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1. 发明专利

JP2011202266A Mating-type connecting part and method of producing the same 有权
标题翻译：主要类型的连接部分及其生产方法
公开(公告)号：JP2011202266A
公开(公告)日：2011-10-13
申请号：JP2010073502
申请日：2010-03-26
申请人： Kobe Steel Ltd , Shinko Leadmikk Kk , 株式会社神戸製鋼所 , 神鋼リードミック株式会社
发明人： MASAGO YASUSHI , TAIRA KOICHI , MITSUI TOSHIYUKI , KAKUMOTO JUNICHI
IPC分类号： C25D7/00 , C25D5/12 , C25D5/50 , H01R13/03
摘要： PROBLEM TO BE SOLVED: To provide an mating-type connecting part which has an Sn coating layer and a Cu-Sn alloy coating layer each having an appropriate and controllable plan-view shape on the outermost surface of a contact side with a mating part and which meets the need of miniaturization of a terminal.SOLUTION: The mating-type connecting part includes as the surface coating layer, an Sn coating layer group X observed as a plurality of parallel lines, and the CU-Sn alloy layer 2 present adjacent to each side of each of the Sn coating layers 1a-1d constituting the Sn coating layer group X. The maximum height roughness Rz in the part insertion direction is ≤10 μm. When a copper sheet material is stamped, the copper sheet material is surface-roughened by pressing, thereby forming depressions observed as a plurality of parallel lines in the surface of the copper sheet material and the copper sheet material is then plated with Cu and Sn, followed by reflowing to complete the production.
摘要翻译：要解决的问题：提供一种配合型连接部件，其具有Sn接触层和Cu-Sn合金涂层，每个Sn镀层和Cu-Sn合金涂层在与接合部分的接触侧的最外表面上具有适当且可控的平面形状，满足终端小型化的需要。解决方案：配合型连接部件包括作为表面被覆层，作为多条平行线观察到的Sn涂层组X，以及邻近存在的Cu-Sn合金层2 构成Sn被覆层组X的Sn被覆层1a〜1d的各侧。部件插入方向的最大高度粗糙度Rz为≤10μm。当铜片材料被冲压时，铜片材料通过压制进行表面粗糙化，从而在铜片材料的表面上形成作为多条平行线观察到的凹陷，然后用铜和锡镀铜片材料，其次是回流完成生产。

2. 发明专利

JP2011071471A Lead frame for led 有权
标题翻译： LED框架
公开(公告)号：JP2011071471A
公开(公告)日：2011-04-07
申请号：JP2010094493
申请日：2010-04-15
申请人： Kobe Steel Ltd , Shinko Leadmikk Kk , 株式会社神戸製鋼所 , 神鋼リードミック株式会社
发明人： SUZUKI JUN , SATO TOSHIKI , OKAMOTO HIDEHITO , MITSUI TOSHIYUKI , SUEMATSU JIN , NISHIMURA MASAYASU
IPC分类号： H01L33/62
CPC分类号： H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a lead frame for an LED equipped with a reflection film maintaining a high reflection factor for a long period, to be stably and easily formed. SOLUTION: The lead frame 10 for an LED is constituted of laminating an Ni plating film 12a having a film thickness of ≥0.4 μm, an Ag plating film 12b having a film thickness of ≥0.2 μm and an Ag alloy film 13 containing 0.06-0.5 at% Ge and 0.02-0.2 at% Bi and having a film thickness of 20-500 nm on a substrate 11 composed of copper or copper alloy. By forming the Ni plating film 12a on the surface of the substrate 11, occurrence of discoloration due to thermal expansion of Cu from the inside of the substrate 11 to the surface is prevented. By forming the Ag alloy film 13 by a sputtering method, Ge and Bi are concentrated into the surface and heat resistance, halogenation resistance and sulfidation resistance are given. Further by forming the Ag plating film 12b having a comparatively large crystal grain size on a ground, the crystal grain size of the Ag alloy film 13 is increased, and Ag aggregation by heat is suppressed. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了能够稳定且容易地形成用于为配备有反射膜的反射膜的LED提供长期保持高反射率的引线框架。解决方案：LED的引线框架10由层压厚度≥0.4μm的Ni镀膜12a，膜厚度≥0.2μm的Ag镀膜12b和含有 0.06-0.5at％Ge和0.02-0.2at％Bi，并且在由铜或铜合金构成的基板11上具有20-500nm的膜厚度。通过在基板11的表面上形成Ni镀膜12a，可以防止由于基板11的内部向表面的Cu的热膨胀而发生变色。通过溅射法形成Ag合金膜13，将Ge和Bi浓缩成表面，得到耐热性，耐卤化性和耐硫化性。此外，通过在地面上形成具有比较大的晶粒尺寸的Ag镀膜12b，Ag合金膜13的晶粒尺寸增加，并且抑制了Ag的聚集。版权所有（C）2011，JPO＆INPIT

