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    • 4. 发明申请
    • METHOD OF MANUFACTURING SIDEWALL SPACERS ON A MEMORY DEVICE, AND DEVICE COMPRISING SAME
    • 在存储器件上制造隔板间隔的方法以及包含其的装置
    • WO2006130309A2
    • 2006-12-07
    • PCT/US2006/017367
    • 2006-05-05
    • MICRON TECHNOLOGY, INC.HWANG, David, K.PAREKH, KunalWILLETT, MichaelTRIVEDI, JigishMATHEW, SurajPETERSON, Greg
    • HWANG, David, K.PAREKH, KunalWILLETT, MichaelTRIVEDI, JigishMATHEW, SurajPETERSON, Greg
    • H01L27/105H01L21/8239H01L21/8247H01L21/8242H01L27/108
    • H01L27/11526H01L27/105H01L27/1052H01L27/10894H01L27/10897H01L27/11543
    • The present invention is generally directed to a method of manufacturing sidewall spacers on a memory device, and a memory device comprising such sidewall spacers. In one illustrative embodiment, the method includes forming sidewall spacers on a memory device comprised of a memory array and at least one peripheral circuit by forming a first sidewall spacer adjacent a word line structure in the memory array, the first sidewall spacer having a first thickness and forming a second sidewall spacer adjacent a transistor structure in the peripheral circuit, the second sidewall spacer having a second thickness that is greater than the first thickness, wherein the first and second sidewall spacers comprise material from a single layer of spacer material. In one illustrative embodiment, the device includes a memory array comprised of a plurality of word line structures, each of the plurality of word line structures having a first sidewall spacer formed adjacent thereto, the first sidewall spacer having a first thickness, and a peripheral circuit comprised of at least one transistor having a second sidewall spacer formed adjacent thereto, the second sidewall spacer having a second thickness that is greater than the first thickness, the first and second sidewall spacers comprised of a material from a single layer of spacer material.
    • 本发明一般涉及在存储器件上制造侧壁间隔物的方法,以及包括这种侧壁间隔物的存储器件。 在一个说明性实施例中,该方法包括在由存储器阵列和至少一个外围电路构成的存储器件上形成侧壁间隔物,该隔离物通过形成邻近存储器阵列中的字线结构的第一侧壁间隔物,第一侧壁间隔物具有第一厚度 以及在所述外围电路中形成与所述晶体管结构相邻的第二侧壁间隔物,所述第二侧壁间隔物具有大于所述第一厚度的第二厚度,其中所述第一和第二侧壁间隔物包括来自单层间隔物材料的材料。 在一个说明性实施例中,该装置包括由多个字线结构组成的存储器阵列,多个字线结构中的每一个具有与其相邻形成的第一侧壁间隔物,第一侧壁间隔物具有第一厚度,外围电路 包括至少一个晶体管,其具有与其相邻形成的第二侧壁间隔物,所述第二侧壁间隔物具有大于第一厚度的第二厚度,所述第一和第二侧壁间隔物由来自单层间隔物材料的材料构成。
    • 8. 发明申请
    • SIDEWALL SPACERS ON A MEMORY DEVICE
    • 内存设备上的平板电脑
    • WO2006130309A3
    • 2007-02-15
    • PCT/US2006017367
    • 2006-05-05
    • MICRON TECHNOLOGY INCHWANG DAVID KPAREKH KUNALWILLETT MICHAELTRIVEDI JIGISHMATHEW SURAJPETERSON GREG
    • HWANG DAVID KPAREKH KUNALWILLETT MICHAELTRIVEDI JIGISHMATHEW SURAJPETERSON GREG
    • H01L27/105H01L21/8239H01L21/8242H01L21/8247H01L27/108
    • H01L27/11526H01L27/105H01L27/1052H01L27/10894H01L27/10897H01L27/11543
    • The present invention is generally directed to a method of manufacturing sidewall spacers on a memory device, and a memory device comprising such sidewall spacers. In one illustrative embodiment, the method includes forming sidewall spacers on a memory device comprised of a memory array and at least one peripheral circuit by forming a first sidewall spacer adjacent a word line structure in the memory array, the first sidewall spacer having a first thickness and forming a second sidewall spacer adjacent a transistor structure in the peripheral circuit, the second sidewall spacer having a second thickness that is greater than the first thickness, wherein the first and second sidewall spacers comprise material from a single layer of spacer material. In one illustrative embodiment, the device includes a memory array comprised of a plurality of word line structures, each of the plurality of word line structures having a first sidewall spacer formed adjacent thereto, the first sidewall spacer having a first thickness, and a peripheral circuit comprised of at least one transistor having a second sidewall spacer formed adjacent thereto, the second sidewall spacer having a second thickness that is greater than the first thickness, the first and second sidewall spacers comprised of a material from a single layer of spacer material.
    • 本发明一般涉及在存储器件上制造侧壁间隔物的方法,以及包括这种侧壁间隔物的存储器件。 在一个说明性实施例中,该方法包括在由存储器阵列和至少一个外围电路构成的存储器件上形成侧壁间隔物,该隔离物通过形成邻近存储器阵列中的字线结构的第一侧壁间隔物,第一侧壁间隔物具有第一厚度 以及在所述外围电路中形成与所述晶体管结构相邻的第二侧壁间隔物,所述第二侧壁间隔物具有大于所述第一厚度的第二厚度,其中所述第一和第二侧壁间隔物包括来自单层间隔物材料的材料。 在一个说明性实施例中,该装置包括由多个字线结构组成的存储器阵列,多个字线结构中的每一个具有与其相邻形成的第一侧壁间隔物,第一侧壁间隔物具有第一厚度,外围电路 包括至少一个晶体管,其具有与其相邻形成的第二侧壁间隔物,所述第二侧壁间隔物具有大于第一厚度的第二厚度,所述第一和第二侧壁间隔物由来自单层间隔物材料的材料构成。