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1. 发明授权

US07479662B2 Coated LED with improved efficiency 有权
标题翻译：涂层LED效率提高
公开(公告)号：US07479662B2
公开(公告)日：2009-01-20
申请号：US10525697
申请日：2003-08-29
申请人： Thomas F. Soules , Stanton Weaver, Jr. , Chen-Lun Hsing Chen , Mathew Sommers , Boris Kolodin , Anan Achyut Setlur , Thomas Elliot Stecher
发明人： Thomas F. Soules , Stanton Weaver, Jr. , Chen-Lun Hsing Chen , Mathew Sommers , Boris Kolodin , Anan Achyut Setlur , Thomas Elliot Stecher
IPC分类号： H01L29/22 , H01L29/24 , H01L33/00 , H01L21/00 , H01J63/04
CPC分类号： H01L33/58 , F21K9/64 , H01L33/44 , H01L33/507 , H01L2224/48091 , H01L2924/00014
摘要： An LED device including an LED chip and a lens positioned apart from the chip and coated with a uniform thickness layer of fluorescent phosphor for converting at least some of the radiation emitted by the chip into visible light. Positioning the phosphor layer away from the LED improves the efficiency of the device and produces more consistent color rendition. The surface area of the lens is preferably at least ten times the surface area of the LED chip. For increased efficiency, the reflector and submount can also be coated with phosphor to further reduce internal absorption.
摘要翻译：一种LED装置，包括LED芯片和与芯片分离并且涂覆有均匀厚度的荧光荧光粉层的透镜，用于将由芯片发射的至少一些辐射转换成可见光。将荧光体层定位在远离LED的位置，提高了器件的效率，并产生更一致的色彩再现。透镜的表面积优选为LED芯片的表面积的至少十倍。为了提高效率，反射器和底座也可以涂覆磷光体，以进一步减少内部吸收。

2. 发明申请

US20070147046A1 LED LIGHT WITH ACTIVE COOLING 有权
标题翻译： LED活动冷却灯
公开(公告)号：US20070147046A1
公开(公告)日：2007-06-28
申请号：US11682784
申请日：2007-03-06
申请人： Mehmet Arik , James Petroski , Stanton Weaver
发明人： Mehmet Arik , James Petroski , Stanton Weaver
IPC分类号： F21V29/00
CPC分类号： F21V29/74 , F21V29/02 , F21V29/67 , F21V29/76 , F21Y2115/10 , H01L23/467 , H01L23/473 , H01L2924/0002 , Y10S362/80 , H01L2924/00
摘要： An LED light system that includes an LED and a synthetic jet actuator to cool the LED as disclosed.
摘要翻译：一种LED灯系统，其包括LED和合成射流致动器以冷却LED，如所公开的。

3. 发明申请

US20070144236A1 Sensor Device For Detection of Dissolved Hydrocarbon Gases in Oil Filled High-Voltage Electrical Equipment 失效
标题翻译：用于检测充油高压电气设备中溶解的烃类气体的传感器装置
公开(公告)号：US20070144236A1
公开(公告)日：2007-06-28
申请号：US11683739
申请日：2007-03-08
申请人： Edward Stokes , Peter Sandvik , Vinayak Tilak , Jeffrey Fedison , Elena Babes-Dornea , Renyan Qin , James Rose , Stanton Weaver
发明人： Edward Stokes , Peter Sandvik , Vinayak Tilak , Jeffrey Fedison , Elena Babes-Dornea , Renyan Qin , James Rose , Stanton Weaver
IPC分类号： G01N27/00
CPC分类号： G01N33/2841 , G01N27/4141
摘要： A multi-gas sensor device for the detection of dissolved hydrocarbon gases in oil-filled electrical equipment. The device comprising a semiconductor substrate, one or more catalytic metal gate-electrodes deposited on the surface of the semiconductor substrate operable for sensing various gases, and an ohmic contact deposited on the surface of the semiconductor substrate. The semiconductor substrate comprises one of GaN, SiC, AlN, InN, AlGaN, InGaN and AlInGaN. A method for sensing gas in an oil-filled reservoir of electrical equipment, comprising providing a sensor device, immersing the sensor device in the oil-filled reservoir, allowing the gases emitted from the oil to interact with the one or more catalytic metal gate-electrodes, altering the gas as it contacts the catalytic metal gate-electrodes and altering the sensitivity of the sensor.
摘要翻译：一种用于检测充油电气设备中溶解的烃类气体的多气体传感器装置。所述器件包括半导体衬底，沉积在可操作以感测各种气体的半导体衬底的表面上的一个或多个催化金属栅电极和沉积在半导体衬底的表面上的欧姆接触。半导体衬底包括GaN，SiC，AlN，InN，AlGaN，InGaN和AlInGaN中的一种。一种用于感测电气设备的充满油的储存器中的气体的方法，包括提供传感器装置，将传感器装置浸入充满油的储存器中，允许从油中排出的气体与一个或多个催化金属栅极 - 电极，当气体接触催化金属栅电极时改变气体并改变传感器的灵敏度。

