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1. 发明专利

CA873581A ARC-SUPPRESSING CIRCUIT FOR SWITCHING DEVICES IN DIRECT CURRENT CIRCUIT 未知
公开(公告)号：CA873581A
公开(公告)日：1971-06-15
申请号：CA873581D
申请人： WATANABE TOSHIO , MATSUSHITA ELECTRIC WORKS LTD
发明人： WATANABE TOSHIO , UKITA SHIGETSUGU

2. 发明专利

CA847527A ARC-SUPPRESSING CIRCUIT FOR SWITCHING DEVICES IN ALTERNATING CURRENT CIRCUIT 未知
公开(公告)号：CA847527A
公开(公告)日：1970-07-21
申请号：CA847527D
申请人： WATANABE TOSHIO , MATSUSHITA ELECTRIC WORKS LTD
发明人： WATANABE TOSHIO , UKITA SHIGETSUGU

3. 发明专利

CA884573A ARC EXTINGUISHING DEVICE FOR ELECTRIC SWITCHES 未知
公开(公告)号：CA884573A
公开(公告)日：1971-10-26
申请号：CA884573D
申请人： WATANABE TOSHIO
发明人： WATANABE TOSHIO

4. 发明专利

DE1665064B1 未知
公开(公告)号：DE1665064B1
公开(公告)日：1971-03-04
申请号：DE1665064
申请日：1966-07-29
申请人： MATSUSHITA ELECTRIC WORKS LTD , WATANABE TOSHIO
发明人： WATANABE TOSHIO , UKITA SHIGETSUGU
IPC分类号： H01H9/54 , H01H9/30
摘要： 1,113,732. Arcing preventing in switches. MATSUSHITA DENKO KABUSHIKI KAISHA and T. WATANABE. 28 July, 1966 [30 July, 1965; 18 Aug., 1965], No. 33972/66. Heading H1N. An arc suppressing arrangement for use with a pair of contacts (SW) used to interrupt an alternating current comprises a two-terminal multi-layer semi-conductor device (SSS) across the contacts (Fig. 3, not shown). The device (SSS) is a five-layer diode, and a series combination of a capacitor (C) and resistor (R) is inserted in parallel with the switch (SW) and load (L) to protect the diode against voltage surges (Fig. 4, not shown), or is alternatively in parallel with the diode (SSS), (Fig. 5, not shown). An inductor (L 1 ) may be connected in series with the device (SSS), (Figs. 6, 7, not shown), to restrict the current therethrough. The secondary winding (L2) of a transformer (T) is connected in series with the device (SSS), the primary winding (L1) being in series with a capacitor (C1) and the combination being connected across the switch contacts. A voltage surge-limiting capacitor (C2) is optionally provided (Figs. 8-15, not shown).

5. 发明申请

WO2007047790A2 PROCESS FOR LASER WELDING 审中-公开
标题翻译：激光焊接工艺
公开(公告)号：WO2007047790A2
公开(公告)日：2007-04-26
申请号：PCT/US2006/040766
申请日：2006-10-19
申请人： E. I. DU PONT DE NEMOURS AND COMPANY , MORI, Hiroshi , NAKAJIMA, Katsuhiko , NAKAMURA, Hideo , NAKATANI, Mitsunobu , UEDA, Makiko , WATANABE, Toshio
发明人： MORI, Hiroshi , NAKAJIMA, Katsuhiko , NAKAMURA, Hideo , NAKATANI, Mitsunobu , UEDA, Makiko , WATANABE, Toshio
IPC分类号： B29C65/16
CPC分类号： B29C65/1658 , B29C65/1616 , B29C65/1635 , B29C65/1674 , B29C65/1677 , B29C66/1282 , B29C66/12841 , B29C66/14 , B29C66/342 , B29C66/43 , B29C66/71 , B29C66/727 , B29C66/73113 , B29C66/73776 , B29C66/7392 , B29C66/73921 , B29C66/8266 , B29C66/836 , B29K2023/00 , B29K2059/00 , B29K2067/00 , B29K2077/00 , B29K2101/12 , B29K2105/165 , B29K2309/08 , B29K2995/0027 , B29L2031/7492 , Y10T428/249953
摘要： A process for laser welding objects comprising the thermoplastic polymer compositions comprising a material having voids.
摘要翻译：一种用于激光焊接物体的方法，包括含有具有空隙的材料的热塑性聚合物组合物。