3. 发明专利

JP2010262863A Press-fit terminal and method of manufacturing the same 有权
标题翻译：压接端子及其制造方法
公开(公告)号：JP2010262863A
公开(公告)日：2010-11-18
申请号：JP2009113779
申请日：2009-05-08
申请人： Shinko Leadmikk Kk , 神鋼リードミック株式会社
发明人： OKAMOTO HIDEHITO , HIOKA SHINICHIRO , MITSUI TOSHIYUKI
IPC分类号： H01R12/00 , H01R12/51 , H01R12/55 , H01R12/58 , H01R43/16
摘要： PROBLEM TO BE SOLVED: To provide a press-fit terminal allowing for a highly productive and stable production with high hardness without deterioration of a contact performance with a through-hole, and also to provide a method of manufacturing the same. SOLUTION: The press-fit terminal 10 is to be attached to a substrate 11 by being press-fitted into the through-hole 12 formed in the substrate 11, wherein a surface of a base material is sequentially provided with a Cu 3 Sn alloy layer and a Cu 6 Sn 5 alloy layer via a base plating layer, thereby eliminating an exposure of Sn on the surface of the Cu 6 Sn 5 alloy layer. The method of manufacturing the press-fit terminal includes a first step of: providing a base plating to the base material; and sequentially performing a Cu plating and Sn plating thereon, and a second step of: heating the base material having the base plating, the Cu plating, and the Sn plating; sequentially providing the Cu 3 Sn alloy layer and the Cu 6 Sn 5 alloy layer via the base plating layer; and thereby eliminating the exposure of Sn on the surface of the heat-treated Cu 6 Sn 5 alloy layer. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种压配合端子，其能够以高硬度进行高生产性和稳定的生产，而不会导致与通孔的接触性能的劣化，并且还提供其制造方法。解决方案：压入端子10通过压配合到形成在基板11中的通孔12中而附接到基板11，其中基材的表面依次设置有Cu < SB> 3 Sn合金层和Cu 6 Sn 5 合金层，从而消除了Cu在Cu表面上的暴露 6 5 5 合金层。制造压配端子的方法包括：第一步骤：向基材提供基底镀层; 并顺序地进行Cu电镀和Sn镀覆，第二步骤：对具有基底镀层，Cu镀层和Sn镀层的基材进行加热; 通过基底镀层依次提供CuSb 3 Sn合金层和Cu 6 Sn 5 合金层; 从而消除了在热处理的Cu Sn 5 合金层的表面上的Sn的暴露。版权所有（C）2011，JPO＆INPIT

4. 发明专利

JP2014162990A Electrode member and production method thereof 审中-公开
标题翻译：电极部件及其制造方法
公开(公告)号：JP2014162990A
公开(公告)日：2014-09-08
申请号：JP2013038333
申请日：2013-02-28
申请人： Kobe Steel Ltd , 株式会社神戸製鋼所 , Shinko Leadmikk Kk , 神鋼リードミック株式会社
发明人： KATSURA SHOO , SUZUKI JUN , HATTORI TETSUYA , MARUO SATOSHI , FURUYA RYUJI
IPC分类号： C25D7/00 , C25D5/50
摘要： PROBLEM TO BE SOLVED: To provide an electrode member and its production method which enable production of an electrode member having excellent heat resistance by suppressing surface diffusion of Cu of a substrate sufficiently.SOLUTION: Electrode members 1a and 1b are provided with a substrate 11 composed of Cu or a Cu alloy and an Ag plating film 12 of a film thickness of 0.1-10.0 μm which is formed on at least one side of the substrate 11, and the X-ray diffraction intensity Iof the (111) plane and the X-ray diffraction intensity Iof the (200) plane of the Ag plating film 12 satisfy the relation (1): I/I≤3.0.
摘要翻译：要解决的问题：提供一种电极部件及其制造方法，其能够充分地抑制基板的Cu的表面扩散，从而能够制造具有优异的耐热性的电极部件。解决方案：电极部件1a和1b设置有基板11，的Cu或Cu合金以及形成在基板11的至少一侧上的膜厚度为0.1-10.0μm的Ag镀膜12，以及（111）面的X射线衍射强度I和X Ag镀膜12的（200）面的射线衍射强度I满足关系式（1）：I /I≤3.0。

