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1. 发明专利

JP2011071471A Lead frame for led 有权
标题翻译： LED框架
公开(公告)号：JP2011071471A
公开(公告)日：2011-04-07
申请号：JP2010094493
申请日：2010-04-15
申请人： Kobe Steel Ltd , Shinko Leadmikk Kk , 株式会社神戸製鋼所 , 神鋼リードミック株式会社
发明人： SUZUKI JUN , SATO TOSHIKI , OKAMOTO HIDEHITO , MITSUI TOSHIYUKI , SUEMATSU JIN , NISHIMURA MASAYASU
IPC分类号： H01L33/62
CPC分类号： H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a lead frame for an LED equipped with a reflection film maintaining a high reflection factor for a long period, to be stably and easily formed. SOLUTION: The lead frame 10 for an LED is constituted of laminating an Ni plating film 12a having a film thickness of ≥0.4 μm, an Ag plating film 12b having a film thickness of ≥0.2 μm and an Ag alloy film 13 containing 0.06-0.5 at% Ge and 0.02-0.2 at% Bi and having a film thickness of 20-500 nm on a substrate 11 composed of copper or copper alloy. By forming the Ni plating film 12a on the surface of the substrate 11, occurrence of discoloration due to thermal expansion of Cu from the inside of the substrate 11 to the surface is prevented. By forming the Ag alloy film 13 by a sputtering method, Ge and Bi are concentrated into the surface and heat resistance, halogenation resistance and sulfidation resistance are given. Further by forming the Ag plating film 12b having a comparatively large crystal grain size on a ground, the crystal grain size of the Ag alloy film 13 is increased, and Ag aggregation by heat is suppressed. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了能够稳定且容易地形成用于为配备有反射膜的反射膜的LED提供长期保持高反射率的引线框架。解决方案：LED的引线框架10由层压厚度≥0.4μm的Ni镀膜12a，膜厚度≥0.2μm的Ag镀膜12b和含有 0.06-0.5at％Ge和0.02-0.2at％Bi，并且在由铜或铜合金构成的基板11上具有20-500nm的膜厚度。通过在基板11的表面上形成Ni镀膜12a，可以防止由于基板11的内部向表面的Cu的热膨胀而发生变色。通过溅射法形成Ag合金膜13，将Ge和Bi浓缩成表面，得到耐热性，耐卤化性和耐硫化性。此外，通过在地面上形成具有比较大的晶粒尺寸的Ag镀膜12b，Ag合金膜13的晶粒尺寸增加，并且抑制了Ag的聚集。版权所有（C）2011，JPO＆INPIT

2. 发明专利

JP2010262863A Press-fit terminal and method of manufacturing the same 有权
标题翻译：压接端子及其制造方法
公开(公告)号：JP2010262863A
公开(公告)日：2010-11-18
申请号：JP2009113779
申请日：2009-05-08
申请人： Shinko Leadmikk Kk , 神鋼リードミック株式会社
发明人： OKAMOTO HIDEHITO , HIOKA SHINICHIRO , MITSUI TOSHIYUKI
IPC分类号： H01R12/00 , H01R12/51 , H01R12/55 , H01R12/58 , H01R43/16
摘要： PROBLEM TO BE SOLVED: To provide a press-fit terminal allowing for a highly productive and stable production with high hardness without deterioration of a contact performance with a through-hole, and also to provide a method of manufacturing the same. SOLUTION: The press-fit terminal 10 is to be attached to a substrate 11 by being press-fitted into the through-hole 12 formed in the substrate 11, wherein a surface of a base material is sequentially provided with a Cu 3 Sn alloy layer and a Cu 6 Sn 5 alloy layer via a base plating layer, thereby eliminating an exposure of Sn on the surface of the Cu 6 Sn 5 alloy layer. The method of manufacturing the press-fit terminal includes a first step of: providing a base plating to the base material; and sequentially performing a Cu plating and Sn plating thereon, and a second step of: heating the base material having the base plating, the Cu plating, and the Sn plating; sequentially providing the Cu 3 Sn alloy layer and the Cu 6 Sn 5 alloy layer via the base plating layer; and thereby eliminating the exposure of Sn on the surface of the heat-treated Cu 6 Sn 5 alloy layer. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种压配合端子，其能够以高硬度进行高生产性和稳定的生产，而不会导致与通孔的接触性能的劣化，并且还提供其制造方法。解决方案：压入端子10通过压配合到形成在基板11中的通孔12中而附接到基板11，其中基材的表面依次设置有Cu < SB> 3 Sn合金层和Cu 6 Sn 5 合金层，从而消除了Cu在Cu表面上的暴露 6 5 5 合金层。制造压配端子的方法包括：第一步骤：向基材提供基底镀层; 并顺序地进行Cu电镀和Sn镀覆，第二步骤：对具有基底镀层，Cu镀层和Sn镀层的基材进行加热; 通过基底镀层依次提供CuSb 3 Sn合金层和Cu 6 Sn 5 合金层; 从而消除了在热处理的Cu Sn 5 合金层的表面上的Sn的暴露。版权所有（C）2011，JPO＆INPIT