6. 发明申请

WO2007047789A1 PROCESS FOR LASER WELDING THREE POLYMERIC LAYERS AND ARTICLE PRODUCED BY THE PROCESS 审中-公开
标题翻译：激光焊接工艺三个聚合物层和工艺生产的产品
公开(公告)号：WO2007047789A1
公开(公告)日：2007-04-26
申请号：PCT/US2006/040765
申请日：2006-10-19
申请人： E. I. DU PONT DE NEMOURS AND COMPANY , MORI, Hiroshi , NAKAJIMA, Katsuhiko , NAKAMURA, Hideo , NAKATANI, Mitsunobu , SUMI, Hiroyuki , WATANABE, Toshio
发明人： MORI, Hiroshi , NAKAJIMA, Katsuhiko , NAKAMURA, Hideo , NAKATANI, Mitsunobu , SUMI, Hiroyuki , WATANABE, Toshio
IPC分类号： B29C65/16
CPC分类号： B29C65/1658 , B29C65/1616 , B29C65/1635 , B29C65/1677 , B29C65/1687 , B29C65/4815 , B29C65/5057 , B29C65/8207 , B29C66/1282 , B29C66/12841 , B29C66/14 , B29C66/43 , B29C66/71 , B29C66/8266 , B29C66/836 , B29K2059/00 , B29K2067/00 , B29K2067/006 , B29K2069/00 , B29K2077/00 , B29K2995/0027 , B29L2031/7492 , B29K2067/003 , B29K2033/08 , B29K2025/06
摘要： A process for welding a first polymeric object to a second polymeric object using laser radiation, wherein the first polymeric object is relatively transparent to the laser radiation and the second object is relatively opaque to the laser radiation, the first and the second objects each presenting a faying surface, said first object presenting an impinging surface, opposite said faying surface thereof, said process comprising the steps of (1) bringing the faying surface of the first object into physical contact with one side of a polymeric film and the faying surface of the second object into physical contact with the other side of the polymeric film to form a juncture between the first object, second object, and polymeric film, and (2) irradiating said first and second objects and polymeric film with said laser radiation such that said laser radiation impinges the impinging surface, passes through said first object and polymeric film and irradiates said faying surface of said second object, causing said first and second objects to be welded at the juncture of the faying surfaces, wherein the polymeric film has an absorptivity of 5 percent or less at the wavelength of the laser radiation.
摘要翻译：一种使用激光辐射将第一聚合物体焊接到第二聚合物体的方法，其中所述第一聚合物体对于所述激光辐射是相对透明的，并且所述第二物体对于所述激光辐射是相对不透明的，所述第一和第二物体各自呈现所述第一物体具有与所述接合表面相对的撞击表面，所述方法包括以下步骤：（1）使所述第一物体的引导表面与聚合物膜的一侧物理接触，并且第二物体与聚合物膜的另一侧物理接触以在第一物体，第二物体和聚合物膜之间形成接合部，以及（2）用所述激光辐射照射所述第一和第二物体和聚合物膜，使得所述激光辐射撞击撞击表面，穿过所述第一物体和聚合物膜并照射所述第二物体的所述配合表面导致所述第一和第二物体在所述接合表面的接合部处被焊接，其中所述聚合物膜在所述激光辐射的波长处具有5％或更小的吸收率。

7. 发明申请

WO2004060610A3 SUBSTRATE HOLDING MECHANISM, SUBSTRATE POLISHING APPARATUS AND SUBSTRATE POLISHING METHOD 审中-公开
标题翻译：基板保持机构，基板抛光装置和基板抛光方法
公开(公告)号：WO2004060610A3
公开(公告)日：2004-11-25
申请号：PCT/JP0317032
申请日：2003-12-26
申请人： EBARA CORP , TOSHIBA KK , TOGAWA TETSUJI , WATANABE TOSHIO , YANO HIROYUKI , TOYOTA GEN , IWADE KENJI , TATEYAMA YOSHIKUNI
发明人： TOGAWA TETSUJI , WATANABE TOSHIO , YANO HIROYUKI , TOYOTA GEN , IWADE KENJI , TATEYAMA YOSHIKUNI
IPC分类号： B24B37/04 , B24B37/30 , B24B37/32 , B24B41/06 , B24B49/14 , B24B55/02 , H01L21/304
CPC分类号： B24B37/015 , B24B41/061 , B24B55/02
摘要： A substrate holding mechanism, a substrate polishing apparatus and a substrate polishing method have functions capable of minimizing the amount of heat generated during polishing of a substrate to be polished and of effectively cooling the substrate holding part of the substrate holding mechanism and also capable of effectively preventing the polishing solution and polishing dust from adhering to the outer peripheral portion of the substrate holding part and drying out thereon. The substrate holding mechanism (top ring 1) has a mounting flange 2, a support member 6, and a retainer ring 3. A substrate W to be polished is held on the lower side of the support member 6 surrounded by the retainer ring 3, and the substrate W is pressed against a polishing surface. The mounting flange 2 is provided with a flow passage 26 contiguous with at least the retainer ring 3. A temperature-controlled gas is supplied through the flow passage 26 to cool the mounting flange 2, the support member 6 and the retainer ring 3. The retainer ring 3 is provided with a plurality of through-holes 3a communicating with the flow passage 26 to spray the gas flowing through the flow passage 26 onto the polishing surface of a polishing table.
摘要翻译：基板保持机构，基板研磨装置和基板研磨方法具有能够使待研磨基板的抛光时产生的热量最小化的功能，并有效地冷却基板保持机构的基板保持部，并且还能够有效地防止研磨液和研磨粉尘附着在基板保持部的外周部并在其上干燥。基板保持机构（顶环1）具有安装凸缘2，支撑构件6和保持环3.待被抛光的基板W被保持在由保持环3包围的支撑构件6的下侧，将基板W压在研磨面上。安装凸缘2设置有与至少保持环3相邻的流动通道26.通过流动通道26供应温度控制的气体以冷却安装凸缘2，支撑构件6和保持环3。保持环3设置有与流路26连通的多个通孔3a，以将流过流路26的气体喷射到研磨台的研磨面上。

