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1. 发明专利

JP2011071471A Lead frame for led 有权
标题翻译： LED框架
公开(公告)号：JP2011071471A
公开(公告)日：2011-04-07
申请号：JP2010094493
申请日：2010-04-15
申请人： Kobe Steel Ltd , Shinko Leadmikk Kk , 株式会社神戸製鋼所 , 神鋼リードミック株式会社
发明人： SUZUKI JUN , SATO TOSHIKI , OKAMOTO HIDEHITO , MITSUI TOSHIYUKI , SUEMATSU JIN , NISHIMURA MASAYASU
IPC分类号： H01L33/62
CPC分类号： H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a lead frame for an LED equipped with a reflection film maintaining a high reflection factor for a long period, to be stably and easily formed. SOLUTION: The lead frame 10 for an LED is constituted of laminating an Ni plating film 12a having a film thickness of ≥0.4 μm, an Ag plating film 12b having a film thickness of ≥0.2 μm and an Ag alloy film 13 containing 0.06-0.5 at% Ge and 0.02-0.2 at% Bi and having a film thickness of 20-500 nm on a substrate 11 composed of copper or copper alloy. By forming the Ni plating film 12a on the surface of the substrate 11, occurrence of discoloration due to thermal expansion of Cu from the inside of the substrate 11 to the surface is prevented. By forming the Ag alloy film 13 by a sputtering method, Ge and Bi are concentrated into the surface and heat resistance, halogenation resistance and sulfidation resistance are given. Further by forming the Ag plating film 12b having a comparatively large crystal grain size on a ground, the crystal grain size of the Ag alloy film 13 is increased, and Ag aggregation by heat is suppressed. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了能够稳定且容易地形成用于为配备有反射膜的反射膜的LED提供长期保持高反射率的引线框架。解决方案：LED的引线框架10由层压厚度≥0.4μm的Ni镀膜12a，膜厚度≥0.2μm的Ag镀膜12b和含有 0.06-0.5at％Ge和0.02-0.2at％Bi，并且在由铜或铜合金构成的基板11上具有20-500nm的膜厚度。通过在基板11的表面上形成Ni镀膜12a，可以防止由于基板11的内部向表面的Cu的热膨胀而发生变色。通过溅射法形成Ag合金膜13，将Ge和Bi浓缩成表面，得到耐热性，耐卤化性和耐硫化性。此外，通过在地面上形成具有比较大的晶粒尺寸的Ag镀膜12b，Ag合金膜13的晶粒尺寸增加，并且抑制了Ag的聚集。版权所有（C）2011，JPO＆INPIT

2. 发明专利

JP2012212850A Lead frame for led and manufacturing method therefor 有权
标题翻译： LED框架及其制造方法
公开(公告)号：JP2012212850A
公开(公告)日：2012-11-01
申请号：JP2011245984
申请日：2011-11-09
申请人： Kobe Steel Ltd , Shinko Leadmikk Kk , 株式会社神戸製鋼所 , 神鋼リードミック株式会社
发明人： KATSURA SHOO , SUZUKI JUN , SATO TOSHIKI , MITSUI TOSHIYUKI , NISHIMURA MASAYASU
IPC分类号： H01L33/62 , H01L23/48
CPC分类号： H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a lead frame for LED including a reflection film that can accommodate wire bonding of an LED chip, can maintain high reflectance for a long term by applying a material of low cost in place of silver, and can be formed stably and easily.SOLUTION: The lead frame 1 includes a reflection film 13 having a thickness of 50 nm or more composed of aluminum or an aluminum alloy and formed on a substrate 11 composed of copper or a copper alloy, and a noble metal film 14 having a thickness of 5-50 nm consisting of one kind or more selected from Pd, Au, Pt and formed on the reflection film 13.
摘要翻译：要解决的问题：为了提供一种包括能够适应LED芯片的引线键合的反射膜的LED引线框架，通过应用低成本的材料代替银，可以长期保持高反射率，以及可以稳定且容易地形成。解决方案：引线框架1包括由铝或铝合金构成的厚度为50nm以上的反射膜13，形成在由铜或铜合金构成的基板11上，贵金属膜14具有厚度为5-50nm，由选自Pd，Au，Pt中的一种或多种构成并形成在反射膜13上。版权所有（C）2013，JPO＆INPIT