3. 发明专利

JP2010262861A Press-fit terminal 有权
标题翻译：新闻终端
公开(公告)号：JP2010262861A
公开(公告)日：2010-11-18
申请号：JP2009113770
申请日：2009-05-08
申请人： Kobe Steel Ltd , Shinko Leadmikk Kk , 株式会社神戸製鋼所 , 神鋼リードミック株式会社
发明人： HARA TOSHIHISA , OKAMOTO HIDEHITO , HIOKA SHINICHIRO , MITSUI TOSHIYUKI
IPC分类号： H01R12/00 , H01R12/53 , H01R12/58 , H01R13/03
摘要： PROBLEM TO BE SOLVED: To provide a press-fit terminal capable of improving each of functions of a mounting part, a female terminal connection part and a substrate connection part and capable of producing a quality product stably and moreover with a better workability. SOLUTION: The press-fit terminal 10 is provided with a female terminal connection part 12 arranged on the one end side of a mounting part 11 to be fixed on a housing and a substrate connection part 13 on the other end side respectively, and the substrate connection part 13 is press-inserted into a through-hole 15 formed on the substrate 14 and is fixed on the substrate 14. A primer plated layer 23 made of Ni or Ni alloy is arranged on a whole surface of a base material 16, and on the surface of the primer plated layer 23 of the female terminal connection part 12 in the base material 16, there are arranged a Cu-Sn alloy layer 24 and a Sn layer 25 or A Cu-Sn alloy layer in this order and a Sn alloy layer, or a Au alloy layer, and on the surface of the primary-plated layer 23 of the substrate connection part 13 in the base material 16, there are arranged a Cu 3 Sn alloy layer 26 and a Cu 6 Sn 5 alloy layer 27 in this order, and, moreover, Sn is not exposed on the surface of the Cu 6 Sn 6 alloy layer 27. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够改善安装部件，阴端子连接部件和基板连接部件的功能的压配合端子，并且能够稳定地生产优质产品，并且还具有更好的可操作性。解决方案：压配端子10设置有阴端子连接部分12，阴端子连接部分12分别布置在安装部分11的一端侧，以分别固定在壳体和另一端侧的基板连接部分13上，并且将基板连接部13压入插入到形成在基板14上的通孔15中并固定在基板14上。由Ni或Ni合金制成的底漆镀层23布置在基材14的整个表面上如图16所示，在母材16的阴端子连接部12的底漆镀层23的表面上，依次配置Cu-Sn合金层24和Sn层25或A-Cu-Sn合金层和Sn合金层或Au合金层，并且在基材16中的基板连接部13的初级镀层23的表面上，配置有Cu 3 Sn合金层26和Cu Sn 5 合金层27，此外，Sn不暴露在s （C）2011，JPO＆INPIT（C）2011年，JPO＆INPIT

4. 发明专利

JP2009144210A Sn-PLATED COPPER SUBSTRATE, METHOD FOR MANUFACTURING Sn-PLATED COPPER SUBSTRATE, LEAD FRAME USING THE SAME, AND CONNECTOR TERMINAL 有权
标题翻译： Sn镀铜基板，制造Sn镀层铜基板的方法，使用其的引线框架和连接器端子
公开(公告)号：JP2009144210A
公开(公告)日：2009-07-02
申请号：JP2007323934
申请日：2007-12-14
申请人： Kobe Steel Ltd , Shinko Leadmikk Kk , 株式会社神戸製鋼所 , 神鋼リードミック株式会社
发明人： SATO TOSHIKI , HISAMOTO ATSUSHI , YANAGISAWA KAZUMI , OKAMOTO HIDEHITO , SUEMATSU JIN
IPC分类号： C25D5/10 , C25D7/00 , H01B5/02 , H01B13/00 , H01L23/50
CPC分类号： H01L24/97 , H01L2924/15747 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an Sn-plated copper substrate which has a plated layer that hardly forms whisker even when an external stress is applied thereto and can be stably formed, is superior in solderability and does not include Pb. SOLUTION: The Sn-plated copper substrate 1 has at least one plated film layer 5 formed by stacking an intermediate Sn-plated layer 3IL and a Cu-plated layer 4 in this order on any metal substrate 2 of a pure copper sheet, a copper alloy sheet and a copper-plated metal sheet, so as to have a layer thickness of 1.5 μm or more; also has an outermost Sn-plated layer 3OL on the plated film layer 5 so that the layer thickness is 0.2 to 1.5 μm and a total thickness including the plated film layer 5 is 3 μm or more; and has an Sn-Cu alloy phase 6 which is made by diffusing Cu that originates in at least one of the Cu-plated layer 4 and the metal substrate 2, into at least any of a grain boundary 3g and a grain 3c of the intermediate Sn-plated layer 3IL and the outermost Sn-plated layer 3OL. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供即使在施加外部应力并且可以稳定地形成时也具有难以形成晶须的镀层的镀Sn的铜基板，具有优异的可焊性并且不包括Pb。镀锡铜基板1具有至少一个镀膜层5，其通过在中间镀Sn层3IL和Cu镀层4上依次层叠在纯铜片的任何金属基板2上铜合金板和镀铜金属片，以使层厚度为1.5μm以上; 在镀膜层5上也具有最外层的镀Sn层，因此层厚度为0.2〜1.5μm，镀膜层5的总厚度为3μm以上。并且具有通过将起源于Cu镀层4和金属基板2中的至少一个的Cu扩散到中间体的晶界3g和晶粒3c中的至少任一个而制成的Sn-Cu合金相6 镀锡层3IL和最外层镀锡层3OL。版权所有（C）2009，JPO＆INPIT