5. 发明专利

JP2013128076A Led lead frame and manufacturing method of the same 有权
标题翻译： LED引线框架及其制造方法
公开(公告)号：JP2013128076A
公开(公告)日：2013-06-27
申请号：JP2011277610
申请日：2011-12-19
申请人： Kobe Steel Ltd , 株式会社神戸製鋼所 , Shinko Leadmikk Kk , 神鋼リードミック株式会社
发明人： SUZUKI JUN , KATSURA SHOO , NISHIMURA MASAYASU
IPC分类号： H01L33/62 , H01L23/48
CPC分类号： H01L2224/45144 , H01L2224/48091 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an LED lead frame which includes a reflection film that can be easily formed and does not change a color and like due to a sulfur component thereby to maintain high reflectance for a long periods of time, and which is suitable for mounting by wire bonding and suitable for soldering.SOLUTION: A lead frame 1 comprises: an Ag plating film 12 having a film thickness of 0.6-8 μm; a metal intermediate film 13 composed of Ti, Zr, a Ti-base alloy or Zr-base alloy and having a film thickness of 1-15 nm; and a noble metal film 14 composed of Pd or Pt and having a film thickness of 2-50 nm, which are laminated on a substrate 11 composed of Cu or a Cu alloy. By coating the Ag plating film 12 with the metal intermediate film 13, contact of a halogen ion or sulfur with the Ag plating film 12 from outside is prevented, thereby achieving a reflection film having excellent durability. By providing the noble metal film 14 on an outermost surface, wire bondability and solderability are added.
摘要翻译：要解决的问题：提供一种LED引线框架，其包括能够容易地形成并且不会由于硫成分而改变颜色的反射膜，从而长期保持高反射率，并且适用于通过引线接合安装并适合焊接。引线框架1包括：具有0.6-8μm的膜厚度的Ag镀膜12; 由Ti，Zr，Ti基合金或Zr基合金构成的膜厚为1-15nm的金属中间膜13; 和由Pd或Pt构成的膜厚度为2-50nm的贵金属膜14层压在由Cu或Cu合金构成的基板11上。通过用金属中间膜13涂布Ag镀膜12，防止了卤素离子或硫与Ag镀膜12从外部的接触，从而实现了耐久性优异的反射膜。通过在最外表面上设置贵金属膜14，添加线接合性和可焊性。版权所有（C）2013，JPO＆INPIT

6. 发明专利

JP2012028139A Terminal for connection 有权
标题翻译：终端连接
公开(公告)号：JP2012028139A
公开(公告)日：2012-02-09
申请号：JP2010165145
申请日：2010-07-22
申请人： Shinko Leadmikk Kk , 神鋼リードミック株式会社
发明人： MITSUI TOSHIYUKI , IZEKI SHIGERU , NISHIMURA MASAYASU
IPC分类号： H01R13/03
摘要： PROBLEM TO BE SOLVED: To provide a terminal for connection that reduces total inserting force and further has stable electric connection reliability.SOLUTION: The terminal 10 for connection can reduce the total insertion force and further has the stable electric connection reliability since a surface plating layer 14 made of In or alloy principally consisting of In is provided on a surface of a base material 11 made of Cu or Cu alloy, and a hard plating layer 13 which is harder than the surface plating layer 14 is formed as a primer of the surface plating layer 14.
摘要翻译：要解决的问题：提供一种降低总插入力的连接用端子，并且还具有稳定的电连接可靠性。解决方案：由于由In制成的表面镀层14或主要由In组成的表面镀层14设置在制成的基材11的表面上，所以用于连接的端子10可以减小总插入力并且还具有稳定的电连接可靠性的Cu或Cu合金，并且形成比表面镀层14硬的硬镀层13作为表面镀层14的底漆。版权所有（C）2012，JPO＆INPIT