3. 发明专利

JP2011023704A Lead frame for led 有权
标题翻译： LED框架
公开(公告)号：JP2011023704A
公开(公告)日：2011-02-03
申请号：JP2010094492
申请日：2010-04-15
申请人： Kobe Steel Ltd , Shinko Leadmikk Kk , 株式会社神戸製鋼所 , 神鋼リードミック株式会社
发明人： SUZUKI JUN , SATO TOSHIKI , OKAMOTO HIDEHITO , MITSUI TOSHIYUKI , SUEMATSU JIN , NISHIMURA MASAYASU
IPC分类号： H01L33/62 , H01L33/60
CPC分类号： H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a lead frame for an LED, the lead frame having a reflective film that maintains high reflectivity for a long period and is stably and easily formed. SOLUTION: The lead frame 10 for LED is formed by stacking a substrate 11 made of copper or copper alloy and an Ag alloy film 13 containing 0.06-0.5 at.% Ge and 0.02-0.2 at.% Bi across an Ag plating film 12 formed on a surface of the substrate, and the Ag alloy film 13 is formed by a sputtering method to concentrate Ge and Bi on a surface, thereby imparting heat resistance, resistance to halogenation, and resistance to sulfidization. Further, the film thickness of the Ag alloy film 13 which is not easily made thick is limited to 20-500 nm, and the total thickness including the Ag plating film 12 is set to ≥0.6 μm, thereby preventing discoloration due to diffusion of Cu from the substrate 11 to the surface. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种用于LED的引线框架，引线框架具有能够长期保持高反射率且稳定且容易地形成的反射膜。解决方案：用于LED的引线框架10通过将由铜或铜合金制成的基板11和含有0.06-0.5原子％Ge和0.02-0.2原子％Bi的Ag合金膜13堆叠在Ag镀层上而形成形成在基板表面上的膜12，通过溅射法形成Ag合金膜13，以将Ge和Bi集中在表面上，从而赋予耐热性，耐卤化性和耐硫化性。此外，不容易制成厚度的Ag合金膜13的膜厚度限制在20〜500nm，并且包括Ag镀膜12的总厚度设定为≥0.6μm，从而防止由于Cu的扩散而引起的变色从基板11到表面。版权所有（C）2011，JPO＆INPIT

4. 发明专利

JP2014162990A Electrode member and production method thereof 审中-公开
标题翻译：电极部件及其制造方法
公开(公告)号：JP2014162990A
公开(公告)日：2014-09-08
申请号：JP2013038333
申请日：2013-02-28
申请人： Kobe Steel Ltd , 株式会社神戸製鋼所 , Shinko Leadmikk Kk , 神鋼リードミック株式会社
发明人： KATSURA SHOO , SUZUKI JUN , HATTORI TETSUYA , MARUO SATOSHI , FURUYA RYUJI
IPC分类号： C25D7/00 , C25D5/50
摘要： PROBLEM TO BE SOLVED: To provide an electrode member and its production method which enable production of an electrode member having excellent heat resistance by suppressing surface diffusion of Cu of a substrate sufficiently.SOLUTION: Electrode members 1a and 1b are provided with a substrate 11 composed of Cu or a Cu alloy and an Ag plating film 12 of a film thickness of 0.1-10.0 μm which is formed on at least one side of the substrate 11, and the X-ray diffraction intensity Iof the (111) plane and the X-ray diffraction intensity Iof the (200) plane of the Ag plating film 12 satisfy the relation (1): I/I≤3.0.
摘要翻译：要解决的问题：提供一种电极部件及其制造方法，其能够充分地抑制基板的Cu的表面扩散，从而能够制造具有优异的耐热性的电极部件。解决方案：电极部件1a和1b设置有基板11，的Cu或Cu合金以及形成在基板11的至少一侧上的膜厚度为0.1-10.0μm的Ag镀膜12，以及（111）面的X射线衍射强度I和X Ag镀膜12的（200）面的射线衍射强度I满足关系式（1）：I /I≤3.0。