5. 发明专利

JP2011023704A Lead frame for led 有权
标题翻译： LED框架
公开(公告)号：JP2011023704A
公开(公告)日：2011-02-03
申请号：JP2010094492
申请日：2010-04-15
申请人： Kobe Steel Ltd , Shinko Leadmikk Kk , 株式会社神戸製鋼所 , 神鋼リードミック株式会社
发明人： SUZUKI JUN , SATO TOSHIKI , OKAMOTO HIDEHITO , MITSUI TOSHIYUKI , SUEMATSU JIN , NISHIMURA MASAYASU
IPC分类号： H01L33/62 , H01L33/60
CPC分类号： H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a lead frame for an LED, the lead frame having a reflective film that maintains high reflectivity for a long period and is stably and easily formed. SOLUTION: The lead frame 10 for LED is formed by stacking a substrate 11 made of copper or copper alloy and an Ag alloy film 13 containing 0.06-0.5 at.% Ge and 0.02-0.2 at.% Bi across an Ag plating film 12 formed on a surface of the substrate, and the Ag alloy film 13 is formed by a sputtering method to concentrate Ge and Bi on a surface, thereby imparting heat resistance, resistance to halogenation, and resistance to sulfidization. Further, the film thickness of the Ag alloy film 13 which is not easily made thick is limited to 20-500 nm, and the total thickness including the Ag plating film 12 is set to ≥0.6 μm, thereby preventing discoloration due to diffusion of Cu from the substrate 11 to the surface. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种用于LED的引线框架，引线框架具有能够长期保持高反射率且稳定且容易地形成的反射膜。解决方案：用于LED的引线框架10通过将由铜或铜合金制成的基板11和含有0.06-0.5原子％Ge和0.02-0.2原子％Bi的Ag合金膜13堆叠在Ag镀层上而形成形成在基板表面上的膜12，通过溅射法形成Ag合金膜13，以将Ge和Bi集中在表面上，从而赋予耐热性，耐卤化性和耐硫化性。此外，不容易制成厚度的Ag合金膜13的膜厚度限制在20〜500nm，并且包括Ag镀膜12的总厚度设定为≥0.6μm，从而防止由于Cu的扩散而引起的变色从基板11到表面。版权所有（C）2011，JPO＆INPIT

6. 发明专利

JP2006114492A Press-fit terminal and its manufacturing method 有权
标题翻译：新闻终端及其制造方法
公开(公告)号：JP2006114492A
公开(公告)日：2006-04-27
申请号：JP2005270607
申请日：2005-09-16
申请人： Kobe Steel Ltd , Shinko Leadmikk Kk , 株式会社神戸製鋼所 , 神鋼リードミック株式会社
发明人： OKAMOTO HIDEHITO , HIOKA SHINICHIRO , MITSUI TOSHIYUKI , HARA TOSHIHISA
IPC分类号： H01R13/03 , H01R43/16
CPC分类号： H01R13/03
摘要： PROBLEM TO BE SOLVED: To provide a press-fit terminal of which surface is hardened without bringing forth degeneration of a contact property, and its manufacturing method. SOLUTION: In the manufacturing method of the press-fit terminal 10 making connection of electronic components loaded on an ECU of an automobile, a base Ni-plated layer of 0.2 to 5 μm is formed on the surface of a mother material, on which a Cu-Sn alloy layer of 0.2 to 5 μm with a Cu content of 35 to 75 at% is formed to harden the surface, decrease cutting at insertion into a through-hole 13, and prevent increase of electrical resistance. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供表面硬化而不会导致接触性变性的压入端及其制造方法。解决方案：在装配在汽车的ECU上的电子部件连接的压入端子10的制造方法中，在母材表面上形成0.2〜5μm的基底镀Ni层，形成Cu含量为35〜75at％的0.2〜5μm的Cu-Sn合金层，使表面硬化，减少插入通孔13中的切断，防止电阻的上升。版权所有（C）2006，JPO＆NCIPI