4. 发明申请

US20070120135A1 Coated led with improved efficiency 有权
标题翻译：涂层领先，效率提高
公开(公告)号：US20070120135A1
公开(公告)日：2007-05-31
申请号：US10525697
申请日：2003-08-29
申请人： Thomas Soules , Stanton Weaver , Chen-Lun Chen , Mathew Sommers , Boris Kolodin , Anan Setlur , Thomas Stecher
发明人： Thomas Soules , Stanton Weaver , Chen-Lun Chen , Mathew Sommers , Boris Kolodin , Anan Setlur , Thomas Stecher
IPC分类号： H01L33/00 , H01L29/22 , H01L29/227
CPC分类号： H01L33/58 , F21K9/64 , H01L33/44 , H01L33/507 , H01L2224/48091 , H01L2924/00014
摘要： An LED device including an LED chip and a lens positioned apart from the chip and coated with a uniform thickness layer of fluorescent phosphor for converting at least some of the radiation emitted by the chip into visible light. Positioning the phosphor layer away from the LED improves the efficiency of the device and produces more consistent color rendition. The surface area of the lens is preferably at least ten times the surface area of the LED chip. For increased efficiency, the reflector and submount can also be coated with phosphor to further reduce internal absorption.
摘要翻译：一种LED装置，包括LED芯片和与芯片分离并且涂覆有均匀厚度的荧光荧光粉层的透镜，用于将由芯片发射的至少一些辐射转换成可见光。将荧光体层定位在远离LED的位置，提高了器件的效率，并产生更一致的色彩再现。透镜的表面积优选为LED芯片的表面积的至少十倍。为了提高效率，反射器和底座也可以涂覆磷光体，以进一步减少内部吸收。

5. 发明申请

US20060130489A1 Thermal transfer device and system and method incorporating same 失效
标题翻译：热转印装置及其组合方法
公开(公告)号：US20060130489A1
公开(公告)日：2006-06-22
申请号：US11015260
申请日：2004-12-17
申请人： Stanton Weaver
发明人： Stanton Weaver
IPC分类号： F25B21/00 , H01L35/28 , B21D53/02
CPC分类号： H01L35/00 , B82Y10/00 , B82Y30/00 , F25B21/00 , F25B2321/003 , H01J45/00 , Y02B30/66 , Y10T29/4935
摘要： A method of manufacturing a thermal transfer device including providing first and second thermally conductive substrates that are substantially atomically flat, providing a patterned electrical barrier having a plurality of closed shapes on the first thermally conductive substrate and providing a nanotube catalyst material on the first thermally conductive substrate in a nanotube growth area oriented within each of the plurality of closed shapes of the patterned electrical barrier. The method also includes orienting the second thermally conductive substrate opposite the first thermally conductive substrate such that the patterned electrical barrier is disposed between the first and second thermally conductive substrates and providing a precursor gas proximate the nanotube catalyst material to facilitate growth of nanotubes in the nanotube growth areas from the first thermally conductive substrate toward, and limited by, the second thermally conductive substrate. In this thermal transfer device, introduction of current flow between the first and second thermally conductive substrates enables heat transfer between the first and second thermally conductive substrates via a flow of electrons between the first and second thermally conductive substrates.
摘要翻译：一种制造热转印装置的方法，包括提供基本上原子上平坦的第一和第二导热基底，在第一导热基底上提供具有多个封闭形状的图案化电屏障，并在第一导热基底上提供纳米管催化剂材料衬底在取向于图案化电屏障的多个封闭形状的每一个内的纳米管生长区域中。该方法还包括将第二导热衬底定位成与第一导热衬底相对的方向，使得图案化电阻挡层设置在第一和第二导热衬底之间，并提供靠近纳米管催化剂材料的前体气体，以促进纳米管在纳米管中的生长生长区域从第一导热衬底朝向第二导热衬底限制。在该热转印装置中，在第一导热基板和第二导热基板之间引入电流可以使第一和第二导热基板之间的电流经由第一和第二导热基板之间的电流传递。

