形激光脉冲序列可以用于激光束在划线上的相应配方步骤或通过。在另一个实施例中，使用包括彼此不同的至少两个激光脉冲的混合形状的激光脉冲串，划线半导体器件晶片仅包括激光束沿着划线的单次通过。另外，或者在其他实施例中，可以选择一个或多个定制的脉冲形状并将其提供给工件。选择可以基于传感器反馈。

7. 发明授权

US07813389B2 Generating laser pulses of prescribed pulse shapes programmed through combination of separate electrical and optical modulators 有权
标题翻译：通过单独的电和光调制器的组合产生规定脉冲形状的激光脉冲
公开(公告)号：US07813389B2
公开(公告)日：2010-10-12
申请号：US12268203
申请日：2008-11-10
申请人： Xiaoyuan Peng , David Barsic , William J. Jordens , Qi Wang
发明人： Xiaoyuan Peng , David Barsic , William J. Jordens , Qi Wang
IPC分类号： H01S3/30 , H01S3/10 , H01S3/13
CPC分类号： H01S3/06754 , H01S3/2316 , H01S3/2383 , H01S5/005 , H01S5/0092 , H01S5/0428 , H01S5/12
摘要： A programmable laser pulse combines electrical modulation of the pulse frequency and optical modulation of the pulse shape to form laser pulses of prescribed pulse shapes. A prescribed pulse shape features high peak power and low average power. The laser system disclosed also allows for power-scaling and nonlinear conversions to other (shorter or longer) wavelengths. The system provides an economical reliable alternative to using a laser source with high repetition rates to achieve shaped pulses at a variety of wavelengths. The combinatorial scheme disclosed is inherently more efficient than existing subtractive methods.
摘要翻译：可编程激光脉冲组合脉冲频率的电调制和脉冲形状的光调制形成规定脉冲形状的激光脉冲。规定的脉冲形状具有高峰值功率和低平均功率。所公开的激光系统还允许对其它（更短或更长）波长进行功率缩放和非线性转换。该系统提供了使用具有高重复率的激光源实现各种波长的成形脉冲的经济可靠的替代方案。所公开的组合方案固有地比现有的减法方法更有效。

8. 发明申请

US20100118899A1 GENERATING LASER PULSES OF PRESCRIBED PULSE SHAPES PROGRAMMED THROUGH COMBINATION OF SEPARATE ELECTRICAL AND OPTICAL MODULATORS 有权
标题翻译：通过单独电气和光学调制器的组合生成规定的脉冲形状的激光脉冲
公开(公告)号：US20100118899A1
公开(公告)日：2010-05-13
申请号：US12268203
申请日：2008-11-10
申请人： Xiaoyuan Peng , David Barsic , William J. Jordens , Qi Wang
发明人： Xiaoyuan Peng , David Barsic , William J. Jordens , Qi Wang
IPC分类号： H01S3/10
CPC分类号： H01S3/06754 , H01S3/2316 , H01S3/2383 , H01S5/005 , H01S5/0092 , H01S5/0428 , H01S5/12
摘要： A programmable laser pulse combines electrical modulation of the pulse frequency and optical modulation of the pulse shape to form laser pulses of prescribed pulse shapes. A prescribed pulse shape features high peak power and low average power. The laser system disclosed also allows for power-scaling and nonlinear conversions to other (shorter or longer) wavelengths. The system provides an economical reliable alternative to using a laser source with high repetition rates to achieve shaped pulses at a variety of wavelengths. The combinatorial scheme disclosed is inherently more efficient than existing subtractive methods.
摘要翻译：可编程激光脉冲组合脉冲频率的电调制和脉冲形状的光调制形成规定脉冲形状的激光脉冲。规定的脉冲形状具有高峰值功率和低平均功率。所公开的激光系统还允许对其它（更短或更长）波长进行功率缩放和非线性转换。该系统提供了使用具有高重复率的激光源实现各种波长的成形脉冲的经济可靠的替代方案。所公开的组合方案固有地比现有的减法方法更有效。