8. 发明申请

WO2007047790A3 PROCESS AND COMPOSITION FOR LASER WELDING 审中-公开
标题翻译：激光焊接的工艺和组成
公开(公告)号：WO2007047790A3
公开(公告)日：2007-07-12
申请号：PCT/US2006040766
申请日：2006-10-19
申请人： DU PONT , MORI HIROSHI , NAKAJIMA KATSUHIKO , NAKAMURA HIDEO , NAKATANI MITSUNOBU , UEDA MAKIKO , WATANABE TOSHIO
发明人： MORI HIROSHI , NAKAJIMA KATSUHIKO , NAKAMURA HIDEO , NAKATANI MITSUNOBU , UEDA MAKIKO , WATANABE TOSHIO
IPC分类号： B29C65/16
CPC分类号： B29C65/1658 , B29C65/1616 , B29C65/1635 , B29C65/1674 , B29C65/1677 , B29C66/1282 , B29C66/12841 , B29C66/14 , B29C66/342 , B29C66/43 , B29C66/71 , B29C66/727 , B29C66/73113 , B29C66/73776 , B29C66/7392 , B29C66/73921 , B29C66/8266 , B29C66/836 , B29K2023/00 , B29K2059/00 , B29K2067/00 , B29K2077/00 , B29K2101/12 , B29K2105/165 , B29K2309/08 , B29K2995/0027 , B29L2031/7492 , Y10T428/249953
摘要： A process for welding a first polymeric object (102) to second polymeric object (104) using laser radiation, wherein the first polymeric object is relatively transparent to the laser radiation and the second object is relatively opaque to the laser radiation, the first and the second objects each presenting a faying surface, the first object presenting an impinging surface (116) , opposite the faying surface thereof , the process comprising the steps of 1. bringing the faying surfaces of the first and second objects into physical contact so as to form a juncture there between and 2. irradiating the first and second objects with the laser radiation such that the laser radiation impinges the impinging surface (116) , passes through the first object and irradiates the faying surface of the second object', causing the first and second objects (102,104) to be welded at the juncture of the faying surfaces, wherein the second polymeric object is formed from a thermoplastic polymer composition comprising a material having voids.
摘要翻译：一种使用激光辐射将第一聚合物体（102）焊接到第二聚合物体（104）的方法，其中所述第一聚合物体对于所述激光辐射是相对透明的，并且所述第二物体对于所述激光辐射是相对不透明的，所述第一和第第一物体呈现着与其表面相对的入射表面（116），该第一物体呈现着与其表面相对的第一物体，该过程包括以下步骤：使第一和第二物体的接合表面物理接触从而形成它们之间的接合点与激光辐射照射第一和第二物体，使得激光辐射撞击撞击表面（116），穿过第一物体并照射第二物体的引导表面，从而使第一和第第二物体（102,104）在接合表面的接合处被焊接，其中第二聚合物体由热塑性聚合物组合物形成包括具有空隙的材料。