6. 发明申请

US20060071219A1 Monolithic array for solid state ultraviolet light emitters 有权
公开(公告)号：US20060071219A1
公开(公告)日：2006-04-06
申请号：US10950029
申请日：2004-09-24
申请人： Robert Wojnarowski , Stanton Weaver , Abasifreke Ebong , Xian An Cao , Steven LeBoeuf , Larry Rowland , Stephen Arthur
发明人： Robert Wojnarowski , Stanton Weaver , Abasifreke Ebong , Xian An Cao , Steven LeBoeuf , Larry Rowland , Stephen Arthur
IPC分类号： H01L33/00
CPC分类号： H01L33/20 , H01L27/153 , H01L33/32
摘要： The present invention is directed towards a source of ultraviolet energy, wherein the source is a UV-emitting LED's. In an embodiment of the invention, the UV-LED's are characterized by a base layer material including a substrate, a p-doped semiconductor material, a multiple quantum well, a n-doped semiconductor material, upon which base material a p-type metal resides and wherein the base structure has a mesa configuration, which mesa configuration may be rounded on a boundary surface, or which may be non-rounded, such as a mesa having an upper boundary surface that is flat. In other words, the p-type metal resides upon a mesa formed out of the base structure materials. In a more specific embodiment, the UV-LED structure includes n-type metallization layer, passivation layers, and bond pads positioned at appropriate locations of the device. In a more specific embodiment, the p-type metal layer is encapsulated in the encapsulating layer.

7. 发明申请

US20060012991A1 Led lighting system with reflective board 有权
标题翻译：带反光板的LED照明系统
公开(公告)号：US20060012991A1
公开(公告)日：2006-01-19
申请号：US10891722
申请日：2004-07-15
申请人： Stanton Weaver , Thomas Stecher
发明人： Stanton Weaver , Thomas Stecher
IPC分类号： F21V1/00
CPC分类号： H05K1/181 , F21K9/00 , H01L25/0753 , H01L2924/0002 , H01S5/005 , H01S5/02216 , H01S5/02292 , H01S5/4025 , H05K1/0274 , H05K2201/0195 , H05K2201/0209 , H05K2201/2054 , Y02P70/611 , Y10S362/80 , H01L2924/00
摘要： A light emitting apparatus (8) includes one or more light emitting chips (10) that are disposed on a printed circuit board (12) and emit light predominantly in a wavelength range between about 400 nanometers and about 470 nanometers. The printed circuit board includes: (i) an electrically insulating board (14); (ii) electrically conductive printed circuitry (20); and (iii) an electrically insulating solder mask (22) having vias (24) through which the one or more light emitting chips electrically contact the printed circuitry. The solder mask (22) has a reflectance of greater than 60% at least between about 400 nanometers and about 470 nanometers.
摘要翻译：发光装置（8）包括设置在印刷电路板（12）上的一个或多个发光芯片（10），并且发射主要在约400纳米至约470纳米的波长范围内。印刷电路板包括：（i）电绝缘板（14）; （ii）导电印刷电路（20）; 和（iii）具有通孔（24）的电绝缘的焊接掩模（22），所述一个或多个发光芯片通过该通孔与印刷电路电接触。焊料掩模（22）具有大于60％的反射率，至少在约400纳米和约470纳米之间。

8. 发明申请

US20060000226A1 Thermal transfer device and system and method incorporating same 失效
标题翻译：热转印装置及其组合方法
公开(公告)号：US20060000226A1
公开(公告)日：2006-01-05
申请号：US10880807
申请日：2004-06-30
申请人： Stanton Weaver
发明人： Stanton Weaver
IPC分类号： F25B21/00 , F25B49/00
CPC分类号： F25B21/00 , F25B2321/003 , Y02B30/66 , Y10T29/49147
摘要： A thermal transfer device having a first substrate layer, a second substrate layer and first and second electrodes disposed between the first substrate layer and the second substrate layer. The thermal transfer device also includes a release layer disposed between the first electrode and the second electrode and an actuator disposed adjacent the first and second electrodes. The actuator is adapted to separate the first and second electrodes from the release layer to open a thermotunneling gap between the first and second electrodes, and wherein the actuator is adapted to actively control the thermotunneling gap.
摘要翻译：一种热转印装置，具有第一基底层，第二基底层和设置在第一基底层和第二基底层之间的第一和第二电极。热转印装置还包括设置在第一电极和第二电极之间的释放层和邻近第一和第二电极设置的致动器。致动器适于将第一和第二电极与释放层分开以打开第一和第二电极之间的热电穿孔间隙，并且其中致动器适于主动地控制热电穿孔间隙。