5. 发明专利

JP2013128076A Led lead frame and manufacturing method of the same 有权
标题翻译： LED引线框架及其制造方法
公开(公告)号：JP2013128076A
公开(公告)日：2013-06-27
申请号：JP2011277610
申请日：2011-12-19
申请人： Kobe Steel Ltd , 株式会社神戸製鋼所 , Shinko Leadmikk Kk , 神鋼リードミック株式会社
发明人： SUZUKI JUN , KATSURA SHOO , NISHIMURA MASAYASU
IPC分类号： H01L33/62 , H01L23/48
CPC分类号： H01L2224/45144 , H01L2224/48091 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an LED lead frame which includes a reflection film that can be easily formed and does not change a color and like due to a sulfur component thereby to maintain high reflectance for a long periods of time, and which is suitable for mounting by wire bonding and suitable for soldering.SOLUTION: A lead frame 1 comprises: an Ag plating film 12 having a film thickness of 0.6-8 μm; a metal intermediate film 13 composed of Ti, Zr, a Ti-base alloy or Zr-base alloy and having a film thickness of 1-15 nm; and a noble metal film 14 composed of Pd or Pt and having a film thickness of 2-50 nm, which are laminated on a substrate 11 composed of Cu or a Cu alloy. By coating the Ag plating film 12 with the metal intermediate film 13, contact of a halogen ion or sulfur with the Ag plating film 12 from outside is prevented, thereby achieving a reflection film having excellent durability. By providing the noble metal film 14 on an outermost surface, wire bondability and solderability are added.
摘要翻译：要解决的问题：提供一种LED引线框架，其包括能够容易地形成并且不会由于硫成分而改变颜色的反射膜，从而长期保持高反射率，并且适用于通过引线接合安装并适合焊接。引线框架1包括：具有0.6-8μm的膜厚度的Ag镀膜12; 由Ti，Zr，Ti基合金或Zr基合金构成的膜厚为1-15nm的金属中间膜13; 和由Pd或Pt构成的膜厚度为2-50nm的贵金属膜14层压在由Cu或Cu合金构成的基板11上。通过用金属中间膜13涂布Ag镀膜12，防止了卤素离子或硫与Ag镀膜12从外部的接触，从而实现了耐久性优异的反射膜。通过在最外表面上设置贵金属膜14，添加线接合性和可焊性。版权所有（C）2013，JPO＆INPIT

6. 发明专利

JP2012089638A Lead frame for led 有权
标题翻译： LED框架
公开(公告)号：JP2012089638A
公开(公告)日：2012-05-10
申请号：JP2010234227
申请日：2010-10-19
申请人： Kobe Steel Ltd , Shinko Leadmikk Kk , 株式会社神戸製鋼所 , 神鋼リードミック株式会社
发明人： SUZUKI JUN , SATO TOSHIKI , MITSUI TOSHIYUKI , NISHIMURA MASAYASU
IPC分类号： H01L33/62 , H01L23/48 , H01L33/60
CPC分类号： H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a lead frame for LED having a reflective film which can keep a high reflectance for a long term, and which can be formed with stability and ease.SOLUTION: A lead frame 1 comprises: a substrate 11 made of copper or copper alloy; an Ag plating film 13 provided on the substrate 11 and having a thickness of 0.6 to 8 μm inclusive; and a metal oxide film 15 made of one metal or an alloy of two or more metals selected from a group consisting of Ti, V, Cr, Zr, Nb, Mo, Hf, Ta, and W, and formed on the Ag plating film 13 to have a thickness of 0.5 to 15 nm inclusive. The root mean square roughness of the surface of the lead frame on the side where the metal oxide film 15 is located is 30 nm or smaller. The metal oxide film 15 covering the Ag plating film 13 prevents the Ag plating film 13 from touching a halogen ion or sulfur coming from the outside, and thus the Ag plating film 13 makes a reflective film having an excellent durability.
摘要翻译：要解决的问题：提供一种具有能够长期保持高反射率并且可以稳定且容易地形成的具有反射膜的LED的引线框架。引线框架1包括：由铜或铜合金制成的基板11; 设置在基板11上并具有0.6〜8μm厚度的Ag镀膜13; 和由选自Ti，V，Cr，Zr，Nb，Mo，Hf，Ta和W中的两种或更多种金属的合金制成的金属氧化物膜15，并且在Ag镀膜上形成 13，其厚度为0.5〜15nm。引线框架在金属氧化物膜15所在一侧的表面的均方根粗糙度为30nm以下。覆盖Ag镀膜13的金属氧化物膜15防止Ag镀膜13接触来自外部的卤素离子或硫，因此Ag镀膜13形成具有优异耐久性的反射膜。版权所有（C）2012，JPO＆INPIT