9. 发明申请

WO2010089902A1 USE OF A PEBA COPOLYMER, COMPOSITION, PROCESS AND SKIN 审中-公开
标题翻译：使用PEBA共聚物，组合物，工艺和皮肤
公开(公告)号：WO2010089902A1
公开(公告)日：2010-08-12
申请号：PCT/JP2009/052451
申请日：2009-02-06
申请人： ARKEMA FRANCE , TOYOTA JIDOSYA KABUSHIKIKAISHA , AMOUROUX, Nicolas , JOURDAIN, Melanie , SHIMIZU, Shigeru , WATANABE, Toshio , URAYAMA, Hiroshi , TAKEMOTO, Mototsugu
发明人： AMOUROUX, Nicolas , JOURDAIN, Melanie , SHIMIZU, Shigeru , WATANABE, Toshio , URAYAMA, Hiroshi , TAKEMOTO, Mototsugu
IPC分类号： C08G69/44 , C08L87/00 , B29C41/00
CPC分类号： B29C41/18 , B29C41/003 , B29K2071/00 , B29K2077/00 , B29K2105/0085 , B29L2031/3005 , C08G69/44 , C08L77/02 , C08L77/12 , C08L2205/02 , C08L2666/02 , C08L2666/20
摘要： The present invention relates to the use of a copolymer comprising a polyether block and a polyamide block, for the manufacture of skins having a stable appearance over time and improved resistance to fogging, said copolymer being of at least partially renewable origin. The present invention also relates to a thermoplastic polymer composition and also to a process for the manufacture of such skins, and to the use thereof, in particular in parts of passenger compartments of vehicles, such as dashboards.
摘要翻译：本发明涉及包含聚醚嵌段和聚酰胺嵌段的共聚物的用途，用于制造具有稳定的外观随着时间的改变和提高的抗雾化性能的皮肤，所述共聚物是至少部分可再生的来源。本发明还涉及一种热塑性聚合物组合物，以及制造这种皮肤的方法及其用途，特别是在诸如仪表板的车辆的乘客隔间的部分中。

10. 发明申请

WO2004060610A2 SUBSTRATE HOLDING MECHANISM, SUBSTRATE POLISHING APPARATUS AND SUBSTRATE POLISHING METHOD 审中-公开
标题翻译：基板保持机构，基板抛光装置和基板抛光方法
公开(公告)号：WO2004060610A2
公开(公告)日：2004-07-22
申请号：PCT/JP2003/017032
申请日：2003-12-26
申请人： EBARA CORPORATION , KABUSHIKI KAISHA TOSHIBA , TOGAWA, Tetsuji , WATANABE, Toshio , YANO, Hiroyuki , TOYOTA, Gen , IWADE, Kenji , TATEYAMA, Yoshikuni
发明人： TOGAWA, Tetsuji , WATANABE, Toshio , YANO, Hiroyuki , TOYOTA, Gen , IWADE, Kenji , TATEYAMA, Yoshikuni
IPC分类号： B24B37/04
CPC分类号： B24B37/015 , B24B41/061 , B24B55/02
摘要： A substrate holding mechanism, a substrate polishing apparatus and a substrate polishing method have functions capable of minimizing the amount of heat generated during polishing of a substrate to be polished and of effectively cooling the substrate holding part of the substrate holding mechanism and also capable of effectively preventing the polishing solution and polishing dust from adhering to the outer peripheral portion of the substrate holding part and drying out thereon. The substrate holding mechanism (top ring 1) has a mounting flange 2, a support member 6, and a retainer ring 3. A substrate W to be polished is held on the lower side of the support member 6 surrounded by the retainer ring 3, and the substrate W is pressed against a polishing surface. The mounting flange 2 is provided with a flow passage 26 contiguous with at least the retainer ring 3. A temperature-controlled gas is supplied through the flow passage 26 to cool the mounting flange 2, the support member 6 and the retainer ring 3. The retainer ring 3 is provided with a plurality of through-holes 3a communicating with the flow passage 26 to spray the gas flowing through the flow passage 26 onto the polishing surface of a polishing table.
摘要翻译：衬底保持机构，衬底抛光装置和衬底抛光方法具有能够最小化抛光期间产生的热量的功能，并且有效地冷却衬底保持机构的衬底保持部分基板保持机构，并且还能够有效地防止抛光液和抛光粉附着到基板保持部的外周部并在其上干燥。基板保持机构（顶环1）具有安装凸缘2，支撑构件6和挡圈3.待被抛光的基板W保持在由挡圈3围绕的支撑构件6的下侧，基板W被按压在研磨面上。安装凸缘2设置有至少与保持环3邻接的流动通道26.通过流动通道26供应温度受控的气体以冷却安装凸缘2，支撑构件6和保持环3。在保持环3上设有与流路26连通的多个贯通孔3a，以将流过流路26的气体喷射到研磨台的研磨面上。

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