7. 发明专利

JP2009144210A Sn-PLATED COPPER SUBSTRATE, METHOD FOR MANUFACTURING Sn-PLATED COPPER SUBSTRATE, LEAD FRAME USING THE SAME, AND CONNECTOR TERMINAL 有权
标题翻译： Sn镀铜基板，制造Sn镀层铜基板的方法，使用其的引线框架和连接器端子
公开(公告)号：JP2009144210A
公开(公告)日：2009-07-02
申请号：JP2007323934
申请日：2007-12-14
申请人： Kobe Steel Ltd , Shinko Leadmikk Kk , 株式会社神戸製鋼所 , 神鋼リードミック株式会社
发明人： SATO TOSHIKI , HISAMOTO ATSUSHI , YANAGISAWA KAZUMI , OKAMOTO HIDEHITO , SUEMATSU JIN
IPC分类号： C25D5/10 , C25D7/00 , H01B5/02 , H01B13/00 , H01L23/50
CPC分类号： H01L24/97 , H01L2924/15747 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an Sn-plated copper substrate which has a plated layer that hardly forms whisker even when an external stress is applied thereto and can be stably formed, is superior in solderability and does not include Pb. SOLUTION: The Sn-plated copper substrate 1 has at least one plated film layer 5 formed by stacking an intermediate Sn-plated layer 3IL and a Cu-plated layer 4 in this order on any metal substrate 2 of a pure copper sheet, a copper alloy sheet and a copper-plated metal sheet, so as to have a layer thickness of 1.5 μm or more; also has an outermost Sn-plated layer 3OL on the plated film layer 5 so that the layer thickness is 0.2 to 1.5 μm and a total thickness including the plated film layer 5 is 3 μm or more; and has an Sn-Cu alloy phase 6 which is made by diffusing Cu that originates in at least one of the Cu-plated layer 4 and the metal substrate 2, into at least any of a grain boundary 3g and a grain 3c of the intermediate Sn-plated layer 3IL and the outermost Sn-plated layer 3OL. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供即使在施加外部应力并且可以稳定地形成时也具有难以形成晶须的镀层的镀Sn的铜基板，具有优异的可焊性并且不包括Pb。镀锡铜基板1具有至少一个镀膜层5，其通过在中间镀Sn层3IL和Cu镀层4上依次层叠在纯铜片的任何金属基板2上铜合金板和镀铜金属片，以使层厚度为1.5μm以上; 在镀膜层5上也具有最外层的镀Sn层，因此层厚度为0.2〜1.5μm，镀膜层5的总厚度为3μm以上。并且具有通过将起源于Cu镀层4和金属基板2中的至少一个的Cu扩散到中间体的晶界3g和晶粒3c中的至少任一个而制成的Sn-Cu合金相6 镀锡层3IL和最外层镀锡层3OL。版权所有（C）2009，JPO＆INPIT

8. 发明专利

JP2012212850A Lead frame for led and manufacturing method therefor 有权
标题翻译： LED框架及其制造方法
公开(公告)号：JP2012212850A
公开(公告)日：2012-11-01
申请号：JP2011245984
申请日：2011-11-09
申请人： Kobe Steel Ltd , Shinko Leadmikk Kk , 株式会社神戸製鋼所 , 神鋼リードミック株式会社
发明人： KATSURA SHOO , SUZUKI JUN , SATO TOSHIKI , MITSUI TOSHIYUKI , NISHIMURA MASAYASU
IPC分类号： H01L33/62 , H01L23/48
CPC分类号： H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a lead frame for LED including a reflection film that can accommodate wire bonding of an LED chip, can maintain high reflectance for a long term by applying a material of low cost in place of silver, and can be formed stably and easily.SOLUTION: The lead frame 1 includes a reflection film 13 having a thickness of 50 nm or more composed of aluminum or an aluminum alloy and formed on a substrate 11 composed of copper or a copper alloy, and a noble metal film 14 having a thickness of 5-50 nm consisting of one kind or more selected from Pd, Au, Pt and formed on the reflection film 13.
摘要翻译：要解决的问题：为了提供一种包括能够适应LED芯片的引线键合的反射膜的LED引线框架，通过应用低成本的材料代替银，可以长期保持高反射率，以及可以稳定且容易地形成。解决方案：引线框架1包括由铝或铝合金构成的厚度为50nm以上的反射膜13，形成在由铜或铜合金构成的基板11上，贵金属膜14具有厚度为5-50nm，由选自Pd，Au，Pt中的一种或多种构成并形成在反射膜13上。版权所有（C）2013，JPO＆INPIT