9. 发明申请

US20110267671A1 COMBINING MULTIPLE LASER BEAMS TO FORM HIGH REPETITION RATE, HIGH AVERAGE POWER POLARIZED LASER BEAM 失效
标题翻译：组合多个激光束形成高重复率，高平均功率极化激光束
公开(公告)号：US20110267671A1
公开(公告)日：2011-11-03
申请号：US12934928
申请日：2009-03-27
申请人： Xiaoyuan Peng , William J. Jordens
发明人： Xiaoyuan Peng , William J. Jordens
IPC分类号： G02F1/03 , G02F1/35 , H01S3/067
CPC分类号： H01S3/2383 , H01S3/005 , H01S3/0085 , H01S3/0092 , H01S3/0941 , H01S3/10046 , H01S3/10061 , H01S3/115 , H01S3/117 , H01S5/0085 , H01S5/0092 , H01S5/4012 , H01S5/4025
摘要： Two pulsed lasers (14) or sets of lasers propagate beams of pulses (20) having orthogonally related polarization states. A beam combiner (24) combines the orthogonal beams to form a combined beam propagating along a common beam path (16) to intersect an optical modulator (30) that selectively changes the polarization state of selected pulses of either beam to provide a composite beam (18) including similarly polarized pulses from the orthogonal beams. The composite polarized beam has a composite average power and a composite repetition rate that are greater than those provided by either laser. The optical modulator can also selectively control the polarization states of pulses from either laser to pass through or be blocked by a downstream polarizer (32). Additional modulators may facilitate pulse shaping of the pulses. The system is scalable by addition of sets of single lasers or pairs of lasers with beam combiners and modulators.
摘要翻译：两个脉冲激光器（14）或一组激光器传播具有正交相关极化状态的脉冲（20）。光束组合器（24）组合正交光束以形成沿着公共光束路径（16）传播的组合光束以与选择性地改变任一光束的选定脉冲的偏振态的光调制器（30）相交，以提供复合光束 18）包括来自正交光束的类似偏振脉冲。复合极化光束具有大于由任一激光器提供的复合平均功率和复合重复率。光学调制器还可以选择性地控制来自任一激光器的脉冲的偏振态通过或被下游偏振器（32）阻挡。附加的调制器可以促进脉冲的脉冲整形。该系统通过添加单个激光器组或激光器组合与光束组合器和调制器可扩展。

10. 发明申请

US20100301023A1 ACOUSTO-OPTIC DEFLECTOR APPLICATIONS IN LASER PROCESSING OF DIELECTRIC OR OTHER MATERIALS 有权
标题翻译：光电或其他材料的激光加工中的光学偏光器应用
公开(公告)号：US20100301023A1
公开(公告)日：2010-12-02
申请号：US12790082
申请日：2010-05-28
申请人： Mark A. Unrath , William J. Jordens , James Ismail , Hisashi Matsumoto , Brian J. Lineburg
发明人： Mark A. Unrath , William J. Jordens , James Ismail , Hisashi Matsumoto , Brian J. Lineburg
IPC分类号： B23K26/00 , B23K26/073
CPC分类号： B23K26/032 , B23K26/046 , B23K26/0648 , B23K26/0665 , B23K26/08 , B23K26/082 , B23K26/40 , B23K2101/40 , B23K2103/50
摘要： A laser processing system for micromachining a workpiece includes a laser source to generate laser pulses for processing a feature in a workpiece, a galvanometer-driven (galvo) subsystem to impart a first relative movement of a laser beam spot position along a processing trajectory with respect to the surface of the workpiece, and an acousto-optic deflector (AOD) subsystem to effectively widen a laser beam spot along a direction perpendicular to the processing trajectory. The AOD subsystem may include a combination of AODs and electro-optic deflectors. The AOD subsystem may vary an intensity profile of laser pulses as a function of deflection position along a dither direction to selectively shape the feature in the dither direction. The shaping may be used to intersect features on the workpiece. The AOD subsystem may also provide rastering, galvo error position correction, power modulation, and/or through-the-lens viewing of and alignment to the workpiece.
摘要翻译：用于微加工工件的激光处理系统包括激光源以产生用于处理工件中的特征的激光脉冲，电流计驱动（电流）子系统，以相对于处理轨迹赋予激光束光斑位置的第一相对运动到达工件的表面，以及声光偏转器（AOD）子系统，以沿垂直于处理轨迹的方向有效地加宽激光束点。 AOD子系统可以包括AOD和电光偏转器的组合。 AOD子系统可以根据抖动方向改变作为偏转位置的函数的激光脉冲的强度分布，以选择性地形成抖动方向上的特征。成形可以用于与工件上的特征相交。 AOD子系统还可以提供对工件的扫描，Galvo错误位置校正，功率调制和/或透镜观察并对准工件。

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