7. 发明专利

JP2011009707A Lead frame for led 有权
标题翻译： LED框架
公开(公告)号：JP2011009707A
公开(公告)日：2011-01-13
申请号：JP2010094491
申请日：2010-04-15
申请人： Kobe Steel Ltd , Shinko Leadmikk Kk , 株式会社神戸製鋼所 , 神鋼リードミック株式会社
发明人： SUZUKI JUN , SATO TOSHIKI , OKAMOTO HIDEHITO , MITSUI TOSHIYUKI , SUEMATSU JIN , NISHIMURA MASAYASU
IPC分类号： H01L33/62 , H01L23/48 , H01L23/50 , H01L33/60
CPC分类号： H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a lead frame for an LED which shows high specular reflectance to reduce loss of light due to diffusion reflection and does not cause the aggregation and discoloration of Ag used as a reflection film, thereby the light emitted from an LED element is enabled to continuously be used with high efficiency.SOLUTION: The lead frame 10 for the LED is formed by stacking an Ag alloy film 13 with a thickness of ≥200 nm and ≤5 μm via a glossy Ni plated film 12 with a thickness of ≥0.4 μm and ≤10 μm on the surface of a substrate 11 composed of copper or copper alloy, wherein the Ag alloy film 13 contains 0.06 to 0.5 atom% of Ge and has a surface root-mean-square-roughness of ≤30 nm.
摘要翻译：要解决的问题：为了提供一种用于LED的引线框架，其具有高镜面反射率以减少由于扩散反射引起的光的损失，并且不会引起用作反射膜的Ag的聚集和变色，从而从LED发射的光可以高效率地连续使用元件。解决方案：LED的引线框10通过厚度≥200nm且≤5μm的Ag合金膜13通过具有厚度的光泽的Ni镀膜12来形成在铜或铜合金构成的基板11的表面上为≥0.4μm以上且≤10μm的Ag合金膜13含有0.06〜0.5原子％的Ge，表面均方根粗糙度≤30 纳米。

8. 发明专利

JP2014167155A METHOD FOR MANUFACTURING Ag-PLATING ELECTRODE MEMBER 有权
标题翻译：制造Ag电镀电极部件的方法
公开(公告)号：JP2014167155A
公开(公告)日：2014-09-11
申请号：JP2013039765
申请日：2013-02-28
申请人： Kobe Steel Ltd , 株式会社神戸製鋼所
发明人： SUZUKI JUN , SATO TOSHIKI
IPC分类号： C25D5/12 , C25D7/00
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing an Ag-plating electrode member excellent in adhesiveness between a Ni-plating film and an Ag-plating film and excellent in wire bondability.SOLUTION: An Ag-plating electrode member manufacturing method for manufacturing an Ag-plating electrode member comprising a substrate made of pure Cu or a Cu alloy, a Ni-plating film made of Ni or a Ni alloy and formed on at least one surface of the substrate, and an Ag-plating film made of pure Ag of an Ag alloy and formed on the Ni-plating film includes: a Ni-plating film forming step S1 of forming the Ni-plating film on the substrate in a Ni-plating bath; an oxide film removing step S2 of removing an oxide film formed on the surface of the Ni-plating film with an acidic plating solution; and an Ag-plating film forming step S3 of forming the Ag-plating film on the Ni-plating film in an Ag-plating bath using the acidic plating solution, after the removal of the oxide film.
摘要翻译：要解决的问题：提供一种镀镍电镀膜和镀银膜之间的粘合性优异的镀银电极构件的制造方法，并且具有优异的引线接合性。包含由纯Cu或Cu合金制成的基板，由Ni或Ni合金制成的Ni镀膜并形成在基板的至少一个表面上的镀Ag电镀部件和由纯的Cu制成的Ag镀膜在Ni镀膜上形成的Ag合金Ag包括：在镀Ni浴中在基板上形成Ni镀膜的Ni镀膜形成工序S1; 氧化膜去除步骤S2，用酸性电镀液去除形成在Ni镀膜表面上的氧化膜; 以及在除去氧化膜之后，使用酸性电镀液在Ag镀液中在Ni镀膜上形成Ag镀膜的Ag镀膜形成工序S3。