9. 发明专利

JP2012123953A Pcb terminal and method of manufacturing the same 有权
标题翻译： PCB端子及其制造方法
公开(公告)号：JP2012123953A
公开(公告)日：2012-06-28
申请号：JP2010272088
申请日：2010-12-07
申请人： Kobe Steel Ltd , Shinko Leadmikk Kk , 株式会社神戸製鋼所 , 神鋼リードミック株式会社
发明人： MASAGO YASUSHI , TAIRA KOICHI , MITSUI TOSHIYUKI , KAKUMOTO JUNICHI , NISHIMURA MASAYASU
IPC分类号： H01R13/04 , H01R13/03
CPC分类号： H01R12/55 , C25D5/10 , H01R13/03 , Y10T29/49224
摘要： PROBLEM TO BE SOLVED: To provide an Sn coating layer and a Cu-Sn alloy coating layer having a proper controllable plan view in a PCB terminal where the Cu-Sn alloy coating layer and the Sn coating layer are formed in this order, as a surface coating layer, on the outermost surface of a fitting part to a female terminal, the Sn coating layer is smoothed by reflow treatment, and a part of the Cu-Sn alloy coating layer is exposed to the outermost surface.SOLUTION: An Sn coating layer group X observed as a plurality of parallel lines is formed as a surface coating layer, and a Cu-Sn alloy coating layer 2 is exposed to the outermost surface on both sides of individual Sn coating layers 1a-1d constituting the Sn coating layer group X. The width of the Sn coating layers 1a-1d is 1-500 μm, the interval of adjoining Sn coating layers is 1-2000 μm, and the maximum height roughness Rz of the outermost surface in the terminal insertion direction is 10 μm or less.
摘要翻译：要解决的问题：为了提供在PCB端子中具有适当可控平面图的Sn涂层和Cu-Sn合金涂层，其中Cu-Sn合金涂层和Sn涂层按此顺序形成作为表面被覆层，在与阴端子的嵌合部的最外表面上，通过回流处理使Sn被覆层平坦化，并且将Cu-Sn合金被覆层的一部分露出到最外表面。解决方案：形成作为多个平行线观察的Sn涂层组X作为表面涂层，并且将Cu-Sn合金涂层2暴露于各个Sn涂层1a两侧的最外表面 -1d。Sn涂层1a-1d的宽度为1-500μm，邻接的Sn涂层的间隔为1-2000μm，最外表面的最大高度粗糙度Rz 端子插入方向为10μm以下。版权所有（C）2012，JPO＆INPIT

10. 发明专利

JP2012089821A Electronic part material 有权
标题翻译：电子部件材料
公开(公告)号：JP2012089821A
公开(公告)日：2012-05-10
申请号：JP2011127581
申请日：2011-06-07
申请人： Shinko Leadmikk Kk , 神鋼リードミック株式会社
发明人： MITSUI TOSHIYUKI , IZEKI SHIGERU , KATAYAMA SATORU , NISHIMURA MASAYASU , MATSUDA HIDEHARU
IPC分类号： H01L23/50
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an electronic part material, usable in replace of Cu alloy, and capable of saving weight and reducing raw material cost.SOLUTION: The electronic part material includes a first plating layer 13, which is composed of any one or two or more kinds of Ni or Ni alloy, Cu or Cu alloy, Ag or Ag alloy, Sn or Sn alloy, Pd or Pd alloy, or Au or Au alloy, formed on a surface of an Al alloy substrate 10 to which an annealing treatment is performed to have tensile strength of 200 to 300 MPa and Vickers hardness Hv of 65 to 100.
摘要翻译：要解决的问题：提供可用于替代Cu合金的电子部件材料，并且能够节省重量并降低原材料成本。电解部件材料包括由Ni或Ni合金，Cu或Cu合金，Ag或Ag合金，Sn或Sn合金，Pd或Sn合金中的任何一种或两种以上组成的第一镀层13 Pd合金或Au或Au合金，形成在进行退火处理的Al合金基板10的表面上，其拉伸强度为200〜300MPa，维氏硬度Hv为65〜100。 C）2012，JPO＆INPIT

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