7. 发明专利

JP2011009707A Lead frame for led 有权
标题翻译： LED框架
公开(公告)号：JP2011009707A
公开(公告)日：2011-01-13
申请号：JP2010094491
申请日：2010-04-15
申请人： Kobe Steel Ltd , Shinko Leadmikk Kk , 株式会社神戸製鋼所 , 神鋼リードミック株式会社
发明人： SUZUKI JUN , SATO TOSHIKI , OKAMOTO HIDEHITO , MITSUI TOSHIYUKI , SUEMATSU JIN , NISHIMURA MASAYASU
IPC分类号： H01L33/62 , H01L23/48 , H01L23/50 , H01L33/60
CPC分类号： H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a lead frame for an LED which shows high specular reflectance to reduce loss of light due to diffusion reflection and does not cause the aggregation and discoloration of Ag used as a reflection film, thereby the light emitted from an LED element is enabled to continuously be used with high efficiency.SOLUTION: The lead frame 10 for the LED is formed by stacking an Ag alloy film 13 with a thickness of ≥200 nm and ≤5 μm via a glossy Ni plated film 12 with a thickness of ≥0.4 μm and ≤10 μm on the surface of a substrate 11 composed of copper or copper alloy, wherein the Ag alloy film 13 contains 0.06 to 0.5 atom% of Ge and has a surface root-mean-square-roughness of ≤30 nm.
摘要翻译：要解决的问题：为了提供一种用于LED的引线框架，其具有高镜面反射率以减少由于扩散反射引起的光的损失，并且不会引起用作反射膜的Ag的聚集和变色，从而从LED发射的光可以高效率地连续使用元件。解决方案：LED的引线框10通过厚度≥200nm且≤5μm的Ag合金膜13通过具有厚度的光泽的Ni镀膜12来形成在铜或铜合金构成的基板11的表面上为≥0.4μm以上且≤10μm的Ag合金膜13含有0.06〜0.5原子％的Ge，表面均方根粗糙度≤30 纳米。

8. 发明专利

JP2006249460A Sn PLATING OR Sn ALLOY PLATING HAVING EXCELLENT SUPPRESSION OF WHISKER GENERATION 有权
标题翻译： Sn镀层或Sn合金镀层具有优异的抑制生成
公开(公告)号：JP2006249460A
公开(公告)日：2006-09-21
申请号：JP2005064477
申请日：2005-03-08
申请人： Kobe Steel Ltd , Shinko Leadmikk Kk , 株式会社神戸製鋼所 , 神鋼リードミック株式会社
发明人： SATO TOSHIKI , YANAGISAWA KAZUMI , OKAMOTO HIDEHITO , MITSUI TOSHIYUKI , OKUDA FUMIO
IPC分类号： C25D7/00 , C25D5/10 , C25D5/50 , C25D7/12 , H01L23/50 , H01R13/03
摘要： PROBLEM TO BE SOLVED: To provide an Sn plating or Sn alloy plating structure free from the generation of whiskers, to provide its production method, and particularly, to provide an Sn plating or Sn alloy plating structure where the generation of whiskers is suppressed even when being subjected to external stress such as bending, and to provide its production method.
SOLUTION: The Sn plating or Sn alloy plating is characterized in that an alloy phase of Sn is formed on the grain boundaries of Sn plating or Sn alloy plating, and particularly, an alloy phase of Sn in which the ratio to be occupied in the length of the grain boundaries is ≥50% is formed.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供不产生晶须的Sn镀层或Sn合金镀层结构，以提供其制造方法，特别是提供一种Sn镀层或Sn合金镀层结构，其中生成晶须是即使在受到诸如弯曲的外部应力的影响时也被抑制，并且提供其制造方法。＆lt; P＆gt;解决方案：Sn镀层或Sn合金镀层的特征在于，在Sn镀层或Sn合金镀层的晶界上形成Sn的合金相，特别是Sn的合金相，其中Sn的合金相在晶界的长度上形成≥50％。版权所有（C）2006，JPO＆NCIPI

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