9. 发明授权

US06964877B2 LED power package 有权
标题翻译： LED电源包装
公开(公告)号：US06964877B2
公开(公告)日：2005-11-15
申请号：US10832969
申请日：2004-04-27
申请人： Chen-Lun Hsing Chen , Stanton Weaver, Jr. , Ivan Eliashevich , Sebastien Libon , Mehmet Arik , David Shaddock
发明人： Chen-Lun Hsing Chen , Stanton Weaver, Jr. , Ivan Eliashevich , Sebastien Libon , Mehmet Arik , David Shaddock
IPC分类号： H01L21/00 , H01L31/02 , H01L33/48 , H01L33/62
CPC分类号： H01L33/486 , H01L24/97 , H01L33/62 , H01L33/647 , H01L2224/05001 , H01L2224/05023 , H01L2224/05568 , H01L2224/16 , H01L2224/97 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12041 , H01L2924/12042 , H01L2924/3011 , H01L2224/81 , H01L2924/00 , H01L2224/05599 , H01L2224/05644 , H01L2224/05155 , H01L2224/05166
摘要： Surface mount light emitting diode (LED) packages each contain a light emitting diode (LED) die (24). A plurality of arrays of openings are drilled into an electrically insulating sub-mount wafer (10). A metal is applied to the drilled openings to produce a plurality of via arrays (12). The LED dice (24) are flip-chip bonded onto a frontside (16) of the sub-mount wafer (10). The p-type and n-type contacts of each flip-chip bonded LED (24) electrically communicate with a solderable backside (18) of the sub-mount wafer (10) through a via array (12). A thermal conduction path (10, 12) is provided for thermally conducting heat from the flip-chip bonded LED dice (24) to the solderable backside (18) of the sub-mount wafer (10). Subsequent to the flip-chip bonding, the sub-mount wafer (10) is separated to produce the surface mount LED packages.
摘要翻译：表面贴装发光二极管（LED）封装各自包含发光二极管（LED）裸片（24）。将多个开口阵列钻入电绝缘子安装晶片（10）中。金属被施加到钻孔以产生多个通孔阵列（12）。 LED芯片（24）被倒装芯片接合到子安装晶片（10）的前侧（16）上。每个倒装芯片接合的LED（24）的p型和n型触点通过通孔阵列（12）与辅助安装晶片（10）的可焊接背面（18）电连通。提供了一种导热路径（10,12），用于将来自倒装芯片接合的LED骰子（24）的热量传导到子安装晶片（10）的可焊接背面（18）。在倒装芯片接合之后，子安装晶片（10）被分离以产生表面贴装LED封装。

10. 发明申请

US20070165402A1 LED lighting system with reflective board 有权
标题翻译： LED照明系统带反光板
公开(公告)号：US20070165402A1
公开(公告)日：2007-07-19
申请号：US11725410
申请日：2007-03-19
申请人： Stanton Weaver , Thomas Stecher
发明人： Stanton Weaver , Thomas Stecher
IPC分类号： F21V1/00
CPC分类号： H05K1/181 , F21K9/00 , H01L25/0753 , H01L2924/0002 , H01S5/005 , H01S5/02216 , H01S5/02292 , H01S5/4025 , H05K1/0274 , H05K2201/0195 , H05K2201/0209 , H05K2201/2054 , Y02P70/611 , Y10S362/80 , H01L2924/00
摘要： A light emitting apparatus (8) includes one or more light emitting chips (10) that are disposed on a printed circuit board (12) and emit light predominantly in a wavelength range between about 400 nanometers and about 470 nanometers. The printed circuit board includes: (i) an electrically insulating board (14); (ii) electrically conductive printed circuitry (20); and (iii) an electrically insulating solder mask (22) having vias (24) through which the one or more light emitting chips electrically contact the printed circuitry. The solder mask (22) has a reflectance of greater than 60% at least between about 400 nanometers and about 470 nanometers.
摘要翻译：发光装置（8）包括设置在印刷电路板（12）上的一个或多个发光芯片（10），并且发射主要在约400纳米至约470纳米的波长范围内。印刷电路板包括：（i）电绝缘板（14）; （ii）导电印刷电路（20）; 和（iii）具有通孔（24）的电绝缘的焊接掩模（22），所述一个或多个发光芯片通过该通孔与印刷电路电接触。焊料掩模（22）具有大于60％的反射率，至少在约400纳米和约470纳米之间。

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