9. 发明专利

JP2014075287A Fuel cell separator and method for manufacturing the same 有权
标题翻译：燃料电池分离器及其制造方法
公开(公告)号：JP2014075287A
公开(公告)日：2014-04-24
申请号：JP2012222461
申请日：2012-10-04
申请人： Kobe Steel Ltd , 株式会社神戸製鋼所
发明人： SUZUKI JUN , SATO TOSHIKI , TAKADA SATORU
IPC分类号： H01M8/02 , H01M8/10
CPC分类号： Y02P70/56
摘要： PROBLEM TO BE SOLVED: To provide: a fuel cell separator including a low-cost carbon layer formed with good adhesion on a titanium base material excellent in corrosion resistance and light in weight, maintaining conductivity and excellent in hydrogen absorption resistance, thereby capable of being used as a separator arranged on a hydrogen electrode side of a fuel cell; and a method for manufacturing the fuel cell separator.SOLUTION: A fuel cell separator 10 includes a base material 1 comprising titanium or a titanium alloy, and a conductive carbon layer 2 coating the surface of the base material 1, while an intermediate layer 3 is formed at the interface between the base material 1 and the carbon layer 2. The intermediate layer 3 has a double layer structure where the carbon layer 2 side is a layer 32 of a titanium oxide and the base material 1 side is a layer 31 containing titanium carbon. At a portion where the intermediate layer 3 is formed on the base material 1, the thickness of the layer 32 of a titanium oxide is 1-40 nm, and 50% or less of the total thickness of the intermediate layer 3.
摘要翻译：要解决的问题：提供一种燃料电池隔板，包括在耐腐蚀性和重量轻，保持导电性和耐氢吸收性优异的钛基材上具有良好粘附性的低成本碳层，由此能够用作设置在燃料电池的氢电极侧的隔膜; 燃料电池用隔板10的制造方法。燃料电池隔板10包括由钛或钛合金构成的基材1和涂覆基材1的表面的导电性碳层2，中间层3为形成在基材1和碳层2之间的界面处。中间层3具有双层结构，其中碳层2侧是氧化钛的层32，基材1侧是含有钛的层31 碳。在基材1上形成中间层3的部分，氧化钛层32的厚度为1-40nm，中间层3的总厚度的50％以下。

10. 发明专利

JP2013225051A Reflective film laminate and method of manufacturing the same 有权
标题翻译：反射膜层压板及其制造方法
公开(公告)号：JP2013225051A
公开(公告)日：2013-10-31
申请号：JP2012097619
申请日：2012-04-23
申请人： Kobe Steel Ltd , 株式会社神戸製鋼所
发明人： KATSURA SHOO , SUZUKI JUN
IPC分类号： G02B5/08 , B32B9/00 , F21S8/10 , F21V7/22
摘要： PROBLEM TO BE SOLVED: To provide a reflective film laminate that has high reflectance, has excellent alkali resistance and hot-water resistance, and can keep high reflectance even when exposed to alkaline environment or hot-water immersion environment, with good productivity and at low cost.SOLUTION: A reflective film laminate is formed on a substrate, and includes, in order from the substrate side, an Al-Mg alloy film containing 10-20 atom% of Mg as a first layer, and a metal oxide film containing 80 or more atom% of Zr as a second layer. The thickness of the second layer is 1.0-5nm.
摘要翻译：要解决的问题：提供具有高反射率，耐碱性和耐热水性优异的反射膜层叠体，即使在暴露于碱性环境或热水浸渍环境下也能保持高反射率，生产率高，低成本。解决方案：在基板上形成反射膜层叠体，从基板侧依次包括含有10〜20原子％的Mg作为第一层的Al-Mg合金膜和含有80重量％的金属氧化物膜或更多原子％的Zr作为第二层。第二层的厚度为1.0-5nm。

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